JP7232763B2 - スペーサ及びウェハ平坦化システムを有するパッドコンディショナ - Google Patents

スペーサ及びウェハ平坦化システムを有するパッドコンディショナ Download PDF

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Publication number
JP7232763B2
JP7232763B2 JP2019533320A JP2019533320A JP7232763B2 JP 7232763 B2 JP7232763 B2 JP 7232763B2 JP 2019533320 A JP2019533320 A JP 2019533320A JP 2019533320 A JP2019533320 A JP 2019533320A JP 7232763 B2 JP7232763 B2 JP 7232763B2
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Japan
Prior art keywords
carrier
spacer
pad
abrasive element
abrasive
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JP2019533320A
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English (en)
Japanese (ja)
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JP2020501923A (ja
JP2020501923A5 (enExample
Inventor
リン，イ－シャン
チェン トゥ，ポー
オー． シャンティ，ノア
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3M Innovative Properties Co
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3M Innovative Properties Co
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/02—Machines or devices using grinding or polishing belts; Accessories therefor for grinding rotationally symmetrical surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/12—Lapping plates for working plane surfaces
    • B24B37/16—Lapping plates for working plane surfaces characterised by the shape of the lapping plate surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B24B37/245—Pads with fixed abrasives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0009—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using moulds or presses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
    • B24D3/06—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • B24D7/06—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental
    • B24D7/066—Grinding blocks; their mountings or supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321—After treatment
    • H01L21/32115—Planarisation
    • H01L21/3212—Planarisation by chemical mechanical polishing [CMP]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP2019533320A 2016-12-21 2017-12-18 スペーサ及びウェハ平坦化システムを有するパッドコンディショナ Active JP7232763B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201662437144P 2016-12-21 2016-12-21
US62/437,144 2016-12-21
PCT/IB2017/058053 WO2018116122A1 (en) 2016-12-21 2017-12-18 Pad conditioner with spacer and wafer planarization system

Publications (3)

Publication Number Publication Date
JP2020501923A JP2020501923A (ja) 2020-01-23
JP2020501923A5 JP2020501923A5 (enExample) 2021-02-12
JP7232763B2 true JP7232763B2 (ja) 2023-03-03

Family

ID=62626270

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019533320A Active JP7232763B2 (ja) 2016-12-21 2017-12-18 スペーサ及びウェハ平坦化システムを有するパッドコンディショナ

Country Status (5)

Country Link
US (1) US20190337119A1 (enExample)
JP (1) JP7232763B2 (enExample)
CN (1) CN110087809B (enExample)
TW (1) TWI813551B (enExample)
WO (1) WO2018116122A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI706831B (zh) * 2020-02-10 2020-10-11 富仕多科技有限公司 用於研磨墊修整裝置之基座
DE102020111728B4 (de) * 2020-04-29 2022-06-23 Schott Ag Elektro-optisches Wandlerbauteil mit einem Abstandhalter, sowie Abstandhalter-Wafer zur Herstellung eines elektro-optischen Wandlerbauteils
CN112757161B (zh) * 2020-12-31 2022-04-19 上海超硅半导体股份有限公司 一种抛光载具的修整方法
EP4408614A1 (en) * 2021-09-29 2024-08-07 Entegris, Inc. Double-sided pad conditioner

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002208575A (ja) 2001-01-10 2002-07-26 Sony Corp 半導体研磨装置
US20030070756A1 (en) 2001-10-11 2003-04-17 Yung-Tai Hung Wafer carrier used for chemical mechanic polishing
JP2014510645A (ja) 2011-03-07 2014-05-01 インテグリス・インコーポレーテッド 化学機械平坦化パッドコンディショナー
JP2015524358A (ja) 2012-08-02 2015-08-24 スリーエム イノベイティブ プロパティズ カンパニー 精密に成形された構造部を有する研磨物品及びその作製方法

Family Cites Families (22)

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US2442129A (en) * 1945-08-06 1948-05-25 Norton Co Diamond grinding wheel construction
US5197249A (en) * 1991-02-07 1993-03-30 Wiand Ronald C Diamond tool with non-abrasive segments
JP3533046B2 (ja) * 1996-07-18 2004-05-31 新日本製鐵株式会社 半導体基板用研磨布のドレッサー
KR19990081117A (ko) * 1998-04-25 1999-11-15 윤종용 씨엠피 패드 컨디셔닝 디스크 및 컨디셔너, 그 디스크의 제조방법, 재생방법 및 세정방법
US6203407B1 (en) * 1998-09-03 2001-03-20 Micron Technology, Inc. Method and apparatus for increasing-chemical-polishing selectivity
US6093085A (en) * 1998-09-08 2000-07-25 Advanced Micro Devices, Inc. Apparatuses and methods for polishing semiconductor wafers
US20040072518A1 (en) * 1999-04-02 2004-04-15 Applied Materials, Inc. Platen with patterned surface for chemical mechanical polishing
US6498101B1 (en) * 2000-02-28 2002-12-24 Micron Technology, Inc. Planarizing pads, planarizing machines and methods for making and using planarizing pads in mechanical and chemical-mechanical planarization of microelectronic device substrate assemblies
CN1314514C (zh) * 2001-10-29 2007-05-09 旺宏电子股份有限公司 化学机械研磨装置的晶圆载具结构
JP2003175465A (ja) * 2001-12-11 2003-06-24 Mitsubishi Materials Corp ダイヤモンドコーティング切削工具
US7160178B2 (en) * 2003-08-07 2007-01-09 3M Innovative Properties Company In situ activation of a three-dimensional fixed abrasive article
US6951509B1 (en) * 2004-03-09 2005-10-04 3M Innovative Properties Company Undulated pad conditioner and method of using same
JP2006075922A (ja) * 2004-09-07 2006-03-23 Toshiba Ceramics Co Ltd 研磨布用ドレッシング工具
WO2009043058A2 (en) * 2007-09-28 2009-04-02 Chien-Min Sung Cmp pad conditioners with mosaic abrasive segments and associated methods
US8801497B2 (en) * 2009-04-30 2014-08-12 Rdc Holdings, Llc Array of abrasive members with resilient support
CN101879702B (zh) * 2009-05-05 2011-11-30 宋健民 组合式修整器及其制法
US8496511B2 (en) * 2010-07-15 2013-07-30 3M Innovative Properties Company Cathodically-protected pad conditioner and method of use
CN202180415U (zh) * 2010-08-31 2012-04-04 深圳嵩洋微电子技术有限公司 化学机械抛光垫修整器
US8998678B2 (en) * 2012-10-29 2015-04-07 Wayne O. Duescher Spider arm driven flexible chamber abrading workholder
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TWI546159B (zh) * 2014-04-11 2016-08-21 中國砂輪企業股份有限公司 可控制研磨深度之化學機械研磨修整器
TWI595973B (zh) * 2015-06-01 2017-08-21 China Grinding Wheel Corp Chemical mechanical polishing dresser and its manufacturing method

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002208575A (ja) 2001-01-10 2002-07-26 Sony Corp 半導体研磨装置
US20030070756A1 (en) 2001-10-11 2003-04-17 Yung-Tai Hung Wafer carrier used for chemical mechanic polishing
JP2014510645A (ja) 2011-03-07 2014-05-01 インテグリス・インコーポレーテッド 化学機械平坦化パッドコンディショナー
JP2015524358A (ja) 2012-08-02 2015-08-24 スリーエム イノベイティブ プロパティズ カンパニー 精密に成形された構造部を有する研磨物品及びその作製方法

Also Published As

Publication number Publication date
US20190337119A1 (en) 2019-11-07
JP2020501923A (ja) 2020-01-23
TW201829128A (zh) 2018-08-16
CN110087809B (zh) 2020-12-01
WO2018116122A1 (en) 2018-06-28
CN110087809A (zh) 2019-08-02
TWI813551B (zh) 2023-09-01

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