JP2020182932A - 脆い構造体を破壊するための電気的に活性化された圧力容器 - Google Patents
脆い構造体を破壊するための電気的に活性化された圧力容器 Download PDFInfo
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F42—AMMUNITION; BLASTING
- F42B—EXPLOSIVE CHARGES, e.g. FOR BLASTING, FIREWORKS, AMMUNITION
- F42B3/00—Blasting cartridges, i.e. case and explosive
- F42B3/04—Blasting cartridges, i.e. case and explosive for producing gas under pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B63—SHIPS OR OTHER WATERBORNE VESSELS; RELATED EQUIPMENT
- B63B—SHIPS OR OTHER WATERBORNE VESSELS; EQUIPMENT FOR SHIPPING
- B63B85/00—Dismantling or scrapping vessels
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F42—AMMUNITION; BLASTING
- F42B—EXPLOSIVE CHARGES, e.g. FOR BLASTING, FIREWORKS, AMMUNITION
- F42B3/00—Blasting cartridges, i.e. case and explosive
- F42B3/10—Initiators therefor
- F42B3/12—Bridge initiators
- F42B3/124—Bridge initiators characterised by the configuration or material of the bridge
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F42—AMMUNITION; BLASTING
- F42B—EXPLOSIVE CHARGES, e.g. FOR BLASTING, FIREWORKS, AMMUNITION
- F42B3/00—Blasting cartridges, i.e. case and explosive
- F42B3/10—Initiators therefor
- F42B3/195—Manufacture
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B63—SHIPS OR OTHER WATERBORNE VESSELS; RELATED EQUIPMENT
- B63B—SHIPS OR OTHER WATERBORNE VESSELS; EQUIPMENT FOR SHIPPING
- B63B22/00—Buoys
- B63B2022/006—Buoys specially adapted for measuring or watch purposes
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- H—ELECTRICITY
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/57—Protection from inspection, reverse engineering or tampering
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Abstract
Description
Claims (38)
- 構造体と、
圧力デバイスであって、
結合位置で前記構造体の表面に結合された容器であって、前記容器内の内部空間及び結合表面を有する、容器と、
前記内部空間内に配設されたガス放出材料と、
前記ガス放出材料を活性化するように配置された開始因子と、を含む、圧力デバイスと、
前記容器の前記結合表面を前記構造体の表面に結合させる結合剤と、を備え、前記開始因子による前記ガス放出材料の活性化時に、前記圧力デバイスが、前記構造体を破断する局所的な力を生成するように構成されている、装置。 - 前記結合剤及び前記結合表面が、前記表面の結合位置で、前記容器の内周の断面積にわたって、前記構造体の破壊限界よりも大きい結合力で前記容器を前記結合位置に結合させるように構成されている、請求項1に記載の装置。
- 前記構造体の前記破壊限界が、約5MPaを超える、請求項2に記載の装置。
- 前記構造体の一部分又は全部がガラスである、請求項1に記載の装置。
- 前記ガラスが、前記結合位置において0.5mm超の厚さである、請求項4に記載の装置。
- 前記ガラスが、鋳造ガラス、スランプガラス、非強化ガラス、強化ガラス、熱強化ガラス、イオン交換ガラス、ソーダ石灰ガラス、鉛ガラス、ホウケイ酸ガラス、アルミノシリケートガラス、アルカリ−アルミノシリケートガラス、シリカガラス、及びナトリウム富化ガラスのうちの1つ以上を含む、請求項4に記載の装置。
- 前記構造体の一部分又は全部が、粘土、磁器、プラスチック、金属又は木材又は石膏の積層充填材、から作製されている、請求項1に記載の装置。
- 前記構造体が、海洋ブイ、エンクロージャ、航空宇宙用構成要素、機械部品、窓、電子基板のうちの1つである、請求項1に記載の装置。
- 前記結合剤が、エポキシ、シアノアクリレート、構造用接着剤、鋼強化接着剤、シリコーン、熱硬化プラスチック、アクリル、ウレタン、UV硬化接着剤、エチレンビニルアセテート、はんだ、溶接界面材料、及び建築用接着剤のうちの1つ以上を含む、請求項1に記載の装置。
- 前記結合表面の反対側の、前記容器の表面上に配設された裏当て材料を更に含む、請求項1に記載の装置。
- 前記裏当て材料が、コンクリート及びエポキシポッティング化合物のうちの少なくとも1つを含む、請求項10に記載の装置。
- 前記裏当て材料が、前記容器を前記構造体の前記表面に結合させる、請求項10に記載の装置。
- 前記開始因子を通して電流を送達するように構成された電源を更に備える、請求項1に記載の装置。
- 電流がスイッチを通して送達される、請求項13に記載の装置。
- 前記スイッチが、MOSFETトランジスタ、シリコン制御整流器、機械式スイッチ、機械式リレースイッチのうちの1つである、請求項14に記載の装置。
- 前記電源がバッテリである、請求項13に記載の装置。
- 圧力デバイスであって、
内部空間と、構造体の表面への前記容器の結合を提供するように構成された結合表面と、を有する容器と、
前記空間内に配設されたガス放出材料と、
前記ガス放出材料を活性化するように配置された開始因子と、を備え、前記構造体に結合されるとき、前記圧力デバイスが、前記開始因子による前記ガス放出材料の活性化に応答して前記構造体を破断する局所的な力を生成するように構成されている、圧力デバイス。 - 前記容器が、結合位置で結合剤によって前記構造体の表面に結合されるとき、前記結合表面が、前記結合位置で、前記容器の内周の断面積にわたって、前記構造体の破壊限界よりも大きい結合力を提供するように構成されている、請求項17に記載の圧力デバイス。
- 前記結合表面が、5MPaを超える結合力で、前記表面の結合位置への前記容器の結合を提供するように構成されている、請求項17に記載の圧力デバイス。
- 前記結合表面の表面積と前記内部空間の体積との比が、約0.05cm−1を超える、請求項17に記載の圧力デバイス。
- 前記結合表面の前記表面積と前記内部空間の前記体積との比が、約0.6cm−1より大きく、約5cm−1未満である、請求項17に記載の圧力デバイス。
- 前記容器材料が、金属、プラスチック、ゴム、セラミック、セメント、熱可塑性物質、圧縮砂、木材、ガラスのうちの1つ以上を含む、請求項17に記載の圧力デバイス。
- 前記容器が、
第1の層と、
前記結合表面を含む前記第1の層を貫通する穴と、
前記第1の層に結合された第2の層であって、前記容器の前記内部空間が、前記穴の側面及び前記第2の層によって境界されている、第2の層と、を含む、請求項17に記載の圧力デバイス。 - 前記容器が、単一層であって、前記単一層内に配設された前記内部空間を有する、単一層を含む、請求項17に記載の圧力デバイス。
- 前記容器が打ち抜きされた金属である、請求項17に記載の圧力デバイス。
- 前記容器が前記内部空間への開口部を含み、前記開口部が、前記容器が前記結合位置で前記構造体に結合されるとき、前記構造体の前記表面によって覆われるように構成されている、請求項17に記載の圧力デバイス。
- 前記開始因子が電気開始因子である、請求項17に記載の圧力デバイス。
- 前記電気開始因子が、
一対の導電性ワイヤと、
前記ワイヤ間の導電性ブリッジであって、前記ブリッジが、前記ワイヤよりも高い電気抵抗を有する材料を含む、導電性ブリッジと、を備える、請求項27に記載の圧力デバイス。 - 前記ブリッジが、発熱材料でコーティングされている、請求項28に記載の圧力デバイス。
- 前記ブリッジが、ニクロム合金を含む、請求項28に記載の圧力デバイス。
- 前記ガス放出材料が、硝酸カリウム、アジ化ナトリウム、過塩素酸アンモニウム、硝酸アンモニウム、アンモニウムジニトラミドのうちの1つを含む、請求項17に記載の圧力デバイス。
- 圧力デバイスを構造体の表面上の結合位置に結合させることであって、前記圧力デバイスが、
内部空間及び結合表面を含む容器と、
前記内部空間内に配設されたガス放出材料と、
前記ガス放出材料を活性化するように配置された開始因子と、を備える、結合させることと、
前記開始因子に通電することと、
前記開始因子の通電に応答して前記ガス放出材料を活性化することであって、前記ガス放出材料の活性化が、前記構造体を破断させる局所的な力を生成する、活性化することと、を含む、方法。 - 前記圧力デバイスを結合させることが、前記圧力デバイスを、前記表面の結合位置で、前記容器の内周の断面積にわたって、前記構造体の破壊限界よりも大きい結合力で、前記圧力デバイスを前記結合位置に結合させることを含む、請求項32に記載の方法。
- 前記開始因子に通電することが、前記開始因子に電源を接続することを含み、前記電源が、前記開始因子を通る電流を生成する、請求項32に記載の方法。
- 装置を製作する方法であって、
ガス放出材料に近接して開始因子を配置することと、
ガス放出材料で容器の内部空間を満たすことと、
前記内部空間内に配設された前記ガス放出材料及び開始因子を有する前記容器を、前記開始因子による前記ガス放出材料の活性化に応答して発生する圧力に耐えるのに十分な結合力で構造体の表面に結合させることと、を含む、方法。 - 前記容器を形成することを更に含む、請求項35に記載の方法。
- 前記容器を形成することが、
第1の層材料内に穴を開けることと、
前記容器の前記内部空間が前記穴の側面及び第2の層によって境界されるように、前記第1の層に材料の前記第2の層を結合させることと、を含む、請求項36に記載の方法。 - 前記容器を形成することが、前記容器の前記内部空間を形成するために材料の層をミリング又は打ち抜きすることを含む、請求項36に記載の方法。
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US16/403,131 | 2019-05-03 | ||
US16/403,131 US10969205B2 (en) | 2019-05-03 | 2019-05-03 | Electrically-activated pressure vessels for fracturing frangible structures |
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Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
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US20220196169A1 (en) * | 2020-12-21 | 2022-06-23 | Palo Alto Research Center Incorporated | Triggerable mechanisms and fragment containment arrangements for self-destructing frangible structures and sealed vessels |
US11904986B2 (en) * | 2020-12-21 | 2024-02-20 | Xerox Corporation | Mechanical triggers and triggering methods for self-destructing frangible structures and sealed vessels |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0938950A (ja) * | 1995-07-31 | 1997-02-10 | Hitachi Zosen Corp | 被破壊物の破壊装置 |
JPH10331446A (ja) * | 1997-05-30 | 1998-12-15 | Hitachi Zosen Corp | 放電衝撃破壊方法および放電衝撃破壊装置 |
JPH11256977A (ja) * | 1998-03-06 | 1999-09-21 | Hitachi Zosen Corp | 破壊方法 |
US20080307992A1 (en) * | 2007-06-15 | 2008-12-18 | Jonathan Mohler | Charge system for destroying chips on a circuit board and method for destroying chips on a circuit board |
Family Cites Families (100)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1839884A (en) * | 1929-08-27 | 1932-01-05 | Gen Fire Extinguisher Co | Frangible vessel and method of making the same |
US2529210A (en) | 1947-05-23 | 1950-11-07 | Joseph F Butler | Cutting apparatus for wallboards and the like |
GB1138401A (en) | 1965-05-06 | 1969-01-01 | Mallory & Co Inc P R | Bonding |
US3601114A (en) | 1969-01-21 | 1971-08-24 | Norton Co | Method and apparatus for cutting complex shapes |
US3673667A (en) | 1970-11-23 | 1972-07-04 | Whittaker Corp | Method for producing complex shapes by filled billet extrusion |
US3666967A (en) | 1971-05-12 | 1972-05-30 | Us Navy | Self-destruct aluminum-tungstic oxide films |
US3882323A (en) | 1973-12-17 | 1975-05-06 | Us Navy | Method and apparatus for protecting sensitive information contained in thin-film microelectonic circuitry |
CA1064333A (en) | 1976-11-30 | 1979-10-16 | Her Majesty The Queen In Right Of Canada As Represented By The Minister Of National Defence Of Her Majesty's Canadian Government | Scuttling method for marine markers |
US4102664A (en) | 1977-05-18 | 1978-07-25 | Corning Glass Works | Method for making glass articles with defect-free surfaces |
US4139359A (en) | 1977-11-02 | 1979-02-13 | Ppg Industries, Inc. | Method and apparatus for shaping glass sheets by roll forming |
DE3230554C2 (de) | 1982-04-28 | 1984-07-26 | GTI Glastechnische Industrie Peter Lisec, GmbH, Amstetten | Verfahren und Vorrichtung zum Schneiden von Verbundglas |
SE435352B (sv) | 1983-05-04 | 1984-09-24 | Hydro Betong Ab | Konstruktionskropp for en berande konstruktion bestaende av ett antal med varandra sammanfogade skivor av plastmaterial, av exv uretanskum samt sett att tillverka sagda kropp |
GB8322258D0 (en) | 1983-08-18 | 1983-09-21 | Holmes A | Security and protection screens |
US4558622A (en) | 1983-11-04 | 1985-12-17 | Russell Tausheck | Apparatus for cutting laminated glass |
US4739555A (en) | 1985-06-18 | 1988-04-26 | Werner Jurgens | Laminated glass cutter |
FR2681472B1 (fr) | 1991-09-18 | 1993-10-29 | Commissariat Energie Atomique | Procede de fabrication de films minces de materiau semiconducteur. |
GB9201863D0 (en) | 1992-01-29 | 1992-03-18 | Dunn Kenneth R | Multi glazing air cushion release unit |
US6327978B1 (en) * | 1995-12-08 | 2001-12-11 | Kaman Aerospace Corporation | Exploding thin film bridge fracturing fragment detonator |
US5791056A (en) | 1996-11-22 | 1998-08-11 | Messina; Gary D. | Emergency glass breaking tool |
WO2000018191A1 (en) * | 1998-09-18 | 2000-03-30 | Marc Seghatol | Microwave polymerization system for dentistry |
DE19958750B4 (de) | 1999-12-07 | 2006-08-24 | Robert Bosch Gmbh | Leckwellenantenne |
KR100771258B1 (ko) | 2000-05-09 | 2007-10-29 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 본인 인증 시스템과 본인 인증 방법 및 휴대 전화 장치 |
US6418628B1 (en) | 2001-03-22 | 2002-07-16 | Task Force Tips, Inc. | Spring-loaded car window breaker and retractable safety sheath |
FR2823599B1 (fr) | 2001-04-13 | 2004-12-17 | Commissariat Energie Atomique | Substrat demomtable a tenue mecanique controlee et procede de realisation |
GB0127083D0 (en) | 2001-11-10 | 2002-01-02 | P W Allen & Company Ltd | Device for breaking glass |
FR2837304B1 (fr) | 2002-03-13 | 2004-05-28 | Commissariat Energie Atomique | Dispositif electronique securise |
US20040031966A1 (en) | 2002-08-16 | 2004-02-19 | Forrest Stephen R. | Organic photonic integrated circuit using a photodetector and a transparent organic light emitting device |
JP2004075504A (ja) | 2002-08-22 | 2004-03-11 | Nippon Sheet Glass Co Ltd | 板ガラスの複曲成形方法及びその装置 |
DE10305733B4 (de) | 2003-02-12 | 2005-10-20 | Saint Gobain Sekurit D Gmbh | Verfahren zum Erzeugen von Sollbruchstellen in Glasscheiben, Glasscheibe mit Schwächungszone und Verwendung derselben |
JP4115859B2 (ja) | 2003-02-28 | 2008-07-09 | 株式会社日立製作所 | 陽極接合方法および電子装置 |
DE10309826B4 (de) | 2003-03-05 | 2009-11-12 | Schott Ag | Verfahren zum Strukturieren von Phosphatgläsern durch zerstörungsfreien Ionenaustausch, strukturierte Phosphatgläser und deren Verwendung |
US7002517B2 (en) | 2003-06-20 | 2006-02-21 | Anritsu Company | Fixed-frequency beam-steerable leaky-wave microstrip antenna |
EP1517073A1 (en) | 2003-09-19 | 2005-03-23 | Universita degli Studi di Trento | ESP glass rupture disk |
JP2007509315A (ja) | 2003-10-09 | 2007-04-12 | オカス コーポレーション | 2層構造のボロメータ型赤外線センサ及びその製造方法 |
US20050082331A1 (en) | 2003-10-17 | 2005-04-21 | Chi-Hong Yang | Tempered glass breaker |
DE102004015546B4 (de) | 2004-03-30 | 2011-05-12 | Infineon Technologies Ag | Halbleiterchip mit integrierter Schaltung und Verfahren zum Sichern einer integrierten Halbleiterschaltung |
US20060270190A1 (en) | 2005-05-25 | 2006-11-30 | The Regents Of The University Of California | Method of transferring a thin crystalline semiconductor layer |
US20080311686A1 (en) | 2005-08-03 | 2008-12-18 | California Institute Of Technology | Method of Forming Semiconductor Layers on Handle Substrates |
US7880248B1 (en) | 2005-10-17 | 2011-02-01 | Teledyne Technologies Incorporated | Destructor integrated circuit chip, interposer electronic device and methods |
CN101313413B (zh) | 2005-11-18 | 2011-08-31 | 株式会社半导体能源研究所 | 光电转换装置 |
US8168050B2 (en) | 2006-07-05 | 2012-05-01 | Momentive Performance Materials Inc. | Electrode pattern for resistance heating element and wafer processing apparatus |
GB0717489D0 (en) | 2007-09-08 | 2007-10-17 | Design Factor Ni The Ltd | A Glass breaking device |
US7623560B2 (en) | 2007-09-27 | 2009-11-24 | Ostendo Technologies, Inc. | Quantum photonic imagers and methods of fabrication thereof |
US8006621B1 (en) | 2008-02-07 | 2011-08-30 | Cherry Christopher R | Linear explosive breaching apparatus and method |
JP2009212315A (ja) | 2008-03-04 | 2009-09-17 | Elpida Memory Inc | 半導体装置及びその製造方法 |
CN102067144B (zh) | 2008-06-13 | 2014-08-06 | Nxp股份有限公司 | 使用应力变化的侵入保护 |
KR20180015272A (ko) | 2008-08-08 | 2018-02-12 | 코닝 인코포레이티드 | 강화 유리 제품 및 제조방법 |
KR20100063269A (ko) | 2008-12-03 | 2010-06-11 | 주식회사 동부하이텍 | 이미지센서 및 그 제조방법 |
US8089285B2 (en) | 2009-03-03 | 2012-01-03 | International Business Machines Corporation | Implementing tamper resistant integrated circuit chips |
JP5095656B2 (ja) * | 2009-03-31 | 2012-12-12 | 株式会社神戸製鋼所 | 爆破処理方法および爆破処理装置 |
JP5095658B2 (ja) * | 2009-03-31 | 2012-12-12 | 株式会社神戸製鋼所 | 爆破処理方法及び爆破処理装置 |
JP5131933B2 (ja) * | 2009-03-31 | 2013-01-30 | 独立行政法人産業技術総合研究所 | 爆破処理方法および爆破処理装置 |
US8130072B2 (en) | 2009-05-14 | 2012-03-06 | Palo Alto Research Center Incorporated | Vanadium oxide thermal microprobes |
CN201532635U (zh) | 2009-09-03 | 2010-07-21 | 百富计算机技术(深圳)有限公司 | 一种安全保护装置 |
US8946590B2 (en) | 2009-11-30 | 2015-02-03 | Corning Incorporated | Methods for laser scribing and separating glass substrates |
FR2953213B1 (fr) | 2009-12-01 | 2013-03-29 | Saint Gobain | Procede de structuration de surface par abrasion ionique,surface structuree et utilisations |
TWI438162B (zh) | 2010-01-27 | 2014-05-21 | Wintek Corp | 強化玻璃切割方法及強化玻璃切割預置結構 |
US8393175B2 (en) | 2010-08-26 | 2013-03-12 | Corning Incorporated | Methods for extracting strengthened glass substrates from glass sheets |
US9450310B2 (en) | 2010-10-15 | 2016-09-20 | The Invention Science Fund I Llc | Surface scattering antennas |
US8607590B2 (en) | 2010-11-30 | 2013-12-17 | Corning Incorporated | Methods for separating glass articles from strengthened glass substrate sheets |
US8616024B2 (en) | 2010-11-30 | 2013-12-31 | Corning Incorporated | Methods for forming grooves and separating strengthened glass substrate sheets |
US8539794B2 (en) | 2011-02-01 | 2013-09-24 | Corning Incorporated | Strengthened glass substrate sheets and methods for fabricating glass panels from glass substrate sheets |
EP2695240A4 (en) | 2011-04-07 | 2015-03-11 | Polyvalor Ltd Partnership | CRLH SCALE WAVE ANTENNA WITH ENTIRE SPACE SCAN AND END SWITCHING |
US8695263B2 (en) * | 2011-07-01 | 2014-04-15 | Applied Explosives Technology Pty Limited | Shell destruction technique |
US8635887B2 (en) | 2011-08-10 | 2014-01-28 | Corning Incorporated | Methods for separating glass substrate sheets by laser-formed grooves |
TWI415809B (zh) | 2011-08-12 | 2013-11-21 | Wintek Corp | 強化玻璃單元及其製作方法以及具有強化玻璃單元的覆蓋板 |
US20130082383A1 (en) | 2011-10-03 | 2013-04-04 | Texas Instruments Incorporated | Electronic assembly having mixed interface including tsv die |
KR101979354B1 (ko) | 2011-12-01 | 2019-08-29 | 더 보오드 오브 트러스티스 오브 더 유니버시티 오브 일리노이즈 | 프로그램 변형을 실행하도록 설계된 과도 장치 |
CN102617023B (zh) | 2012-03-31 | 2014-12-31 | 洛阳兰迪玻璃机器股份有限公司 | 柱状曲面钢化玻璃加工装置 |
CN102617022B (zh) | 2012-03-31 | 2014-10-22 | 洛阳兰迪玻璃机器股份有限公司 | 柱状曲面钢化玻璃加工方法 |
SE537874C2 (sv) | 2012-04-13 | 2015-11-03 | Silex Microsystems Ab | CTE-anpassad interposer och metod att tillverka en sådan |
US20130273717A1 (en) | 2012-04-17 | 2013-10-17 | Taiwan Semiconductor Manufacturing Co., Ltd. | Apparatus and Method for the Singulation of a Semiconductor Wafer |
US9938180B2 (en) | 2012-06-05 | 2018-04-10 | Corning Incorporated | Methods of cutting glass using a laser |
KR101395054B1 (ko) | 2012-08-08 | 2014-05-14 | 삼성코닝정밀소재 주식회사 | 강화유리 커팅 방법 및 강화유리 커팅용 스테이지 |
US8765536B2 (en) | 2012-09-28 | 2014-07-01 | International Business Machines Corporation | Stress engineered multi-layers for integration of CMOS and Si nanophotonics |
US8816717B2 (en) | 2012-10-17 | 2014-08-26 | International Business Machines Corporation | Reactive material for integrated circuit tamper detection and response |
US20140060347A1 (en) * | 2012-10-19 | 2014-03-06 | Javad Sahebkar Yazdi | Universal Recycling & Disposal Machine (URDM) |
US9385435B2 (en) | 2013-03-15 | 2016-07-05 | The Invention Science Fund I, Llc | Surface scattering antenna improvements |
EP2984910B1 (en) | 2013-04-12 | 2020-01-01 | The Board of Trustees of the University of Illionis | Inorganic and organic transient electronic devices |
US9041205B2 (en) | 2013-06-28 | 2015-05-26 | Intel Corporation | Reliable microstrip routing for electronics components |
JP5582232B1 (ja) | 2013-07-30 | 2014-09-03 | 日本電気硝子株式会社 | 曲面形状を有するガラス板の製造方法、曲面形状を有するガラス板及び曲面形状を有するガラス板の製造装置 |
US9790128B2 (en) | 2013-08-07 | 2017-10-17 | Corning Incorporated | Laser controlled ion exchange process and glass articles formed therefrom |
US9154138B2 (en) | 2013-10-11 | 2015-10-06 | Palo Alto Research Center Incorporated | Stressed substrates for transient electronic systems |
US9356603B2 (en) | 2013-10-11 | 2016-05-31 | Palo Alto Research Center Incorporated | Thermally tempered glass substrate using CTE mismatched layers and paste mixtures for transient electronic systems |
US9294098B2 (en) | 2013-11-26 | 2016-03-22 | Lawrence Livermore National Security, Llc | System and method for on demand, vanishing, high performance electronic systems |
US9850160B2 (en) | 2013-12-17 | 2017-12-26 | Corning Incorporated | Laser cutting of display glass compositions |
US9853361B2 (en) | 2014-05-02 | 2017-12-26 | The Invention Science Fund I Llc | Surface scattering antennas with lumped elements |
US9711852B2 (en) | 2014-06-20 | 2017-07-18 | The Invention Science Fund I Llc | Modulation patterns for surface scattering antennas |
US10381326B2 (en) | 2014-05-28 | 2019-08-13 | Invensas Corporation | Structure and method for integrated circuits packaging with increased density |
FR3024136B1 (fr) | 2014-07-24 | 2021-04-30 | Saint Gobain | Procede de rompage d'une feuille de verre |
US9586857B2 (en) | 2014-11-17 | 2017-03-07 | International Business Machines Corporation | Controlling fragmentation of chemically strengthened glass |
US9780044B2 (en) | 2015-04-23 | 2017-10-03 | Palo Alto Research Center Incorporated | Transient electronic device with ion-exchanged glass treated interposer |
US9577047B2 (en) | 2015-07-10 | 2017-02-21 | Palo Alto Research Center Incorporated | Integration of semiconductor epilayers on non-native substrates |
US10012250B2 (en) | 2016-04-06 | 2018-07-03 | Palo Alto Research Center Incorporated | Stress-engineered frangible structures |
US10224297B2 (en) | 2016-07-26 | 2019-03-05 | Palo Alto Research Center Incorporated | Sensor and heater for stimulus-initiated fracture of a substrate |
US10026579B2 (en) | 2016-07-26 | 2018-07-17 | Palo Alto Research Center Incorporated | Self-limiting electrical triggering for initiating fracture of frangible glass |
US10903173B2 (en) | 2016-10-20 | 2021-01-26 | Palo Alto Research Center Incorporated | Pre-conditioned substrate |
US10026651B1 (en) | 2017-06-21 | 2018-07-17 | Palo Alto Research Center Incorporated | Singulation of ion-exchanged substrates |
US10479300B2 (en) | 2017-10-06 | 2019-11-19 | Ford Global Technologies, Llc | Monitoring of vehicle window vibrations for voice-command recognition |
US10717669B2 (en) | 2018-05-16 | 2020-07-21 | Palo Alto Research Center Incorporated | Apparatus and method for creating crack initiation sites in a self-fracturing frangible member |
-
2019
- 2019-05-03 US US16/403,131 patent/US10969205B2/en active Active
-
2020
- 2020-04-06 JP JP2020068659A patent/JP7362540B2/ja active Active
- 2020-04-28 EP EP20171951.5A patent/EP3741657A3/en active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0938950A (ja) * | 1995-07-31 | 1997-02-10 | Hitachi Zosen Corp | 被破壊物の破壊装置 |
JPH10331446A (ja) * | 1997-05-30 | 1998-12-15 | Hitachi Zosen Corp | 放電衝撃破壊方法および放電衝撃破壊装置 |
JPH11256977A (ja) * | 1998-03-06 | 1999-09-21 | Hitachi Zosen Corp | 破壊方法 |
US20080307992A1 (en) * | 2007-06-15 | 2008-12-18 | Jonathan Mohler | Charge system for destroying chips on a circuit board and method for destroying chips on a circuit board |
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US10969205B2 (en) | 2021-04-06 |
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