TWI716712B - 成像組件及其製作方法以及模塑模具、攝像模組和智能終端 - Google Patents

成像組件及其製作方法以及模塑模具、攝像模組和智能終端 Download PDF

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Publication number
TWI716712B
TWI716712B TW107126931A TW107126931A TWI716712B TW I716712 B TWI716712 B TW I716712B TW 107126931 A TW107126931 A TW 107126931A TW 107126931 A TW107126931 A TW 107126931A TW I716712 B TWI716712 B TW I716712B
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TW
Taiwan
Prior art keywords
photosensitive element
flexible film
photosensitive
molded package
inclined inner
Prior art date
Application number
TW107126931A
Other languages
English (en)
Chinese (zh)
Other versions
TW201910900A (zh
Inventor
田中武彥
姚立鋒
趙波杰
梅哲文
Original Assignee
中國商寧波舜宇光電信息有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Priority claimed from CN201710693245.0A external-priority patent/CN109387915B/zh
Priority claimed from CN201721013133.8U external-priority patent/CN207216104U/zh
Application filed by 中國商寧波舜宇光電信息有限公司 filed Critical 中國商寧波舜宇光電信息有限公司
Publication of TW201910900A publication Critical patent/TW201910900A/zh
Application granted granted Critical
Publication of TWI716712B publication Critical patent/TWI716712B/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B11/00—Filters or other obturators specially adapted for photographic purposes
    • G03B11/04—Hoods or caps for eliminating unwanted light from lenses, viewfinders or focusing aids
    • G03B11/045—Lens hoods or shields

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Light Receiving Elements (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Studio Devices (AREA)
TW107126931A 2017-08-14 2018-08-02 成像組件及其製作方法以及模塑模具、攝像模組和智能終端 TWI716712B (zh)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
CN201710693245.0A CN109387915B (zh) 2017-08-14 2017-08-14 成像组件及其制作方法以及模塑模具、摄像模组和智能终端
CN201721013133.8 2017-08-14
CN201710693245.0 2017-08-14
??201721013133.8 2017-08-14
??201710693245.0 2017-08-14
CN201721013133.8U CN207216104U (zh) 2017-08-14 2017-08-14 成像组件以及模塑模具、摄像模组和智能终端

Publications (2)

Publication Number Publication Date
TW201910900A TW201910900A (zh) 2019-03-16
TWI716712B true TWI716712B (zh) 2021-01-21

Family

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TW107126931A TWI716712B (zh) 2017-08-14 2018-08-02 成像組件及其製作方法以及模塑模具、攝像模組和智能終端

Country Status (5)

Country Link
EP (1) EP3671302A4 (enExample)
JP (1) JP7104776B2 (enExample)
KR (1) KR102393994B1 (enExample)
TW (1) TWI716712B (enExample)
WO (1) WO2019033897A1 (enExample)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102291525A (zh) * 2010-06-18 2011-12-21 华晶科技股份有限公司 支架及具有该支架的摄像装置
TW201604655A (zh) * 2014-04-25 2016-02-01 日立化成股份有限公司 感光性元件、積層體、永久抗蝕罩幕及其製造方法以及半導體封裝的製造方法
CN205961279U (zh) * 2016-08-01 2017-02-15 宁波舜宇光电信息有限公司 摄像模组及其模塑感光组件和成型模具

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002110722A (ja) 2000-10-03 2002-04-12 Nitto Denko Corp 半導体チップの樹脂封止方法及び半導体チップ樹脂封止用離型フィルム
JP2004296584A (ja) 2003-03-26 2004-10-21 Sony Corp 固体撮像装置及びその製造方法
EP1471730A1 (en) * 2003-03-31 2004-10-27 Dialog Semiconductor GmbH Miniature camera module
JP4365743B2 (ja) * 2004-07-27 2009-11-18 富士通マイクロエレクトロニクス株式会社 撮像装置
JP4672301B2 (ja) 2004-07-28 2011-04-20 富士フイルム株式会社 固体撮像装置及び固体撮像装置の製造方法
KR20210138171A (ko) * 2014-03-07 2021-11-18 에이지씨 가부시키가이샤 반도체 소자 실장용 패키지의 제조 방법, 및 이형 필름
CN105280664B (zh) * 2015-10-29 2024-09-06 格科微电子（上海）有限公司 摄像头模组
CN111193852B (zh) * 2016-03-28 2021-10-15 宁波舜宇光电信息有限公司 摄像模组及其制造方法
CN206977545U (zh) * 2017-06-30 2018-02-06 南昌欧菲光电技术有限公司 摄像模组及其感光组件
CN207216104U (zh) * 2017-08-14 2018-04-10 宁波舜宇光电信息有限公司 成像组件以及模塑模具、摄像模组和智能终端

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102291525A (zh) * 2010-06-18 2011-12-21 华晶科技股份有限公司 支架及具有该支架的摄像装置
TW201604655A (zh) * 2014-04-25 2016-02-01 日立化成股份有限公司 感光性元件、積層體、永久抗蝕罩幕及其製造方法以及半導體封裝的製造方法
CN205961279U (zh) * 2016-08-01 2017-02-15 宁波舜宇光电信息有限公司 摄像模组及其模塑感光组件和成型模具

Also Published As

Publication number Publication date
JP7104776B2 (ja) 2022-07-21
WO2019033897A1 (zh) 2019-02-21
TW201910900A (zh) 2019-03-16
EP3671302A1 (en) 2020-06-24
KR102393994B1 (ko) 2022-05-03
EP3671302A4 (en) 2020-09-02
JP2020530664A (ja) 2020-10-22
KR20200041320A (ko) 2020-04-21

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