CN114340211A - Circuit board composite material and preparation method and application thereof - Google Patents
Circuit board composite material and preparation method and application thereof Download PDFInfo
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- CN114340211A CN114340211A CN202110345168.6A CN202110345168A CN114340211A CN 114340211 A CN114340211 A CN 114340211A CN 202110345168 A CN202110345168 A CN 202110345168A CN 114340211 A CN114340211 A CN 114340211A
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Abstract
The invention relates to the technical field of piezoelectricity, in particular to a circuit board composite material and a preparation method and application thereof. The method comprises the following steps: (1) placing a connector between a circuit board and a material body, wherein the connector comprises a reaction foil, and a first adhesive and a first fusible link material sequentially coated on an upper surface of the reaction foil, and a second adhesive and a second fusible link material sequentially coated on a lower surface of the reaction foil; (2) applying pressure to make the circuit board, the connecting body and the material body contact; (3) and activating the reaction foil to carry out self-propagating reaction so as to melt the connecting body and form a welding layer, thereby obtaining the circuit board composite material. The circuit board composite material prepared by the method improves the welding strength between the circuit board and the material body, forms a welding layer with low void defect rate and uniform thickness, and improves the heat conductivity and the electric conductivity of the composite material.
Description
Technical Field
The invention relates to the technical field of piezoelectricity, in particular to a circuit board composite material and a preparation method and application thereof.
Background
At present, the soldering between the circuit board and different materials is mainly performed by the connection of conductive adhesive and non-conductive adhesive, or the connection using fasteners (screws or clamps), but the above methods have great disadvantages, such as: the soldering process required for the printed circuit board cannot be ensured, and the functional characteristics required for soldering cannot be satisfied. That is, neither adhesive nor mechanical joining methods provide adequate thermal contact resistance, and excessive thermal resistance can cause the soldered assembly to overheat, thereby affecting the proper operation of the entire electronic system.
The connection method of the circuit board and the metal material through glue can not provide enough heat conductivity and mechanical strength; over time, the glue itself can crystallize and break, resulting in system failure.
Among the soldering processes, the most robust soldering method is ohmic contact soldering using a relatively low thermal resistance (compared to mechanical or adhesive methods), and soldering flux (removing oxide film on the connection surface) or no soldering flux may be used.
However, since it is impossible to ensure thorough cleaning of the welding surface during welding, the welding technique cannot form high-strength welds with a low void defect rate, resulting in non-uniform welds and thicknesses. In addition, flux residue can lead to incomplete wetting (60-70%) of the solder at the joint surface, which can degrade thermal and electrical conductivity.
To improve the uniformity of the weld, reduce the weld (and improve the reliability of the weld), lead shims with a fusible tin coating or shims reinforced with a copper mesh are used. Although this approach achieves quite good performance characteristics, it still requires careful preparation of the materials to be soldered, which complicates the overall process, but still does not eliminate the defects in the flux.
The fluxless soldering technique involves saturating molten solder with hydrogen or argon at high temperature in a special vacuum apparatus by decomposing the oxide film of the surfaces to be joined in vacuum or in an inert gas and then reducing in an active gas medium. However, the high temperature and saturation of the solder can result in the formation of porous welds, which adversely affects weld strength, and the use of vacuum equipment increases process complexity and cost.
It is possible to mechanically remove the oxide film by using a vibrator to vibrate the parts connected to each other at a low frequency (50-300 Hz). However, this increases the total soldering time (30-90s), and requires an increase in the size of the micro-seismic mass to a size of twice the amplitude of the soldered circuit board, and the oxidation residue cannot be completely removed from the soldered area. The use of ultrasonic vibration (18-23kHz) to decompose the oxide film surface can significantly reduce the welding time. However, the action of the ultrasonic frequency vibration causes a large number of bubbles to be formed in the solder melt, resulting in the formation of void defects in the weld, which is not preferable for the microwave model.
Disclosure of Invention
The invention aims to solve the problems that in the prior art, a circuit board and different materials cannot form low-void defect rate and high-strength welding, so that the thickness of a welding seam is not uniform, and flux residues cause incomplete wetting of solder, so that the thermal conductivity and the electric conductivity are poor, and provides a circuit board composite material, and a preparation method and application thereof. Compared with the prior art, the composite material improves the thermal conductivity and the electric conductivity of the composite material on the basis of ensuring the functional characteristics of the circuit board; meanwhile, the method is rapid and reliable, and is convenient for industrial application.
In order to achieve the above object, a first aspect of the present invention provides a method for preparing a circuit board composite material, the method comprising the steps of:
(1) placing a connector between a circuit board and a material body, wherein the connector comprises a reaction foil, and a first adhesive and a first fusible link material sequentially coated on an upper surface of the reaction foil, and a second adhesive and a second fusible link material sequentially coated on a lower surface of the reaction foil;
(2) applying pressure to make the circuit board, the connecting body and the material body contact;
(3) and activating the reaction foil to carry out self-propagating reaction so as to melt the connecting body and form a welding layer, thereby obtaining the circuit board composite material.
The invention provides a circuit board composite material prepared by the method provided by the first aspect.
A third aspect of the invention provides a use of the circuit board composite provided in the second aspect in a printed circuit board.
According to the technical scheme, the reaction foil is used in the preparation process of the circuit board composite material, and particularly, the heat released by the self-propagating reaction of the reaction foil is utilized, the components and the thicknesses of the reaction foil, the adhesive and the fusible connecting material in the connector are limited, and pressure is applied, so that the adhesive and the fusible connecting material uniformly wet the surface to be welded, the welding strength between the circuit board and the material body is improved, a welding layer with low void defect rate and uniform thickness is formed, and the heat conductivity and the electric conductivity of the composite material are further improved; meanwhile, the method does not need soldering flux, reduces the complexity and cost of the process and is convenient for industrial application.
Drawings
FIG. 1 is a schematic illustration of a circuit board composite provided by the present invention;
FIG. 2 is a schematic structural view of a linker provided by the present invention;
FIG. 3 is a TEM image of reaction foil O1 provided in preparation example 1, wherein the light phase is Al and the dark phase is Ni; a is a TEM image before magnetron deposition and b is a TEM image after magnetron deposition.
Description of the reference numerals
1. Connector 2, circuit board 3, and material body
4. Reactive foil 5, first adhesive 6, second adhesive
7. First fusible link material 8, second fusible link material
Detailed Description
The endpoints of the ranges and any values disclosed herein are not limited to the precise range or value, and such ranges or values should be understood to encompass values close to those ranges or values. For ranges of values, between the endpoints of each of the ranges and the individual points, and between the individual points may be combined with each other to give one or more new ranges of values, and these ranges of values should be considered as specifically disclosed herein.
The invention provides a preparation method of a circuit board composite material, which comprises the following steps:
(1) placing a connector between a circuit board and a material body, wherein the connector comprises a reaction foil, and a first adhesive and a first fusible link material sequentially coated on an upper surface of the reaction foil, and a second adhesive and a second fusible link material sequentially coated on a lower surface of the reaction foil;
(2) applying pressure to make the circuit board, the connecting body and the material body contact;
(3) and igniting the reaction foil to carry out self-propagating reaction so as to melt the connector and form a welding layer, thereby obtaining the circuit board composite material.
The inventor of the invention finds in research that: the thickness and the chemical composition of the reaction foil determine that the reaction foil contains a large amount of stored energy, so that the reaction foil is used as a welding heat source between the circuit board and the material body, the thickness and the chemical composition of the reaction foil are limited, and the connector containing the adhesive and the fusible connecting material can be quickly melted and uniformly wet the surface to be welded by utilizing the heat released by the self-propagating reaction of the reaction foil, so that the non-uniformity of a welding layer is avoided, and the welding layer with low void defect rate is formed; meanwhile, the combination with the pressure application improves the connection strength between the circuit board and the material body under the condition of not damaging the circuit board, and simultaneously improves the electrical conductivity and the thermal conductivity of the composite material.
Specifically, as shown in fig. 1-2, the connection body 1 is disposed between a circuit board 2 and a material body 3, the connection body 1 includes a reaction foil 4, an upper surface of the reaction foil 4 is coated with a first adhesive 5 and a first fusible link material 7 in this order, and a lower surface of the reaction foil 4 is coated with a second adhesive 6 and a second fusible link material 8 in this order; applying pressure to bring the circuit board 2, the connecting body 1 and the material body 3 into contact; the self-propagating reaction that activates the reactive foil 4 melts the interconnect 1 and forms a uniformly wetted surface to be soldered. That is, the present invention improves the connectivity between the circuit board and the material body by using the reactive foil as a heat source for melt-bonding the circuit board and the material body and by applying pressure thereto without damaging the circuit board.
In some embodiments of the invention, the connector is placed between the circuit board and the body of material such that the upper surface of the reactive foil corresponds to the circuit board and the lower surface of the reactive foil corresponds to the body of material.
In the present invention, the thickness of the reactive foil, the thickness of the adhesive (i.e., the thickness of the first adhesive and the thickness of the second adhesive), and the thickness of the fusible link material (i.e., the thickness of the first fusible link material and the thickness of the second fusible link material) can be measured by scanning electron microscope image calibration, step surface contact method, ellipsometry, or the like without specific description.
In the present invention, the thickness of the reactive foil depends on the composition of the reactive foil and the thickness of the fusible link material, and preferably the thickness of the reactive foil is 10 to 150 μm, preferably 40 to 150 μm.
Further preferably, the reactive foil comprises metal layers and optionally non-metal layers arranged alternately one on top of the other and having a thickness of 2-20 nm.
Preferably, the total number of layers of the metal layer and the optional non-metal layer is 1000-. In the present invention, the number of layers of the metal layer and the optional non-metal layer depends on the metal type of the metal layer, the non-metal type of the optional non-metal layer, the thickness of the reactive foil, the thickness of the adhesive, and the thickness of the fusible link material.
According to the present invention, preferably, the metal layer is a layer formed of at least one element of nickel, aluminum, copper, niobium, cobalt, titanium, molybdenum, and tantalum.
According to the present invention, preferably, the non-metal layer is a layer formed of at least one element of carbon, silicon, and boron.
In a preferred embodiment of the present invention, the reactive foil comprises metal layers alternately stacked, i.e. metal layers a with a thickness of 2-20nm and metal layers a 'with a thickness of 2-20nm are alternately stacked, wherein the atomic molar ratio of the metal a to the metal a' is 0.5-2: 1, preferably 1: 1, for example, the reactive foil can be Ni-Al, Cu-Al, Co-Al, Ti-Al, but the present invention is not limited thereto.
In another preferred embodiment of the present invention, the reactive foil comprises metal layers and non-metal layers alternately stacked, that is, metal layers a with a thickness of 2-20nm and non-metal layers a 'with a thickness of 2-20nm are alternately stacked, wherein the atomic molar ratio of the metal a to the non-metal a' is 0.5-2: 1, for example: Nb-C, Ti-Si, Mo-2Si, Mo-B, Ti-C, 2Ta-C, to which the present invention is not limited.
In the present invention, there is a wide range of options for the method of manufacturing the reactive foil, and preferably, the reactive foil is manufactured by cold rolling, magnetron sputtering, electron beam physical vapor deposition.
In a preferred embodiment of the present invention, the reaction foil comprises a metal layer a and a metal layer a ' alternately stacked, wherein the atomic molar ratio of the metal a to the metal a ' is 0.5-2: 1, two metal foils are alternately stacked in the order of one metal a and one metal a ', and then rolled into a cylindrical shape, and after several rolling, the final thickness is one half of the initial value, and the sample is taken out of the jig, divided and re-stacked to the same height as the initial height.
In another preferred embodiment of the present invention, the reaction foil comprises a metal layer a and a nonmetal layer a 'alternately stacked, wherein the metal a and the nonmetal a' are sputtered at an atomic ratio of 0.5 to 2: 1, a deposition thickness ratio of 1: 0.5 to 2, a chamber pressure of less than 10mTorr, a chamber atmosphere of high purity argon, a sum of thicknesses of a single nickel layer and a single aluminum layer after deposition of 2 to 20nm, and a reaction foil having a thickness of 10 to 100 μm, a silicon substrate on which the nickel layer and the aluminum layer are deposited is immersed in an acetone solution, and a photoresist is melted to separate the silicon substrate from the reaction foil, thereby obtaining the reaction foil.
In order to ensure strong adhesion of the fusible link material to the reaction foil, thereby preventing the fusible link material from peeling off from the reaction foil, and to improve the connectivity of the solder layer, a first adhesive and a second adhesive are coated on the upper surface and the lower surface of the reaction foil, respectively. Preferably, the first and second binders are the same or different; further preferably, the first binder and the second binder are each independently selected from at least one of a silver-based material, a gold-based material, and a copper-based material. The preferred adhesive has good adhesion during coating and welding, and improves the firmness of welding.
In the present invention, the metal-based material refers to a metal-containing material, and may be a pure metal or a metal-containing alloy. For example, the silver-based material may be elemental silver having a purity of 100%, or may be an alloy containing silver.
Preferably, the thicknesses of the layers formed by the first adhesive and the second adhesive are the same or different; further preferably, the thickness of the layer formed by each of the first adhesive and the second adhesive is the same; more preferably, the thickness of the layer formed by each of the first and second adhesives is 20 to 150nm, preferably 30 to 120 nm.
In the present invention, the first fusible link material may be a material that is preferably capable of good connection with the circuit board without affecting the performance of the circuit board. The second soluble joining material may be a material that preferably bonds well to the body of material without affecting the properties of the body of material. Preferably, the first and second fusible link materials are the same or different; further preferably, the first fusible link material and the second fusible link material are each independently selected from a tin-base-bismuth-base material and/or a tin-base-indium-base material, wherein the tin-base-bismuth-base material refers to a material containing metallic tin and metallic bismuth, and the tin-base-indium-base material refers to a mixture containing metallic tin base and metallic indium.
Preferably, the thickness of the layer formed by each of the first and second fusible link materials is the same or different; further preferably, the thickness of the layer formed by each of the first and second fusible link materials is the same; more preferably, the layer formed by each of the first and second fusible link materials has a thickness of 1 to 20 μm, preferably 2 to 15 μm.
In the present invention, the first fusible link material and the second fusible link material are each independently coated on the upper surface and the lower surface of the reaction foil by an electroplating method, an electroless deposition method, a spray method.
In order to improve the connection strength between the circuit board, the connection body and the material body, it is preferable that the applied pressure is 0.5 to 6kg/cm2Preferably 1.5 to 5.2kg/cm2. In the present invention, the contact time is not limited.
According to the invention, the melting time is preferably between 1 and 60ms, preferably between 5 and 30 ms. Wherein the time for melting is from activation of the reactive foil to self-propagating reaction until the connecting body melts.
In the invention, in order to activate the reaction foil to carry out self-propagating reaction, the activation mode is selected from thermal activation, laser activation, combustion activation and voltage activation, wherein the laser activation refers to that laser contacts the reaction foil, the wavelength of the laser is 0.3-10 mu m, and the power is 1-100W/min; voltage activation means that the spark generated by the 6-12V dc voltage passes through a small portion of the metal foil; thermal activation refers to the brief heating of the tips of the reaction foils using a heat source at 250-600 ℃.
Preferably, the conditions of the self-propagating reaction include: the temperature of the reaction front is 750-2000 ℃, the speed of the reaction front is 5-30m/s, and the reaction release energy is 500-2000J/g. By adopting the optimal conditions, the connecting body containing the adhesive and the fusible connecting material can be rapidly melted and uniformly wet the surface to be welded, so that the welding is prevented from being nonuniform, and a welding layer with low void defect rate and uniform thickness is formed.
In the present invention, the time of the melting depends on the propagation speed of the self-propagating reaction of the reactive foil and the materials of the adhesive and the fusible link material, without specific description.
In the present invention, there is a wide range of choices for the circuit board, and preferably, the circuit board is a printed circuit board, wherein the number of layers of the printed circuit board is a single layer, a multilayer, for example, a glass fiber board, a polycor board, a Rogers board, and a polymer-made multilayer board.
In the present invention, there is a wide selection range for the material body, preferably, the material body is selected from metal and/or nonmetal, wherein the metal is selected from simple metal and/or alloy, wherein the simple metal can be selected from copper, gold, nickel, aluminum, etc., and the alloy can be selected from type 1 superconductor, type 2 superconductor, kovar alloy, etc.; the non-metal is selected from ceramics, piezoelectric ceramics, sapphire, amorphous, etc.
The invention provides a circuit board composite material prepared by the method provided by the first aspect.
According to the invention, preferably, the composite material comprises: the circuit board comprises a circuit board body, a material body and a welding layer arranged between the circuit board body and the material body.
In the present invention, the solder layer is formed by fusing the interconnect as described above. The composition of the solder layer formed can include all of the chemical elements of the interconnect. The formed soldering layer with the composition can improve the soldering strength effect of the circuit board and the material body.
In the present invention, the circuit board and the materialThe bodies are connected by a solder layer in order to increase the soldering strength between the circuit board and the body. Preferably, the welding layer satisfies: the breaking strength is 3-6kgf/mm2The tensile strength is 20-80MPa, the elastic modulus is 3-20GPa, the shear strength is 20-70MPa, the shear modulus is 1-5GPa, the Poisson ratio is 0.01-0.1 mu, and the resistivity is 50-70 omega.m, wherein the parameters of the welding layer are measured by using an FM-250 WPM Masch2168 tensile tester.
According to the invention, the welding layer preferably has a void defect rate of less than or equal to 5%/cm2. Wherein the void defect rate is less than or equal to 5% per square centimeter and can be measured by ultrasonic detection and X-ray scanning.
Compared with the existing circuit board, the circuit board composite material provided by the invention has the advantages that the circuit board and the material body are connected, the connection strength between the circuit board and the material body is improved under the condition of not damaging the circuit board, the welding layer with low void defect rate and high strength is formed, and the heat conductivity and the electric conductivity of the composite material are improved.
The circuit board composite material provided by the invention is subjected to environmental adaptability experiment test, and after the test is finished, the following results can be obtained through X-ray scanning analysis: the circuit board composite material has a stable welding structure, and the thickness and the conductivity of the welding layer are not changed.
A third aspect of the invention provides a use of the circuit board composite provided in the second aspect in a printed circuit board.
Compared with the prior art, the circuit board composite material prepared by the method has higher heat-conducting property, electric conductivity and mechanical strength; the welding layer has better structural stability, and system faults are effectively avoided.
The present invention will be described in detail below by way of examples.
The thickness of the reaction foil, the thickness of the adhesive and the thickness of the fusible link material are measured by an electron scanning microscope;
the performance parameters of the circuit board composite material are measured by monitoring an electromechanical vibration system;
the parameters of the welded layer (breaking strength, tensile strength, elastic modulus, shear strength, shear modulus, poisson's ratio) were measured using FM-250 WPM mask 2168 tensile tester;
the void defect rate of the welded layer was measured by ultrasonic testing.
The properties of the reactive foils obtained in preparation examples 1 to 10 and the specific parameters of the interconnect are shown in Table 1.
Preparation example 1
(1)Preparation of the reaction foil: coating a layer of photoresist on the surface of a silicon substrate, and then alternately depositing a nickel layer and an aluminum layer on the surface of the photoresist, wherein the purity of the nickel layer and the purity of the aluminum layer are respectively 99.99% and 99.99%, the sputtering atomic ratio is 1: 1, the deposition thickness ratio is 1: 1, the cavity pressure is less than 10mTorr, the cavity atmosphere is high-purity argon, the sum of the thicknesses of the single nickel layer and the single aluminum layer after deposition is 7-20nm, the thickness of the reaction foil is 28-80 mu m, immersing the silicon substrate deposited with the nickel layer and the aluminum layer into an acetone solution, melting the photoresist, and separating the silicon substrate from the reaction foil to obtain a reaction foil O1;
wherein the TEM image of the reaction foil O1 is shown in fig. 3, wherein the light phase is Al and the dark phase is Ni; fig. 3(a) is a TEM image before magnetron deposition, and fig. 3(b) is a TEM image after magnetron deposition.
(2)Preparation of the linker: sequentially coating silver-based materials on the upper surface and the lower surface of the reaction foil, wherein the thicknesses of the first adhesive layer and the second adhesive layer are both 110 nm; then, a fusible link material (a molar ratio of tin to bismuth is 1: 1) was coated on the first adhesive layer and the second adhesive layer, respectively, by an electroplating method, and the thickness of each of the first fusible link material layer and the second fusible link material layer was 10 μm, to obtain a connector P1.
Preparation examples 2 to 10
Linker P2-10 was obtained according to the procedure of preparation example 1, except that the specific parameters of the linker were varied.
TABLE 1
Note: the thickness range of the layer formed by the adhesive, and the thickness range of the layer formed by the fusible link material.
TABLE 1
Note: the thickness range of the layer formed by the adhesive, and the thickness range of the layer formed by the fusible link material.
TABLE 1
The solder layer performance parameters for the circuit board composites prepared in examples 1-10 are listed in Table 2.
Example 1
(1) Disposing the connecting body P1 between the circuit board and the material body (copper plate);
(2) applying pressure to make the circuit board, the connecting body P1 and the material body (copper plate) contact;
(3) and activating the self-propagating reaction of the reactive foil by laser to enable the connector containing the adhesive and the fusible connecting material to be molten and uniformly wet the surface to be welded to form a welding layer Q1, so as to obtain the circuit board composite material S1.
Examples 2 to 10
A circuit board composite material S2 to S10 comprising solder layers Q2 to Q10 was obtained by following the procedure of example 1 except that the kind of the connector was changed and pressure was applied;
wherein the types of the connecting bodies are respectively replaced by P2-P10.
TABLE 2
As can be seen from the data in Table 2, the circuit board composite material prepared by the method provided by the invention can realize high-strength welding between the circuit board and the fusible connecting material, obtain a welding layer with low void defect rate and uniform thickness, and simultaneously improve the thermal conductivity and the electrical conductivity of the composite material.
Test example 1
The circuit board composite materials containing the soldering layers obtained in examples 1 to 10 were subjected to environmental suitability test, specifically as follows:
sinusoidal vibrations with a frequency in the range of 1-60Hz (vibration resistance) and alternating accelerations in three coordinate axes (up to 20 m/s)2(2g) ) a smooth transition in frequency change, no more than eight degrees per minute change, a test time of at least 2 minutes on each axis;
the impact test is carried out on three coordinate axes with a peak impact acceleration of at most 150m/s2(15g) The impact duration is 0.5-2ms, the impact load is carried out in a three-coordinate plane, and the total impact times are 18 times;
the sinusoidal vibration test is carried out at a frequency of 20-30Hz with an acceleration of 20m/s2(2g) Test along the Y axis for 30 minutes;
test of the influence of sinusoidal vibrations in the frequency range 1-60Hz with an acceleration of 15m/s2(1.5g) performing the test on three perpendicular axes, each axis having a test duration of at least 1 hour;
-mechanical impact perpendicular to the circuit board surface;
-ambient temperature test, temperature cycling test from maximum 70 ℃ to minimum-50 ℃, cooling to-50 ℃, temperature variation of 1 ℃ per minute for 2 hours; heating to 70 deg.C, changing the temperature by 2 deg.C per minute, and maintaining for 2 hr;
-exposure to a working temperature of 40 ℃ and an extreme temperature of 70 ℃ for 1.5 hours at 70 ℃ and holding for 30 minutes, and then for 2 hours at 40 ℃;
-exposure to an environment at a temperature of 40 ℃ and a relative humidity of 95% for 2 days;
at the end of the test, the X-ray scanning analysis shows that: the circuit board composite material has a stable welding structure, and the thickness and the conductivity of the welding layer are not changed. Therefore, the circuit board composite material provided by the invention has higher heat-conducting property, electric conductivity and mechanical strength; the welding layer has better structural stability, and system faults are effectively avoided.
The preferred embodiments of the present invention have been described above in detail, but the present invention is not limited thereto. Within the scope of the technical idea of the invention, many simple modifications can be made to the technical solution of the invention, including combinations of various technical features in any other suitable way, and these simple modifications and combinations should also be regarded as the disclosure of the invention, and all fall within the scope of the invention.
Claims (10)
1. A method for preparing a circuit board composite material, the method comprising the steps of:
(1) placing a connector between a circuit board and a material body, wherein the connector comprises a reaction foil, and a first adhesive and a first fusible link material sequentially coated on an upper surface of the reaction foil, and a second adhesive and a second fusible link material sequentially coated on a lower surface of the reaction foil;
(2) applying pressure to make the circuit board, the connecting body and the material body contact;
(3) and activating the reaction foil to carry out self-propagating reaction so as to melt the connecting body and form a welding layer, thereby obtaining the circuit board composite material.
2. The method according to claim 1, wherein the reactive foil has a thickness of 10-150 μ ι η, preferably 40-150 μ ι η;
preferably, the reactive foil comprises metal layers and optional non-metal layers which are alternately stacked and have the thickness of 2-20 nm;
preferably, the total number of the metal layers and the optional non-metal layers is 1000-;
preferably, the metal layer is a layer formed of at least one element of nickel, aluminum, copper, niobium, cobalt, titanium, molybdenum, and tantalum;
preferably, the non-metal layer is a layer formed of at least one element of carbon, silicon, and boron.
3. The method of claim 1 or 2, wherein the first and second binders are the same or different;
preferably, the first binder and the second binder are each independently selected from at least one of a silver-based material, a gold-based material, and a copper-based material;
preferably, the thicknesses of the layers formed by the first adhesive and the second adhesive are the same or different;
preferably, the thickness of the layer formed by each of the first adhesive and the second adhesive is 20 to 150nm, preferably 30 to 120 nm.
4. The method of any of claims 1-3 wherein the first and second fusible link materials are the same or different;
preferably, the first and second fusible link materials are each independently selected from tin-bismuth and/or tin-indium based materials;
preferably, the thickness of the layer formed by each of the first and second fusible link materials is the same or different;
preferably, the thickness of the layer formed by each of the first and second fusible link materials is 1 to 20 μm, preferably 2 to 15 μm;
preferably, the first fusible link material and the second fusible link material are each independently coated on the upper surface and the lower surface of the reaction foil by an electroplating method, an electroless deposition method, or a spraying method.
5. The method according to any one of claims 1 to 4, wherein the applied pressure is 0.5 to 6kg/cm2Preferably 1 to 5.2kg/cm2；
Preferably, the manner of activation is selected from thermal activation, laser activation, combustion activation, voltage activation;
preferably, the conditions of the self-propagating reaction include: the temperature of the reaction front is 750-2000 ℃, the speed of the reaction front is 5-30m/s, and the reaction release energy is 500-2000J/g.
6. A circuit board composite made by the method of any one of claims 1-5.
7. The composite material of claim 6, wherein the composite material comprises: the circuit board comprises a circuit board body, a material body and a welding layer arranged between the circuit board body and the material body.
8. The composite of claim 7, wherein the parameters of the weld layer satisfy: the breaking strength is 3-6kgf/mm2The tensile strength is 20-80MPa, the elastic modulus is 3-20GPa, the shear strength is 20-70MPa, the shear modulus is 1-5GPa, the Poisson ratio is 0.01-0.1 mu, and the resistivity is 50-70 omega.m.
9. The composite of claim 7 or 8, wherein the welded layer has a void defect rate of 5%/cm or less2。
10. Use of the circuit board composite according to any one of claims 6-9 in a printed circuit board.
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2021
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