JP2001223254A5 - - Google Patents

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Publication number
JP2001223254A5
JP2001223254A5 JP2000033246A JP2000033246A JP2001223254A5 JP 2001223254 A5 JP2001223254 A5 JP 2001223254A5 JP 2000033246 A JP2000033246 A JP 2000033246A JP 2000033246 A JP2000033246 A JP 2000033246A JP 2001223254 A5 JP2001223254 A5 JP 2001223254A5
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JP
Japan
Prior art keywords
tweezers
processing chamber
vibration sensor
wafer
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000033246A
Other languages
English (en)
Japanese (ja)
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JP2001223254A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2000033246A priority Critical patent/JP2001223254A/ja
Priority claimed from JP2000033246A external-priority patent/JP2001223254A/ja
Publication of JP2001223254A publication Critical patent/JP2001223254A/ja
Publication of JP2001223254A5 publication Critical patent/JP2001223254A5/ja
Pending legal-status Critical Current

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JP2000033246A 2000-02-10 2000-02-10 ウエハ搬送装置および半導体製造装置 Pending JP2001223254A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000033246A JP2001223254A (ja) 2000-02-10 2000-02-10 ウエハ搬送装置および半導体製造装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000033246A JP2001223254A (ja) 2000-02-10 2000-02-10 ウエハ搬送装置および半導体製造装置

Publications (2)

Publication Number Publication Date
JP2001223254A JP2001223254A (ja) 2001-08-17
JP2001223254A5 true JP2001223254A5 (enExample) 2005-09-02

Family

ID=18557750

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000033246A Pending JP2001223254A (ja) 2000-02-10 2000-02-10 ウエハ搬送装置および半導体製造装置

Country Status (1)

Country Link
JP (1) JP2001223254A (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003109999A (ja) * 2001-09-28 2003-04-11 Hitachi Kokusai Electric Inc 基板処理装置
JP2007251088A (ja) 2006-03-20 2007-09-27 Tokyo Electron Ltd 縦型熱処理装置及び縦型熱処理装置における移載機構の制御方法
US7900579B2 (en) 2007-09-26 2011-03-08 Tokyo Electron Limited Heat treatment method wherein the substrate holder is composed of two holder constituting bodies that move relative to each other
JP2010157612A (ja) * 2008-12-26 2010-07-15 Ihi Corp 浮上搬送装置及び浮上搬送方法
JP6114060B2 (ja) * 2013-02-27 2017-04-12 東京エレクトロン株式会社 基板搬送装置、基板受渡位置確認方法及び基板処理システム
KR102438196B1 (ko) * 2017-10-11 2022-08-31 (주)테크윙 테스트핸들러용 진동 장치
KR102421675B1 (ko) * 2018-08-01 2022-07-15 히라따기꼬오 가부시키가이샤 반송 장치 및 제어 방법
JP7055226B2 (ja) * 2019-02-01 2022-04-15 株式会社Kokusai Electric 基板処理装置及び半導体装置の製造方法
JP2021030376A (ja) * 2019-08-26 2021-03-01 川崎重工業株式会社 ロボット
CN113899446B (zh) * 2021-12-09 2022-03-22 北京京仪自动化装备技术股份有限公司 晶圆传送系统检测方法及晶圆传送系统

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