JP2020537161A - 検査装置 - Google Patents
検査装置 Download PDFInfo
- Publication number
- JP2020537161A JP2020537161A JP2020541331A JP2020541331A JP2020537161A JP 2020537161 A JP2020537161 A JP 2020537161A JP 2020541331 A JP2020541331 A JP 2020541331A JP 2020541331 A JP2020541331 A JP 2020541331A JP 2020537161 A JP2020537161 A JP 2020537161A
- Authority
- JP
- Japan
- Prior art keywords
- probe
- cable
- inspection
- signal
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007689 inspection Methods 0.000 title claims abstract description 64
- 239000000523 sample Substances 0.000 claims abstract description 81
- 239000000758 substrate Substances 0.000 claims description 10
- 239000004065 semiconductor Substances 0.000 description 4
- 230000008054 signal transmission Effects 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06772—High frequency probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0441—Details
- G01R1/045—Sockets or component fixtures for RF or HF testing
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/18—Screening arrangements against electric or magnetic fields, e.g. against earth's field
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
- G01R31/66—Testing of connections, e.g. of plugs or non-disconnectable joints
- G01R31/70—Testing of connections between components and printed circuit boards
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
Description
前記ケーブル支持部は前記ケーブル支持ブロックが通過する貫通孔を有するケーブル支持基板を含むことによって、ケーブル支持ブロックを安定して導電ブロックに結合させることができる。
100 検査ソケット
110 導電ブロック
120 信号プローブ
130 接地プローブ
140 上部支持部材
150 下部支持部材
200 同軸ケーブル
300 ケーブル支持部
310 ケーブル支持ブロック
320 ケーブル支持基板
Claims (5)
- 被検査体の電気的特性を検査する検査装置であって、
プローブ孔を有する導電ブロックと、
前記プローブ孔の内壁に非接触状態で支持され、一端が前記被検査体の被検査接点に接触し、長さ方向に伸縮可能な少なくとも一つの信号プローブと、
前記信号プローブの他端に電気的に接触する心線を有する同軸ケーブルと、
を含む検査装置。 - 前記同軸ケーブルを収容するケーブル収容孔を含み、前記プローブ孔と前記ケーブル収容孔が対応するように前記導電ブロックに結合されるケーブル支持ブロックを有するケーブル支持部をさらに含む、請求項1に記載の検査装置。
- 前記ケーブル支持ブロックは、前記同軸ケーブルを固定するケーブル固定陥没部を含む、請求項2に記載の検査装置。
- 前記ケーブル支持部は、前記ケーブル支持ブロックから一体に拡張する拡張板部を含む、請求項2に記載の検査装置。
- 前記ケーブル支持部は、前記ケーブル支持ブロックが通過する貫通孔を有するケーブル支持基板を含む、請求項4に記載の検査装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020170162775A KR102015788B1 (ko) | 2017-11-30 | 2017-11-30 | 검사장치 |
KR10-2017-0162775 | 2017-11-30 | ||
PCT/KR2018/014396 WO2019107830A1 (en) | 2017-11-30 | 2018-11-22 | Test device |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2020537161A true JP2020537161A (ja) | 2020-12-17 |
JP7097452B2 JP7097452B2 (ja) | 2022-07-07 |
Family
ID=66664546
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020541331A Active JP7097452B2 (ja) | 2017-11-30 | 2018-11-22 | 検査装置 |
Country Status (8)
Country | Link |
---|---|
US (2) | US11391757B2 (ja) |
EP (1) | EP3669196A4 (ja) |
JP (1) | JP7097452B2 (ja) |
KR (1) | KR102015788B1 (ja) |
CN (1) | CN111279203B (ja) |
SG (1) | SG11202002291TA (ja) |
TW (1) | TWI700500B (ja) |
WO (1) | WO2019107830A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112098749A (zh) * | 2019-09-05 | 2020-12-18 | 日置电机株式会社 | 测量装置 |
CN112824912A (zh) * | 2019-11-20 | 2021-05-21 | 嘉联益电子(昆山)有限公司 | 传输线测试模块与传输线测试方法 |
TWI800098B (zh) * | 2021-11-15 | 2023-04-21 | 貿聯國際股份有限公司 | 測試板 |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6471141A (en) * | 1987-09-11 | 1989-03-16 | Hitachi Ltd | Inspection device for semiconductor element |
JPH06317624A (ja) * | 1993-05-10 | 1994-11-15 | Hitachi Ltd | 電極の接続装置 |
US20020113610A1 (en) * | 2000-09-29 | 2002-08-22 | Griffin Gary W. | Test system and associated interface module |
JP2003207539A (ja) * | 2002-01-10 | 2003-07-25 | Murata Mfg Co Ltd | 検査装置 |
JP2004170182A (ja) * | 2002-11-19 | 2004-06-17 | Yokowo Co Ltd | 高周波・高速用デバイスの検査治具およびコンタクトプローブ |
WO2009098770A1 (ja) * | 2008-02-07 | 2009-08-13 | Advantest Corporation | 品種交換ユニットおよび製造方法 |
JP2012502277A (ja) * | 2008-09-08 | 2012-01-26 | スリーエム イノベイティブ プロパティズ カンパニー | ローブブロックアセンブリ |
WO2016072193A1 (ja) * | 2014-11-07 | 2016-05-12 | 株式会社村田製作所 | プローブ |
JP2016099301A (ja) * | 2014-11-26 | 2016-05-30 | セイコーエプソン株式会社 | 中継基板及びその製造方法 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0652748B2 (ja) * | 1987-05-12 | 1994-07-06 | 東京エレクトロン株式会社 | プロ−ブカ−ド |
US5426372A (en) * | 1993-07-30 | 1995-06-20 | Genrad, Inc. | Probe for capacitive open-circuit tests |
US5561377A (en) * | 1995-04-14 | 1996-10-01 | Cascade Microtech, Inc. | System for evaluating probing networks |
JP2001099889A (ja) * | 1999-09-29 | 2001-04-13 | Yokowo Co Ltd | 高周波回路の検査装置 |
JP2003270291A (ja) * | 2002-03-18 | 2003-09-25 | Murata Mfg Co Ltd | 高周波製品の検査装置 |
JP2005180922A (ja) * | 2003-12-15 | 2005-07-07 | Yamaichi Electronics Co Ltd | 検査装置用ケーブルの配線構造 |
JP4438601B2 (ja) * | 2004-10-28 | 2010-03-24 | 株式会社ヨコオ | 検査ユニットの製法 |
WO2007080644A1 (ja) * | 2006-01-13 | 2007-07-19 | Advantest Corporation | コネクタハウジングブロック、インターフェイス部材および電子部品試験装置 |
JP5210550B2 (ja) * | 2007-06-01 | 2013-06-12 | 株式会社日本マイクロニクス | 電気的接続装置 |
JP5133196B2 (ja) * | 2008-10-10 | 2013-01-30 | モレックス インコーポレイテド | プローブコネクタ |
KR20100095142A (ko) * | 2009-02-20 | 2010-08-30 | 리노공업주식회사 | 검사용 소켓 |
TWI410637B (zh) * | 2009-09-17 | 2013-10-01 | Mpi Corp | 陣列式探針卡 |
TWI570413B (zh) * | 2011-07-06 | 2017-02-11 | 色拉頓系統公司 | 具有一探針卡之測試設備及連接器機構 |
US8717053B2 (en) * | 2011-11-04 | 2014-05-06 | Keithley Instruments, Inc. | DC-AC probe card topology |
US9645172B2 (en) * | 2014-10-10 | 2017-05-09 | Samtec, Inc. | Cable assembly |
KR101762836B1 (ko) * | 2015-09-10 | 2017-07-28 | 리노공업주식회사 | 프로브 소켓 |
KR101882209B1 (ko) * | 2016-03-23 | 2018-07-27 | 리노공업주식회사 | 동축 테스트소켓 조립체 |
TWM548273U (zh) * | 2017-06-02 | 2017-09-01 | Qualmax Taiwan Ltd | 探針間具氣隙的測試插座 |
CN107505567B (zh) * | 2017-10-11 | 2019-12-17 | 湖南维胜科技电路板有限公司 | 一种电子线路板高速信号检测装置 |
-
2017
- 2017-11-30 KR KR1020170162775A patent/KR102015788B1/ko active IP Right Grant
-
2018
- 2018-11-22 EP EP18883317.2A patent/EP3669196A4/en active Pending
- 2018-11-22 CN CN201880069228.2A patent/CN111279203B/zh active Active
- 2018-11-22 JP JP2020541331A patent/JP7097452B2/ja active Active
- 2018-11-22 SG SG11202002291TA patent/SG11202002291TA/en unknown
- 2018-11-22 TW TW107141560A patent/TWI700500B/zh active
- 2018-11-22 WO PCT/KR2018/014396 patent/WO2019107830A1/en unknown
-
2020
- 2020-04-16 US US16/850,116 patent/US11391757B2/en active Active
-
2022
- 2022-03-28 US US17/705,639 patent/US11726111B2/en active Active
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6471141A (en) * | 1987-09-11 | 1989-03-16 | Hitachi Ltd | Inspection device for semiconductor element |
JPH06317624A (ja) * | 1993-05-10 | 1994-11-15 | Hitachi Ltd | 電極の接続装置 |
US20020113610A1 (en) * | 2000-09-29 | 2002-08-22 | Griffin Gary W. | Test system and associated interface module |
JP2003207539A (ja) * | 2002-01-10 | 2003-07-25 | Murata Mfg Co Ltd | 検査装置 |
JP2004170182A (ja) * | 2002-11-19 | 2004-06-17 | Yokowo Co Ltd | 高周波・高速用デバイスの検査治具およびコンタクトプローブ |
WO2009098770A1 (ja) * | 2008-02-07 | 2009-08-13 | Advantest Corporation | 品種交換ユニットおよび製造方法 |
JP2012502277A (ja) * | 2008-09-08 | 2012-01-26 | スリーエム イノベイティブ プロパティズ カンパニー | ローブブロックアセンブリ |
WO2016072193A1 (ja) * | 2014-11-07 | 2016-05-12 | 株式会社村田製作所 | プローブ |
JP2016099301A (ja) * | 2014-11-26 | 2016-05-30 | セイコーエプソン株式会社 | 中継基板及びその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
EP3669196A4 (en) | 2020-08-26 |
TW201925805A (zh) | 2019-07-01 |
US11391757B2 (en) | 2022-07-19 |
EP3669196A1 (en) | 2020-06-24 |
KR102015788B1 (ko) | 2019-08-29 |
KR20190063759A (ko) | 2019-06-10 |
TWI700500B (zh) | 2020-08-01 |
US11726111B2 (en) | 2023-08-15 |
JP7097452B2 (ja) | 2022-07-07 |
US20220214377A1 (en) | 2022-07-07 |
CN111279203B (zh) | 2023-07-11 |
WO2019107830A1 (en) | 2019-06-06 |
SG11202002291TA (en) | 2020-04-29 |
US20200241044A1 (en) | 2020-07-30 |
CN111279203A (zh) | 2020-06-12 |
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