JP2005186033A - Manufacturing method of micro reactor chip - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a micro reactor chip that bubbles do not enter a bonding interface and it can be evenly bonded, a fluid neither leaks nor change in inner diameter and shape of a passage at the time of bonding occurs, further, the problem of the defective bonding neither occurs nor any warp generates even though a final micro reactor chip is thin. <P>SOLUTION: The manufacturing method of the micro reactor chip that a plurality of substrates on which micro passages are formed are bonded to at least one surfaces of substrates opposite to each other so as to allow the surface on which the micro passages are formed to be a bonding surface, wherein a volatile liquid that does not dissolve the substrate is interposed on the bonding surface, after the volatile liquid is removed and the substrates are closely contacted, bonding is performed by heating and applying a pressure. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a microreactor, that is, a minute chemistry generally defined as “a device that uses microfabrication and performs a reaction in a minute channel (microchannel) having an equivalent diameter of 500 μm or less”. More particularly, the present invention relates to a method for manufacturing a microreactor chip constituting the microreactor.

  As a microreactor chip constituting the microreactor, a chip made of a material such as metal, ceramic, glass, silicon, or resin is known. And, as a microfabrication method for forming a micro flow path to these, for example, a method using LIGA technology using X-rays, a method using a resist portion as a structure by a photolithography method, a resist opening portion There are a method of etching, a micro electrical discharge machining method, a laser machining method, a mechanical micro cutting method using a micro tool made of a hard material such as diamond, and the like. These techniques can be used alone or in combination.

  The microreactor is assembled and used as a microreactor chip having these microfabricated substrates and components joined by various methods and having a micro flow channel inside. Joining techniques generally used for the joining are broadly divided into solid phase joining and liquid phase joining in addition to screwing and caulking. The solid phase bonding includes anodic bonding, direct bonding, activated direct bonding, diffusion bonding, and the like. The liquid phase bonding includes fusion welding, bonding using an adhesive, and the like.

  On the other hand, as a component constituting a microreactor, glass is often used from the viewpoint of low cost, transparency, workability, etc. In recent years, resin has been further used from the viewpoint of moldability, impact resistance, low cost, etc. More and more are used. For joining parts made of these materials, fusion welding in which heat is applied while applying pressure is generally used. However, in this fusion welding, if the pressure is too high or the heating is too large, the minute flow path is crushed and a microreactor having a desired inner diameter or flow path shape cannot be obtained. On the contrary, if the pressure and heating are insufficient, the joining becomes insufficient, and fluid leakage from the flow path occurs.

  Therefore, in order to obtain the optimum conditions in the fusion welding, it is necessary to finely pack the conditions in consideration of the material type, the size of the microreactor chip, and the like. However, even when the optimum condition is obtained, in practice, bubbles often remain on the joint surface, and the remaining bubbles overlap the flow path, often causing fluid leakage.

  As a method for solving these problems, a method using an adhesive has been performed. This is a method in which an adhesive having a low viscosity and high affinity with a substrate is used, and an adhesive is soaked into the interface of the joint surface by using a capillary phenomenon so that the surfaces are evenly bonded. Although this method seems to prevent bubbles from entering the bonding interface, there is a big problem that the adhesive enters the flow path.

  Therefore, the following has been proposed as a method of adhering a member having a concave portion on the surface and another member in a state of being in close contact, and bonding and integrating the adhesive without closing a minute space. Yes.

  One is to contact the surface of the member where the recess is formed with the surface of the other member via a composition containing an energy ray curable compound, and to apply energy rays to the portion excluding the recess formed in the member. After the composition is cured by irradiation, the uncured composition existing in the space formed between the concave portion of the member and the other member is removed. Yes (see, for example, Patent Document 1).

  The other is that a composition containing a cross-linkable polymerizable compound is applied to the member, and then the composition containing the cross-linkable polymerizable compound loses fluidity and unreacted polymerizable groups remain. The composition containing the cross-linkable polymerizable compound is brought into contact with the coated surface of the composition containing the cross-linkable polymerizable compound of the member and the surface having the groove of the other member in a semi-cured state. It is a manufacturing method of a micro chemical device characterized in that an object is bonded by being completely cured (see, for example, Patent Document 2).

  However, in both of the above production methods, it is difficult to soak the adhesive using the capillary phenomenon, and there is a possibility that bubbles may be generated. In the former proposal, it is difficult to completely remove the energy ray-curable compound remaining in the minute flow path, and in the latter, a composition containing a crosslinkable polymerizable compound remains on one surface of the flow path inner wall. Therefore, there is a possibility of affecting the liquid feeding or the liquid in the flow path.

Furthermore, in the conventional methods including these methods, in particular, when the substrate is thin, the generation of bubbles is increased, and not only uniform bonding becomes difficult, but also there is a problem of warping.
JP 2000-246092 A JP 2000-248076 A

The object of the present invention is to solve the above-mentioned problems of the prior art.
That is, the present invention is a method for manufacturing a microreactor chip in which a plurality of substrates having minute flow paths formed on at least one surface of an opposing substrate are bonded without using an adhesive. It is possible to join uniformly without bubbles, not to cause fluid leakage, etc., there is no change in the inner diameter and shape of the flow path during joining, and even if the final microreactor chip is thin, It is an object of the present invention to provide a microreactor chip manufacturing method that has no problem and does not warp.

The above-mentioned subject is achieved by the following present invention. That is, the present invention
<1> A microreactor chip that joins a plurality of substrates having minute flow paths formed on at least one surface of opposing substrates so that the surfaces having the minute flow paths become bonding surfaces. A production method comprising:
A method of manufacturing a microreactor chip, wherein a volatile liquid that does not dissolve the substrate is interposed between the bonding surfaces, the volatile liquid is removed and the substrates are brought into close contact with each other, and then bonded by heating and pressing. is there.

<2> The method for producing a microreactor chip according to <1>, wherein the volatile liquid is an alcohol.

<3> The method for producing a microreactor chip according to <1> or <2>, wherein the volatile liquid is removed under reduced pressure.

<4> The method for producing a microreactor chip according to any one of <1> to <3>, wherein the minimum thickness is in the range of 0.5 to 2 mm.

  According to the present invention, bubbles do not enter the bonding interface, adhere uniformly, no leakage occurs, there is no change in the inner diameter and shape of the flow path, and there is a problem of poor bonding even when the microreactor chip is thin. Therefore, it is possible to provide a method for manufacturing a microreactor chip that is free from warpage and the like.

Hereinafter, the present invention will be described in detail.
In the method for manufacturing a microreactor chip according to the present invention, a plurality of substrates each having a minute channel formed on at least one surface of an opposing substrate is used as a bonding surface. In the method of manufacturing a microreactor chip to be bonded, a volatile liquid that does not dissolve the substrate is interposed on the bonding surface, the volatile liquid is removed and the substrates are brought into close contact with each other, and then heated and pressurized. It is made to join.

  The production method of the present invention is to join substrates constituting a microreactor chip by fusion bonding without using an adhesive. As described above, when bonding substrates by fusion welding, it is quite difficult to perform uniform bonding without leaving bubbles at the bonding interface on the bonding surface without deforming a minute flow path shape or the like. The reason is that the surface of the substrate has minute irregularities, and the air trapped in the minute irregularities cannot be completely expelled when bonding is performed at a pressure that does not deform the flow path shape. is there.

  In the present invention, from such a situation, a method for removing air existing in a minute space on the joining surface without applying a large pressure during joining has been studied. As a result, the present inventors previously bonded a volatile liquid to the bonding surface when bonding the substrates, and removed the volatile liquid before bonding by actual heating and pressurization, thereby simultaneously bonding the substrates. I found that the air that exists in the minute space on the surface can also be expelled.

Furthermore, if the volatile liquid remains on the joint surface, it is a liquid, which may cause troubles by foaming or lowering the adhesiveness during joining. It is possible to completely disappear from the joining surface before joining by heating and pressing.
The present invention has been completed by adopting the above-described method in joining for producing a micro member called a microreactor chip and optimizing it.

Hereinafter, an embodiment of the present invention will be described.
The microreactor chip in the present invention constitutes the aforementioned microreactor, but the microreactor chip itself may be handled as a microreactor.

  The microreactor is a reaction apparatus having a plurality of microscale micro channels (channels). The microreactor may incorporate minute functional parts such as heaters and pumps, and in addition, the substrate surface must be fully joined to make the flow path inside the substrate so that the fluid used does not leak. There is a need to do.

  As the material for the substrate used in the present invention, glass having a glass transition point, resin, and the like are suitable. As this glass, general things, such as soda glass, quartz glass, borosilicate glass, crystal glass, can be used, for example. The glass transition point of the glass is preferably in the range of 500 ° C to 600 ° C.

  Examples of the resin include polyester resin, styrene resin, acrylic resin, styrene / acrylic resin, silicone resin, epoxy resin, diene resin, phenol resin, terpene resin, coumarin resin, amide resin, amideimide resin, butyral resin, urethane resin, Ethylene / vinyl acetate resin and the like can be mentioned, and acrylic resin such as methyl methacrylate resin and styrene resin are more preferable. The glass transition point of the resin is preferably in the range of 90 ° C to 150 ° C, and more preferably in the range of 100 ° C to 140 ° C.

The size of the substrate (the size of the case of manufacturing a microreactor chip), for example, square or in the area of a rectangle, preferably in the range of 1 to 100 cm ^2, the range of 10 to 40 cm ² is more preferable. The thickness is preferably in the range of 2 to 30 mm, more preferably in the range of 3 to 15 mm. In particular, in the present invention, even when a substrate having a thickness of 2 mm or less is used, uniform bonding can be performed without causing warpage or the like during bonding.

  It is desirable that the surface of the substrate used in the present invention be smooth. In particular, it is not preferable that the surface on the side to be bonded to another substrate has a certain size or more of unevenness because air tends to remain there at the time of bonding.

From the above viewpoint, the surface roughness of at least the bonding surface of the substrate is preferably in the range of 0.001 to 0.1 μm in terms of arithmetic average roughness Ra, and is in the range of 0.005 to 0.05 μm. It is preferable. The surface where Ra is less than 0.001 μm is difficult to obtain in actual manufacturing, and if it exceeds 0.1 μm, bubbles may be generated on the joint surface even if the manufacturing method of the present invention is used. .
The Ra was measured with a surface roughness measuring device Surfcom 1400 (manufactured by Tokyo Seimitsu Co., Ltd.).

  A minute channel is formed on at least one surface of the opposing substrate of the substrate in the present invention. That is, the manufacturing method of the present invention is basically a method of bonding two substrates and providing a sealed flow path between the substrates, but it is also possible to bond three or more substrates simultaneously.

  In this case, a minute flow path may be formed on at least one surface of the plurality of substrates facing each other. For example, when three substrates are bonded together, the flow paths may be formed on all the faces of the three substrates facing each other, or the flow paths may be formed only on both surfaces of the substrate sandwiched between the centers. Good.

  In addition, when the two substrates are joined to provide a sealed channel between the substrates, the minute channel may be formed on only one of the two substrates, You may form in the surface which opposes.

  The minute channel is a microscale. That is, the width of the flow path (flow path diameter) is 5000 μm or less, preferably in the range of 10 to 1000 μm, and more preferably in the range of 30 to 500 μm. Also. The depth of the flow path is about 10 to 500 μm. Furthermore, although the length of the flow path depends on the shape of the formed flow path, it is preferably in the range of 5 to 400 mm, more preferably in the range of 10 to 200 mm.

The minute flow path is produced on a substrate by a fine processing technique. Examples of the microfabrication method for forming a minute flow path include a method using LIGA technology using X-rays, a method using a resist portion as a structure by a photolithography method, and a method of etching a resist opening. , Micro electrical discharge machining, laser machining, and mechanical micro cutting using a micro tool made of a hard material such as diamond. These techniques may be used alone or in combination.
In these, when using the said specific resin as a board | substrate, it is preferable to use a mechanical micro cutting method.

  Further, the substrate may be provided with, for example, a liquid feeding port for feeding a fluid to the microreactor and a collection port for collecting the fluid from the microreactor, as necessary.

  In the present invention, a volatile liquid that does not dissolve the substrate is interposed on the bonding surface before bonding by actual heating and pressurization. Thereby, first, the gas (air) present in the minute irregularities on the substrate surface is replaced by the volatile liquid. Next, as will be described later, by removing the volatile liquid, it is possible to make the minute unevenness free from gas.

  The reason why the liquid that does not dissolve the substrate is used is that if the liquid that dissolves the substrate is used, the bonding surface or a minute flow path formed on the bonding surface is deformed only by being interposed in the bonding surface. Here, “does not dissolve the substrate” means that even if the liquid contacts the surface of the substrate, it does not affect the substrate (it is not affected), and even after removing the liquid, the substrate surface is completely clouded. It means not being done.

  Moreover, as mentioned above, it is necessary to use a volatile liquid as the liquid, but the volatile liquid in the present invention is a liquid at normal temperature and normal pressure, and has a boiling point of 45 to 150 ° C. at normal pressure. A range of liquids. In the present invention, it is more preferable to use a volatile liquid having a boiling point in the range of 50 to 100 ° C.

Accordingly, the volatile liquid in the present invention is not particularly limited as long as the above conditions are satisfied, but alcohols are preferable from the viewpoint of good wettability to the substrate surface and the like.
Examples of the alcohols include aliphatic alcohols such as methanol, ethanol, butanol, 1-propanol, isopropyl alcohol, and allyl alcohol. Ethanol and methanol are preferable, and not only do not dissolve the substrate and contain gas but also have almost no residual impurities after volatilization removal and do not contaminate the flow path.

  The amount of the volatile liquid intervening on the bonding surface is not particularly limited, but it is preferable that an amount of the liquid spreads over the entire bonding surface when at least the surfaces of the substrates to be bonded are combined.

  After interposing the volatile liquid on the bonding surface, the volatile liquid is removed and the substrates are brought into close contact with each other. The method for removing the volatile liquid is not limited as long as it can completely remove the volatile liquid on the joint surface and can prevent air or the like from entering the joint surface after the removal. It is preferable to perform the operation below because the entry of a gas such as air can be prevented.

  As conditions for the said pressure reduction, the range of 100-2000 Pa is preferable, and the range of 100-1000 Pa is more preferable. At this time, in order to increase the degree of adhesion of the substrate, a load that does not deform the bonding surface (about 2 to 40 N) may be applied, and further, heating may be performed to accelerate the removal of the volatile liquid. .

  After removing the volatile liquid from the bonding surface, the substrates are bonded to each other in the close contact state as described above. Joining at this time is fusion welding without using an adhesive as described above, and the joining surfaces are melted and joined by heating and pressing.

As heating conditions at this time, it is preferable that the temperature of the bonding interface is equal to or higher than the glass transition temperature of the substrate. Specifically, for example, the adhered substrate may be left in a heated atmosphere. A heating and pressing press that is performed simultaneously with the pressurization described later may be performed.
The heating temperature is preferably in the range of 80 to 150 ° C, more preferably in the range of 100 to 130 ° C.

  Further, as the pressurizing condition, it is preferable to carry out under a milder condition than normal fusion welding so as not to deform a minute flow path or the like of the joining interface, and the above-described hot pressurizing press is preferably used. It is preferable to pressurize in the range of 685500 Pa, more preferably in the range of 228500-457000 Pa.

  The time required for bonding varies depending on the material of the substrate used, heating, and pressurizing conditions, but is usually in the range of 1 to 10 hours. In addition, this joining can also be continuously performed under this pressure reduction condition, when the removal of the said volatile liquid is performed under pressure reduction conditions.

  As described above, according to the manufacturing method of the present invention, it is possible to obtain a microreactor chip that is uniformly bonded without bubbles on the bonding surface of the substrate.

  As described above, in the manufacturing method of the present invention, since it is not necessary to apply a large pressure at the time of fusion welding, a relatively thin substrate can be used. Therefore, the manufactured microreactor chip can also be obtained as a thinly bonded one with no warpage and well bonded.

  In the present invention, in the microreactor chip whose thickness varies depending on the measurement part, particularly when the thickness when the thickness of the thin part is more than 20% of the whole is set as the minimum thickness, the minimum thickness of the manufactured microreactor chip is 0.5. Even in the range of ˜2 mm, there is no warp and the like can be satisfactorily joined, and even in the range of 0.5 to 1.5 mm, it can be joined similarly.

EXAMPLES Hereinafter, although an Example and a comparative example demonstrate this invention further more concretely, this invention is not limited to the following Examples at all.
<Example 1>
In this example, a microreactor chip of the present invention obtained by bonding two substrates is described.
(Production of microreactor chip)
FIG. 1 is a front view of the substrate used in this example. Substrates A and B are methyl methacrylate resin plates (Clarex S (normal type), manufactured by Nitto Resin Co., Ltd., Tg: 105 ° C., arithmetic surface roughness Ra: 0.0.15 μm), L ₁ in the figure , L ₃ is about 70 mm, L ₂ and L ₄ are about 30 mm, and the thickness is about 1 mm.

  The substrate A is a flat plate with no flow path processing, but the surface of the substrate B is a minute flow path having a width of about 100 μm, a depth of about 40 μm, and a length of about 60 mm as shown in the figure by an end mill. k was formed. In addition, liquid supply ports a and b and recovery ports c and d are provided at both ends of the channel k. Next, the substrate A and the substrate B were placed in about 100 ml of ethanol (reagent first grade: Wako Pure Chemical Industries, Ltd.) and washed with an ultrasonic generator (UT-53N, manufactured by SHARP) for about 5 minutes. .

After taking out both substrates, the substrate A was placed horizontally, and about 5 ml of ethanol was dropped on this surface so as to cover the entire surface. Here, the substrate B was placed so that the surface on which the minute flow path was formed was a bonding surface, and L ₁ and L ₃ and L ₂ and L ₄ were combined, and then spilled from the side surface. Ethanol was wiped off with a waste cloth and lightly adhered.
In this way, an adhesion body C in which the substrate A and the substrate B were superimposed as shown in the side view of FIG. 2 was obtained.

  Next, as shown in FIG. 3, the contact body C is placed on a metal plate e2 (copper, 90 mm × 60 mm × 8 mm), and a metal plate e1 (same material and shape as e2) is formed thereon. And hold a 5 kg weight f (pillar-type weight, 80.5 mm x 90.0 mm x 140 mm, manufactured by Murakami Seiki Mfg. Co., Ltd.), and squeeze out the ethanol on the bonding surface of the adhesion body C. Adhere B more closely. Subsequently, this was put into a vacuum dryer (DP-41: manufactured by Yamato) and dried under reduced pressure at a vacuum degree of about 70 Pa for about 1 hour to remove ethanol.

  Thereafter, under reduced pressure, the temperature was set to about 125 ° C., and heating was continued for about 4.5 hours to perform bonding. After the heater was turned off, it was left as it was for about 5 hours. After cooling to about room temperature, the joined body (microreactor chip) was taken out from the vacuum dryer.

(Performance confirmation of microreactor chip)
The thickness of the obtained bonded body (microreactor chip) was about 2 mm. When the cross section of the bonded portion of the bonded body was confirmed by a stereomicroscope (50 ×), as shown in the cross-sectional photograph of FIG. 4, the bonding interface (thickness: about 2 μm) was formed between the substrate A and the substrate B. The substrate A and the substrate B were almost completely joined. In addition, it was confirmed that there were no bubbles or the like in any part of the joined part, and there was no warp of the microreactor chip or deformation of the flow path.

  Next, as shown in FIG. 5, the bonded microreactor chip 10 is fixed by a fixing jig 11, and a capillary tube 21 and a capillary tube 22 are connected to the liquid feeding ports a and b and the recovery ports c and d, respectively. Then, distilled water loaded in the microsyringe 23 connected to the ends of the capillary tube 21 opposite to the liquid feeding ports a and b is fed by a pump (not shown), and the microreactor chip 10 has a minute size. The flow of distilled water (fluid) in the channel k was confirmed.

  Specifically, light is irradiated from the lower side of the microreactor chip 10 in the drawing by the light source 30, and from the upper side of the microreactor chip 10, the microscope 31 with a CCD camera controlled by the personal computer 32 is placed in the circle of FIG. The flow and leakage of fluid in each part of the flow path k shown were enlarged and confirmed.

  As a result, there is no clogging or leakage of fluid in any part of the minute flow path k, and a two-layer laminar flow is formed depending on the liquid feeding conditions, and the fluid discharged from the recovery ports c and d is stored in the container. 24 was confirmed to be recovered.

<Comparative Example 1>
In the production of the microreactor chip of Example 1, a microreactor chip was produced in the same manner as in Example 1 except that bonding was performed without dropping ethanol on the bonding surface when the substrates A and B were combined. Similar evaluations were made.

  As a result, as shown in the cross-sectional photograph of FIG. 6, bubbles were partially present at the bonding interface between the substrate A and the substrate B, and the microreactor chip was warped. Furthermore, when the flow of the fluid was examined in the same manner as in the method shown in FIG. 5, it was confirmed that the fluid leaked from the minute channel k to a portion other than the channel.

It is a front view which shows an example of the board | substrate used for this invention. It is a side view which shows the contact body with which the board | substrates were piled up. It is a schematic block diagram which shows an example of the method of pressurizing a contact body. It is an expanded sectional photograph of the joint surface of the microreactor chip of the present invention. It is the schematic which shows the state which has confirmed the liquid feeding state of the micro reactor chip. It is an expanded sectional photograph of the joint surface of a micro reactor chip.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Microreactor chip 11 Fixing jig 21, 22 Capillary tube 23 Micro syringe 24 Container 30 Light source 31 CCD camera microscope 32 Personal computer A, B Substrate C Adherence body a, b Liquid feeding port c, d Recovery port e1, e2 Metal plate k Minute flow path

Claims (1)

A method of manufacturing a microreactor chip in which a plurality of substrates having minute flow paths formed on at least one surface of opposing substrates are bonded so that the surfaces having the minute flow paths become bonding surfaces. There,
A method for producing a microreactor chip, wherein a volatile liquid that does not dissolve the substrate is interposed on the bonding surface, the volatile liquid is removed and the substrates are brought into close contact with each other, and then bonded by heating and pressing. .