JP2020501375A5 - - Google Patents
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- JP2020501375A5 JP2020501375A5 JP2019531090A JP2019531090A JP2020501375A5 JP 2020501375 A5 JP2020501375 A5 JP 2020501375A5 JP 2019531090 A JP2019531090 A JP 2019531090A JP 2019531090 A JP2019531090 A JP 2019531090A JP 2020501375 A5 JP2020501375 A5 JP 2020501375A5
- Authority
- JP
- Japan
- Prior art keywords
- material layer
- conductive
- conductive material
- depositing
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 238000000034 method Methods 0.000 claims 25
- 239000004020 conductor Substances 0.000 claims 20
- 239000000463 material Substances 0.000 claims 20
- 238000005530 etching Methods 0.000 claims 16
- 238000000151 deposition Methods 0.000 claims 12
- 239000000758 substrate Substances 0.000 claims 5
- 238000007641 inkjet printing Methods 0.000 claims 4
- 238000003475 lamination Methods 0.000 claims 4
- 238000007764 slot die coating Methods 0.000 claims 4
- 238000004528 spin coating Methods 0.000 claims 4
- 230000001678 irradiating effect Effects 0.000 claims 3
- 239000011368 organic material Substances 0.000 claims 3
- 239000002262 Schiff base Substances 0.000 claims 2
- 150000004753 Schiff bases Chemical class 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 2
- 238000001039 wet etching Methods 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 150000001413 amino acids Chemical class 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 claims 1
- 229920000642 polymer Polymers 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023111882A JP2023139049A (ja) | 2016-12-12 | 2023-07-07 | 導電性特徴をエッチングする方法、ならびに関連するデバイスおよびシステム |
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201662432710P | 2016-12-12 | 2016-12-12 | |
| US62/432,710 | 2016-12-12 | ||
| US15/835,116 | 2017-12-07 | ||
| US15/835,116 US10398034B2 (en) | 2016-12-12 | 2017-12-07 | Methods of etching conductive features, and related devices and systems |
| PCT/IL2017/051338 WO2018109762A1 (en) | 2016-12-12 | 2017-12-11 | Methods of etching conductive features, and related devices and systems |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023111882A Division JP2023139049A (ja) | 2016-12-12 | 2023-07-07 | 導電性特徴をエッチングする方法、ならびに関連するデバイスおよびシステム |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2020501375A JP2020501375A (ja) | 2020-01-16 |
| JP2020501375A5 true JP2020501375A5 (cg-RX-API-DMAC7.html) | 2021-01-28 |
Family
ID=62558108
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019531090A Pending JP2020501375A (ja) | 2016-12-12 | 2017-12-11 | 導電性特徴をエッチングする方法、ならびに関連するデバイスおよびシステム |
| JP2023111882A Pending JP2023139049A (ja) | 2016-12-12 | 2023-07-07 | 導電性特徴をエッチングする方法、ならびに関連するデバイスおよびシステム |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023111882A Pending JP2023139049A (ja) | 2016-12-12 | 2023-07-07 | 導電性特徴をエッチングする方法、ならびに関連するデバイスおよびシステム |
Country Status (6)
| Country | Link |
|---|---|
| US (3) | US10398034B2 (cg-RX-API-DMAC7.html) |
| EP (1) | EP3551781B1 (cg-RX-API-DMAC7.html) |
| JP (2) | JP2020501375A (cg-RX-API-DMAC7.html) |
| KR (1) | KR20190093576A (cg-RX-API-DMAC7.html) |
| CN (1) | CN110249075A (cg-RX-API-DMAC7.html) |
| WO (1) | WO2018109762A1 (cg-RX-API-DMAC7.html) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016193978A2 (en) | 2015-06-04 | 2016-12-08 | Jet Cu Pcb Ltd. | Methods for producing an etch resist pattern on a metallic surface |
| WO2017025949A1 (en) | 2015-08-13 | 2017-02-16 | Jet Cu Pcb Ltd. | Methods for producing an etch resist pattern on a metallic surface |
| US10398034B2 (en) | 2016-12-12 | 2019-08-27 | Kateeva, Inc. | Methods of etching conductive features, and related devices and systems |
| WO2020165897A1 (en) | 2019-02-14 | 2020-08-20 | Orbotech Ltd | A method and apparatus for preparing a pcb product having highly dense conductors |
| KR20220127272A (ko) * | 2020-01-13 | 2022-09-19 | 카티바, 인크. | 잉크젯 인쇄 회로 기판 |
| US11963300B2 (en) | 2020-08-14 | 2024-04-16 | Au Optronics Corporation | Panel device and manufacturing method of panel device |
| DE102021122646A1 (de) * | 2021-09-01 | 2023-03-02 | At&S Austria Technologie & Systemtechnik Aktiengesellschaft | Komponententräger-Ätzsystem mit physisch getrennten Äzmodulen und Komponententräger |
| TWI849785B (zh) | 2023-03-08 | 2024-07-21 | 友達光電股份有限公司 | 電路裝置 |
| CN118612936B (zh) * | 2024-06-21 | 2024-12-06 | 南华大学 | 一种可拉伸的金属基电/热导件 |
| CN119603888B (zh) * | 2024-12-18 | 2025-09-23 | 西安电子科技大学 | 一种面向曲面电路三维打印的基材表面改性与附着力增强方法 |
| CN120512823B (zh) * | 2025-05-29 | 2026-04-07 | 都看(江苏)数码科技有限公司 | 基于喷墨掩模的陶瓷电路板高精度蚀刻方法及设备 |
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| WO2016193978A2 (en) | 2015-06-04 | 2016-12-08 | Jet Cu Pcb Ltd. | Methods for producing an etch resist pattern on a metallic surface |
| WO2017025949A1 (en) | 2015-08-13 | 2017-02-16 | Jet Cu Pcb Ltd. | Methods for producing an etch resist pattern on a metallic surface |
| US10398034B2 (en) * | 2016-12-12 | 2019-08-27 | Kateeva, Inc. | Methods of etching conductive features, and related devices and systems |
-
2017
- 2017-12-07 US US15/835,116 patent/US10398034B2/en active Active
- 2017-12-11 JP JP2019531090A patent/JP2020501375A/ja active Pending
- 2017-12-11 EP EP17880261.7A patent/EP3551781B1/en active Active
- 2017-12-11 CN CN201780086295.0A patent/CN110249075A/zh active Pending
- 2017-12-11 KR KR1020197016384A patent/KR20190093576A/ko not_active Ceased
- 2017-12-11 WO PCT/IL2017/051338 patent/WO2018109762A1/en not_active Ceased
-
2019
- 2019-07-10 US US16/507,358 patent/US11006528B2/en active Active
-
2021
- 2021-04-02 US US17/301,459 patent/US11425822B2/en active Active
-
2023
- 2023-07-07 JP JP2023111882A patent/JP2023139049A/ja active Pending
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