JP2020526011A - 光ガイドを使用して導電性バイアを形成する方法および構造体 - Google Patents
光ガイドを使用して導電性バイアを形成する方法および構造体 Download PDFInfo
- Publication number
- JP2020526011A JP2020526011A JP2019570506A JP2019570506A JP2020526011A JP 2020526011 A JP2020526011 A JP 2020526011A JP 2019570506 A JP2019570506 A JP 2019570506A JP 2019570506 A JP2019570506 A JP 2019570506A JP 2020526011 A JP2020526011 A JP 2020526011A
- Authority
- JP
- Japan
- Prior art keywords
- light guide
- photoresist
- photoresist layer
- metal
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/38—Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/40—Treatment after imagewise removal, e.g. baking
- G03F7/405—Treatment with inorganic or organometallic reagents after imagewise removal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/428—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates having a metal pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09645—Patterning on via walls; Plural lands around one hole
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0514—Photodevelopable thick film, e.g. conductive or insulating paste
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0562—Details of resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1377—Protective layers
- H05K2203/1383—Temporary protective insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
- H05K3/424—Plated through-holes or plated via connections characterised by electroplating method by direct electroplating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Inorganic Chemistry (AREA)
- Organic Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Optical Couplings Of Light Guides (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
Description
ポジティブ・トーン・フォトレジスト・プロセス
ネガティブ・トーン・フォトレジスト・プロセス
光ガイド
Claims (11)
- バイアを形成するための方法であって、前記方法が、
基材の面に垂直な方向に前記基材内にバイアを設けることと、
前記バイアの内部表面にフォトレジスト層を塗布することと、
前記バイアの中に光ガイドを挿入することと、
前記光ガイドによって、前記フォトレジスト層の一部を光にさらし、それによって、前記フォトレジスト層の露光部分および前記フォトレジスト層の非露光部分をもたらすことと、
前記フォトレジスト層の一部を除去することと、
前記フォトレジストが除去された前記バイアの区域を金属でめっきし、それによって、金属でめっきされた前記バイアの部分および金属でめっきされていない前記バイアの部分をもたらすことと
を含む、方法。 - 前記光ガイドの外面の一部がマスクされている、請求項1に記載の方法。
- 前記フォトレジスト層がポジティブ・トーン・フォトレジスト材料である、請求項1または2に記載の方法。
- 前記除去することが、前記フォトレジスト層の前記露光部分を除去することを含む、請求項3に記載の方法。
- 前記フォトレジスト層がネガティブ・トーン・フォトレジスト材料である、請求項1または2に記載の方法。
- 前記除去することが、前記フォトレジスト層の前記非露光部分を除去することを含む、請求項5に記載の方法。
- 前記除去することが、前記バイアをフォトレジスト現像液で洗浄することを含む、請求項1ないし6のいずれかに記載の方法。
- 前記基材が、前記基材の面に垂直な方向に、少なくとも2つの銅ライン、および前記少なくとも2つの銅ラインを分離する少なくとも1つの絶縁体層を含み、前記バイアが前記少なくとも2つの銅ラインと交差している、請求項1ないし7のいずれかに記載の方法。
- 前記光ガイドの外面の一部がマスクされている、請求項8に記載の方法。
- 前記光ガイドの前記マスクされた部分が、1つまたは複数のマスクされていない領域によって分離された2つ以上のマスクされた領域を有する、請求項9に記載の方法。
- 構造体であって、
光源と、
前記光源に取り付けられた光ガイドであり、前記光源からの光を伝送することができる、光ガイドと、
前記光ガイドの表面の一部におけるマスクであり、それによって、前記光ガイドの覆われていない部分および前記光ガイドの覆われた部分をもたらし、前記光ガイドの少なくとも一部が、プリント回路基板のバイアの中に挿入され得るように設計されている、マスクと
を備える、構造体。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15/635,374 US10481496B2 (en) | 2017-06-28 | 2017-06-28 | Forming conductive vias using a light guide |
US15/635,374 | 2017-06-28 | ||
PCT/IB2018/054316 WO2019003016A1 (en) | 2017-06-28 | 2018-06-13 | FORMING CONDUCTIVE INTERCONNECTION HOLES USING AN OPTICAL WAVEGUIDE |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2020526011A true JP2020526011A (ja) | 2020-08-27 |
JP2020526011A5 JP2020526011A5 (ja) | 2020-10-08 |
JP7064272B2 JP7064272B2 (ja) | 2022-05-10 |
Family
ID=64738653
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019570506A Active JP7064272B2 (ja) | 2017-06-28 | 2018-06-13 | 光ガイドを使用して導電性バイアを形成する方法および構造体 |
Country Status (6)
Country | Link |
---|---|
US (2) | US10481496B2 (ja) |
JP (1) | JP7064272B2 (ja) |
CN (1) | CN110710339B (ja) |
DE (1) | DE112018003324T5 (ja) |
GB (1) | GB2579456B (ja) |
WO (1) | WO2019003016A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10481496B2 (en) * | 2017-06-28 | 2019-11-19 | International Business Machines Corporation | Forming conductive vias using a light guide |
TWI782696B (zh) * | 2021-09-06 | 2022-11-01 | 先豐通訊股份有限公司 | 具有多網路通孔的線路板及其製作方法 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63182888A (ja) * | 1987-01-26 | 1988-07-28 | 関西ペイント株式会社 | プリント配線板の製造方法 |
JPH04326717A (ja) * | 1991-04-26 | 1992-11-16 | Yokogawa Electric Corp | 3次元露光方法 |
JPH05206644A (ja) * | 1992-01-08 | 1993-08-13 | Nec Corp | 印刷配線板の製造方法 |
JPH1041622A (ja) * | 1996-07-26 | 1998-02-13 | Kenseidou Kagaku Kogyo Kk | 配線基体のスルーホール形成方法 |
JP2002516386A (ja) * | 1998-05-22 | 2002-06-04 | ビーエムシー インダストリーズ,インコーポレイティド | 筒状物品を製造する方法及び装置 |
WO2003072967A1 (fr) * | 2002-02-28 | 2003-09-04 | Fujitsu Limited | Procede de fabrication de palier sous pression dynamique, palier sous pression dynamique, et dispositif de fabrication de palier sous pression dynamique |
JP2006053337A (ja) * | 2004-08-11 | 2006-02-23 | Fujitsu Ltd | フォトマスク装置、フォトマスク製造方法およびマスクパターン形成方法 |
US20100044095A1 (en) * | 2008-08-19 | 2010-02-25 | International Business Machines Corporation | Via Stub Elimination |
Family Cites Families (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56132326A (en) | 1980-03-19 | 1981-10-16 | Matsushita Electric Ind Co Ltd | Exposure method and exposure device |
US4357205A (en) * | 1980-09-23 | 1982-11-02 | Siemens Aktiengesellschaft | Method for etched and/or galvanic production of ring zones in small diameter holes |
US4888450A (en) * | 1981-12-11 | 1989-12-19 | At&T Bell Laboratories | Circuit board fabrication leading to increased capacity |
JPS6254433A (ja) | 1985-09-03 | 1987-03-10 | Fujitsu Ltd | 半導体基板の検査方法 |
US5147760A (en) | 1989-07-21 | 1992-09-15 | Mitsubishi Denki Kabushiki Kaisha | Method of exposing printed wiring boards having through holes |
US5246813A (en) | 1989-07-21 | 1993-09-21 | Mitsubishi Denki Kabushiki Kaisha | Method of exposing printed wiring boards having through holes |
US5082755A (en) | 1989-10-02 | 1992-01-21 | General Electric Company | Liquid crystal programmable photoresist exposure method for making a set of masks |
JP3400067B2 (ja) * | 1994-03-16 | 2003-04-28 | 富士通株式会社 | 印刷配線板の導体切断方法及び装置 |
TW312079B (ja) * | 1994-06-06 | 1997-08-01 | Ibm | |
US6312876B1 (en) | 1999-07-08 | 2001-11-06 | Taiwan Semiconductor Manufacturing Company | Method for placing identifying mark on semiconductor wafer |
JP4048019B2 (ja) * | 2000-08-31 | 2008-02-13 | 富士通株式会社 | 多層配線基板及びその製造方法 |
JP4326717B2 (ja) | 2001-04-19 | 2009-09-09 | 日立建機株式会社 | ケーシング回転掘削装置のスペーサ取付装置 |
US6682875B2 (en) | 2001-06-18 | 2004-01-27 | Bmc Industries, Inc. | Method and apparatus for imaging with fiber optic arrays on non-flat surfaces |
JP2003204157A (ja) * | 2001-12-28 | 2003-07-18 | Toshiba Corp | 多層プリント配線板、多層プリント配線板を搭載した電子機器および多層プリント配線板の製造方法 |
US7802360B2 (en) | 2003-01-29 | 2010-09-28 | General Dynamics Advanced Information Systems, Inc. | Methods for filling holes in printed wiring boards |
KR20050038427A (ko) | 2003-10-22 | 2005-04-27 | 삼성전자주식회사 | 반도체 소자 제조장비에서의 기판 주변부 노광장치 |
TWI244143B (en) * | 2004-03-02 | 2005-11-21 | Via Tech Inc | Process of plating through hole |
TWI242783B (en) * | 2004-10-20 | 2005-11-01 | Ind Tech Res Inst | Cut via structure for and manufacturing method of connecting separate conductors |
KR20060096199A (ko) | 2005-03-03 | 2006-09-11 | 태산엘시디 주식회사 | 도광판 제작용 스탬퍼의 제조방법 |
CN1924382A (zh) * | 2005-08-31 | 2007-03-07 | 台达电子工业股份有限公司 | 动压轴承制作方法 |
US20070152771A1 (en) | 2006-01-05 | 2007-07-05 | Lei Shan | Apparatus and method of via-stub resonance extinction |
US7676920B2 (en) | 2006-10-16 | 2010-03-16 | Dell Products L.P. | Method of processing a circuit board |
EP2099268A1 (en) * | 2008-03-07 | 2009-09-09 | Atotech Deutschland Gmbh | Non-etching adhesion composition, method of preparing a work piece and method of forming coppper structures on a circuit carrier substrate |
JP5206644B2 (ja) | 2009-10-22 | 2013-06-12 | 株式会社豊田自動織機 | ディーゼルエンジンの排気ガス浄化装置 |
TWI443652B (zh) * | 2010-02-06 | 2014-07-01 | Hon Hai Prec Ind Co Ltd | 導光裝置及具有該導光裝置的固定裝置 |
US8302301B2 (en) | 2010-03-31 | 2012-11-06 | Flextronics Ap, Llc | Method for backdrilling via stubs of multilayer printed circuit boards with reduced backdrill diameters |
US9560742B2 (en) | 2014-11-11 | 2017-01-31 | Alcatel Lucent | Backdrill reliability anchors |
CN105813404B (zh) | 2014-12-31 | 2018-07-06 | 先丰通讯股份有限公司 | 电路板的孔内加工方法及其所制成的电路板导光元件 |
CN106816495A (zh) * | 2016-12-20 | 2017-06-09 | 北京有色金属研究总院 | 一种砷化镓光导开关的制备方法 |
US10481496B2 (en) * | 2017-06-28 | 2019-11-19 | International Business Machines Corporation | Forming conductive vias using a light guide |
-
2017
- 2017-06-28 US US15/635,374 patent/US10481496B2/en active Active
-
2018
- 2018-06-13 GB GB2000790.2A patent/GB2579456B/en active Active
- 2018-06-13 CN CN201880035594.6A patent/CN110710339B/zh active Active
- 2018-06-13 WO PCT/IB2018/054316 patent/WO2019003016A1/en active Application Filing
- 2018-06-13 DE DE112018003324.4T patent/DE112018003324T5/de active Pending
- 2018-06-13 JP JP2019570506A patent/JP7064272B2/ja active Active
-
2019
- 2019-09-13 US US16/569,903 patent/US10712664B2/en active Active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63182888A (ja) * | 1987-01-26 | 1988-07-28 | 関西ペイント株式会社 | プリント配線板の製造方法 |
JPH04326717A (ja) * | 1991-04-26 | 1992-11-16 | Yokogawa Electric Corp | 3次元露光方法 |
JPH05206644A (ja) * | 1992-01-08 | 1993-08-13 | Nec Corp | 印刷配線板の製造方法 |
JPH1041622A (ja) * | 1996-07-26 | 1998-02-13 | Kenseidou Kagaku Kogyo Kk | 配線基体のスルーホール形成方法 |
JP2002516386A (ja) * | 1998-05-22 | 2002-06-04 | ビーエムシー インダストリーズ,インコーポレイティド | 筒状物品を製造する方法及び装置 |
WO2003072967A1 (fr) * | 2002-02-28 | 2003-09-04 | Fujitsu Limited | Procede de fabrication de palier sous pression dynamique, palier sous pression dynamique, et dispositif de fabrication de palier sous pression dynamique |
JP2006053337A (ja) * | 2004-08-11 | 2006-02-23 | Fujitsu Ltd | フォトマスク装置、フォトマスク製造方法およびマスクパターン形成方法 |
US20100044095A1 (en) * | 2008-08-19 | 2010-02-25 | International Business Machines Corporation | Via Stub Elimination |
Also Published As
Publication number | Publication date |
---|---|
GB2579456B (en) | 2022-01-26 |
US20190004428A1 (en) | 2019-01-03 |
US20200004154A1 (en) | 2020-01-02 |
US10712664B2 (en) | 2020-07-14 |
WO2019003016A1 (en) | 2019-01-03 |
GB202000790D0 (en) | 2020-03-04 |
DE112018003324T5 (de) | 2020-03-12 |
CN110710339A (zh) | 2020-01-17 |
JP7064272B2 (ja) | 2022-05-10 |
CN110710339B (zh) | 2022-08-30 |
US10481496B2 (en) | 2019-11-19 |
GB2579456A (en) | 2020-06-24 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR20020016807A (ko) | 광·전기배선기판, 실장기판 및 광·전기배선기판의제조방법 | |
JP2009093177A (ja) | フォトリソグラフィを用いた内部光学経路を備えた回路基板の製造方法 | |
JP7064272B2 (ja) | 光ガイドを使用して導電性バイアを形成する方法および構造体 | |
JP2015133473A (ja) | 多層基板および多層基板の製造方法 | |
US20140119703A1 (en) | Printed Circuit Board Comprising Both Conductive Metal and Optical Elements | |
JP2002107560A (ja) | 実装用基板 | |
JP5049145B2 (ja) | 光導波路デバイスの製法 | |
JP2007264164A (ja) | 金属パターンの形成方法および光接続構造の製造方法 | |
JP2002182049A (ja) | 実装用基板及びそれの製造方法並びにその実装用基板を用いたデバイスの搭載構造 | |
KR20010074918A (ko) | 다층 회로의 제조방법 | |
US20050164131A1 (en) | Substrate optical waveguides having fiber-like shape and methods of making the same | |
JP4538949B2 (ja) | 光部品搭載用基板製造方法 | |
CN101206287A (zh) | 光电基板及其制造方法 | |
JP3699334B2 (ja) | 配線回路基板の製造方法およびフォトマスク | |
US20140119688A1 (en) | Circuit board and manufacturing method thereof and electro-optic apparatus having the circuit board | |
JP2000340906A (ja) | 光・電気配線基板及びその製造方法並びに実装基板 | |
JP4590722B2 (ja) | 光部品搭載用基板製造方法 | |
JP2005164762A (ja) | 光接続構造およびその製造方法 | |
CN109788661B (zh) | 柔性电路板及该柔性电路板的制备方法 | |
KR100787385B1 (ko) | 리드선 없이 인쇄 회로 기판에 전해 금도금을 수행하는 방법 | |
CN113316327B (zh) | 电路板金手指的制作方法和带有金手指的电路板 | |
WO2004038471A1 (en) | An optical board with electrical and optical wiring layers and a method of its production | |
US20230232546A1 (en) | Manufacturing process of rigid-flex board | |
US20230230929A1 (en) | Packaging process for embedded chips | |
KR101519545B1 (ko) | 차량 블랙박스용 회로기판의 제조방법 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20200722 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20201130 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20211012 |
|
RD12 | Notification of acceptance of power of sub attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7432 Effective date: 20211215 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A821 Effective date: 20211216 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20220111 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20220412 |
|
RD14 | Notification of resignation of power of sub attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7434 Effective date: 20220413 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20220420 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 7064272 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |