TWI813551B - 具間隔物之墊修整器及具此墊修整器之晶圓化學機械平坦化系統 - Google Patents

具間隔物之墊修整器及具此墊修整器之晶圓化學機械平坦化系統 Download PDF

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Publication number
TWI813551B
TWI813551B TW106144802A TW106144802A TWI813551B TW I813551 B TWI813551 B TW I813551B TW 106144802 A TW106144802 A TW 106144802A TW 106144802 A TW106144802 A TW 106144802A TW I813551 B TWI813551 B TW I813551B
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TW
Taiwan
Prior art keywords
carrier
pad
single spacer
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pad conditioner
Prior art date
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TW106144802A
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English (en)
Chinese (zh)
Other versions
TW201829128A (zh
Inventor
林義翔
諾亞 歐莫 善提
杜柏成
Original Assignee
美商3M新設資產公司
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Publication of TW201829128A publication Critical patent/TW201829128A/zh
Application granted granted Critical
Publication of TWI813551B publication Critical patent/TWI813551B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/02—Machines or devices using grinding or polishing belts; Accessories therefor for grinding rotationally symmetrical surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/12—Lapping plates for working plane surfaces
    • B24B37/16—Lapping plates for working plane surfaces characterised by the shape of the lapping plate surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B24B37/245—Pads with fixed abrasives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0009—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using moulds or presses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
    • B24D3/06—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • B24D7/06—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental
    • B24D7/066—Grinding blocks; their mountings or supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321—After treatment
    • H01L21/32115—Planarisation
    • H01L21/3212—Planarisation by chemical mechanical polishing [CMP]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW106144802A 2016-12-21 2017-12-20 具間隔物之墊修整器及具此墊修整器之晶圓化學機械平坦化系統 TWI813551B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201662437144P 2016-12-21 2016-12-21
US62/437,144 2016-12-21

Publications (2)

Publication Number Publication Date
TW201829128A TW201829128A (zh) 2018-08-16
TWI813551B true TWI813551B (zh) 2023-09-01

Family

ID=62626270

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106144802A TWI813551B (zh) 2016-12-21 2017-12-20 具間隔物之墊修整器及具此墊修整器之晶圓化學機械平坦化系統

Country Status (5)

Country Link
US (1) US20190337119A1 (enExample)
JP (1) JP7232763B2 (enExample)
CN (1) CN110087809B (enExample)
TW (1) TWI813551B (enExample)
WO (1) WO2018116122A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI706831B (zh) * 2020-02-10 2020-10-11 富仕多科技有限公司 用於研磨墊修整裝置之基座
DE102020111728B4 (de) * 2020-04-29 2022-06-23 Schott Ag Elektro-optisches Wandlerbauteil mit einem Abstandhalter, sowie Abstandhalter-Wafer zur Herstellung eines elektro-optischen Wandlerbauteils
CN112757161B (zh) * 2020-12-31 2022-04-19 上海超硅半导体股份有限公司 一种抛光载具的修整方法
EP4408614A1 (en) * 2021-09-29 2024-08-07 Entegris, Inc. Double-sided pad conditioner

Citations (5)

* Cited by examiner, † Cited by third party
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US5197249A (en) * 1991-02-07 1993-03-30 Wiand Ronald C Diamond tool with non-abrasive segments
JP2003175465A (ja) * 2001-12-11 2003-06-24 Mitsubishi Materials Corp ダイヤモンドコーティング切削工具
JP2006075922A (ja) * 2004-09-07 2006-03-23 Toshiba Ceramics Co Ltd 研磨布用ドレッシング工具
CN101879702A (zh) * 2009-05-05 2010-11-10 宋健民 组合式修整器及其制法
TW201538277A (zh) * 2014-04-11 2015-10-16 Kinik Co 可控制研磨深度之化學機械研磨修整器

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US2442129A (en) * 1945-08-06 1948-05-25 Norton Co Diamond grinding wheel construction
JP3533046B2 (ja) * 1996-07-18 2004-05-31 新日本製鐵株式会社 半導体基板用研磨布のドレッサー
KR19990081117A (ko) * 1998-04-25 1999-11-15 윤종용 씨엠피 패드 컨디셔닝 디스크 및 컨디셔너, 그 디스크의 제조방법, 재생방법 및 세정방법
US6203407B1 (en) * 1998-09-03 2001-03-20 Micron Technology, Inc. Method and apparatus for increasing-chemical-polishing selectivity
US6093085A (en) * 1998-09-08 2000-07-25 Advanced Micro Devices, Inc. Apparatuses and methods for polishing semiconductor wafers
US20040072518A1 (en) * 1999-04-02 2004-04-15 Applied Materials, Inc. Platen with patterned surface for chemical mechanical polishing
US6498101B1 (en) * 2000-02-28 2002-12-24 Micron Technology, Inc. Planarizing pads, planarizing machines and methods for making and using planarizing pads in mechanical and chemical-mechanical planarization of microelectronic device substrate assemblies
JP2002208575A (ja) 2001-01-10 2002-07-26 Sony Corp 半導体研磨装置
TW505967B (en) 2001-10-11 2002-10-11 Macronix Int Co Ltd Wafer carrier structure of chemical mechanical polishing device
CN1314514C (zh) * 2001-10-29 2007-05-09 旺宏电子股份有限公司 化学机械研磨装置的晶圆载具结构
US7160178B2 (en) * 2003-08-07 2007-01-09 3M Innovative Properties Company In situ activation of a three-dimensional fixed abrasive article
US6951509B1 (en) * 2004-03-09 2005-10-04 3M Innovative Properties Company Undulated pad conditioner and method of using same
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Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5197249A (en) * 1991-02-07 1993-03-30 Wiand Ronald C Diamond tool with non-abrasive segments
JP2003175465A (ja) * 2001-12-11 2003-06-24 Mitsubishi Materials Corp ダイヤモンドコーティング切削工具
JP2006075922A (ja) * 2004-09-07 2006-03-23 Toshiba Ceramics Co Ltd 研磨布用ドレッシング工具
CN101879702A (zh) * 2009-05-05 2010-11-10 宋健民 组合式修整器及其制法
TW201538277A (zh) * 2014-04-11 2015-10-16 Kinik Co 可控制研磨深度之化學機械研磨修整器

Also Published As

Publication number Publication date
JP7232763B2 (ja) 2023-03-03
US20190337119A1 (en) 2019-11-07
JP2020501923A (ja) 2020-01-23
TW201829128A (zh) 2018-08-16
CN110087809B (zh) 2020-12-01
WO2018116122A1 (en) 2018-06-28
CN110087809A (zh) 2019-08-02

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