JP2001223254A - ウエハ搬送装置および半導体製造装置 - Google Patents

ウエハ搬送装置および半導体製造装置

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Publication number
JP2001223254A
JP2001223254A JP2000033246A JP2000033246A JP2001223254A JP 2001223254 A JP2001223254 A JP 2001223254A JP 2000033246 A JP2000033246 A JP 2000033246A JP 2000033246 A JP2000033246 A JP 2000033246A JP 2001223254 A JP2001223254 A JP 2001223254A
Authority
JP
Japan
Prior art keywords
tweezers
wafer
vibration sensor
vibration
tweezer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000033246A
Other languages
English (en)
Japanese (ja)
Other versions
JP2001223254A5 (enExample
Inventor
Yoshiaki Ishii
芳晶 石井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP2000033246A priority Critical patent/JP2001223254A/ja
Publication of JP2001223254A publication Critical patent/JP2001223254A/ja
Publication of JP2001223254A5 publication Critical patent/JP2001223254A5/ja
Pending legal-status Critical Current

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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2000033246A 2000-02-10 2000-02-10 ウエハ搬送装置および半導体製造装置 Pending JP2001223254A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000033246A JP2001223254A (ja) 2000-02-10 2000-02-10 ウエハ搬送装置および半導体製造装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000033246A JP2001223254A (ja) 2000-02-10 2000-02-10 ウエハ搬送装置および半導体製造装置

Publications (2)

Publication Number Publication Date
JP2001223254A true JP2001223254A (ja) 2001-08-17
JP2001223254A5 JP2001223254A5 (enExample) 2005-09-02

Family

ID=18557750

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000033246A Pending JP2001223254A (ja) 2000-02-10 2000-02-10 ウエハ搬送装置および半導体製造装置

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Country Link
JP (1) JP2001223254A (enExample)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003109999A (ja) * 2001-09-28 2003-04-11 Hitachi Kokusai Electric Inc 基板処理装置
JP2010157612A (ja) * 2008-12-26 2010-07-15 Ihi Corp 浮上搬送装置及び浮上搬送方法
US7900579B2 (en) 2007-09-26 2011-03-08 Tokyo Electron Limited Heat treatment method wherein the substrate holder is composed of two holder constituting bodies that move relative to each other
US7905700B2 (en) 2006-03-20 2011-03-15 Tokyo Electron Limited Vertical-type heat processing apparatus and method of controlling transfer mechanism in vertical-type heat processing apparatus
JP2014165439A (ja) * 2013-02-27 2014-09-08 Tokyo Electron Ltd 基板搬送装置、基板受渡位置確認方法及び基板処理システム
CN109655729A (zh) * 2017-10-11 2019-04-19 泰克元有限公司 应用于测试处理器的振动装置
WO2020157967A1 (ja) * 2019-02-01 2020-08-06 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ 基板処理装置及び半導体装置の製造方法
CN112262466A (zh) * 2018-08-01 2021-01-22 平田机工株式会社 搬运装置及控制方法
JP2021030376A (ja) * 2019-08-26 2021-03-01 川崎重工業株式会社 ロボット
WO2023103178A1 (zh) * 2021-12-09 2023-06-15 北京京仪自动化装备技术股份有限公司 晶圆传送系统检测方法及晶圆传送系统

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003109999A (ja) * 2001-09-28 2003-04-11 Hitachi Kokusai Electric Inc 基板処理装置
US7905700B2 (en) 2006-03-20 2011-03-15 Tokyo Electron Limited Vertical-type heat processing apparatus and method of controlling transfer mechanism in vertical-type heat processing apparatus
US7900579B2 (en) 2007-09-26 2011-03-08 Tokyo Electron Limited Heat treatment method wherein the substrate holder is composed of two holder constituting bodies that move relative to each other
US8230806B2 (en) 2007-09-26 2012-07-31 Tokyo Electron Limited Heat treatment method and heat treatment apparatus wherein the substrate holder is composed of two holder constituting bodies that move relative to each other
US8741064B2 (en) 2007-09-26 2014-06-03 Tokyo Electron Limited Heat treatment method and heat treatment apparatus
US9064916B2 (en) 2007-09-26 2015-06-23 Tokyo Electron Limited Heat treatment method and heat treatment apparatus
JP2010157612A (ja) * 2008-12-26 2010-07-15 Ihi Corp 浮上搬送装置及び浮上搬送方法
JP2014165439A (ja) * 2013-02-27 2014-09-08 Tokyo Electron Ltd 基板搬送装置、基板受渡位置確認方法及び基板処理システム
CN109655729A (zh) * 2017-10-11 2019-04-19 泰克元有限公司 应用于测试处理器的振动装置
CN109655729B (zh) * 2017-10-11 2021-06-22 泰克元有限公司 应用于测试处理器的振动装置
CN112262466A (zh) * 2018-08-01 2021-01-22 平田机工株式会社 搬运装置及控制方法
CN112262466B (zh) * 2018-08-01 2023-04-14 平田机工株式会社 搬运装置及控制方法
WO2020157967A1 (ja) * 2019-02-01 2020-08-06 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ 基板処理装置及び半導体装置の製造方法
JPWO2020157967A1 (ja) * 2019-02-01 2021-10-14 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ 基板処理装置及び半導体装置の製造方法
JP7055226B2 (ja) 2019-02-01 2022-04-15 株式会社Kokusai Electric 基板処理装置及び半導体装置の製造方法
JP2021030376A (ja) * 2019-08-26 2021-03-01 川崎重工業株式会社 ロボット
WO2023103178A1 (zh) * 2021-12-09 2023-06-15 北京京仪自动化装备技术股份有限公司 晶圆传送系统检测方法及晶圆传送系统
JP2024524325A (ja) * 2021-12-09 2024-07-05 北京京儀自動化装備技術股▲ふん▼有限公司 ウェハ搬送システムの検出方法及びウェハ搬送システム

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