SG11202002291TA - Test device - Google Patents

Test device

Info

Publication number
SG11202002291TA
SG11202002291TA SG11202002291TA SG11202002291TA SG11202002291TA SG 11202002291T A SG11202002291T A SG 11202002291TA SG 11202002291T A SG11202002291T A SG 11202002291TA SG 11202002291T A SG11202002291T A SG 11202002291TA SG 11202002291T A SG11202002291T A SG 11202002291TA
Authority
SG
Singapore
Prior art keywords
test device
test
Prior art date
Application number
SG11202002291TA
Inventor
Changhyun Song
Jaehwan Jeong
Original Assignee
Leeno Ind Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Leeno Ind Inc filed Critical Leeno Ind Inc
Publication of SG11202002291TA publication Critical patent/SG11202002291TA/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/18—Screening arrangements against electric or magnetic fields, e.g. against earth's field
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/045—Sockets or component fixtures for RF or HF testing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06772—High frequency probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
    • G01R31/66—Testing of connections, e.g. of plugs or non-disconnectable joints
    • G01R31/70—Testing of connections between components and printed circuit boards

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
SG11202002291TA 2017-11-30 2018-11-22 Test device SG11202002291TA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020170162775A KR102015788B1 (en) 2017-11-30 2017-11-30 Test device
PCT/KR2018/014396 WO2019107830A1 (en) 2017-11-30 2018-11-22 Test device

Publications (1)

Publication Number Publication Date
SG11202002291TA true SG11202002291TA (en) 2020-04-29

Family

ID=66664546

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202002291TA SG11202002291TA (en) 2017-11-30 2018-11-22 Test device

Country Status (8)

Country Link
US (2) US11391757B2 (en)
EP (1) EP3669196A4 (en)
JP (1) JP7097452B2 (en)
KR (1) KR102015788B1 (en)
CN (1) CN111279203B (en)
SG (1) SG11202002291TA (en)
TW (1) TWI700500B (en)
WO (1) WO2019107830A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112098749A (en) * 2019-09-05 2020-12-18 日置电机株式会社 Measuring device
CN112824912A (en) * 2019-11-20 2021-05-21 嘉联益电子(昆山)有限公司 Transmission line test module and transmission line test method
TWI800098B (en) * 2021-11-15 2023-04-21 貿聯國際股份有限公司 Testing board

Family Cites Families (28)

* Cited by examiner, † Cited by third party
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JPH0652748B2 (en) * 1987-05-12 1994-07-06 東京エレクトロン株式会社 Probe card
JP2539453B2 (en) * 1987-09-11 1996-10-02 株式会社日立製作所 Semiconductor element inspection equipment
JP3192270B2 (en) * 1993-05-10 2001-07-23 株式会社日立製作所 Electrode connection device
US5426372A (en) * 1993-07-30 1995-06-20 Genrad, Inc. Probe for capacitive open-circuit tests
US5561377A (en) * 1995-04-14 1996-10-01 Cascade Microtech, Inc. System for evaluating probing networks
JP2001099889A (en) * 1999-09-29 2001-04-13 Yokowo Co Ltd Inspection equipment for high frequency circuit
US6420888B1 (en) * 2000-09-29 2002-07-16 Schlumberger Technologies, Inc. Test system and associated interface module
JP2003207539A (en) * 2002-01-10 2003-07-25 Murata Mfg Co Ltd Inspection device
JP2003270291A (en) * 2002-03-18 2003-09-25 Murata Mfg Co Ltd Inspection device for high-frequency product
JP4251855B2 (en) * 2002-11-19 2009-04-08 株式会社ヨコオ Manufacturing method of inspection jigs for high frequency and high speed devices
JP2005180922A (en) * 2003-12-15 2005-07-07 Yamaichi Electronics Co Ltd Cable wiring structure for inspection apparatus
JP4438601B2 (en) * 2004-10-28 2010-03-24 株式会社ヨコオ Inspection unit manufacturing method
WO2007080644A1 (en) * 2006-01-13 2007-07-19 Advantest Corporation Connector housing block, interface member, and electronic part tester
JP5210550B2 (en) * 2007-06-01 2013-06-12 株式会社日本マイクロニクス Electrical connection device
CN101939659A (en) * 2008-02-07 2011-01-05 爱德万测试株式会社 Variety exchanging unit, and manufacturing method
US7740508B2 (en) * 2008-09-08 2010-06-22 3M Innovative Properties Company Probe block assembly
JP5133196B2 (en) * 2008-10-10 2013-01-30 モレックス インコーポレイテド Probe connector
KR20100095142A (en) * 2009-02-20 2010-08-30 리노공업주식회사 Test socket
TWI410637B (en) * 2009-09-17 2013-10-01 Mpi Corp Area array probe card
TWI570413B (en) * 2011-07-06 2017-02-11 色拉頓系統公司 Test apparatus having a probe card and connector mechanism
US8717053B2 (en) * 2011-11-04 2014-05-06 Keithley Instruments, Inc. DC-AC probe card topology
US9645172B2 (en) * 2014-10-10 2017-05-09 Samtec, Inc. Cable assembly
CN107148575B (en) * 2014-11-07 2021-03-12 株式会社村田制作所 Probe needle
JP2016099301A (en) * 2014-11-26 2016-05-30 セイコーエプソン株式会社 Relay substrate and manufacturing method of the same
KR101762836B1 (en) * 2015-09-10 2017-07-28 리노공업주식회사 A probe socket
KR101882209B1 (en) * 2016-03-23 2018-07-27 리노공업주식회사 Coaxial Test Socket Assembly
TWM548273U (en) * 2017-06-02 2017-09-01 Qualmax Taiwan Ltd Test socket using air gap
CN107505567B (en) * 2017-10-11 2019-12-17 湖南维胜科技电路板有限公司 High-speed signal detection device for electronic circuit board

Also Published As

Publication number Publication date
EP3669196A4 (en) 2020-08-26
TW201925805A (en) 2019-07-01
US11391757B2 (en) 2022-07-19
EP3669196A1 (en) 2020-06-24
KR102015788B1 (en) 2019-08-29
KR20190063759A (en) 2019-06-10
TWI700500B (en) 2020-08-01
US11726111B2 (en) 2023-08-15
JP7097452B2 (en) 2022-07-07
US20220214377A1 (en) 2022-07-07
CN111279203B (en) 2023-07-11
WO2019107830A1 (en) 2019-06-06
US20200241044A1 (en) 2020-07-30
JP2020537161A (en) 2020-12-17
CN111279203A (en) 2020-06-12

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