JP2020526934A5 - - Google Patents

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JP2020526934A5
JP2020526934A5 JP2020501522A JP2020501522A JP2020526934A5 JP 2020526934 A5 JP2020526934 A5 JP 2020526934A5 JP 2020501522 A JP2020501522 A JP 2020501522A JP 2020501522 A JP2020501522 A JP 2020501522A JP 2020526934 A5 JP2020526934 A5 JP 2020526934A5
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Japan
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JP2020501522A
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Japanese (ja)
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JP2020526934A (ja
JP7058319B2 (ja
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Priority claimed from CN201810283325.3A external-priority patent/CN108493183B/zh
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JP2020501522A 2018-04-02 2018-08-28 アレイ基板、ｃｏｆ、表示装置及び位置合わせ方法 Active JP7058319B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CN201810283325.3A CN108493183B (zh) 2018-04-02 2018-04-02 一种阵列基板、覆晶薄膜及其对位方法及显示装置
CN201810283325.3 2018-04-02
PCT/CN2018/102687 WO2019192137A1 (zh) 2018-04-02 2018-08-28 阵列基板、覆晶薄膜、显示装置及对位方法

Publications (3)

Publication Number Publication Date
JP2020526934A JP2020526934A (ja) 2020-08-31
JP2020526934A5 true JP2020526934A5 (enExample) 2020-10-08
JP7058319B2 JP7058319B2 (ja) 2022-04-21

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JP2020501522A Active JP7058319B2 (ja) 2018-04-02 2018-08-28 アレイ基板、ｃｏｆ、表示装置及び位置合わせ方法

Country Status (6)

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EP (1) EP3640980A4 (enExample)
JP (1) JP7058319B2 (enExample)
KR (1) KR20200008655A (enExample)
CN (1) CN108493183B (enExample)
TW (1) TWI659513B (enExample)
WO (1) WO2019192137A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110097823B (zh) * 2019-04-09 2021-02-02 深圳市华星光电半导体显示技术有限公司 显示面板及显示模组
CN110930866B (zh) * 2019-11-26 2021-07-06 Tcl华星光电技术有限公司 覆晶薄膜及显示装置
CN111081151A (zh) * 2020-01-08 2020-04-28 深圳市华星光电半导体显示技术有限公司 显示面板
CN115633548B (zh) * 2021-05-13 2025-03-07 京东方科技集团股份有限公司 电路板、覆晶膜、显示装置和绑定方法
KR102802969B1 (ko) * 2022-10-24 2025-05-08 세메스 주식회사 반도체 기판 장치와, 반도체 처리 방법 및 반도체 처리 장치

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11274670A (ja) * 1998-03-19 1999-10-08 Kyocera Corp 積層基板
JP4651886B2 (ja) * 2001-09-14 2011-03-16 東北パイオニア株式会社 電子機器及び電子機器の製造方法
JP4214357B2 (ja) * 2002-02-28 2009-01-28 セイコーエプソン株式会社 電子デバイスの製造方法
JP3544970B2 (ja) * 2002-09-30 2004-07-21 沖電気工業株式会社 Ｃｏｆテープキャリア、半導体素子、半導体装置
JP2006119321A (ja) * 2004-10-21 2006-05-11 Kofu Casio Co Ltd 電気回路間の導通接続構造
JP2006245514A (ja) * 2005-03-07 2006-09-14 Hitachi Media Electoronics Co Ltd フレキシブル基板同士の接続方法
CN100461984C (zh) * 2005-09-30 2009-02-11 友达光电股份有限公司 电路组装结构
TWI292936B (en) * 2006-03-24 2008-01-21 Chipmos Technologies Inc Inner lead bonding tape and tape carrier package utilizing the tape
TW200822303A (en) * 2006-11-07 2008-05-16 Chipmos Technologies Inc Substrate for chip on film packages
CN100545890C (zh) * 2007-03-22 2009-09-30 中华映管股份有限公司 显示面板、显示面板的引脚接合及检测方法
TWI343090B (en) * 2007-05-18 2011-06-01 Au Optronics Corp System and method for alignment
CN101060112B (zh) * 2007-06-11 2010-10-06 友达光电股份有限公司 基板对位系统及其对位方法
JP2012013719A (ja) * 2010-06-29 2012-01-19 Funai Electric Co Ltd Ｃｏｆアライメントマーク
US8994898B2 (en) * 2012-10-18 2015-03-31 Shenzhen China Star Optoelectronics Technology Co., Ltd COF base tape and manufacturing method thereof and liquid crystal display module comprising same
CN203365865U (zh) * 2013-07-04 2013-12-25 京东方科技集团股份有限公司 一种阵列基板、覆晶薄膜和显示装置
CN105551378A (zh) * 2016-02-04 2016-05-04 京东方科技集团股份有限公司 一种覆晶薄膜、柔性显示面板及显示装置
CN106783664B (zh) * 2017-01-03 2020-04-21 京东方科技集团股份有限公司 一种显示模组、绑定检测方法及绑定系统

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