CN1859997A - Method of joining using reactive multilayer foils with enhanced control of molten joining materials - Google Patents

Method of joining using reactive multilayer foils with enhanced control of molten joining materials Download PDF

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Publication number
CN1859997A
CN1859997A CNA2004800264926A CN200480026492A CN1859997A CN 1859997 A CN1859997 A CN 1859997A CN A2004800264926 A CNA2004800264926 A CN A2004800264926A CN 200480026492 A CN200480026492 A CN 200480026492A CN 1859997 A CN1859997 A CN 1859997A
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pressure
seam
connection
bodies
solder
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CN100471611C (en
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O·尼奥
T·P·韦斯
王佳平
E·贝斯诺瓦恩
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Johns Hopkins University
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Johns Hopkins University
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/16—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating with interposition of special material to facilitate connection of the parts, e.g. material for absorbing or producing gas
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0006—Exothermic brazing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
    • B23K20/023—Thermo-compression bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/16—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating with interposition of special material to facilitate connection of the parts, e.g. material for absorbing or producing gas
    • B23K20/165—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating with interposition of special material to facilitate connection of the parts, e.g. material for absorbing or producing gas involving an exothermic reaction of the interposed material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0233—Sheets, foils
    • B23K35/0238—Sheets, foils layered

Abstract

In accordance with the invention, bodies of materials are joined by disposing between them a reactive multilayer foil and one or more layers of meltable joining material such as braze or solder. The bodies are pressed together against the foil and joining material, and the foil is ignited to melt the joining material. The pressing is near the critical pressure and typically produces a joint having a strength of at least 70-85% the maximum strength producible at practical maximum pressures. Thus for example, reactively formed stainless steel soldered joints that were heretofore made at an applied pressure of about 100 MPa can be made with substantially the same strength at a critical applied pressure of about 10 kPa. Advantages of the process include minimization of braze or solder extrusion and reduced equipment and processing costs, especially in the joining of large bodies.

Description

But fusion is connected the method for attachment of the use reactive multilayer paper tinsel that the control of material is improved
The cross reference of related application
The U.S. Provisional Application No.60/489 that the application requires people such as Jiaping Wang to submit on July 23rd, 2003, the priority of 378 (being entitled as " Methodology of Controlling Flow ofMolten Solder or Braze in Reactive Multilayer Joining ").
This application also is the U.S. Patent application No.10/844 that people such as Jiaping Wang submitted on May 13rd, 2004,816 part continuation application (being entitled as " Nanostructured Solderedor Brazed Joints Made With Reactive Multilayered Foils "), the latter requires following two U.S. Provisional Application No. again: the 1) No.60/469 that submits on May 13rd, 2003 of people such as Etienne Besnoir, 841 (being entitled as " Method of ControllingThermal Waves In Reactive Multilayer Joining and ResultingProduct "), with 2) No.60/475 that submits on June 4th, 2003 of people such as Jiaping Wang, 830 (being entitled as " Microstructure of Solder or Braze in JointsMade With Freestanding Reactive Multilayer Foils ").
The U.S. Patent application No.10/761 that this application is still submitted on January 21st, 2004 by people such as T.Weihs, the part continuation application of 688 (being entitled as " Freestanding Reactive Multilayer Foils "), the latter is the U.S. Patent application No.09/846 that submits to May 1 calendar year 2001, the division of 486 (being entitled as " Freestanding Reactive Multilayer Foils ").No.09/846,486 applications are non-provisional applications, the U.S. Provisional Application No.60/201 that it requires people such as T.Weihs to submit on May 2nd, 2000, the priority of 292 (being entitled as " ReactiveMultilayer Foils ").All applications of quoting in this part all are hereby incorporated by.
Governmental interests:
According to the Award DMI-0115238 that is supported by NSF, U.S. government has specific right for the present invention.
Background technology
The manufacturing of the multiple product in from huge steamer and aircraft to the scope of small semiconductor and optics, the element that connects (joints) identical or different material is basic.Be connected by solder brazing (brazing) or solder (soldering) in the manufacturing of the assembling of the product of forming by metal parts and electronics and optics and be even more important.
Traditionally, solder or brazing product are by between the matching surface that soft solder or hard solder is clipped in respective element and in stove or use flame that this sandwich structure is heated.Unfortunately, these traditional methods all are exposed to element and seam region under harmful heating usually.In solder brazing or solder, temperature sensitive element may damage, and the cause thermal damage of abutment joint makes expensive and time-consuming annealing necessitates.Unmatched big thermal coefficient of expansion (CTE does not match) can cause leafing or other damage.Optionally the low temperature connection can generate more unstable seam usually.
The U.S. Patent No. 6,736 of authorizing people such as T.Weihs on May 18th, 2004, but the reactive multilayer paper tinsel of describing in 942 can realize having the connection of height local heat as thermal source.But reactive foil is made up of the layer that replaces, and layer material is to select in the material of reaction each other heat release and automatic propagation reaction from meeting.In case reaction, paper tinsel will be supplied with the heat energy of the height part that can work to articulamentum.Connect material (hard solder or soft solder) if use, the paper tinsel reaction just can be supplied with enough heat and make the fusion of connection material, connects material in case cooling will form the strong combination that the lot of materials body is connected.
But be usually directed between material bodies, be provided with reactive multilayer paper tinsel and fusible one or more layers or the coating that is connected material but use the reactive multilayer paper tinsel that material bodies is connected, material bodies is exerted pressure on down extruding leans against paper tinsel and is connected material together at height, and start automatically by paper tinsel that the propagation chemical reaction makes the fusion of connection material.
Although this process (technology, method) operation is fine and can make harmful heating of material bodies reduce to minimum, but observe in some applications, fusion connects material can flee from seam in side direction, in case cooling will stay the undesirable thin articulamentum and the outside residue of undesirable connection material.Have been noted that also that when needs connect very large element normally used pressure in this process (high to 100 MPas) encounters difficulties.Use high pressure that big element is loaded equipment very difficult and need be large-scale and expensive.Therefore, just need a kind ofly improvedly to connect the method for product by the multilayer paper tinsel that can react, it can provide high joint strength, to the control of the improvement that connects material behavior and the ease of use of raising.
Summary of the invention
Inventor of the present invention is definite, but has critical exerting pressure in the connection of material bodies by the reactive multilayer paper tinsel, compares with the intensity that is generated by higher substantially pressure, and critical exerting pressure can provide approaching maximum joint strength.In addition, they also find, in limiting value, can reduce critical exerting pressure by volume and/or the fusion duration that increases melted material.
Therefore according to the present invention, but material bodies is connected material for example hard solder or soft solder connects by the reactive multilayer paper tinsel is set between them with one or more layers fusible.On material bodies is extruded and leans against paper tinsel together and be connected material, and paper tinsel is lighted a fire fusion to connect material.This extruding is near critical pressure and can form the seam that intensity is the 70-85% of the maximum intensity that can generate under actual maximum pressure at least usually.Therefore, for example, the stainless steel soft soldering seam that forms in the reaction that forms under the exerting pressure of about 100 MPas just can create and have essentially identical intensity under about 10 kPas critical exerting pressure in the past.The advantage of method comprises equipment that minimizes and reduce and the processing cost that hard solder or soft solder are extruded, especially in the connection of big material bodies.
Description of drawings
By considering now the illustrative examples that will describe in detail and in conjunction with the accompanying drawings, character of the present invention, advantage and various additional feature will be more apparent.In the accompanying drawing:
Fig. 1 is the schematic diagram of automatic propagation reaction in the multilayer paper tinsel, has shown the sectional view of atom and thermal diffusion;
Fig. 2 is the schematic diagram that shows that the reaction of two elements connects, and carries out but this reaction connection is to use reactive multilayer paper tinsel and two soft solders or braze layer utilization to exert pressure;
Fig. 3 is the schematic diagram that shows that the reaction of plating Au stainless steel element connects, and this reaction connects and is to use the Al/Ni paper tinsel that plates Incusil and two AuSn or AgSn solder layer to carry out;
Fig. 4 a to Fig. 4 b is the image of the SEM micrograph of stainless steel element, and this stainless steel element is used and can reacts Al/Ni paper tinsel (100 micron thickness) and two independent AuSn soft solders (25 micron thickness) layer and link together in being connected under the pressure of (a) that apply 10 kPas.Here the thickness of solder layer is held constant at 25 microns before and after solder.(b) 60 MPas.Note that most of AuSn soft solders approximately only are 5 microns from the thickness of seam outflow and solder layer;
Fig. 5 is to use the figure of the shear strength of the stainless steel seam that the Al/Ni paper tinsel (100 microns) that can react and AuSn soft solder (25 micron thickness) make, be shown as open circles, or Al/Ni paper tinsel (40 microns) and AgSn soft solder (25 microns), be shown as filled circles, this shear strength is shown as the function of the connection pressure that applies.These two kinds of data groups are enlightened the connection pressure that applies and need be reached critical value the AuSn of fusion or AgSn soft solder can fully be flowed to form strong seam;
Fig. 6 a to Fig. 6 c is to use the image of the plane of disruption of the stainless steel seam that the Al/Ni paper tinsel (100 micron thickness) that can react and AuSn solder layer (25 micron thickness) make, and this image obtains by the optical stereo microscope;
Fig. 6 a has shown the seam that forms under 2 kPas exerting pressure, and has shown the shear strength of local wetting and 8 MPas of plating Au stainless steel sample.All solder material all remain in the join domain;
Fig. 6 b is the seam that forms under 10 kPas exerting pressure, and has shown the complete wetting of plating Au stainless steel sample and the shear strength of 50 MPas.All solder material all remain in the join domain;
Fig. 6 c is the seam that forms under the exerting pressure of 30 MPas, and has shown the complete wetting of plating Au stainless steel sample and the shear strength of 50 MPas.A large amount of soft solders flow out from join domain;
Fig. 7 a is the experiment set-up dirgram that is used for interface (between face) thermal resistance measurement, and a paper tinsel that can react and two independent solder layer are placed between Ti and the SiC piece;
Fig. 7 b shows the schematic diagram that uses the interior thermograde of each element and the temperature difference at the interface to calculate interface resistance;
Fig. 8 is the accompanying drawing of the surface temperature of the Ti that clamps under different pressures and SiC piece.Interface resistance can be calculated by thermograde at the interface the temperature difference, the element and the thermal conductivity meter in this element;
Fig. 9 has shown that schematically plating Au stainless steel and Al element use the Al/Ni paper tinsel of plating Incusil and the reaction of two AuSn solder layer to be connected;
Figure 10 is the figure as the shear strength of the stainless steel seam of the function of the connection pressure that applies and al alloy joint;
Figure 11 a is the figure of stainless steel seam, has shown complete wetting;
Figure 11 b is the image of al alloy joint, shown local wetting, al alloy joint all uses Al/Ni paper tinsel (100 micron thickness) and the AuSn solder layer (25 micron thickness) that can react to make under 10 kPas exerting pressure, and this image obtains by the optical stereo microscope;
Figure 12 has shown that schematically the reaction of the plating Au stainless steel element of the Al/Ni paper tinsel that uses plating Incusil connects.The Incusil coating is as braze material and do not have independently soft solder or braze layer;
Figure 13 is the shear strength figure of the function of the connection pressure that applies of the conduct of stainless steel seam, the stainless steel seam is to use Al/Ni paper tinsel and AuSn or AgSn soft solder (25 micron thickness) or Incusil hard solder (1 micron) to make, and this figure enlightens out character and the physical dimension that the critical value of exerting pressure depends on soft solder or braze material;
Figure 14 a and Figure 14 b are to use the image of the plane of disruption of the stainless steel seam that the Al/Ni paper tinsel (150 micron thickness) that can react and Incusil hard solder (1 micron thickness) make, and this image is to use the optical stereo microscope to obtain;
Figure 14 a is the image of the seam that forms under 10 kPas pressure and has shown and do not plate the moistening of Au stainless steel sample substantially and be the shear strength of 0 MPa substantially;
Figure 14 b is the image of the seam of formation under the exerting pressure of 6 MPas and has shown the complete wetting of plating Au stainless steel sample and the high shear strength of 80 MPas;
Figure 15 has schematically shown the plating Au stainless steel element that uses on the PC plate that the paper tinsel that can react and solder layer be connected to plating Au; And
Figure 16 is the chart of shear strength to exerting pressure that is used for the syndeton of Figure 15.
Should be appreciated that these accompanying drawings are the purposes that are used to show notion of the present invention, and except curve map and micrograph, all be not pro rata.
The specific embodiment
Specification is divided into two parts.Part I describes and has shown that but reactive foil is connected, and part II has described the control of fusion connection material in the connection procedure.The Reference numeral of the numeral indication of having drawn together with bracket is quoted in subordinate list fully.
But I. use the reactive multilayer paper tinsel that material bodies is connected
For example observe automatic propagation heat release reaction of formation in Al/Ni, Al/Ti, Ni/Si and the Nb/Si paper tinsel [1-4] at multiple nanostructured multilayer paper tinsel.These reactions are to be driven by the reduction of atom bond energy.In case the atom diffusion will be taken place perpendicular to layer by for example sparklet or flame startup of energy pulses in reaction.
But Fig. 1 has schematically shown layer 16 and the layer 18 multilayer reactive foil 14 that alternately forms made by materials A and material B respectively.Layer 16 that these replace and layer 18 can be can respond stimulus to make adjacent atom mix any materials of (or chemical bonding is changed).Preferably, element is based on their reactions to A/B and selects in the mode that generation has a stable compound of big negative thermosetting and high adiabatic reaction temperature.In the above-mentioned U.S. Patent application No.09/846 that is hereby incorporated by, multiple such combination has been proposed in 486.
Heat can be very rapidly given birth in the key exchange.The thermal diffusion meeting is parallel to that layer takes place and heat can be transmitted under the paper tinsel and is easy to that more atom mixes and compound forms, thereby foundation is along the automatic propagation reaction of paper tinsel.The speed of these self-propagating exothermic reactions depends on layer thickness and can be up to 30 meter per seconds, and maximum reaction temperature is higher than 1200 degrees centigrade [5].
The multilayer paper tinsel that can react provides unique chance, can by use paper tinsel as local heat source come flow of molten solder or braze layer and therefore Connection Element improve traditional solder and solder brazing technology significantly.The paper tinsel solder that can react or solder brazing can at room temperature and in air, argon gas or vacuum be carried out.
Fig. 2 schematically illustrates the paper tinsel 14 that uses multilayer to react two element 20A and 20B is linked together.The paper tinsel 14 that can react is clipped between the matching surface 21A of element and the 21B and one or more layers or coating 22A, the 22B of contiguous hard solder or soft solder.The preferably above-mentioned application No.09/846 of the paper tinsel 14 that can react, the paper tinsel that the stand alone type described in 486 can be reacted still also can be the coating on one or more element 20A, 20B.Hard solder or soft solder 22A, 22B can be the coatings on freestanding or the element.
In case element, paper tinsel and soft solder or hard solder assemble and force together, just generate quick and strong thermal diffusion as before passing through the heat wave of paper tinsel to paper tinsel 14 point of applications fire stimulus 23.
This new reaction connection procedure has been eliminated the stove or the needs of external heat source thereafter.In addition, reaction connects provides very local heating, so just can connect thermally sensitive element or material and does not have fire damage.The local heat that is provided by the paper tinsel that can react also helps connecting the material with very different thermal coefficient of expansions, for example connects metal and pottery.Usually, when with the metal solder or when being brazed to pottery and going up, can be the time from high solder or the cooling of solder brazing temperature owing to metal and pottery between mismatch in coefficient of thermal expansion very big thermal stress appears.These thermal stress will limit the size of metal/ceramic seam region.When using the multilayer that can react to connect, the heat and the rising of temperature that metal and ceramic component absorb seldom are very limited.Basically have only the surface of soft solder or braze layer and element to be heated.Therefore just the CTE problem and the delamination that is connected that connect have been avoided.
In addition, the reaction connection procedure is very fast, expense is cheap and can generate the seam of strong and thermal conducting.Therefore just can realize sizable commercial benefit, especially for the assembling of microelectronic component.
II. the control of fusion connection material in the connection procedure
Before for using researching and proposing of the paper tinsel that can react and soft solder or hard solder Connection Element, under the exerting pressure of 100 MPas, the paper tinsel that can use Al/Ni to react successfully is connected the stainless steel sample with the AuSn solder layer, has 50 MPa shear strengths [8].Also observe, a large amount of AuSn soft solders flow out from join domain.Flow of molten solder can limit this method in the application that element is connected on the very accurate electron plate from the outflow of seam region, and this is because the splash meeting that solder material causes owing to high stress application damages other element or the circuit line on the same plate.
The seam that also proposes to have thin solder layer in the document is for heat fatigue responsive [9] more.If applied pressure is too high in connection procedure, also have too much flowing of flow of molten solder or hard solder.Therefore, too much soft solder or hard solder will be extruded from join domain, thereby cause extremely thin soft solder or braze layer, and this can shorten the heat fatigue and the mechanical fatigue life-span of seam.
Having shown in the literature exerts pressure can connect and the performance that influences the seam that generates during reaction is connected in tradition.For example, comprise PbO, ZnO, B when conventionally using 2O 3And SiO 2The coml solder glass AIN element is carried out stove when connecting, the pressure that applies 19 kPas in connection procedure on joint assembly can improve the VISCOUS FLOW of solder glass and help to eliminate pore.Applied pressure also can reduce processing time and temperature [10] by the pressure VISCOUS FLOW of solder glass.
Applied pressure also can play an important role in the multilayer welding termination process that can react.For example, when using the Al/Ni paper tinsel that can react to connect a large amount of glassy metal sample of Zr base, connecting pressure when 20 MPas improve 160 MPas, the shear strength of seam is increased to 500 MPas [11] from 100 MPas.According to suggestion, improving in connection procedure exerts pressure can improve the driving force that makes soften glass flow into crackle in the paper tinsel that can react.In this case, do not use soft solder or braze material and seam to form by softening element self.Yet in the various application of reaction method of attachment, can use soft solder or braze material and seam is by flow of molten solder or braze material and wetting formation on element.In research before this, do not solve the effect of exerting pressure that the reaction that is used for these physical dimensions connects, and the character of its effect is difficult to prediction.
The invention describes multilayer that control can react connect in the flowing of flow of molten solder or hard solder to improve the method for switching performance.We have considered the fusion duration of the connection pressure, soft solder or the braze material that apply and the volume of flow of molten solder or braze material according to the order that occurs.Shown critical the determining of exerting pressure that optimization connects then.
(a) the connection pressure that applies
At first, we describe the interface resistance in the flowing of the soft solder of the connection pressure influence fusion apply or braze material, the connection procedure and the mode of the joint strength that generates.Higher applying connects pressure and can improve flowing of flow of molten solder or braze material, improves wetting conditions and forms more strong seam.This seam is shown as by the stainless steel element uses the Al/Ni paper tinsel 14 that can react to be connected with AuSn or AgSn solder layer.These seams are to make by pile up the paper tinsel that two AuSn or two AgSn solder layer 22A, 22B and one deck can react between two stainless steel sample 20A, 20B, as schematically showing among Fig. 3.The size of stainless steel sample is 0.5 millimeter * 6 millimeters * 25 millimeters and uses Ni and Au coating 30 is electroplated to improve combination.These stainless steel samples are at room temperature to connect by under 2 kPas of pressure in the 300 MPa scopes paper tinsel that can react being lighted a fire in air.
Cross section by the untested stainless steel seam of Al/Ni paper tinsel that can react and the manufacturing of AuSn solder layer is polished to 1 micron fineness, uses SEM (SEM) to characterize then in the JEOL microscope.Fig. 4 (a) and 4 (b) have shown the stainless steel sample that uses paper tinsel (100 micron thickness) that one deck Al/Ni can react and two-layer independently AuSn soft solder (25 micron thickness) to be connected under different pressures-10 kPa and 60 MPas.When low exert pressure (10 kPas) connect down, the thickness of solder layer is held constant at 25 microns (Fig. 4 (a)) before and after solder.Yet, when when higher exerting pressure (60 MPa) connects down, the thickness of AuSn solder layer can be reduced to 5 microns (Fig. 4 (b)) from 25 microns, this just shows that higher applying connects pressure and can improve flowing of flow of molten solder, helps soft solder to flow in the crackle that forms in the paper tinsel of reaction and flows out from join domain.These flow and cause thinner solder layer.As indicated above, thin solder joints is more responsive to heat fatigue and mechanical fatigue.In addition, since high apply connect extra solder extrusion that pressure causes can be by generating near undesirable short circuit other device damaging.
In order to determine to form the strong required connection pressure of seam, use the stainless steel seam of making by Al/Ni paper tinsel (100 microns) (100 microns) and AuSn soft solder (25 microns) layer at room temperature to use Instron (Instron) testing machine under the crosshead speed of tension force and 0.1 mm/min, to test.The shear strength of these seams is by obtaining maximum failure load divided by the seam area, and is depicted as the function of the connection pressure that applies in Fig. 5.When 2 kPas increased to 10 kPas, the shear strength of seam also increased to 50 MPas from 8 MPas at the connection pressure that applies.Required low-down pressure enabled to be applied to the connection of the element on the big surface area during reaction connected.The further increase of the connection pressure that applies can not improve the shear strength of seam basically.The shear strength of the seam that forms under the pressure between 10 kPas and 300 MPas can be held constant at about 50 MPa places substantially.
Some stainless steel seams are to use Al/Ni paper tinsel (40 microns) and AgSn soft solder (25 microns) layer to make.The Al/Ni paper tinsel of 40 micron thickness because comparing with the AuSn soft solder, the AgSn soft solder has low many fusing points, so can provide enough heat to come all AgSn soft solders of fusion.Mechanical test on these seams has shown similar trend.The shear strength of these seams can increase along with the increase of exerting pressure, and arrives critical value until it.The shear strength of seam is constant substantially subsequently, as shown in Figure 5.When using different types of paper tinsel that reacts to be connected another kind of material or element with soft solder or braze material, expectation can see that also shear strength is with this variation of exerting pressure.Generally speaking, when using the paper tinsel that can react and independent soft solder or braze material Connection Element, improving exerts pressure can improve the shear strength of the seam that is obtained, until certain maximum.For higher exerting pressure, it is constant relatively that measured shear strength will keep.In other words, the connection pressure that is applied need reach critical value to form strong seam.
We have used the optical stereo microscopic study under various connection pressure use Al/Ni paper tinsel (100 micron thickness) and the stainless steel seam made of AuSn solder layer (25 microns) independently, thereby the flowing and element the wetting directly related of shear strength that makes the connection pressure that applies and seam and flow of molten solder or hard solder.Shown in Fig. 6 (a), for the seam that forms under 2 kPas exerting pressure, local wetting and all the AuSn soft solders with plating Au stainless steel sample remain in the join domain.This very limited wetting meeting causes the low shear strength of seam, i.e. 8 MPas.Exerting pressure when increasing to 10 kPas, have the complete wetting of plating Au stainless steel sample, and all AuSn soft solders are still remaining on join domain (Fig. 6 (b)).Because complete wetting, the shear strength of seam can increase to 50 MPas.Under high many 30 MPas of for example exerting pressure, also have the complete wetting of plating Au stainless steel sample, and also have considerable AuSn soft solder to flow out, shown in Fig. 6 (c) from join domain.This is consistent with the extremely thin solder layer that applies in the stainless steel seam that forms under the connection pressure at height of observing in the cross section (Fig. 4 (b)) that uses SEM.Seam among Fig. 4 (b) has also shown the high shear strength of about 50 MPas, and this is because the complete wetting of sample, though coexist 10 kPas exerting pressure down the seam of formation compare, the AuSn solder layer is more thinner significantly.The optical stereo microscope figure of the SEM micrograph of the cross section of the seam that can react and the plane of disruption enlightens with the shear strength of these seams, when the connection pressure that applies increases, meeting improves flowing of fusion AuSn soft solder, thereby therefore causes better wetting and the more strong seam of formation.Simultaneously, the AuSn soft solder that pushes from join domain also can increase along with the increase of the connection pressure that applies, thereby causes being easier to the thinner solder layer of heat fatigue.
This method can be generalized to multiple other material system, and wherein other material or element use different types of paper tinsel that reacts to be connected with soft solder or braze material.Institute's applied pressure need reach critical exerting pressure and optimize flowing of flow of molten solder or braze material, thereby therefore the complete wetting sample forms strong seam.In addition, it is too many that applied pressure should not surpass critical pressure, and soft solder or braze extrusion will keep minimum and soft solder or braze layer thickness will keep maximum like this.Like this, just can optimize the performance of the seam that obtains.
The connection pressure that is applied also can influence the interface resistance in the seam.Higher applying connects pressure and can reduce interface resistance and improve flowing of flow of molten solder or hard solder, therefore improves switching performance.This is based on a Ti piece being clipped between heating plate and the coldplate and the thermal measurement of a SiC piece shows.The paper tinsel 14 that one deck can react and two solder layer 22A, 22B put between Ti piece 20A and the SiC piece 20B, as shown in Figure 7.Being in the SiC of poised state and the temperature in the Ti piece is to use that thermal camera is measured and is depicted among Fig. 8.Interface resistance R can be expressed as,
R = ΔT Ak dT dx
Wherein Δ T is the temperature difference at the interface, and A is the area at interface, and k is the thermal conductivity of an element, and dT/dx is the thermograde in this element.According to calculating, when applied pressure when 10 MPas increase to 20 MPas, interface resistance is reduced to 3.4K/W from 5.0K/W.This experiment demonstrates, and higher applying connects pressure can reduce interface resistance, and the fusion that therefore improves heat transfer process and raising soft solder or hard solder is with mobile.
(b) the fusion duration of soft solder or hard solder
The fusion duration of soft solder or hard solder also can influence soft solder or braze flow and therefore influence the reaction switching performance.For different material systems, soft solder or hard solder are fully flowed and therefore form the required critical fusion duration of exerting pressure and depending on soft solder or braze material of strong seam.Usually, the long soft solder or the fusion duration of braze material can be improved the wetting and flow of molten solder of element or flowing of hard solder, thereby cause the lower critical connection pressure that applies.This be by use the Al/Ni paper tinsel (100 microns) that can react and independently AuSn solder layer (25) reaction of relatively plating Au stainless steel sample (0.5 millimeter * 6 millimeters * 25 millimeters) is connected to be connected and shows with the reaction of the al alloy specimens (0.5 millimeter * 6 millimeters * 25 millimeters) of plating Au, as schematically demonstration among Fig. 9.In Figure 10, the shear strength of stainless steel seam and al alloy joint is depicted as the function that is connected pressure that applies.Connect under the pressure 10 kPas apply, the stainless steel sample can successfully connect and have the shear strength that surpasses 50 MPas, and al alloy joint is still quite insecure, has the shear strength less than 10 MPas.All the stainless steel seam of formation and the plane of disruption of al alloy joint under 10 kPas exerting pressure have been shown among Figure 11.For the stainless steel seam, there be the complete wetting of AuSn soft solder on the stainless steel sample, thereby generate strong seam.Yet, for al alloy joint, only observe local wetting on the al alloy specimens, so suitable not firm of seam.These different wetting states are that aluminium alloy has high many thermal conductivities (167W/mK) owing to compare with stainless thermal conductivity (16.2W/mK) in stainless steel seam and the al alloy joint.In being connected according to reaction in stainless steel described in the patent [12] early and al alloy specimens to the numerical prediction of AuSn solder layer fusion, using the Al/Ni paper tinsel (100 microns) that to react and AuSn solder layer (25 microns) under stainless steel and the state that al alloy specimens is connected, the fusion duration of AuSn soft solder in al alloy joint only is 1 microsecond, by comparison, be 5 microseconds in the stainless steel seam.The fusion of the AuSn solder material in al alloy joint has under the situation of duration of such weak point, just needs higher pressure to improve the flowing of soft solder of fusion, improves the wetting of plating Au sample, and fills any gap in the seam.As shown in figure 10, the shear strength of al alloy joint can increase gradually along with the increase that connects pressure.These results enlighten out, and critical value of exerting pressure depends on the fusion duration of AuSn soft solder.The longer fusion duration of AuSn soft solder can be improved flowing of flow of molten solder, therefore causes lower critical exerting pressure.For a person skilled in the art, this principle can be generalized in multiple other material system obviously.As advising in the previous patent [12], the fusion duration of soft solder or braze material is that paper tinsel, element and the soft solder that for example can be reacted by Several Factors or the physical dimension and the character of braze material are determined.Therefore, the soft solder of fusion or hard solder flowing in reaction connects just can be controlled with the pressure that is connected that applies by changing these factors, thereby makes performance the best of the seam that can react.
(c) volume of flow of molten solder or hard solder
How our volume that will describe flow of molten solder available in the seam that can react or hard solder influences flowing and switching performance of soft solder or hard solder now.The flow of molten solder of larger volume or braze material can improve flowing of soft solder or hard solder in the seam that can react, therefore improve the wetting and switching performance of sample.Therefore, just need the lower critical connection pressure that applies to form strong seam.This reaction that is based on the plating Au stainless steel (0.5 millimeter * 6 millimeters * 25 millimeters) of the soft solder that uses Al/Ni paper tinsel and different volumes or braze material is connected demonstration.Some stainless steel seams are under 2 kPas of exerting pressure in the 300 MPa scopes, use Al/Ni paper tinsel and AuSn solder layer (25 microns) or AgSn solder layer (25 microns) to make, as shown in Figure 3.But some stainless steel seams are to be placed between two stainless steel samples by the reactive foil of one deck being plated Incusil to form, as schematically showing among Figure 12.Here, the Incusil coating of 1 micron thickness is used as braze material and does not use independent soft solder or braze layer on the paper tinsel that can react.These samples are to connect under 10 kPas of exerting pressure in the 100 MPa scopes, and have used the paper tinsel of suitable thickness to come fusion AgSn and AuSn soft solder and Incusil hard solder.Experimental result shows that when AuSn that uses 25 micron thickness or AgSn solder material, critical the exerting pressure that forms strong seam is 10 kPas.When using the Incusil hard solder of 1 micron thickness, need form strong seam up to exerting pressure of 6 MPas, as shown in figure 13.The plane of disruption that has shown the stainless steel seam that the Incusil hard solder that uses the Al/Ni paper tinsel that can react and 1 micron thickness is made among Figure 14.The seam that forms under 10 kPas exerting pressure does not demonstrate the wetting of plating Au stainless steel sample substantially and demonstrates zero shear strength, and the seam that forms under the exerting pressure of 6 MPas has shown the complete wetting of plating Au stainless steel sample and the very high shear strength of 80 MPas.Connect in the physical dimension at this, the volume of fusion braze material is quite limited, therefore compare with other connection physical dimension with thicker soft solder or braze layer, in connection procedure, need very high pressure to improve flowing of fusion hard solder, come the complete wetting sample, and form strong seam.This also is applicable to other material system.Generally speaking, the flow of molten solder of available larger volume or braze material can improve flowing of soft solder or braze material in connection procedure, therefore just need lower critical exerting pressure to form good seam.
(d) determine critical exerting pressure
Exert pressure and to determine by among the shear strength of type shown in Figure 16 and the figure that is connected pressure that applies for given application critical.Should be pointed out that pressure is plotted on the logarithmic scale.The applicant observes, and the data point among this figure can be divided into two groups.In corresponding to low a group 160 of exerting pressure, joint strength can increase with the high gradient (gradient) when exerting pressure increase significantly.Applying in another group 161 that connects pressure corresponding to higher, joint strength is along with the increase of pressure only increases slightly with the flat or very little gradient.Critically apply that to connect pressure be the pressure at the point of inflexion on a curve place between high gradient group and low gradient group.It can more accurately be determined by the curve match, for example as the pressure at some P place, wherein intersects through the fit line 162 of too high gradient group 160 and the fit line 163 of the low gradient group of process at a P place.
How our present proposition discerns the critical instantiation that connects pressure that applies of different materials.As shown in figure 15, plating Au stainless steel element 150 uses Al/Ni paper tinsel 152 (100 microns) and the AuSn solder layer 153 (25 microns) that can react to be connected on the RodgersPC plate 151 of plating Au.The size of stainless steel element 150 is that the size of 0.5 millimeter * 6 millimeters * 25 millimeters and Rodgers PC plate 151 is 1 millimeter * 15 millimeters * 25 millimeters.In the scope of join domain between 18 to 30 square millimeters.Connection procedure is at room temperature to carry out by under 2 kPas of pressure in the 100 MPa scopes paper tinsel that can react being lighted a fire in air.The shear strength that has shown the seam that use Al/Ni paper tinsel and AuSn solder layer are made among Figure 16.When the connection pressure that applies when 2 kPas increase to 30 kPas, joint shear strength increases to 30 MPas significantly from 10 MPas.Cause the small raising of joint shear strength in the further increase in the connection pressure of 100 MPas that applies, promptly be elevated to 40 MPas from 30 MPas.Therefore, the seam that forms under 30% exerting pressure has about 75% the intensity that generates in the time of can using the exerting pressure of 100 MPas.This figure demonstrates, and in order will to plate on the Rodgers PC plate that Au stainless steel element is connected to plating Au, critical applying connects pressure and be in flex point zone about 30 kPas.
For many application, critically exert pressure that realized can be by peaked at least 70% the joint strength that can not damage that the actual maximum pressure that is connected material obtains.As indicated above, optimum pressure should be too surpasses critical pressure to avoid extruding and the reduction of caused their thickness of hard solder and soft solder.And pressure should be near critical pressure to obtain to be connected the best wetting of element.Therefore, applied pressure advantageously near critical pressure, usually the critical pressure in the scope that generates about 70% to 85% maximum joint strength ± 5% within.Use for the great majority that connect metal, pottery or other structural material, the practical application of the critical pressure ratio maximum of expectation is exerted pressure little by about 10%.Use the joint strength under the exerting pressure of approaching about 100 MPas of the joint strength maximum actual pressure under for these.Lower exerting pressure is easy to have formation greater than the big regional seam of 10 square inches area.
In brief, the volume of inner available flow of molten solder of the fusion duration of connection pressure, soft solder or the braze material that can apply by change and seam or braze material is controlled flowing of flow of molten solder in the multilayer seam that can react or braze material.Higher applying connects pressure and can improve flowing of flow of molten solder or braze material, improves wetting conditions, thereby forms more strong seam.The connection pressure that applies need can fully flow the soft solder of fusion or braze material and forms good seam near critical value.The arrival critical value in case exert pressure, the shear strength of seam are just basic to keep constant.The thickness of soft solder or braze layer can reduce along with the increase of the connection pressure that applies in the seam that can react.In the fusion duration of soft solder or braze material and the seam volume of available flow of molten solder or braze material also can influence reaction is connected in flow of molten solder or hard solder mobile.Flow of molten solder or hard solder than long duration and larger volume can improve flowing of soft solder or hard solder and cause lower critical exerting pressure.The fusion duration of soft solder or hard solder is to be determined by the character of the paper tinsel that can react, soft solder or braze material and element and physical dimension.Therefore, connection pressure, the paper tinsel that can react, soft solder or the braze material that can apply by change and the character of element and physical dimension control reaction is connected in flow of molten solder or hard solder mobile, thereby make performance the best of the seam of acquisition.
Therefore, the present invention can be considered as comprising multilayer paper tinsel and fusible one or more layers or connection first material bodies of coating and the method for second material bodies that is connected material that a kind of use can be reacted.It comprises the paper tinsel that can react and fusible connection material arrangements between material bodies, with material bodies press together against paper tinsel be connected material on, and start automatic propagation reaction by paper tinsel and connect material with fusion.Material bodies is coarctate near pressure place in the flex point zone in the figure of joint strength (shear strength) and the logarithm of exerting pressure or this pressure.Particularly, this figure is characterised in that lower pressure span has the higher gradient, and higher pressure span has the low gradient, and has the flex point zone between high sloping region and low sloping region.Material bodies should be pushed the best of breed of extruding the seam minimum with good wet that obtains approaching maximum joint strength, minimal solder flow, connection surface and the high confining force that is connected material thickness and material side direction at the place of exerting pressure in this flex point zone.
The another kind of mode that specifies in the desired pressure of using in the connection procedure be joint strength can be applying can the damaged material body maximum actual pressure place obtain.Desired pressure is much smaller than maximum pressure, but but can form the seam with 70% the shear strength that equals maximum pressure down cut intensity.Desired pressure is typically less than 20% of maximum pressure, and usually less than 10%.
Typical case for the body of most of metals, pottery or other structural material connects, and the shear strength that is generated by exerting pressure of 100 MPas is shear strength rationally approximate under maximum actual pressure.So, expectation exert pressure be one far below 100 MPas and can form the value of seam with at least 70% the shear strength that equals the following shear strength that generates of 100 MPas.For the connection of typical microelectronics or semi-conducting material, the shear strength at maximum actual pressure place is approximately the shear strength at about 1.0 MPa places.
The another kind of mode of used desired pressure in the connection procedure of specifying in is that critical exerting pressure makes low-intensity separate with the zone of low-intensity to the pressure gradient the zone of the pressure gradient.The expectation exert pressure be advantageously located at this critical pressure ± 5% in.
The favourable supplementary features of said process are to exert pressure less than about 30 kPas, and preferably less than about 20 kPas.Connect material and have greater than about 0.5 micron thickness, and it is enough low to exert pressure, the minimizing of thickness is no more than 20% in the connection procedure like this.The fusion of connection material has the duration greater than about 0.5 microsecond, and material bodies is connecting above on about 0.03 square centimeter area.This process is especially favourable when formation surpasses about 10 square inches large tracts of land seam.
Many schematically several in may specific embodiments that should be appreciated that the foregoing description only is that expression the present invention uses.Those skilled in the art can make a lot of various other configurations and not break away from the spirit and scope of the present invention.

Claims (43)

1. but one kind is utilized reactive multilayer paper tinsel and fusible one or more layers of material or the method that coating connects first material bodies and second material bodies of being connected, and comprises the following steps:
But described reactive foil and described fusible connection material are arranged between the described material bodies;
But lean against described reactive foil and described fusible the connection on the material with described material bodies is compressed together; And
But start automatic propagation reaction so that the fusion of described connection material by described reactive foil,
Wherein, the bonding strength that is used for connection procedure is characterised in that with the figure that exerts pressure, the lower zone of exerting pressure has the higher gradient, the higher zone of exerting pressure has the lower gradient, and between the high gradient and the low gradient, has the flex point zone, and wherein, force together under the pressure of described material bodies in described flex point zone.
2. the method for claim 1 is characterized in that, described pressure is approximately 30 kPas or littler.
3. the method for claim 1 is characterized in that, described pressure is approximately 20 kPas or littler.
4. the method for claim 1 is characterized in that, described fusible connection material comprises soft solder or braze material.
5. the method for claim 1 is characterized in that, described pressure is enough low, makes the thickness of the described connection material that described connection procedure reduced be no more than 20%.
6. the method for claim 1 is characterized in that, the fusion of described connection material has the duration greater than about 0.5 microsecond.
7. the method for claim 1 is characterized in that, described connection material has greater than about 0.5 micron thickness.
8. the method for claim 1 is characterized in that, described material bodies is to connect above on about 0.03 square centimeter area.
9. the method for claim 1 is characterized in that, the intensity of seam surpasses about 1 MPa.
10. the method for claim 1 is characterized in that, seam has greater than about 10 square inches area.
11. but a utilization reactive multilayer paper tinsel and fusible one or more layers of material or the method that coating connects first material bodies and second material bodies of being connected comprise the following steps:
But described reactive foil and described fusible connection material are arranged between the described material bodies;
But lean against described reactive foil and described fusible the connection on the material with described material bodies is compressed together; And
But start automatic propagation reaction so that the fusion of described connection material by described reactive foil;
Wherein, described compacting is to carry out under the maximum actual pressure of exerting pressure that can not damage described material bodies, but the shear strength that the shear strength that the seam that provides has equals that described maximum is actual under exerting pressure at least 70%.
12. method as claimed in claim 11 is characterized in that, described pressure is approximately 30 kPas or littler.
13. method as claimed in claim 11 is characterized in that, described pressure is approximately 20 kPas or littler.
14. method as claimed in claim 11 is characterized in that, described fusible connection material comprises soft solder or braze material.
15. method as claimed in claim 11 is characterized in that, described pressure is enough low, makes the thickness of the described connection material that connection procedure reduced be no more than 20%.
16. method as claimed in claim 11 is characterized in that, the fusion of described connection material has the duration greater than about 0.5 microsecond.
17. method as claimed in claim 11 is characterized in that, described connection material has greater than about 0.5 micron thickness.
18. method as claimed in claim 11 is characterized in that, described material bodies is to connect above on about 0.03 square centimeter area.
19. method as claimed in claim 11 is characterized in that, the intensity of seam surpasses about 1 MPa.
20. method as claimed in claim 11 is characterized in that, seam has greater than about 10 square inches area.
21. but a utilization reactive multilayer paper tinsel and fusible one or more layers of material or the method that coating connects first material bodies and second material bodies of being connected comprise the following steps:
But described reactive foil and described fusible connection material are arranged between the described material bodies;
But lean against described reactive foil and described fusible the connection on the material with described material bodies is compressed together; And
But start automatic propagation reaction so that the fusion of described connection material by described reactive foil;
Wherein, described compacting is to carry out under the pressure of 100 MPas, but the shear strength that the seam that provides has equals to use at least 70% of shear strength that exerting pressure of 100 MPas form.
22. method as claimed in claim 21 is characterized in that, described pressure is approximately 30 kPas or littler.
23. method as claimed in claim 21 is characterized in that, described pressure is approximately 20 kPas or littler.
24. method as claimed in claim 21 is characterized in that, described fusible connection material comprises soft solder or braze material.
25. method as claimed in claim 21 is characterized in that, described pressure is enough low, makes the thickness of the described connection material that connection procedure reduced be no more than 20%.
26. method as claimed in claim 21 is characterized in that, the fusion of described connection material has the duration greater than about 0.5 microsecond.
27. method as claimed in claim 21 is characterized in that, described connection material has greater than about 0.5 micron thickness.
28. method as claimed in claim 21 is characterized in that, described material bodies is to connect above on about 0.03 square centimeter area.
29. method as claimed in claim 21 is characterized in that, the intensity of seam surpasses about 1 MPa.
30. method as claimed in claim 21 is characterized in that, seam has greater than about 10 square inches area.
31. but a utilization reactive multilayer paper tinsel and fusible one or more layers of material or the method that coating connects first material bodies and second material bodies of being connected comprise the following steps:
But described reactive foil and described fusible connection material are arranged between the described material bodies;
But lean against described reactive foil and described fusible the connection on the material with described material bodies is compressed together; And
But start automatic propagation reaction so that the fusion of described connection material by described reactive foil;
Wherein, in described first material bodies and second material bodies at least one comprises microcircuit device or semiconductor, and described compacting is carried out at such pressure, this pressure enough low with eliminate soft solder from seam spray but enough height forming a seam, the shear strength that this seam has equal to form used soft solder of this seam or braze material shear strength at least 70%.
32. method as claimed in claim 31 is characterized in that, described pressure is approximately 30 kPas or littler.
33. method as claimed in claim 31 is characterized in that, described pressure is approximately 20 kPas or littler.
34. method as claimed in claim 31 is characterized in that, described fusible connection material comprises soft solder or braze material.
35. method as claimed in claim 31 is characterized in that, described pressure is enough low, makes the thickness of the described connection material that connection procedure reduced be no more than 20%.
36. method as claimed in claim 31 is characterized in that, the fusion of described connection material has the duration greater than about 0.5 microsecond.
37. method as claimed in claim 31 is characterized in that, described connection material has greater than about 0.5 micron thickness.
38. method as claimed in claim 31 is characterized in that, described material bodies is to connect above on about 0.03 square centimeter area.
39. method as claimed in claim 31 is characterized in that, the intensity of described seam surpasses about 1 MPa.
40. product that comprises at least two material bodies that connect by the described method of claim 1.
41. product that comprises at least two material bodies that connect by the described method of claim 11.
42. product that comprises at least two material bodies that connect by the described method of claim 21.
43. product that comprises at least two material bodies that connect by the described method of claim 31.
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