JP7104776B2 - イメージングアセンブリとその製造方法、及びモールド金型、撮像モジュールとスマート端末 - Google Patents

イメージングアセンブリとその製造方法、及びモールド金型、撮像モジュールとスマート端末 Download PDF

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JP7104776B2
JP7104776B2 JP2020508336A JP2020508336A JP7104776B2 JP 7104776 B2 JP7104776 B2 JP 7104776B2 JP 2020508336 A JP2020508336 A JP 2020508336A JP 2020508336 A JP2020508336 A JP 2020508336A JP 7104776 B2 JP7104776 B2 JP 7104776B2
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Japan
Prior art keywords
mold
photosensitive
photosensitive element
flexible film
inclined inner
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JP2020508336A
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Japanese (ja)
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JP2020530664A5 (enExample
JP2020530664A (ja
Inventor
武彦 田中
立▲鋒▼ 姚
波杰 ▲趙▼
哲文 梅
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▲寧▼波舜宇光▲電▼信息有限公司
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Priority claimed from CN201710693245.0A external-priority patent/CN109387915B/zh
Priority claimed from CN201721013133.8U external-priority patent/CN207216104U/zh
Application filed by ▲寧▼波舜宇光▲電▼信息有限公司 filed Critical ▲寧▼波舜宇光▲電▼信息有限公司
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Publication of JP2020530664A5 publication Critical patent/JP2020530664A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B11/00—Filters or other obturators specially adapted for photographic purposes
    • G03B11/04—Hoods or caps for eliminating unwanted light from lenses, viewfinders or focusing aids
    • G03B11/045—Lens hoods or shields

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Light Receiving Elements (AREA)
  • Studio Devices (AREA)
JP2020508336A 2017-08-14 2018-07-19 イメージングアセンブリとその製造方法、及びモールド金型、撮像モジュールとスマート端末 Active JP7104776B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
CN201710693245.0 2017-08-14
CN201710693245.0A CN109387915B (zh) 2017-08-14 2017-08-14 成像组件及其制作方法以及模塑模具、摄像模组和智能终端
CN201721013133.8U CN207216104U (zh) 2017-08-14 2017-08-14 成像组件以及模塑模具、摄像模组和智能终端
CN201721013133.8 2017-08-14
PCT/CN2018/096305 WO2019033897A1 (zh) 2017-08-14 2018-07-19 成像组件及其制作方法以及模塑模具、摄像模组和智能终端

Publications (3)

Publication Number Publication Date
JP2020530664A JP2020530664A (ja) 2020-10-22
JP2020530664A5 JP2020530664A5 (enExample) 2020-12-03
JP7104776B2 true JP7104776B2 (ja) 2022-07-21

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JP2020508336A Active JP7104776B2 (ja) 2017-08-14 2018-07-19 イメージングアセンブリとその製造方法、及びモールド金型、撮像モジュールとスマート端末

Country Status (5)

Country Link
EP (1) EP3671302A4 (enExample)
JP (1) JP7104776B2 (enExample)
KR (1) KR102393994B1 (enExample)
TW (1) TWI716712B (enExample)
WO (1) WO2019033897A1 (enExample)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002110722A (ja) 2000-10-03 2002-04-12 Nitto Denko Corp 半導体チップの樹脂封止方法及び半導体チップ樹脂封止用離型フィルム
JP2004296584A (ja) 2003-03-26 2004-10-21 Sony Corp 固体撮像装置及びその製造方法
JP2006041277A (ja) 2004-07-28 2006-02-09 Fuji Photo Film Co Ltd 固体撮像装置及び固体撮像装置の製造方法
CN205961279U (zh) 2016-08-01 2017-02-15 宁波舜宇光电信息有限公司 摄像模组及其模塑感光组件和成型模具

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1471730A1 (en) * 2003-03-31 2004-10-27 Dialog Semiconductor GmbH Miniature camera module
JP4365743B2 (ja) * 2004-07-27 2009-11-18 富士通マイクロエレクトロニクス株式会社 撮像装置
CN102291525B (zh) * 2010-06-18 2013-06-12 华晶科技股份有限公司 支架及具有该支架的摄像装置
MY176963A (en) * 2014-03-07 2020-08-28 Agc Inc Process for producing package for mounting a semiconductor element and mold release film
WO2015163455A1 (ja) * 2014-04-25 2015-10-29 日立化成株式会社 感光性エレメント、積層体、永久マスクレジスト及びその製造方法並びに半導体パッケージの製造方法
CN105280664B (zh) * 2015-10-29 2024-09-06 格科微电子（上海）有限公司 摄像头模组
CN111193852B (zh) * 2016-03-28 2021-10-15 宁波舜宇光电信息有限公司 摄像模组及其制造方法
CN206977545U (zh) * 2017-06-30 2018-02-06 南昌欧菲光电技术有限公司 摄像模组及其感光组件
CN207216104U (zh) * 2017-08-14 2018-04-10 宁波舜宇光电信息有限公司 成像组件以及模塑模具、摄像模组和智能终端

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002110722A (ja) 2000-10-03 2002-04-12 Nitto Denko Corp 半導体チップの樹脂封止方法及び半導体チップ樹脂封止用離型フィルム
JP2004296584A (ja) 2003-03-26 2004-10-21 Sony Corp 固体撮像装置及びその製造方法
JP2006041277A (ja) 2004-07-28 2006-02-09 Fuji Photo Film Co Ltd 固体撮像装置及び固体撮像装置の製造方法
CN205961279U (zh) 2016-08-01 2017-02-15 宁波舜宇光电信息有限公司 摄像模组及其模塑感光组件和成型模具

Also Published As

Publication number Publication date
TWI716712B (zh) 2021-01-21
KR20200041320A (ko) 2020-04-21
TW201910900A (zh) 2019-03-16
EP3671302A4 (en) 2020-09-02
EP3671302A1 (en) 2020-06-24
KR102393994B1 (ko) 2022-05-03
JP2020530664A (ja) 2020-10-22
WO2019033897A1 (zh) 2019-02-21

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