JP2021176172A5 - - Google Patents

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Publication number
JP2021176172A5
JP2021176172A5 JP2020081397A JP2020081397A JP2021176172A5 JP 2021176172 A5 JP2021176172 A5 JP 2021176172A5 JP 2020081397 A JP2020081397 A JP 2020081397A JP 2020081397 A JP2020081397 A JP 2020081397A JP 2021176172 A5 JP2021176172 A5 JP 2021176172A5
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JP
Japan
Prior art keywords
plate
temperature control
control mechanism
temperature
controlling
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JP2020081397A
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English (en)
Japanese (ja)
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JP7301021B2 (ja
JP2021176172A (ja
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Priority claimed from JP2020081397A external-priority patent/JP7301021B2/ja
Priority to JP2020081397A priority Critical patent/JP7301021B2/ja
Priority to TW110114121A priority patent/TWI883180B/zh
Priority to TW114113766A priority patent/TW202531473A/zh
Priority to KR1020210051048A priority patent/KR20210134503A/ko
Priority to CN202110441064.5A priority patent/CN113594016A/zh
Priority to US17/240,195 priority patent/US11626818B2/en
Publication of JP2021176172A publication Critical patent/JP2021176172A/ja
Publication of JP2021176172A5 publication Critical patent/JP2021176172A5/ja
Priority to JP2023099398A priority patent/JP7613816B2/ja
Publication of JP7301021B2 publication Critical patent/JP7301021B2/ja
Application granted granted Critical
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JP2020081397A 2020-05-01 2020-05-01 基板処理装置、載置台及び温度制御方法 Active JP7301021B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2020081397A JP7301021B2 (ja) 2020-05-01 2020-05-01 基板処理装置、載置台及び温度制御方法
TW110114121A TWI883180B (zh) 2020-05-01 2021-04-20 基板處理裝置及溫度控制方法
TW114113766A TW202531473A (zh) 2020-05-01 2021-04-20 基板處理裝置
KR1020210051048A KR20210134503A (ko) 2020-05-01 2021-04-20 기판 처리 장치, 적재대 및 온도 제어 방법
CN202110441064.5A CN113594016A (zh) 2020-05-01 2021-04-23 基板处理装置、载置台以及温度控制方法
US17/240,195 US11626818B2 (en) 2020-05-01 2021-04-26 Substrate processing apparatus, and temperature control method
JP2023099398A JP7613816B2 (ja) 2020-05-01 2023-06-16 基板処理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2020081397A JP7301021B2 (ja) 2020-05-01 2020-05-01 基板処理装置、載置台及び温度制御方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2023099398A Division JP7613816B2 (ja) 2020-05-01 2023-06-16 基板処理装置

Publications (3)

Publication Number Publication Date
JP2021176172A JP2021176172A (ja) 2021-11-04
JP2021176172A5 true JP2021176172A5 (enExample) 2023-04-19
JP7301021B2 JP7301021B2 (ja) 2023-06-30

Family

ID=78243081

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2020081397A Active JP7301021B2 (ja) 2020-05-01 2020-05-01 基板処理装置、載置台及び温度制御方法
JP2023099398A Active JP7613816B2 (ja) 2020-05-01 2023-06-16 基板処理装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2023099398A Active JP7613816B2 (ja) 2020-05-01 2023-06-16 基板処理装置

Country Status (5)

Country Link
US (1) US11626818B2 (enExample)
JP (2) JP7301021B2 (enExample)
KR (1) KR20210134503A (enExample)
CN (1) CN113594016A (enExample)
TW (2) TWI883180B (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20230163011A1 (en) * 2021-11-23 2023-05-25 Intel Corporation Chuck with non-flat shaped surface
US11994807B2 (en) * 2022-05-03 2024-05-28 Tokyo Electron Limited In-situ lithography pattern enhancement with localized stress treatment tuning using heat zones
KR102705998B1 (ko) * 2023-09-05 2024-09-11 주식회사 동탄이엔지 온도 제어가 가능한 정전척 및 이를 이용한 정전척의 온도 제어 방법

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06302550A (ja) * 1993-04-13 1994-10-28 Hitachi Ltd 半導体製造装置
US5835334A (en) * 1996-09-30 1998-11-10 Lam Research Variable high temperature chuck for high density plasma chemical vapor deposition
JP2000021962A (ja) 1998-07-03 2000-01-21 Hitachi Ltd 静電吸着装置
JP2000124299A (ja) 1998-10-16 2000-04-28 Hitachi Ltd 半導体装置の製造方法および半導体製造装置
JP2002009064A (ja) * 2000-06-21 2002-01-11 Hitachi Ltd 試料の処理装置及び試料の処理方法
JP2003224180A (ja) * 2002-01-28 2003-08-08 Kyocera Corp ウエハ支持部材
JP2005072286A (ja) 2003-08-25 2005-03-17 Kyocera Corp 静電チャック
JP2006237348A (ja) * 2005-02-25 2006-09-07 Ulvac Japan Ltd 静電チャック及びこれを備えた真空処理装置
DE102005049598B4 (de) * 2005-10-17 2017-10-19 Att Advanced Temperature Test Systems Gmbh Hybrid Chuck
JP2007317772A (ja) 2006-05-24 2007-12-06 Shinko Electric Ind Co Ltd 静電チャック装置
JP2009218536A (ja) 2008-03-13 2009-09-24 Seiko Epson Corp 基板加熱装置および電気光学装置の製造装置
JP5207996B2 (ja) * 2009-01-20 2013-06-12 東京エレクトロン株式会社 基板載置台及び基板処理装置
JP2010182866A (ja) 2009-02-05 2010-08-19 Nikon Corp 静電吸着保持装置、露光装置、露光方法及びデバイスの製造方法
JP5357561B2 (ja) 2009-02-13 2013-12-04 信越化学工業株式会社 表面の研磨代が均一な半導体ウェーハの製造方法
JP5434636B2 (ja) 2010-01-29 2014-03-05 住友電気工業株式会社 静電チャックを備えた基板保持体
JP5496791B2 (ja) * 2010-06-29 2014-05-21 シャープ株式会社 プラズマ処理装置
JP6196095B2 (ja) * 2013-08-07 2017-09-13 日本特殊陶業株式会社 静電チャック
JP2015082384A (ja) * 2013-10-22 2015-04-27 東京エレクトロン株式会社 プラズマ処理装置、給電ユニット、及び載置台システム
US10008404B2 (en) * 2014-10-17 2018-06-26 Applied Materials, Inc. Electrostatic chuck assembly for high temperature processes
JP6655310B2 (ja) * 2015-07-09 2020-02-26 株式会社日立ハイテクノロジーズ プラズマ処理装置
KR102644272B1 (ko) 2016-10-31 2024-03-06 삼성전자주식회사 정전척 어셈블리
JP7090465B2 (ja) 2018-05-10 2022-06-24 東京エレクトロン株式会社 載置台及びプラズマ処理装置

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