JP2020518457A - 拡散はんだ接合を形成するためのはんだプリフォームおよびはんだプリフォームを形成するための方法 - Google Patents
拡散はんだ接合を形成するためのはんだプリフォームおよびはんだプリフォームを形成するための方法 Download PDFInfo
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- JP2020518457A JP2020518457A JP2019558564A JP2019558564A JP2020518457A JP 2020518457 A JP2020518457 A JP 2020518457A JP 2019558564 A JP2019558564 A JP 2019558564A JP 2019558564 A JP2019558564 A JP 2019558564A JP 2020518457 A JP2020518457 A JP 2020518457A
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- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0233—Sheets, foils
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- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
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- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
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Abstract
Description
Claims (18)
- ・第1の接合パートナー(14)のための第1の接合面(12)と、第2の接合パートナー(17)のための第2の接合面(13)とを備え、
・はんだ材料から成る第1の相(20)と、金属材料から成る第2の相(18)とを含む構造から成る、
拡散はんだ接合を形成するためのはんだプリフォームであって、
前記はんだプリフォーム内に、前記第1の相(20)の材料と前記第2の相(18)の材料とから成る拡散ゾーン(19)が形成され、
・前記第1の接合面(12)と前記第2の接合面(13)は、前記第1の相(20)によって全体的にまたは部分的に形成され、
・前記拡散ゾーン(19)は金属間化合物を有する、
ことを特徴とするはんだプリフォーム。 - 前記拡散ゾーン(19)と前記第1の接合面(12)との間、および前記拡散ゾーン(19)と前記第2の接合面(13)との間には、少なくとも1μm〜最大30μm、好ましくは少なくとも5μm〜最大10μmの範囲の間隔があることを特徴とする、請求項1に記載のはんだプリフォーム。
- ・前記拡散ゾーン(19)と前記第1の接合面(12)との間、および前記拡散ゾーン(19)と前記第2の接合面(13)との間には、少なくとも1μm、多くとも30μm、好ましくは少なくとも5μm、多くとも10μmの範囲の間隔があり、
・前記拡散ゾーン(19)と前記第1の接合面(12)との間、および前記拡散ゾーン(19)と前記第2の接合面(13)との間の前記間隔は、前記接合面(12)の下側の範囲の少なくとも50%、好ましくは少なくとも70%、より好ましくは少なくとも90%を占める、
ことを特徴とする、請求項1に記載のはんだプリフォーム。 - 300秒未満のはんだ付け時間、特に60〜150秒のはんだ付け時間において、前記第1の接合面(12)から前記第2の接合面(13)までの前記拡散ゾーンを通るはんだプリフォームの完全な浸透が形成されるように前記金属間化合物が形成されることを特徴とする、請求項1から3のいずれか1項に記載のはんだプリフォーム。
- 270℃未満の温度範囲、特に220℃〜260℃の温度範囲において、前記第1の接合面(12)から前記第2の接合面(13)までの前記拡散ゾーンを通るはんだプリフォームの完全な浸透が行われるように前記金属化合物が形成されることを特徴とする、請求項1から4のいずれか1項に記載のはんだプリフォーム。
- 前記第1の相(20)および前記第2の相(18)は、はんだプリフォームに層として形成され、
それぞれの前記層の間に前記拡散ゾーン(19)が中間層として形成されることを特徴とする、請求項1から5のいずれか1項に記載のはんだプリフォーム。 - 前記第2の相(18)は、前記第1の相(20)のマトリックス中に分散された粒子の形態であることを特徴とする、請求項1から5のいずれか1項に記載のはんだプリフォーム。
- 前記拡散ゾーンは、前記金属間化合物の粒子を結合する構造(25)を含むことを特徴とする、請求項7に記載のはんだプリフォーム。
- 前記第2の相(18)は、前記第1の相(20)のマトリックスによって取り囲まれた一体型の空間構造(26)を形成することを特徴とする、請求項1から5のいずれか1項に記載のはんだプリフォーム。
- はんだ材料から成る第1の相(20)と金属材料から成る第2の相(18)とが互いに接合されてはんだプリフォームを形成する、はんだプリフォーム(11)を製造する方法において、
はんだプリフォームに熱処理を施し、その際
・熱処理中に、前記第1の相(20)と前記第2の相(18)との間に金属間化合物を有する拡散ゾーン(19)を形成し、
・第1の接合パートナー(14)のための第1の接合面(12)および第2の接合パートナー(17)のための第2の接合面(13)に、前記第1の相(20)が全体的にまたは部分的に形成されたままである、
はんだプリフォームの製造方法。 - 前記はんだプリフォーム(11)は、前記熱処理中に、前記第1の接合面(12)と前記第2の接合面(13)とに係合する2つの保持装置(21)の間に挿入されることを特徴とする、請求項10に記載の方法。
- プレート(32)が中間生成物として形成され、前記プレート(32)を分割することにより多数のはんだプリフォームが得られることを特徴とする、請求項10または11に記載の方法。
- ・前記第1の相(20)は層の形態で使用され、前記第2の相(18)は粒子の形態で使用され、
・前記層と前記粒子とが交互に積層され、
・前記粒子は前記層に埋め込まれている、
ことを特徴とする、請求項10から12のいずれか1項に記載の方法。 - 前記粒子が設けられた層が積層される前に、前記粒子がバインダ(20a)で前記層上に固定されることを特徴とする、請求項13に記載の方法。
- ・前記第2の相(18)は、粒子の形態で、または前記保持装置(21)間の一体型の空間構造の形態で配置され、
・前記第2の相(18)は、溶融した前記第1の相(20)によって浸透される、
ことを特徴とする、請求項11に記載の方法。 - ・前記第2の相(18)は、前記保持装置(21)の一方の上に一体型の空間構造の形態で配置され、
・前記第2の相(18)は、はんだペーストの形態で前記第1の相(20)に埋め込まれ、
・前記保持装置(21)の他方は、製造すべきはんだプリフォーム上に配置される、
ことを特徴とする、請求項11に記載の方法。 - 前記はんだペーストの2つの層間に前記一体型の空間構造(26)が埋め込まれることを特徴とする、請求項16に記載の方法。
- ・第2の相(18)は、一体型の空間構造(26)の形態で使用され、
・前記空間構造(26)は、溶融した前記第1の相(20)に浸漬される、
ことを特徴とする、請求項10から12のいずれか1項に記載の方法。
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DE102017206932.5 | 2017-04-25 | ||
PCT/EP2018/060296 WO2018197390A1 (de) | 2017-04-25 | 2018-04-23 | Lotformteil zum erzeugen einer diffusionslötverbindung und verfahren zum erzeugen eines lotformteils |
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