JP2021075799A - 銀粉およびその製造方法 - Google Patents
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- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/02—Making metallic powder or suspensions thereof using physical processes
- B22F9/06—Making metallic powder or suspensions thereof using physical processes starting from liquid material
- B22F9/08—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying
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- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/05—Metallic powder characterised by the size or surface area of the particles
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- B22—CASTING; POWDER METALLURGY
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- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/06—Metallic powder characterised by the shape of the particles
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- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/24—Electrically-conducting paints
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- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/66—Additives characterised by particle size
- C09D7/69—Particle size larger than 1000 nm
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
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- C22C5/00—Alloys based on noble metals
- C22C5/06—Alloys based on silver
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- H—ELECTRICITY
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- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/02—Making metallic powder or suspensions thereof using physical processes
- B22F9/06—Making metallic powder or suspensions thereof using physical processes starting from liquid material
- B22F9/08—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying
- B22F9/082—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying atomising using a fluid
- B22F2009/0824—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying atomising using a fluid with a specific atomising fluid
- B22F2009/0828—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying atomising using a fluid with a specific atomising fluid with water
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
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- B22F2301/00—Metallic composition of the powder or its coating
- B22F2301/25—Noble metals, i.e. Ag Au, Ir, Os, Pd, Pt, Rh, Ru
- B22F2301/255—Silver or gold
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2304/00—Physical aspects of the powder
- B22F2304/10—Micron size particles, i.e. above 1 micrometer up to 500 micrometer
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0806—Silver
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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- C08K2201/001—Conductive additives
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/005—Additives being defined by their particle size in general
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/006—Additives being defined by their surface area
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- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
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Abstract
Description
銀12kgを1600℃(銀の融点(962℃)より638℃高い温度)に加熱して溶解した溶湯をタンディッシュ下部から落下させながら、水圧150MPa、水量160L/分で高圧水を吹き付けて急冷凝固させ、得られた粉末をろ過し、水洗し、乾燥し、解砕し、風力分級機(株式会社セイシン企業製のクラッシールN−01型)により粗大粒子を除去して、銀粉を得た。
風力分級機により粗大粒子を除去する際に10μmより大きい銀の凝集体を除去することにより粒度を調整した以外は、実施例1と同様の方法により、得られた銀粉について、粒度分布、収縮率、結晶子径、BET比表面積、タップ密度、炭素含有量を求めた。
加熱温度を1400℃とし、水圧を100MPaとした以外は、実施例1と同様の方法により、得られた銀粉について、粒度分布、収縮率、結晶子径、BET比表面積、タップ密度、炭素含有量を求めた。
加熱温度を1400℃とし、水圧を70MPaとした以外は、実施例1と同様の方法により、得られた銀粉について、粒度分布、収縮率、結晶子径、BET比表面積、タップ密度、炭素含有量を求めた。
加熱温度を1500℃とした以外は、実施例1と同様の方法により、得られた銀粉について、粒度分布、収縮率、結晶子径、BET比表面積、タップ密度、炭素含有量を求めた。
加熱温度を1250℃とし、水圧を150MPaとした以外は、実施例1と同様の方法により、得られた銀粉について、粒度分布、収縮率、結晶子径、BET比表面積、タップ密度、炭素含有量を求めた。
銀54kgを含む硝酸銀水溶液4500kgに、25質量%のアンモニア水203kgを添加して、銀アンミン錯塩水溶液を得た。この銀アンミン錯塩水溶液の液温を40℃とし、37質量%のホルマリン水溶液240kgを添加して銀粒子を析出させて銀含有スラリーを得た。この銀含有スラリー中に、銀に対して0.2質量%のステアリン酸を含むステアリン酸エマルジョンを添加した後、濾過し、水洗し、ケーキ15.0kgを得た。このケーキを乾燥機に投入し、乾燥粉13.6kgを得た。この乾燥粉を解砕した後、分級して10μmより大きい銀の凝集体を除去した。
Claims (6)
- 銀の融点より330〜730℃高い温度に加熱した銀溶湯を落下させながら高圧水を吹き付けて急冷凝固させることによって銀を粉末化することを特徴とする、銀粉の製造方法。
- 前記高圧水が水圧90〜160MPaで吹き付けられることを特徴とする、請求項1に記載の銀粉の製造方法。
- 平均粒径が1〜6μm、500℃における収縮率が8%以下であり、平均粒径と500℃における収縮率の積が1〜11μm・%であることを特徴とする、銀粉。
- BET比表面積(m2/g)×タップ密度(g/m3)/結晶子径(m)の値が1×1013〜6×1013(m−2)であることを特徴とする、請求項3に記載の銀粉。
- 炭素含有量が0.1質量%以下であることを特徴とする、請求項3または4に記載の銀粉。
- 溶剤および樹脂を含み、導電性粉体として請求項3乃至5のいずれかに記載の銀粉を含むことを特徴とする、導電性ペースト。
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JP2015213682 | 2015-10-30 | ||
JP2015213682 | 2015-10-30 |
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US (2) | US10828702B2 (ja) |
EP (1) | EP3357608B1 (ja) |
JP (2) | JP6856350B2 (ja) |
KR (1) | KR102446788B1 (ja) |
CN (1) | CN108349009A (ja) |
SG (1) | SG11201802822PA (ja) |
TW (1) | TWI734710B (ja) |
Families Citing this family (5)
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JP7090511B2 (ja) * | 2017-09-29 | 2022-06-24 | Dowaエレクトロニクス株式会社 | 銀粉およびその製造方法 |
KR20210105405A (ko) | 2018-12-26 | 2021-08-26 | 쇼에이 가가쿠 가부시키가이샤 | 은 페이스트 |
US11535767B2 (en) | 2018-12-26 | 2022-12-27 | Shoei Chemical Inc. | Silver paste |
KR102263618B1 (ko) * | 2019-03-29 | 2021-06-10 | 대주전자재료 주식회사 | 혼합 은 분말 및 이를 포함하는 도전성 페이스트 |
JP7334076B2 (ja) * | 2019-06-27 | 2023-08-28 | Dowaエレクトロニクス株式会社 | 銀粉およびその製造方法 |
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- 2016-10-19 JP JP2016204799A patent/JP6856350B2/ja active Active
- 2016-10-25 TW TW105134429A patent/TWI734710B/zh active
- 2016-10-26 KR KR1020187014652A patent/KR102446788B1/ko active IP Right Grant
- 2016-10-26 CN CN201680063241.8A patent/CN108349009A/zh active Pending
- 2016-10-26 US US15/768,065 patent/US10828702B2/en active Active
- 2016-10-26 SG SG11201802822PA patent/SG11201802822PA/en unknown
- 2016-10-26 EP EP16859295.4A patent/EP3357608B1/en active Active
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KR102446788B1 (ko) | 2022-09-22 |
KR20180075582A (ko) | 2018-07-04 |
CN108349009A (zh) | 2018-07-31 |
US20210078081A1 (en) | 2021-03-18 |
US10828702B2 (en) | 2020-11-10 |
US20180326497A1 (en) | 2018-11-15 |
EP3357608A1 (en) | 2018-08-08 |
EP3357608A4 (en) | 2019-05-01 |
JP6856350B2 (ja) | 2021-04-07 |
TWI734710B (zh) | 2021-08-01 |
US11407030B2 (en) | 2022-08-09 |
TW201732046A (zh) | 2017-09-16 |
JP2017082327A (ja) | 2017-05-18 |
EP3357608B1 (en) | 2023-02-22 |
JP7110421B2 (ja) | 2022-08-01 |
SG11201802822PA (en) | 2018-05-30 |
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