CN110545950A - 用于产生扩散焊接连接的焊料成形件和用于产生焊料成形件的方法 - Google Patents
用于产生扩散焊接连接的焊料成形件和用于产生焊料成形件的方法 Download PDFInfo
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- CN110545950A CN110545950A CN201880026942.3A CN201880026942A CN110545950A CN 110545950 A CN110545950 A CN 110545950A CN 201880026942 A CN201880026942 A CN 201880026942A CN 110545950 A CN110545950 A CN 110545950A
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- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0233—Sheets, foils
- B23K35/0238—Sheets, foils layered
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
- B23K35/025—Pastes, creams, slurries
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- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
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Abstract
本发明涉及一种用于产生扩散焊接连接的焊料成形件。该焊料成形件(11)具有焊料(20),通过焊料也形成焊料成形件(11)的接合面(12、13)。根据本发明规定,在焊料成形件中设置例如形式为颗粒的另外的相(18),该相的材料扩散到焊料(20)中,并且因此形成扩散区(19)。根据本发明规定,在焊料成形件的制造期间就已经在焊料成形件中引入该扩散过程(例如通过热处理),从而在随后焊接所述焊料成形件(11)时更快地构造扩散焊接连接。此外,在焊料(20)液化时,可由金属间化合物形成的扩散区(19)使焊料成形件稳定。根据本发明还规定,在接合面(12、13)上还可获得焊料以构造与相邻的接合配对件的焊接连接。本发明还涉及用于制造这种焊料成形件的方法。
Description
本发明涉及一种用于产生扩散焊接连接的焊料成形件(Lotformteil)。该焊料成形件具有用于第一接合配对件的第一接合面和用于第二接合配对件的第二接合面。焊料成形件由微结构构成,微结构具有由焊料构成的第一相和由金属材料构成的第二相。此外,本发明还涉及用于产生焊料成形件的方法,其中,将由焊料构成的第一相和由金属材料构成的第二相接合成焊料成形件。
例如由DE 10 2013 219 642 A1已知用于安装两个接合配对件的扩散焊接连接的应用。在接合配对件之间构造扩散焊接连接时,基于扩散过程形成焊接连接,焊接连接具有金属间相,金属间相具有比剩余的由焊接合金构成的焊接连接更高的熔点。由此可能的是,使接合配对件之间的连接热稳定和机械稳定。
接合配对件例如可以提供由铜构成的接触材料。扩散焊料可以是包含锡的焊料。通过在构造焊接连接期间铜扩散到焊料中而产生扩散区,所述扩散区通过铜与锡之间的金属间化合物形成。扩散区具有大约420°的熔点,该熔点因此明确地位于基于锡的焊料的熔化温度以上。基于必需的扩散过程,扩散区不能够任意深地延伸到焊料中。因此,待构造的焊接连接局限于特定的厚度。因此,根据DE 10 2013 219 642 A1建议,如此形成至少一个所述接合配对件,使得在接合配对件之间的接合缝隙的区域中产生空腔。例如可以通过在其中一个接合配对件的安装面中设置凹陷部来构造空腔。空腔在接合时用作缓冲空间,剩余的焊料可以逸出到缓冲空间中,从而即使在出现数量公差时,也可以确保接合配对件之间的缝隙宽度,该缝隙宽度确保在接合缝隙的整个宽度上可靠地形成扩散区。
此外,根据D.Feil的“Fügekonzepte für Leistungsmodule an(用于冷却体上的功率模块的接合方案)”,Elektronische Baugruppen und Leiterplatten(电子组件和电路板),第60-64页,柏林,奥芬巴赫,2016已知的是,如果将柔软的成形件、例如铜网置入接合缝隙中,那么在构造扩散焊接连接时也可以跨接接合配对件之间的更大的接合缝隙。在接合缝隙上可以放置焊箔,其中,焊料在液化时填充柔软的成形件之间的间隙。成形件在此提供可扩散到焊料中的材料。因为扩散材料不仅通过接合配对件的界面提供,而且也可在焊接连接内部提供,所以即使在较大的接合缝隙的情况下,也可以在接合配对件之间形成连续的扩散区。
Feil也描述了构造扩散焊接连接的另一可能性,其中,替代柔软的成形件地使用金属粉,例如铜粉。金属粉混合到焊料中并且在焊料中分布开地提供了能够扩散到焊料连接中以形成扩散区的材料。由此,在焊接连接中也可以产生扩散区,扩散区跨接两个接合配对件之间的缝隙。
根据US 2009/004500 A1已知的是,可以通过在焊接期间将组分从液相扩散到固相来产生两个接合配对件之间的扩散焊接连接。在此,在接合配对件之间使用包含双组分的焊料。为了可以建立焊接连接,将焊料成形件放置在接合配对件之间,焊料成形件由第一组分和第二组分的层组成的三明治结构构成。由此可能的是,使扩散中的元素的扩散路径保持尽可能短,从而在接合配对件之间产生机械稳定的连接。
在建立焊接连接时,使用焊料成形件需要高的精密性,因为该焊接连接为了构造可靠的触点接通而必须接触两个接合配对件,并且正在形成的焊接连接中的扩散路径不能太大。精密性与一定的制造费用和由此形成的成本相关联。为了使扩散路径保持微小,可以使用特别薄的焊料成形件。该焊料成形件然而需要接合配对件的非常平坦的和干净的表面和对接合精度的更高要求。也不能够出于缩短扩散路径的目的而制造任意薄的成形件。金属间相的相生长所需的时间也不能够任意最小化。也必须注意接合配对件的热负载,热负载限制了热处理的允许处理时间。
本发明所要解决的技术问题在于,给出一种用于扩散焊接的焊料成形件(或称为焊料预制件或焊料预成型件)或用于制造这种焊料成形件的方法,其中,焊料成形件在处理和安装扩散焊接连接时应该是简单的,并且在接合扩散焊接连接时的热负载应该是比较小的。
根据本发明,该技术问题利用开头说明的焊料成形件解决,其方法是,在焊料成形件中形成由第一相的材料和第二相的材料构成的扩散区,其中,第一接合面和第二接合面完全或部分通过第一相构造。在此,第一相和第二相是互溶的,即优选地,第二相的金属材料扩散到第一相中,如果热能足以用于此的话。此时尤其是如下情况,即,由焊料制成的第一相为了构造扩散焊接连接的目的被熔化。第二相在此具有更高的熔点,并且因此在构造扩散焊接连接时没有熔化。扩散过程有利地在结束时导致金属间相的形成,金属间相由第一相和第二相的组分形成,并且具有比焊料更高的熔点。第一相例如可以是基于锡的焊料(尤其是锡-银-铜焊料、例如具有合金组成SN96.5Ag3Cu0.5的SAC305,或锡-铜焊料,例如具有合金组成Sn99.3Cu0.7),而第二相由溶解在第一相中并且可以扩散到第一相中的金属、优选铜构成。
根据本发明的构思是,在焊料成形件中形成的扩散区尚未达到扩散过程的最后阶段。因此有利地,焊料成形件还可以在扩散焊接过程的范围内用于利用扩散焊接连接来连接两个接合配对件。为此可使用第一接合面和第二接合面,其中尤其地,在这两个接合面上都还形成或者说构造有第一相。因此,焊料仍然可用于形成扩散区,扩散区例如可以以如下方式形成,即接合配对件将也在第二相中存在的金属材料贡献用于形成扩散区。
在构造扩散焊接连接时,将焊料成形件加热到出现另外的扩散过程的温度,另外的扩散过程使扩散焊接连接的构造完成。尤其是可以形成金属间相,金属间相也一直延伸到接合面,并且因此导致接合配对件之间的可靠的扩散焊接连接。在焊接焊料成形件之前,在内部存在的扩散区也可以已经至少部分具有金属间相。这与焊料成形件承受多长时间的触发扩散的热处理有关。仅重要的是,在接合面处仍有足够的第一相焊料可供使用以构造扩散焊接连接。
根据本发明的另一实施方案规定,在扩散区(19)与第一接合面(12)之间以及在扩散区(19)与第二接合面(13)之间存在最小间距,最小间距在至少1μm且最高30μm、优选至少5μm且最高10μm的范围内。通过根据本发明设置的间距确保的是,可以利用比较小的热输入完成接合配对件与焊料成形件之间的扩散焊接连接。因此可能有利的是,扩散焊接连接和电子组件的另外的焊接连接一起制造。在正常情况下,为了建立扩散焊接连接需要比针对常规的焊接连接明显更高的温度。然而,由于在焊料成形件中例如通过热处理已经开始的扩散过程,具有金属间化合物的扩散区的形成不必完全通过焊接过程产生。因此有利地,常规的焊接的加工时间和温度是足够的,因此,即使当除了扩散焊接连接以外还应该制造常规的焊接连接时,也可以在唯一的焊接过程中制造所述组件。例如可以在回流焊炉中焊接这种电子组件。
为了在扩散焊接连接中产生扩散区(其从一个接合面一直延伸到另一接合面),最小间距不必分布在接合面的整个面上。但最小间距应该根据本发明的有利的设计方案至少存在于接合面下方的子区域中。
根据本发明的另外的实施方案规定,在扩散区(19)与第一接合面(12)之间以及在扩散区(19)与第二接合面(13)之间存在间距,该间距在至少1μm且最高30μm、优选至少5μm且最高10μm的范围内,其中,在扩散区(19)与第一接合面(12)之间以及在扩散区(19)与第二接合面(13)之间的提到的间距在接合面(12)下方的至少50%、优选至少70%并且更优选至少90%的区域中存在。由此有利地可以确保的是,至少在接合面的主要部分中构造出扩散连接。这有效地稳定了焊接连接,即使当在焊接连接中仍然有焊料残留时也是如此。
根据本发明的另外的实施方案规定,金属间化合物所形成的程度使得可以在小于300秒的焊接时间内、尤其是在60-150秒的焊接时间内形成从第一接合面(12)到第二接合面(13)由扩散区对焊料成形件的完全穿透。也就是说已经证明,可以通过确定扩散区与接合面之间的间距的大小来直接影响焊接时间。以该方式实现的是,焊料成形件设计为,使焊料成形件尤其是可以与常规的焊接连接一起焊接。
根据本发明的另外的实施方案规定,金属间化合物所形成的程度使得可以在小于270℃的温度范围内、尤其是在220℃至260℃的温度范围内进行从第一接合面(12)到第二接合面(13)由扩散区对焊料成形件的完全穿透。也就是说已经证明,通过适当确定扩散区与接合面之间的间距的大小可以降低焊接温度,其中,焊接温度可以调节为,使扩散连接可以与常规的焊接连接一起焊接。
在用于产生焊料成形件的方法中(其中,将由焊料构成的第一相和由金属材料构成的第二相接合成焊料成形件),为了构造具有金属间化合物的扩散区可以规定,执行热处理(随后对此进行更多描述)。在该方法的应用中,热处理可以在其参数(温度、热处理持续时间)方面被调节,从而得到上文针对接合面与扩散区之间的间距所提及的关系。
根据本发明的设计方案规定,第一相和第二相构造为焊料成形件中的层,其中分别在层之间形成扩散区作为中间层。换言之,第一相和第二相的层交替。通过热处理产生中间层。中间层通过扩散区形成,扩散区可以从第一相和第二相之间的界面开始生长,并且也可以共同生长。如果扩散进行得足够远,那么扩散区可以至少部分转换为金属间化合物。有利地,以该方式产生焊料成形件的简单结构,其可以通过由第一相和第二相构成的箔的层制成。
本发明的另外的设计方案规定,第二相以颗粒的形式构造,颗粒分布在由第一相构成的基体中。这例如可以以如下方式实现,即第二相的颗粒分布在由第一相构成的箔之间,并且由此产生形成焊料成形件的复合体(Verband)。特别有利的是,随后产生的扩散区具有金属间化合物的连接所述颗粒的框架。框架在焊料成形件的厚度上延伸,由此使通过焊料成形件构造的扩散焊接连接机械稳定和热稳定。在安装焊料成形件并对其进行扩散焊接后,将金属间化合物的框架补充至接合配对件,从而使框架一直延伸到接合面。因此稳定整个扩散焊接连接。
另外的可能性是,第二相形成一体式空间结构,其被由第一相构成的基体包围。这种一体式空间结构预设了金属间化合物的在第一相中形成的框架的几何形状,从而框架有利地可以构造有定义的几何形状和因此可很好预测的机械特性。即使在本发明的该设计方案中也形成了金属间相的包围空间结构的框架,所述框架的几何形状借助第二相的空间结构定向。
此外根据本发明,利用开头说明的方法如下解决所述技术问题:使焊料成形件承受热处理,其中,在热处理期间,扩散区在第一相和第二相之间形成。在扩散区中也可以导致金属间化合物的形成。此外,热处理及时中断,从而在针对第一接合配对件的第一接合面上并且在针对第二接合配对件的第二接合面上,第一相完全或部分保持形成。由此确保了在接合面上的用于建立与相邻的接合配对件的焊接连接的焊料。第一相保留在接合配对件上这一点可以通过以下方式确保,即,第二相(用于形成扩散区的材料从第二相扩散到第一相中)在靠近接合面的区域中完全不存在或仅在很小的范围内存在。此外可以通过限制热处理的时间来影响一直延伸到接合面的扩散区的形成。
利用根据本发明的方法可以产生一种焊料成形件,之前已经阐述了所述焊料成形件的优点。尤其是可以产生如下焊料成形件,在所述焊料成形件中更快速地实现了扩散过程的结束,这些扩散过程在安装时应该导致建立两个接合配对件之间的扩散焊接连接。在此有利地可以减小与构造焊接连接相关联的热负载。
按照根据本发明的方法的设计方案规定,焊料成形件在热处理期间安装在两个固持设备之间,固持设备作用在第一接合面和第二接合面上。这两个固持设备不能够包含扩散到焊料成形件中的材料,从而所述固持设备在热处理后又可以从焊料成形件取下。固持设备例如可以由陶瓷构成,并且通过两个平坦的板实现。也有利的是,难以通过焊料润湿固持设备,从而焊料不能与固持设备的界面形成连接。在热处理期间,利用固持设备可以将压力施加到焊料成形件上,以便使各个层相互连接并且调节接合面。
此外有利的是,作为中间产品产生具有待制造的焊料成形件的高度的板。在热处理结束后,从该板可以制造多个焊料成形件,其方法是将板分开。这例如可以通过冲压、剪裁、锯、磨切或激光切割实现。通过制造大的板一方面可以改进在各个层的层叠中的过程安全。此外减小了在层的层叠中的耗费,因为针对多个焊料成形件需要处理相对少量的尺寸较大的构件。水平的层偏差例如分别仅发生在板的边缘处,并且可以在分离焊料成形件时简单地被切下。
根据该方法的特别的设计方案规定,使用形式为层的第一相,并且使用形式为颗粒的第二相。层和颗粒交替层叠,并且颗粒随后嵌入层中。例如可以机械地通过滚动或挤压实现嵌入过程。此外通过热处理辅助各个层之间的复合体的构造,因为扩散区的形成导致颗粒与层之间的固定连接。
例如可将形式为球的铜颗粒施加到薄的焊箔上,尤其是含锡的焊接合金上。在此,根据本发明的有利的设计方案可以使用粘合剂,利用粘合剂将颗粒固定在焊箔上。如果多个箔相互堆叠,那么因此产生的焊料成形件的总高度可以实现铜颗粒的足够的填充度。
根据本发明的另外的设计方案可以规定,将形式为颗粒或形式为一体式空间结构的第一相放置在固持设备之间,并且随后第一相被之前熔化的第二相渗透。在此利用的是,第二相具有比第一相更低的熔化温度,并且基于毛细力被吸入第一相的间隙中。由此有利地产生由第一相和第二相构成的复合体(Verbund),其中,可以准确地预先确定填充度和第一相的几何形状。由于将焊料以液态引入焊料成形件中,所以此外提供了足够的热量,从而立即形成扩散区。热处理步骤因此至少部分集成到焊料成形件的制造步骤中,由此有利地可以减少成形件的制造时间。
如果使用铜颗粒,那么例如可以以铜膏的形式处理铜颗粒,其方式是将铜颗粒挤压到不能润湿的面上,例如由陶瓷构成的面上。在干燥该颗粒复合体后,将焊料库(Lotdepot)例如以成形件或焊膏库的形式在侧面安置到铜库上。借助第二固持设备、例如第二陶瓷板限制待产生的焊料成形件朝上侧的造型。附加地,可将用于准确定义待产生的焊料成形件的高度的间隔保持器放置在固持设备之间。通过熔化焊料,该焊料随后渗透铜颗粒库。
根据本发明的另外的设计方案规定,将形式为一体式空间结构的第二相放置在两个固持设备中的一个上。随后,第二相嵌入到第一相中,其中,对形式为焊膏的第一相进行处理。这当第二相被挤压到第一相中时得以实现。随后,将固持设备的另一个放置到待制造的焊料成形件上。有利地,一体式空间结构也可以嵌入到焊膏的两个层之间,以便增大填充度。在该方法中使用已建立的模板印刷技术,从而有利地可以实施具有高安全性的经济的制造过程。
此外,根据本发明的另外的设计方案可以规定,使用形式为一体式空间结构的第二相,并且将空间结构浸没到熔化的第一相中。在该浸没过程中,用焊料润湿一体式空间结构,其中,在仍然液态的焊料中立即形成扩散区。因此产生的用焊料润湿的空间结构随后可以堆叠为更高的焊料成形件。
随后根据附图描述本发明的另外的细节。相同的或相应的附图元件分别设有相同的附图标记,并且仅在各个附图之间产生差异时才多次阐述。其中:
图1以截面图示出根据本发明的焊料成形件的实施例,其中通过各个层形成第二相;
图2示出部分切开的根据本发明的焊料成形件的另一实施例,其中通过颗粒形成第二相;
图3至5以部分切开的方式示出根据本发明的方法(层的堆叠)的实施例的选择的制造步骤;
图6和7以部分切开的方式示出在选择的步骤中的根据本发明的方法(利用焊料渗透)的另一实施例;
图8和9以部分切开的方式示出在选择的步骤中的根据本发明的方法(空间格栅的浸没)的另一实施例;和
图10至14示出以部分切开的方式示出根据本发明的方法(焊膏印刷)的另一实施例的选择的步骤。
根据图1示出焊料成形件11。该焊料成形件具有第一接合面12和第二接合面13。通过第一接合面12使焊料成形件11与第一接合配对件14的第一金属化结构15连接。接合配对件14通过电子组件(零部件)实施。第二接合面13与第二接合配对件17的第二金属化结构16连接。通过形式为电路板的电路载体形成第二接合配对件17。
示意性示出焊料成形件11的结构。在图1中示出如下状态,在该状态中,完成的焊料成形件11放置在第一接合配对件14和第二接合配对件17之间,然而还没有与之焊接。焊料成形件11由第二相18的若干层构成,所述层由金属材料、例如铜形成。第二相18的层之间或者与之相邻地存在扩散区19,扩散区包含基于锡的焊料,铜从第二相18扩散到焊料中。这通过焊料成形件的热处理实现,其中,在完全形成扩散区19之前,中断热处理,然而已经部分形成金属间相。此外,扩散区19还没有达到第一接合面12和第二接合面13,因此,第一接合面和第二接合面通过由含锡的焊料构成的第一相20形成。
扩散区中的金属间化合物未示出(在这方面更多地参考图2)。在后来的焊接过程中还进一步形成金属间化合物,其中,第一接合配对件14和第二接合配对件17与焊料成形件11焊接,用以形成焊接连接。在此,材料从第一金属化结构15和第二金属化结构16以及焊料成形件的第二相18扩散到焊料成形件的第一相20以及扩散区19中,由此,在形成的扩散区中的铜原子的浓度足够用于形成金属间化合物。因此,在第一接合配对件14与第二接合配对件17之间形成扩散焊接连接。因为扩散过程已经在焊料成形件11中开始,所以与在常规的用于该目的的焊料成形件中相比,需要更少的能量来最终形成扩散焊接连接。
在根据图2的焊料成形件中,第二相18以颗粒的形式包含在第一相20中。围绕第二相18,扩散区19已经(至少部分)构造为金属间化合物。然而,在考虑到第二相在第一相中的扩散路径(例如通过热处理的方法参数、如温度和持续时间确定)的情况下选择的第二相18距离第一接合面12和第二接合面13的间距确保了在接合面上存在焊料的第一相20,以便确保利用未示出的接合配对件的随后的扩散过程。
例如可以利用图3至5的方法制造根据图2的焊料成形件。在图3中示出的是,形式为焊箔的第一相20与形式为颗粒的第二相18交替层叠。第二相18在此可以借助所示的粘合剂20a(在第二相的层的一侧或如所示的那样在第二相的层的两侧)固定到或者简单地仅分散到(未示出)第一相20上。在此,第一相20的相应最上面的和最下面的层确保的是,第二相18与后来构造的第一接合面12和第二接合面13间隔开。
在图4中示出的是,根据图3的复合体可以固持在两个形式为陶瓷板的固持设备21之间。通过挤压压力22使第一相20和第二相18相互连接和初步固定。
图5示出了在完成热处理后的焊料成形件11,所述热处理可以在处于形成中的根据图4的焊料成形件在固持设备21中固定的过程中进行。围绕第二相18形成扩散区19,其中,与第一接合面12和第二接合面13邻接地存在第一相20。
根据图6和7示出了用于制造焊料成形件的另一方法。在图6中可看到,第二相18具有球的形状,球在固持设备21之间均匀地层叠。焊料的第一相20通过成形件构造,成形件同样固持在固持设备21之间并且位于后来要构造的焊料成形件的边缘处。此外设置间隔保持器23,其定义待构造的焊料成形件的高度。
在图7中示出了根据图6的排布结构被加热到足以使第一相20熔化的程度。由于通过第一相20的球之间的间隙产生的毛细力,焊料现在渗透第二相18。在图7中可看到刚好被引入到第二相18的间隙中的焊料的前沿24。
因为焊料是液态的,所以立即发生第二相18的材料(例如铜)向第一相20中的扩散,由此形成了由金属间化合物构成的扩散区19。扩散区形成包围第二相的球的框架25,框架使完成的焊料成形件机械稳定,从而焊料成形件在后来构造焊接连接时保持稳定,而在此期间第一相20的其余部分再次熔化。第一相20的其余部分尤其是位于与固持设备21的界面处,固持设备由陶瓷构成,因此不触发第一相20中的扩散过程,或者能被液态的第一相20润湿。
根据图8和9示出了用于制造焊料成形件的另一方法。在该方法中,第二相应该由三维空间结构26(在此是线格栅)形成。为了由空间结构26制造焊料成形件,将空间结构浸没到在容器28中提供的液态的焊料27中。
在图9中可看到,来自图8的空间格栅26在完成的焊料成形件11中形成第二相18。第二相被扩散区19包围,其中,随着与第二相18的间距的增大,第一相20脱离扩散区19,从而由第一相20形成第一接合面12和第二接合面13。
在图10至14中示出用于通过焊膏印刷制造焊料成形件11的方法。在图10中可看到,将第一模板29放置到形式为陶瓷板的固持设备21上,并且借助刮板30以特定的厚度涂上形式为焊膏的第一相20。如从图11看到的那样,形式为铜箔的第二相18可以放置到如此施涂的第一相20上。随后,如在图12中示出的那样,用第二模板31替代第一模板29,第二模板具有更高的高度。备选地(未示出),第一模板29也可以保留在固持设备21上,并且将另外的模板放置到第一模板29上。在该情况下,通过第二模板31形成的空穴因此也变深,从而借助刮板30可以配量另外的焊膏以产生第一相20。以该方式,第一相18被包括在第二相20内。该过程可以多次重复,直到达到针对焊料成形件的期望的厚度。
在图13中示出,在随后的步骤中如何可以为根据图10至12制造的焊料成形件11提供第二固持设备21并进行热处理。在此,围绕第二相18形成具有金属间化合物的扩散区19,其中,在扩散区19的另一边存在第一相20。
作为根据图10至13的构件,替代单个焊料成形件11地,根据图14也可以产生板32,该板具有比待产生的焊料成形件11明显更大的面。该板32可以借助分离设备33、例如通过冲压被分开,即焊料成形件11彼此分离(沿点划线分离)。可以切掉和丢弃边缘区域34,在所述边缘区域中不存在为焊料成形件所需的结构或者水平公差会产生影响。
Claims (18)
1.一种用于产生扩散焊接连接的焊料成形件,
·具有用于第一接合配对件(14)的第一接合面(12)和用于第二接合配对件(17)的第二接合面(13),
·由微结构构成,所述微结构具有由焊料构成的第一相(20)和由金属材料构成的第二相(18),
其特征在于,在焊料成形件中构造有由第一相(20)的材料和第二相(18)的材料构成的扩散区(19),其中,
·第一接合面(12)和第二接合面(13)完全或部分地由第一相(20)构造,
·扩散区(19)具有金属间化合物。
2.根据权利要求1所述的焊料成形件,其特征在于,在扩散区(19)与第一接合面(12)之间以及在扩散区(19)与第二接合面(13)之间存在最小间距,所述最小间距在至少1μm且最高30μm、优选至少5μm且最高10μm的范围内。
3.根据权利要求1所述的焊料成形件,其特征在于,
·在扩散区(19)与第一接合面(12)之间以及在扩散区(19)与第二接合面(13)之间存在间距,所述间距在至少1μm且最高30μm、优选至少5μm且最高10μm的范围内,
·在扩散区(19)与第一接合面(12)之间以及在扩散区(19)与第二接合面(13)之间的所述间距在接合面(12)下方的至少50%、优选至少70%并且更优选至少90%的区域中存在。
4.根据前述权利要求中任一项所述的焊料成形件,其特征在于,所述金属间化合物所形成的程度使得能够在小于300秒的焊接时间内、尤其是在60-150秒的焊接时间内形成从第一接合面(12)到第二接合面(13)由扩散区对焊料成形件的完全穿透。
5.根据前述权利要求中任一项所述的焊料成形件,其特征在于,所述金属间化合物所形成的程度使得能够在小于270℃的温度范围内、尤其是在220℃至260℃的温度范围内进行从第一接合面(12)到第二接合面(13)由扩散区对焊料成形件的完全穿透。
6.根据前述权利要求中任一项所述的焊料成形件,其特征在于,所述第一相(20)和第二相(18)构造为焊料成形件中的层,其中分别在所述层之间形成扩散区(19)作为中间层。
7.根据权利要求1至5中任一项所述的焊料成形件,其特征在于,所述第二相(18)以颗粒的形式构造,所述颗粒分布在由第一相(20)构成的基体中。
8.根据权利要求7所述的焊料成形件,其特征在于,扩散区具有金属间化合物的连接所述颗粒的框架(25)。
9.根据权利要求1至5中任一项所述的焊料成形件,其特征在于,所述第二相(18)形成一体式空间结构(26),所述空间结构被由第一相(20)构成的基体包围。
10.一种用于产生焊料成形件(11)的方法,其中,将由焊料构成的第一相(20)和由金属材料构成的第二相(18)接合成焊料成形件,其特征在于,所述焊料成形件承受热处理,其中,
·在热处理期间,在第一相(20)和第二相(18)之间形成具有金属间化合物的扩散区(19),
·在针对第一接合配对件(14)的第一接合面(12)上并且在针对第二接合配对件(17)的第二接合面(13)上,第一相(20)完全或部分保持形成。
11.根据权利要求10所述的方法,其特征在于,将焊料成形件(11)在热处理期间插入两个固持设备(21)之间,所述固持设备作用在第一接合面(12)和第二接合面(13)上。
12.根据权利要求10或11所述的方法,其特征在于,作为中间产品制备板(32),并且通过将板(32)分开而获得多个焊料成形件。
13.根据权利要求10至12中任一项所述的方法,其特征在于,
·使用形式为层的第一相(20),并且使用形式为颗粒的第二相(18),
·所述层和所述颗粒交替层叠,并且
·使所述颗粒嵌入所述层中。
14.根据权利要求13所述的方法,其特征在于,在设有所述颗粒的层被层叠之前,利用粘合剂(20a)将所述颗粒固定在所述层上。
15.根据权利要求11所述的方法,其特征在于,
·将形式为颗粒或形式为一体式空间结构的第二相(18)放置在固持设备(21)之间,并且
·第二相(18)被熔化的第一相(20)渗透。
16.根据权利要求11所述的方法,其特征在于,
·将形式为一体式空间结构的第二相(18)放置在固持设备(21)中的一个上,
·使第二相(18)嵌入到形式为焊膏的第一相(20)中,并且
·将另一固持设备(21)放置到待制造的焊料成形件上。
17.根据权利要求16所述的方法,其特征在于,将一体式结构空间(26)嵌入到焊膏的两个层之间。
18.根据权利要求10至12中任一项所述的方法,其特征在于,
·使用形式为一体式结构空间(26)的第二相(18),并且
·将结构空间(26)浸没到熔化的第一相(20)中。
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2018
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- 2018-04-23 EP EP18723722.7A patent/EP3582928B1/de active Active
- 2018-04-23 KR KR1020197030611A patent/KR102409338B1/ko active IP Right Grant
- 2018-04-23 US US16/607,574 patent/US11285568B2/en active Active
- 2018-04-23 CN CN201880026942.3A patent/CN110545950B/zh active Active
- 2018-04-23 WO PCT/EP2018/060296 patent/WO2018197390A1/de unknown
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CN116825742A (zh) * | 2023-08-28 | 2023-09-29 | 合肥阿基米德电子科技有限公司 | 一种预成型焊片及其制备方法与应用 |
CN116825742B (zh) * | 2023-08-28 | 2023-11-03 | 合肥阿基米德电子科技有限公司 | 一种预成型焊片及其制备方法与应用 |
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CN110545950B (zh) | 2022-09-16 |
US20200147731A1 (en) | 2020-05-14 |
DE102017206932A1 (de) | 2018-10-25 |
EP3582928C0 (de) | 2023-10-11 |
KR102409338B1 (ko) | 2022-06-14 |
WO2018197390A1 (de) | 2018-11-01 |
EP3582928B1 (de) | 2023-10-11 |
JP2020518457A (ja) | 2020-06-25 |
JP6980029B2 (ja) | 2021-12-15 |
KR20190129955A (ko) | 2019-11-20 |
US11285568B2 (en) | 2022-03-29 |
EP3582928A1 (de) | 2019-12-25 |
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