JP2020530664A5 - - Google Patents

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Publication number
JP2020530664A5
JP2020530664A5 JP2020508336A JP2020508336A JP2020530664A5 JP 2020530664 A5 JP2020530664 A5 JP 2020530664A5 JP 2020508336 A JP2020508336 A JP 2020508336A JP 2020508336 A JP2020508336 A JP 2020508336A JP 2020530664 A5 JP2020530664 A5 JP 2020530664A5
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JP
Japan
Prior art keywords
photosensitive element
photosensitive
mold
flexible film
imaging assembly
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JP2020508336A
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English (en)
Japanese (ja)
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JP7104776B2 (ja
JP2020530664A (ja
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Priority claimed from CN201710693245.0A external-priority patent/CN109387915B/zh
Priority claimed from CN201721013133.8U external-priority patent/CN207216104U/zh
Application filed filed Critical
Priority claimed from PCT/CN2018/096305 external-priority patent/WO2019033897A1/zh
Publication of JP2020530664A publication Critical patent/JP2020530664A/ja
Publication of JP2020530664A5 publication Critical patent/JP2020530664A5/ja
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Publication of JP7104776B2 publication Critical patent/JP7104776B2/ja
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JP2020508336A 2017-08-14 2018-07-19 イメージングアセンブリとその製造方法、及びモールド金型、撮像モジュールとスマート端末 Active JP7104776B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
CN201710693245.0A CN109387915B (zh) 2017-08-14 2017-08-14 成像组件及其制作方法以及模塑模具、摄像模组和智能终端
CN201721013133.8 2017-08-14
CN201710693245.0 2017-08-14
CN201721013133.8U CN207216104U (zh) 2017-08-14 2017-08-14 成像组件以及模塑模具、摄像模组和智能终端
PCT/CN2018/096305 WO2019033897A1 (zh) 2017-08-14 2018-07-19 成像组件及其制作方法以及模塑模具、摄像模组和智能终端

Publications (3)

Publication Number Publication Date
JP2020530664A JP2020530664A (ja) 2020-10-22
JP2020530664A5 true JP2020530664A5 (enExample) 2020-12-03
JP7104776B2 JP7104776B2 (ja) 2022-07-21

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ID=65361751

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020508336A Active JP7104776B2 (ja) 2017-08-14 2018-07-19 イメージングアセンブリとその製造方法、及びモールド金型、撮像モジュールとスマート端末

Country Status (5)

Country Link
EP (1) EP3671302A4 (enExample)
JP (1) JP7104776B2 (enExample)
KR (1) KR102393994B1 (enExample)
TW (1) TWI716712B (enExample)
WO (1) WO2019033897A1 (enExample)

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002110722A (ja) 2000-10-03 2002-04-12 Nitto Denko Corp 半導体チップの樹脂封止方法及び半導体チップ樹脂封止用離型フィルム
JP2004296584A (ja) 2003-03-26 2004-10-21 Sony Corp 固体撮像装置及びその製造方法
EP1471730A1 (en) * 2003-03-31 2004-10-27 Dialog Semiconductor GmbH Miniature camera module
JP4365743B2 (ja) * 2004-07-27 2009-11-18 富士通マイクロエレクトロニクス株式会社 撮像装置
JP4672301B2 (ja) 2004-07-28 2011-04-20 富士フイルム株式会社 固体撮像装置及び固体撮像装置の製造方法
CN102291525B (zh) * 2010-06-18 2013-06-12 华晶科技股份有限公司 支架及具有该支架的摄像装置
KR20210138171A (ko) * 2014-03-07 2021-11-18 에이지씨 가부시키가이샤 반도체 소자 실장용 패키지의 제조 방법, 및 이형 필름
KR20220130832A (ko) * 2014-04-25 2022-09-27 쇼와덴코머티리얼즈가부시끼가이샤 감광성 엘리먼트, 적층체, 영구 마스크 레지스터 및 그 제조 방법 및 반도체 패키지의 제조 방법
CN105280664B (zh) * 2015-10-29 2024-09-06 格科微电子（上海）有限公司 摄像头模组
CN111193852B (zh) * 2016-03-28 2021-10-15 宁波舜宇光电信息有限公司 摄像模组及其制造方法
CN205961279U (zh) * 2016-08-01 2017-02-15 宁波舜宇光电信息有限公司 摄像模组及其模塑感光组件和成型模具
CN206977545U (zh) * 2017-06-30 2018-02-06 南昌欧菲光电技术有限公司 摄像模组及其感光组件
CN207216104U (zh) * 2017-08-14 2018-04-10 宁波舜宇光电信息有限公司 成像组件以及模塑模具、摄像模组和智能终端

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