JP2020501923A5 - - Google Patents

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Publication number
JP2020501923A5
JP2020501923A5 JP2019533320A JP2019533320A JP2020501923A5 JP 2020501923 A5 JP2020501923 A5 JP 2020501923A5 JP 2019533320 A JP2019533320 A JP 2019533320A JP 2019533320 A JP2019533320 A JP 2019533320A JP 2020501923 A5 JP2020501923 A5 JP 2020501923A5
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JP
Japan
Prior art keywords
carrier
spacer
pad conditioner
abrasive grain
pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2019533320A
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English (en)
Japanese (ja)
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JP7232763B2 (ja
JP2020501923A (ja
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Publication date
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Priority claimed from PCT/IB2017/058053 external-priority patent/WO2018116122A1/en
Publication of JP2020501923A publication Critical patent/JP2020501923A/ja
Publication of JP2020501923A5 publication Critical patent/JP2020501923A5/ja
Application granted granted Critical
Publication of JP7232763B2 publication Critical patent/JP7232763B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2019533320A 2016-12-21 2017-12-18 スペーサ及びウェハ平坦化システムを有するパッドコンディショナ Active JP7232763B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201662437144P 2016-12-21 2016-12-21
US62/437,144 2016-12-21
PCT/IB2017/058053 WO2018116122A1 (en) 2016-12-21 2017-12-18 Pad conditioner with spacer and wafer planarization system

Publications (3)

Publication Number Publication Date
JP2020501923A JP2020501923A (ja) 2020-01-23
JP2020501923A5 true JP2020501923A5 (enExample) 2021-02-12
JP7232763B2 JP7232763B2 (ja) 2023-03-03

Family

ID=62626270

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019533320A Active JP7232763B2 (ja) 2016-12-21 2017-12-18 スペーサ及びウェハ平坦化システムを有するパッドコンディショナ

Country Status (5)

Country Link
US (1) US20190337119A1 (enExample)
JP (1) JP7232763B2 (enExample)
CN (1) CN110087809B (enExample)
TW (1) TWI813551B (enExample)
WO (1) WO2018116122A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI706831B (zh) * 2020-02-10 2020-10-11 富仕多科技有限公司 用於研磨墊修整裝置之基座
DE102020111728B4 (de) * 2020-04-29 2022-06-23 Schott Ag Elektro-optisches Wandlerbauteil mit einem Abstandhalter, sowie Abstandhalter-Wafer zur Herstellung eines elektro-optischen Wandlerbauteils
CN112757161B (zh) * 2020-12-31 2022-04-19 上海超硅半导体股份有限公司 一种抛光载具的修整方法
EP4408614A1 (en) * 2021-09-29 2024-08-07 Entegris, Inc. Double-sided pad conditioner

Family Cites Families (26)

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Publication number Priority date Publication date Assignee Title
US2442129A (en) * 1945-08-06 1948-05-25 Norton Co Diamond grinding wheel construction
US5197249A (en) * 1991-02-07 1993-03-30 Wiand Ronald C Diamond tool with non-abrasive segments
JP3533046B2 (ja) * 1996-07-18 2004-05-31 新日本製鐵株式会社 半導体基板用研磨布のドレッサー
KR19990081117A (ko) * 1998-04-25 1999-11-15 윤종용 씨엠피 패드 컨디셔닝 디스크 및 컨디셔너, 그 디스크의 제조방법, 재생방법 및 세정방법
US6203407B1 (en) * 1998-09-03 2001-03-20 Micron Technology, Inc. Method and apparatus for increasing-chemical-polishing selectivity
US6093085A (en) * 1998-09-08 2000-07-25 Advanced Micro Devices, Inc. Apparatuses and methods for polishing semiconductor wafers
US20040072518A1 (en) * 1999-04-02 2004-04-15 Applied Materials, Inc. Platen with patterned surface for chemical mechanical polishing
US6498101B1 (en) * 2000-02-28 2002-12-24 Micron Technology, Inc. Planarizing pads, planarizing machines and methods for making and using planarizing pads in mechanical and chemical-mechanical planarization of microelectronic device substrate assemblies
JP2002208575A (ja) 2001-01-10 2002-07-26 Sony Corp 半導体研磨装置
TW505967B (en) 2001-10-11 2002-10-11 Macronix Int Co Ltd Wafer carrier structure of chemical mechanical polishing device
CN1314514C (zh) * 2001-10-29 2007-05-09 旺宏电子股份有限公司 化学机械研磨装置的晶圆载具结构
JP2003175465A (ja) * 2001-12-11 2003-06-24 Mitsubishi Materials Corp ダイヤモンドコーティング切削工具
US7160178B2 (en) * 2003-08-07 2007-01-09 3M Innovative Properties Company In situ activation of a three-dimensional fixed abrasive article
US6951509B1 (en) * 2004-03-09 2005-10-04 3M Innovative Properties Company Undulated pad conditioner and method of using same
JP2006075922A (ja) * 2004-09-07 2006-03-23 Toshiba Ceramics Co Ltd 研磨布用ドレッシング工具
WO2009043058A2 (en) * 2007-09-28 2009-04-02 Chien-Min Sung Cmp pad conditioners with mosaic abrasive segments and associated methods
US8801497B2 (en) * 2009-04-30 2014-08-12 Rdc Holdings, Llc Array of abrasive members with resilient support
CN101879702B (zh) * 2009-05-05 2011-11-30 宋健民 组合式修整器及其制法
US8496511B2 (en) * 2010-07-15 2013-07-30 3M Innovative Properties Company Cathodically-protected pad conditioner and method of use
CN202180415U (zh) * 2010-08-31 2012-04-04 深圳嵩洋微电子技术有限公司 化学机械抛光垫修整器
CN103688343B (zh) * 2011-03-07 2016-09-07 恩特格里公司 化学机械抛光垫修整器
SG11201500802TA (en) * 2012-08-02 2015-04-29 3M Innovative Properties Co Abrasive articles with precisely shaped features and method of making thereof
US8998678B2 (en) * 2012-10-29 2015-04-07 Wayne O. Duescher Spider arm driven flexible chamber abrading workholder
DE102013206613B4 (de) * 2013-04-12 2018-03-08 Siltronic Ag Verfahren zum Polieren von Halbleiterscheiben mittels gleichzeitiger beidseitiger Politur
TWI546159B (zh) * 2014-04-11 2016-08-21 中國砂輪企業股份有限公司 可控制研磨深度之化學機械研磨修整器
TWI595973B (zh) * 2015-06-01 2017-08-21 China Grinding Wheel Corp Chemical mechanical polishing dresser and its manufacturing method

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