JP2020526923A - Si間隙充填のための周期的な共形堆積/アニーリング/エッチング - Google Patents
Si間隙充填のための周期的な共形堆積/アニーリング/エッチング Download PDFInfo
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- JP2020526923A JP2020526923A JP2020500218A JP2020500218A JP2020526923A JP 2020526923 A JP2020526923 A JP 2020526923A JP 2020500218 A JP2020500218 A JP 2020500218A JP 2020500218 A JP2020500218 A JP 2020500218A JP 2020526923 A JP2020526923 A JP 2020526923A
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- 238000005530 etching Methods 0.000 title claims abstract description 27
- 238000000137 annealing Methods 0.000 title claims abstract description 21
- 238000011049 filling Methods 0.000 title abstract description 20
- 230000008021 deposition Effects 0.000 title abstract description 10
- 230000000737 periodic effect Effects 0.000 title 1
- 238000000034 method Methods 0.000 claims abstract description 61
- 229910021417 amorphous silicon Inorganic materials 0.000 claims abstract description 57
- 239000004065 semiconductor Substances 0.000 claims abstract description 30
- 238000000151 deposition Methods 0.000 claims abstract description 17
- 239000000758 substrate Substances 0.000 claims description 51
- 239000000463 material Substances 0.000 claims description 39
- 238000004519 manufacturing process Methods 0.000 claims description 16
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 9
- 239000012686 silicon precursor Substances 0.000 claims description 7
- 239000011800 void material Substances 0.000 claims description 7
- 229910052757 nitrogen Inorganic materials 0.000 claims description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 5
- 229910052799 carbon Inorganic materials 0.000 claims description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 4
- 229910052732 germanium Inorganic materials 0.000 claims description 4
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims description 4
- 239000002243 precursor Substances 0.000 claims description 4
- 229910052718 tin Inorganic materials 0.000 claims description 4
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 3
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 3
- 229910052787 antimony Inorganic materials 0.000 claims description 3
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 claims description 3
- 229910052786 argon Inorganic materials 0.000 claims description 3
- 229910052785 arsenic Inorganic materials 0.000 claims description 3
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 claims description 3
- 229910052796 boron Inorganic materials 0.000 claims description 3
- MROCJMGDEKINLD-UHFFFAOYSA-N dichlorosilane Chemical compound Cl[SiH2]Cl MROCJMGDEKINLD-UHFFFAOYSA-N 0.000 claims description 3
- 229910052733 gallium Inorganic materials 0.000 claims description 3
- 229910052734 helium Inorganic materials 0.000 claims description 3
- 229910052698 phosphorus Inorganic materials 0.000 claims description 3
- 239000011574 phosphorus Substances 0.000 claims description 3
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 2
- PZPGRFITIJYNEJ-UHFFFAOYSA-N disilane Chemical compound [SiH3][SiH3] PZPGRFITIJYNEJ-UHFFFAOYSA-N 0.000 claims description 2
- 229910000077 silane Inorganic materials 0.000 claims description 2
- VEDJZFSRVVQBIL-UHFFFAOYSA-N trisilane Chemical compound [SiH3][SiH2][SiH3] VEDJZFSRVVQBIL-UHFFFAOYSA-N 0.000 claims description 2
- 229910052738 indium Inorganic materials 0.000 claims 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 6
- 229910052710 silicon Inorganic materials 0.000 abstract description 6
- 239000010703 silicon Substances 0.000 abstract description 6
- 238000010586 diagram Methods 0.000 abstract description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
- 238000000231 atomic layer deposition Methods 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 3
- 238000005137 deposition process Methods 0.000 description 3
- 239000012528 membrane Substances 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 239000012159 carrier gas Substances 0.000 description 2
- 238000009616 inductively coupled plasma Methods 0.000 description 2
- 238000011417 postcuring Methods 0.000 description 2
- KZBUYRJDOAKODT-UHFFFAOYSA-N Chlorine Chemical compound ClCl KZBUYRJDOAKODT-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- CPELXLSAUQHCOX-UHFFFAOYSA-N Hydrogen bromide Chemical compound Br CPELXLSAUQHCOX-UHFFFAOYSA-N 0.000 description 1
- 239000005922 Phosphane Substances 0.000 description 1
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910003481 amorphous carbon Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- RJTANRZEWTUVMA-UHFFFAOYSA-N boron;n-methylmethanamine Chemical compound [B].CNC RJTANRZEWTUVMA-UHFFFAOYSA-N 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- ZOCHARZZJNPSEU-UHFFFAOYSA-N diboron Chemical compound B#B ZOCHARZZJNPSEU-UHFFFAOYSA-N 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 229910000078 germane Inorganic materials 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- QKCGXXHCELUCKW-UHFFFAOYSA-N n-[4-[4-(dinaphthalen-2-ylamino)phenyl]phenyl]-n-naphthalen-2-ylnaphthalen-2-amine Chemical compound C1=CC=CC2=CC(N(C=3C=CC(=CC=3)C=3C=CC(=CC=3)N(C=3C=C4C=CC=CC4=CC=3)C=3C=C4C=CC=CC4=CC=3)C3=CC4=CC=CC=C4C=C3)=CC=C21 QKCGXXHCELUCKW-UHFFFAOYSA-N 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 229910000064 phosphane Inorganic materials 0.000 description 1
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 238000004062 sedimentation Methods 0.000 description 1
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical compound [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 1
- 238000002230 thermal chemical vapour deposition Methods 0.000 description 1
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Abstract
【選択図】図1
Description
Claims (15)
- 半導体デバイスを製造するための方法であって、
基板の表面に形成された1つ又は複数の特徴であって、側壁及び底面を各々が有する1つ又は複数の特徴を有する前記基板を処理チャンバに配置することと、
1つ又は複数の特徴を有する前記基板の上にアモルファスシリコン膜を堆積することと、
前記アモルファスシリコン膜をアニーリングすることと、
前記アモルファスシリコン膜の一部をエッチングすることと
を含む方法。 - 前記アモルファスシリコン膜を堆積することが、シラン、ジシラン、ジクロロシラン、トリシラン、及びテトラシランからなる群から選択されたケイ素前駆体に前記基板を曝露することを含む、請求項1に記載の方法。
- 前記基板をホウ素、リン、ガリウム、スズ、ヒ素、ゲルマニウム、炭素、窒素、アンチモン又はインジウム前駆体に曝露すること
を更に含む、請求項2に記載の方法。 - 前記アモルファスシリコン膜の一部をエッチングすることが、前記アモルファスシリコン膜を、前記基板の上面の下方に、ある距離だけ凹ませることを含み、前記距離が、前記基板の前記上面と、前記1つ又は複数の特徴の1つ又は複数のボイドの最下部のボイドの底部との間の距離に等しい、請求項1に記載の方法。
- 半導体デバイスを製造するための方法であって、
基板の表面に形成された1つ又は複数の高アスペクト比のトレンチであって、側壁及び底面を各々が有する1つ又は複数の高アスペクト比のトレンチを有する前記基板を処理チャンバに配置することと、
前記1つ又は複数の高アスペクト比のトレンチにアモルファスシリコン膜を堆積することと、
前記アモルファスシリコン膜をアニーリングして、前記1つ又は複数の高アスペクト比のトレンチに形成された1つ又は複数のシームを解消することと、
前記アモルファスシリコン膜を、前記基板の上面の下方に、ある距離だけエッチングすることであって、前記距離が、前記基板の前記上面と、前記1つ又は複数の特徴の1つ又は複数のボイドの最下部のボイドの底部との間の距離に等しい、前記アモルファスシリコン膜をエッチングすることと
を含む方法。 - 前記アモルファスシリコン膜がドープされている、請求項5に記載の方法。
- 前記アモルファスシリコン膜を堆積することが、
前記基板をケイ素前駆体に曝露することと、
前記基板をホウ素、リン、ガリウム、スズ、ヒ素、ゲルマニウム、炭素、窒素、アンチモン又はインジウム前駆体に曝露することと
を含む、請求項6に記載の方法。 - 前記アモルファスシリコン膜を堆積することが、摂氏約150度から摂氏約500度の間の温度で、かつ約100mTorrから約350Torrの間の圧力で行われる、請求項7に記載の方法。
- 前記アモルファスシリコン膜をアニーリングすることが、摂氏約400度から摂氏約1100度の間の温度で、かつ約100mTorrから約1atmの間の圧力で行われる、請求項8に記載の方法。
- 前記アモルファスシリコン膜の一部をエッチングすることが、前記アモルファスシリコン膜を、NF3、Cl2、HCl、HBr、C4F6、C2F4、H2、Ar、He、及びN2のうちの1つ又は複数を含むエッチャントに曝露することを含む、請求項9に記載の方法。
- 半導体デバイスを製造するための方法であって、
基板の表面に形成された1つ又は複数の特徴であって、側壁及び底面を各々が有する1つ又は複数の特徴を有する基板を第1のチャンバに配置することと、
前記第1のチャンバで1つ又は複数の特徴を有する前記基板の上に材料を堆積することと、
前記第1のチャンバで前記材料をアニーリングして、前記材料の1つ又は複数のシームを解消することと、
前記1つ又は複数の特徴を有する前記基板を第2のチャンバに移送することと、
アニーリングされた前記材料の一部をエッチングして、アニーリングされた前記材料の1つ又は複数のボイドを除去することと
を含む方法。 - 前記材料がアモルファスシリコンである、請求項11に記載の方法。
- 前記材料を堆積することが、摂氏約150度から摂氏約500度の間の温度で、かつ約100mTorrから約350Torrの間の圧力で行われる、請求項11に記載の方法。
- 前記材料をアニーリングすることが、摂氏約400度から摂氏約1100度の間の温度で、かつ約100mTorrから約1atmの間の圧力で行われる、請求項13に記載の方法。
- アニーリングされた前記材料の一部をエッチングすることが、アニーリングされた前記材料を、前記基板の上面の下方に、ある距離だけ凹ませることを含み、前記距離が、前記基板の前記上面と、前記1つ又は複数の特徴の前記1つ又は複数のボイドの最下部のボイドの底部との間の距離に等しい、請求項14に記載の方法。
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