WO2005051815A3 - Method of joining using reactive multilayer foils with enhanced control of molten joining materials - Google Patents
Method of joining using reactive multilayer foils with enhanced control of molten joining materials Download PDFInfo
- Publication number
- WO2005051815A3 WO2005051815A3 PCT/US2004/023838 US2004023838W WO2005051815A3 WO 2005051815 A3 WO2005051815 A3 WO 2005051815A3 US 2004023838 W US2004023838 W US 2004023838W WO 2005051815 A3 WO2005051815 A3 WO 2005051815A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- joining
- enhanced control
- molten
- reactive multilayer
- materials
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/16—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating with interposition of special material to facilitate connection of the parts, e.g. material for absorbing or producing gas
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0006—Exothermic brazing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
- B23K20/023—Thermo-compression bonding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/16—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating with interposition of special material to facilitate connection of the parts, e.g. material for absorbing or producing gas
- B23K20/165—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating with interposition of special material to facilitate connection of the parts, e.g. material for absorbing or producing gas involving an exothermic reaction of the interposed material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0233—Sheets, foils
- B23K35/0238—Sheets, foils layered
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Ceramic Products (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Laminated Bodies (AREA)
Abstract
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006521285A JP2006528556A (en) | 2003-07-23 | 2004-07-23 | Bonding method using reactive multilayer foil with enhanced control of melt bonding material |
EP04817733A EP1648652A4 (en) | 2003-07-23 | 2004-07-23 | Method of joining using reactive multilayer foils with enhanced control of molten joining materials |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US48937803P | 2003-07-23 | 2003-07-23 | |
US60/489,378 | 2003-07-23 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2005051815A2 WO2005051815A2 (en) | 2005-06-09 |
WO2005051815A3 true WO2005051815A3 (en) | 2005-07-21 |
Family
ID=34632732
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2004/023838 WO2005051815A2 (en) | 2003-07-23 | 2004-07-23 | Method of joining using reactive multilayer foils with enhanced control of molten joining materials |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP1648652A4 (en) |
JP (1) | JP2006528556A (en) |
CN (1) | CN100471611C (en) |
WO (1) | WO2005051815A2 (en) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102006035765A1 (en) * | 2006-07-20 | 2008-01-24 | Technische Universität Ilmenau | Method and arrangement for producing a soldering or diffusion bonding of components made of identical or different materials |
DE102007048299A1 (en) | 2007-10-08 | 2009-04-09 | Behr Gmbh & Co. Kg | Mehrschichtlot |
DE102009006822B4 (en) * | 2009-01-29 | 2011-09-01 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Microstructure, process for its preparation, device for bonding a microstructure and microsystem |
CN102039708B (en) * | 2009-10-22 | 2013-12-11 | 清华大学 | Method for bonding two matrixes |
US8967453B2 (en) * | 2012-03-21 | 2015-03-03 | GM Global Technology Operations LLC | Methods of bonding components for fabricating electronic assemblies and electronic assemblies including bonded components |
DE102014102717B4 (en) | 2014-02-28 | 2022-10-06 | Endress+Hauser SE+Co. KG | Component arrangement with at least two components and method for producing a component arrangement |
JP2015172159A (en) * | 2014-03-12 | 2015-10-01 | 国立研究開発法人科学技術振興機構 | Self-propagating heat-generating grain and method of producing the same, and solder joint method and solder paste |
CN104191112B (en) * | 2014-08-15 | 2016-03-23 | 郑州机械研究所 | The method of attachment of Ag-Cu-Zn strip brazing material and special connection device thereof |
CN105945419B (en) * | 2016-06-24 | 2017-12-26 | 哈尔滨万洲焊接技术有限公司 | Rub deformation triggering self- propagating auxiliary aluminum/steel agitating friction bridging method |
CN108265258B (en) * | 2017-02-27 | 2020-05-08 | 克瓦申基娜·奥利加·叶甫盖尼耶夫娜 | Preparation method of multilayer energy-containing nano-structure foil for material connection |
DE102017216615A1 (en) * | 2017-09-20 | 2019-03-21 | Robert Bosch Gmbh | Carriage with cohesively attached Wälzflächenteil |
JP7421189B2 (en) * | 2020-02-14 | 2024-01-24 | 株式会社デンソー | Method of manufacturing electrical devices |
CN114340211A (en) * | 2020-06-29 | 2022-04-12 | 南京纳研企业管理合伙企业(有限合伙) | Circuit board composite material and preparation method and application thereof |
CN113929487B (en) * | 2020-06-29 | 2023-03-31 | 南京纳研企业管理合伙企业(有限合伙) | Piezoelectric ceramic composite material and preparation method and application thereof |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3729046A (en) * | 1971-09-10 | 1973-04-24 | Airco Inc | Process for manufacturing foil |
US4889745A (en) * | 1986-11-28 | 1989-12-26 | Japan As Represented By Director General Of Agency Of Industrial Science And Technology | Method for reactive preparation of a shaped body of inorganic compound of metal |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4715526A (en) * | 1986-11-20 | 1987-12-29 | General Dynamics, Pomona Division | Floating seal and method of its use |
US5038996A (en) * | 1988-10-12 | 1991-08-13 | International Business Machines Corporation | Bonding of metallic surfaces |
US6544662B2 (en) * | 1999-10-25 | 2003-04-08 | Alliedsignal Inc. | Process for manufacturing of brazed multi-channeled structures |
US6736942B2 (en) * | 2000-05-02 | 2004-05-18 | Johns Hopkins University | Freestanding reactive multilayer foils |
JP3798320B2 (en) * | 2000-05-02 | 2006-07-19 | ジョンズ ホプキンス ユニバーシティ | Method for producing reactive multilayer foil and resulting product |
-
2004
- 2004-07-23 JP JP2006521285A patent/JP2006528556A/en active Pending
- 2004-07-23 EP EP04817733A patent/EP1648652A4/en not_active Withdrawn
- 2004-07-23 WO PCT/US2004/023838 patent/WO2005051815A2/en active Application Filing
- 2004-07-23 CN CNB2004800264926A patent/CN100471611C/en not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3729046A (en) * | 1971-09-10 | 1973-04-24 | Airco Inc | Process for manufacturing foil |
US4889745A (en) * | 1986-11-28 | 1989-12-26 | Japan As Represented By Director General Of Agency Of Industrial Science And Technology | Method for reactive preparation of a shaped body of inorganic compound of metal |
Non-Patent Citations (1)
Title |
---|
See also references of EP1648652A4 * |
Also Published As
Publication number | Publication date |
---|---|
CN100471611C (en) | 2009-03-25 |
EP1648652A2 (en) | 2006-04-26 |
WO2005051815A2 (en) | 2005-06-09 |
CN1859997A (en) | 2006-11-08 |
JP2006528556A (en) | 2006-12-21 |
EP1648652A4 (en) | 2008-01-09 |
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