CN109759662A - A kind of method of ultrasonic wave added porous ceramics soldering - Google Patents
A kind of method of ultrasonic wave added porous ceramics soldering Download PDFInfo
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- CN109759662A CN109759662A CN201910041473.9A CN201910041473A CN109759662A CN 109759662 A CN109759662 A CN 109759662A CN 201910041473 A CN201910041473 A CN 201910041473A CN 109759662 A CN109759662 A CN 109759662A
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Abstract
A kind of method of ultrasonic wave added porous ceramics soldering, it is related to the method for porous ceramics soldering.Vacuum environment is needed the invention solves the welding of existing ceramics/ceramics or need to carry out certain metalized to ceramic surface, and needs certain soaking time, the problem that welding efficiency is low and joint performance is not high.Preparation method: one, part to be welded pre-processes；Two, ceramic wetting；Three, ceramic welding.Or preparation method: one, porous ceramics pre-processes；Two, ceramic welding.The present invention is brazed for ultrasonic wave added porous ceramics.
Description
Technical field
The present invention relates to the methods of porous ceramics soldering.
Background technique
Ceramics are widely used in aerospace, core because having good mechanical property and chemical stability at high temperature
In the fields such as industry.Porous ceramics is due to intensity is high, hardness is high, corrosion resistance is good and the advantages such as density is low by favor.It is porous
Ceramics extensibility is poor, poor in processability, and machining relatively difficult to achieve, this makes the manufacture of ceramic composite and large-size components
Become extremely difficult.However now all multiple components in manufacturing industry can all be related between porous ceramics and porous ceramics/
Connection between metal.Therefore, a kind of method for being suitable for porous ceramics connection is invented, promotion porous ceramics is widely used
There is very big facilitation.The welding method of currently used porous ceramics and ceramics mainly has diffusion welding (DW) and soldering etc..
Numerous scholars have used a variety of methods to weld it, it is expected that obtaining the connector that defect is few, intensity is high.But by
It is good in the thermal stability of ceramics itself, belong to the material of extremely difficult wetting, welding process generally requires vacuum environment or need to be to pottery
Porcelain surface carries out certain metalized, and needs certain soaking time, and welding efficiency is low and joint performance is not high.Cause
This, it is imperative to invent efficient one kind, low temperature, the welding method for the porous ceramics that can be carried out in atmospheric environment.
Summary of the invention
Vacuum environment is needed the invention solves the welding of existing ceramics/ceramics or certain gold need to be carried out to ceramic surface
Categoryization processing, and certain soaking time, the problem that welding efficiency is low and joint performance is not high are needed, and it is auxiliary to provide a kind of ultrasound
The method for helping porous ceramics to be brazed.
A kind of method of ultrasonic wave added porous ceramics soldering carries out according to the following steps:
One, part to be welded pre-processes:
By polishing, polishing and ultrasonic cleaning 2 pieces~20 pieces porous ceramic surfaces of cleaning, pretreated porous pottery is obtained
Porcelain；
The porosity of the porous ceramics is 10%~90%；
Two, ceramic wetting:
Solder is placed in and is heated to melting in solder trough, then under ultrasonic activation and solder melting temperature, will be located in advance
Porous ceramics after reason, which immerses in molten solder, to be soaked, and the ceramics of ultrasonic wave added wetting are obtained；
When the ultrasonic activation be continuously applied when, ultrasonic amplitude be 0.1 μm~100 μm, ultrasonic frequency
Under conditions of being 100W~2000W for 15kHz~50kHz and ultrasonic power, ultrasonic pressing 1s~1800s；
When the ultrasonic activation be gap apply when, ultrasonic amplitude be 0.1 μm~100 μm, ultrasonic frequency
Under conditions of being 100W~2000W for 15kHz~50kHz and ultrasonic power, ultrasonic pressing 1s~100s, then pause is super
Sound wave loads 10s~100s, with ultrasonic pressing and pause for one cycle, recycles 2 times~10 times；
Three, ceramic welding:
Under conditions of clamping force is 0.1MPa~10MPa, the ceramics that 2 pieces~20 pieces ultrasonic wave addeds soak are stacked and filled
It clips together, under solder melting temperature, the ceramic member after clamping is immersed in molten solder and applies ultrasonic activation, finally will
Ceramic member after ultrasound takes out and is cooled to room temperature, and removes clamping force, obtains porous ceramics weldment, i.e. completion ultrasonic wave added is more
The method of hole Ceramic brazing；
When the ultrasonic activation be continuously applied when, ultrasonic amplitude be 0.1 μm~100 μm, ultrasonic frequency
Under conditions of being 100W~2000W for 15kHz~50kHz and ultrasonic power, ultrasonic pressing 1s~1800s；
When the ultrasonic activation be gap apply when, ultrasonic amplitude be 0.1 μm~100 μm, ultrasonic frequency
Under conditions of being 100W~2000W for 15kHz~50kHz and ultrasonic power, ultrasonic pressing 1s~100s, then pause is super
Sound wave loads 10s~100s, with ultrasonic pressing and pause for one cycle, recycles 2 times~10 times.
A kind of method of ultrasonic wave added porous ceramics soldering carries out according to the following steps:
One, porous ceramics pre-processes:
By polishing, polishing and ultrasonic cleaning 2 pieces~20 pieces porous ceramic surfaces of cleaning, pretreated porous pottery is obtained
Porcelain；
The porosity of the porous ceramics is 10%~90%；
Two, ceramic welding:
2 pieces~20 pieces pretreated porous ceramics are stacked, solder is set between adjacent pretreated porous ceramics
Paillon, and compressed under conditions of pressing force is 0.1MPa~10MPa, the ceramic member after compression is heated to solder paillon and is melted
Change, under solder melting temperature, ultrasonic activation applied to the ceramic member after compression, finally takes out the ceramic member after ultrasound,
And be maintained to compress under conditions of pressing force is 0.1MPa~10MPa and be cooled to room temperature, porous ceramics weldment is obtained, that is, is completed
The method of ultrasonic wave added porous ceramics soldering；
The solder foil thickness is 0.1mm~1mm；
When the ultrasonic activation be continuously applied when, ultrasonic amplitude be 0.1 μm~100 μm, ultrasonic frequency
Under conditions of being 100W~2000W for 15kHz~50kHz and ultrasonic power, ultrasonic pressing 1s~1800s；
When the ultrasonic activation be gap apply when, ultrasonic amplitude be 0.1 μm~100 μm, ultrasonic frequency
Under conditions of being 100W~2000W for 15kHz~50kHz and ultrasonic power, ultrasonic pressing 1s~100s, then pause is super
Sound wave loads 10s~100s, with ultrasonic pressing and pause for one cycle, recycles 2 times~10 times.
Mechanism of the present invention: when the liquid water or molten metal for undergoing ultrasonic activation place capillary, water or gold
Category can be risen along pipe inner wall with cracking speed, which is exactly " sound cause capillary " effect.In the process, liquid is in capillary
Rising in pipe does not depend on liquid to the Wet Out of inside pipe wall, the capillary that liquid still can penetrate into non-wetted situation
Inside pipe.In general, conventional solder is poor to the wetability of ceramics, even if by ceramic hot dipping into solder at very long one section
Between, solder will not soak and penetrate into ceramics.Using sound cause capillary phenomenon can be very good solve liquid solder be difficult to penetrate into it is more
The problem of hole ceramics.In addition to this, liquid solder can generate cavitation when undergoing ultrasonic activation, and crumbling and fall for cavitation bubble can generate
Part reaches the high temperature of thousands of degree, can also generate the very high microjet of speed, can solve ceramic surface using the two phenomenons
The problem of hardly possible wetting, realizes wetting of the solder to ceramics.The gap of porous ceramics is typically small, and compared with can produce more in narrow gap
The acoustic cavitation pretended, conducive to the connection of liquid solder and ceramics.
The beneficial effects of the present invention are:
1, ceramic selection is flexible.The present invention can weld any porous ceramics, not limited by ceramic composition.
2, the selection of solder and composition proportion are flexible.Any solder, high/low temperature, and solder ingredient can be used in the present invention
Flexible ratio can be single component, be also possible to composite soldering.
3, welding process wide temperature range.The present invention can select suitable solder according to the service condition of test specimen, then root
According to solder at component selections welding temperature.If the welding temperature of Sn-9Zn solder can be 200 DEG C or more, the weldering of Zn-5Al solder
Jointing temp can be 400 DEG C or more, and the welding temperature of Al-12Si can be 600 DEG C or more.
4, ultrasonic application position is flexible.In welding process, ultrasonic wave can be loaded on ceramics, can also be applied to folder
On tool；Ultrasound can be continuously applied, and can also be applied with gap.
5, the intensity of connector is high.Liquid solder penetrates into the certain depth of base material by ultrasonic wave fine and cavitation,
Form fine and close composite layer, intensity is higher than porous strength of parent after layer welding, i.e., connector stress when from base material
Fracture, and after liquid solder penetrates into base material, so that strength of parent improves, improve 32% or more.
6, at low cost, adaptable, welding efficiency is high.Welding can be completed under atmospheric environment, hardly applied by surrounding
The influence of work environment, and postwelding is not required to keep the temperature.
7, use scope of the invention is wide, is used in various thickness, and various Complex Parts are suitable for the porous pottery of of the same race or xenogenesis
The welding of porcelain.
The method that the present invention is used for a kind of soldering of ultrasonic wave added porous ceramics.
Detailed description of the invention
Fig. 1 is one ultrasonic wave added porous ceramics brazing process schematic diagram of embodiment, and 1 is molten solder, and 2 be the pottery after clamping
Porcelain piece, 3 be Ultrasonic probe, and 4 be solder trough, and 5 be heating device；
Fig. 2 is the cross-sectional morphology scanning electron microscope (SEM) photograph of porous ceramics weldment weld seam prepared by embodiment one, and 1 is porous pottery
Porcelain, 2 be weld seam, and 3 be diffusion layer；
Fig. 3 is the crack propagation pictorial diagram after porous ceramics weldment shearing experiment prepared by embodiment one, and 1 is porous pottery
Porcelain, 2 be weld seam, and 3 be crackle；
Fig. 4 is two ultrasonic wave added porous ceramics brazing process schematic diagram of embodiment, and 1 is solder paillon, and 2 be porous ceramics, 3
It is fixed device for Ultrasonic probe, 4,5 be heating device.
Specific embodiment
Specific embodiment 1: a kind of method of present embodiment ultrasonic wave added porous ceramics soldering be according to the following steps into
Capable:
One, part to be welded pre-processes:
By polishing, polishing and ultrasonic cleaning 2 pieces~20 pieces porous ceramic surfaces of cleaning, pretreated porous pottery is obtained
Porcelain；
The porosity of the porous ceramics is 10%~90%；
Two, ceramic wetting:
Solder is placed in and is heated to melting in solder trough, then under ultrasonic activation and solder melting temperature, will be located in advance
Porous ceramics after reason, which immerses in molten solder, to be soaked, and the ceramics of ultrasonic wave added wetting are obtained；
When the ultrasonic activation be continuously applied when, ultrasonic amplitude be 0.1 μm~100 μm, ultrasonic frequency
Under conditions of being 100W~2000W for 15kHz~50kHz and ultrasonic power, ultrasonic pressing 1s~1800s；
When the ultrasonic activation be gap apply when, ultrasonic amplitude be 0.1 μm~100 μm, ultrasonic frequency
Under conditions of being 100W~2000W for 15kHz~50kHz and ultrasonic power, ultrasonic pressing 1s~100s, then pause is super
Sound wave loads 10s~100s, with ultrasonic pressing and pause for one cycle, recycles 2 times~10 times；
Three, ceramic welding:
Under conditions of clamping force is 0.1MPa~10MPa, the ceramics that 2 pieces~20 pieces ultrasonic wave addeds soak are stacked and filled
It clips together, under solder melting temperature, the ceramic member after clamping is immersed in molten solder and applies ultrasonic activation, finally will
Ceramic member after ultrasound takes out and is cooled to room temperature, and removes clamping force, obtains porous ceramics weldment, i.e. completion ultrasonic wave added is more
The method of hole Ceramic brazing；
When the ultrasonic activation be continuously applied when, ultrasonic amplitude be 0.1 μm~100 μm, ultrasonic frequency
Under conditions of being 100W~2000W for 15kHz~50kHz and ultrasonic power, ultrasonic pressing 1s~1800s；
When the ultrasonic activation be gap apply when, ultrasonic amplitude be 0.1 μm~100 μm, ultrasonic frequency
Under conditions of being 100W~2000W for 15kHz~50kHz and ultrasonic power, ultrasonic pressing 1s~100s, then pause is super
Sound wave loads 10s~100s, with ultrasonic pressing and pause for one cycle, recycles 2 times~10 times.
The beneficial effect of present embodiment is: 1, ceramic selection is flexible.Present embodiment can weld any porous pottery
Porcelain is not limited by ceramic composition.
2, the selection of solder and composition proportion are flexible.Any solder, high/low temperature, and solder can be used in present embodiment
Composition proportion is flexible, can be single component, is also possible to composite soldering.
3, welding process wide temperature range.Present embodiment can select suitable solder according to the service condition of test specimen, and
Afterwards according to solder at component selections welding temperature.If the welding temperature of Sn-9Zn solder can be 200 DEG C or more, Zn-5Al solder
Welding temperature can be 400 DEG C or more, the welding temperature of Al-12Si can be 600 DEG C or more.
4, ultrasonic application position is flexible.In welding process, ultrasonic wave can be loaded on ceramics, can also be applied to folder
On tool；Ultrasound can be continuously applied, and can also be applied with gap.
5, the intensity of connector is high.Liquid solder penetrates into the certain depth of base material by ultrasonic wave fine and cavitation,
Form fine and close composite layer, intensity is higher than porous strength of parent after layer welding, i.e., connector stress when from base material
Fracture, and after liquid solder penetrates into base material, so that strength of parent improves, improve 32% or more.
6, at low cost, adaptable, welding efficiency is high.Welding can be completed under atmospheric environment, hardly applied by surrounding
The influence of work environment, and postwelding is not required to keep the temperature.
7, the use scope of present embodiment is wide, is used in various thickness, and it is more to be suitable for of the same race or xenogenesis for various Complex Parts
The welding of hole ceramics.
Specific embodiment 2: present embodiment is unlike specific embodiment two: porous pottery described in step 1
Porcelain is Si3N4Ceramics, Si2N2O ceramics, SiC ceramic, SiBCN ceramics, ZrO2Ceramics, Al2O3Ceramics, TiB2Ceramics, B4C ceramics,
ZrB2Ceramics, TaB2One of ceramics, ZrC ceramics, binary ceramic, ternary ceramics and quaternary ceramics or in which several.It is other with
Specific embodiment two is identical.
Specific embodiment 3: the present embodiment is different from the first and the second embodiment in that: described in step 3
Porous ceramics weldment is 190 DEG C hereinafter, then solder described in step 2 is Sn base solder using temperature；Described in step 3
Porous ceramics weldment the use of temperature is 380 DEG C hereinafter, then solder described in step 2 is Zn base solder；When step 3 institute
The porous ceramics weldment stated is 600 DEG C hereinafter, then solder described in step 2 is Al base solder using temperature.Other and tool
Body embodiment one or two is identical.
Specific embodiment 4: unlike one of present embodiment and specific embodiment one to three: the Sn base
Solder is Sn-9Zn solder or Sn-4Cu solder；The Zn base solder is Zn-5Al solder；The Al base solder is Al-
12Si solder.It is other identical as specific embodiment one to three.
Specific embodiment 5: unlike one of present embodiment and specific embodiment one to four: described in step 3
The type of cooling be water cooling or air-cooled.It is other identical as specific embodiment one to four.
Specific embodiment 6: a kind of method of present embodiment ultrasonic wave added porous ceramics soldering be according to the following steps into
Capable:
One, porous ceramics pre-processes:
By polishing, polishing and ultrasonic cleaning 2 pieces~20 pieces porous ceramic surfaces of cleaning, pretreated porous pottery is obtained
Porcelain；
The porosity of the porous ceramics is 10%~90%；
Two, ceramic welding:
2 pieces~20 pieces pretreated porous ceramics are stacked, solder is set between adjacent pretreated porous ceramics
Paillon, and compressed under conditions of pressing force is 0.1MPa~10MPa, the ceramic member after compression is heated to solder paillon and is melted
Change, under solder melting temperature, ultrasonic activation applied to the ceramic member after compression, finally takes out the ceramic member after ultrasound,
And be maintained to compress under conditions of pressing force is 0.1MPa~10MPa and be cooled to room temperature, porous ceramics weldment is obtained, that is, is completed
The method of ultrasonic wave added porous ceramics soldering；
The solder foil thickness is 0.1mm~1mm；
When the ultrasonic activation be continuously applied when, ultrasonic amplitude be 0.1 μm~100 μm, ultrasonic frequency
Under conditions of being 100W~2000W for 15kHz~50kHz and ultrasonic power, ultrasonic pressing 1s~1800s；
When the ultrasonic activation be gap apply when, ultrasonic amplitude be 0.1 μm~100 μm, ultrasonic frequency
Under conditions of being 100W~2000W for 15kHz~50kHz and ultrasonic power, ultrasonic pressing 1s~100s, then pause is super
Sound wave loads 10s~100s, with ultrasonic pressing and pause for one cycle, recycles 2 times~10 times.
The beneficial effect of present embodiment is: 1, ceramic selection is flexible.Present embodiment can weld any porous pottery
Porcelain is not limited by ceramic composition.
2, the selection of solder and composition proportion are flexible.Any solder, high/low temperature, and solder can be used in present embodiment
Composition proportion is flexible, can be single component, is also possible to composite soldering.
3, welding process wide temperature range.Present embodiment can select suitable solder according to the service condition of test specimen, and
Afterwards according to solder at component selections welding temperature.If the welding temperature of Sn-9Zn solder can be 200 DEG C or more, Zn-5Al solder
Welding temperature can be 400 DEG C or more, the welding temperature of Al-12Si can be 600 DEG C or more.
4, ultrasonic application position is flexible.In welding process, ultrasonic wave can be loaded on ceramics, can also be applied to folder
On tool；Ultrasound can be continuously applied, and can also be applied with gap.
5, the intensity of connector is high.Liquid solder penetrates into the certain depth of base material by ultrasonic wave fine and cavitation,
Form fine and close composite layer, intensity is higher than porous strength of parent after layer welding, i.e., connector stress when from base material
Fracture, and after liquid solder penetrates into base material, so that strength of parent improves, improve 32% or more.
6, at low cost, adaptable, welding efficiency is high.Welding can be completed under atmospheric environment, hardly applied by surrounding
The influence of work environment, and postwelding is not required to keep the temperature.
7, the use scope of present embodiment is wide, is used in various thickness, and it is more to be suitable for of the same race or xenogenesis for various Complex Parts
The welding of hole ceramics.
Specific embodiment 7: present embodiment is unlike specific embodiment six: described in step 1 porous
Ceramics are Si3N4Ceramics, Si2N2O ceramics, SiC ceramic, SiBCN ceramics, ZrO2Ceramics, Al2O3Ceramics, TiB2Ceramics, B4C pottery
Porcelain, ZrB2Ceramics, TaB2One of ceramics, ZrC ceramics, binary ceramic, ternary ceramics and quaternary ceramics or in which several.Its
It is identical as specific embodiment six.
Specific embodiment 8: present embodiment is unlike specific embodiment six or seven: described in step 2
Porous ceramics weldment is 190 DEG C hereinafter, then the solder paillon is Sn base solder using temperature；It is more described in the step 2
Hole ceramic welding part is 380 DEG C hereinafter, then the solder paillon is Zn base solder using temperature；It is porous described in the step 2
Ceramic welding part is 600 DEG C hereinafter, then the solder paillon is Al base solder using temperature.Other and specific embodiment six
Or seven is identical.
Specific embodiment 9: unlike one of present embodiment and specific embodiment six to eight: the Sn base
Solder is Sn-9Zn solder or Sn-4Cu solder；The Zn base solder is Zn-5Al solder；The Al base solder is Al-
12Si solder.It is other identical as specific embodiment six to eight.
Specific embodiment 10: unlike one of present embodiment and specific embodiment six to nine: described in step 2
The type of cooling be water cooling or air-cooled.It is other identical as specific embodiment six to nine.
Beneficial effects of the present invention are verified using following embodiment:
Embodiment one:
Illustrate the present embodiment in conjunction with Fig. 1, a kind of method of ultrasonic wave added porous ceramics soldering be according to the following steps into
Capable:
One, part to be welded pre-processes:
By polishing, polishing and ultrasonic cleaning 2 pieces of porous ceramic surfaces of cleaning, pretreated porous ceramics is obtained；
The porosity of the porous ceramics is 30%；
Two, ceramic wetting:
Solder is placed in solder trough, is heated to melting under conditions of temperature is 420 DEG C, then in ultrasonic activation and
Temperature is to immerse in molten solder pretreated porous ceramics at 420 DEG C and soak, and obtains the pottery of ultrasonic wave added wetting
Porcelain；
The ultrasonic activation is to be continuously applied, ultrasonic amplitude is 6 μm, ultrasonic frequency is 20kHz and ultrasound
Under conditions of wave power is 1000W, ultrasonic pressing 120s；
Three, ceramic welding:
Under the conditions of clamping force is 0.2MPa~0.4MPa, the ceramics that 2 pieces of ultrasonic wave addeds soak are stacked and clamping is to one
It rises, in the case where temperature is 420 DEG C, the ceramic member after clamping is immersed in molten solder and applies ultrasonic activation, it finally will be after ultrasound
Ceramic member take out and be cooled to room temperature, remove clamping force, obtain porous ceramics weldment, i.e., completion ultrasonic wave added porous ceramics
The method of soldering；
The ultrasonic activation is to be continuously applied, ultrasonic amplitude is 6 μm, ultrasonic frequency is 20kHz and ultrasound
Under conditions of wave power is 1000W, ultrasonic pressing 120s；
Porous ceramics described in step 1 is ZrB2、SiC、TiB2And HfB2The quaternary ceramics of composition；The ZrB2:
SiC:TiB2:HfB2Volume ratio be 16:4:4:1；
Solder described in step 2 is Zn-5Al solder；
The type of cooling described in step 3 is air-cooled；
Ultrasonic activation described in the present embodiment is that Ultrasonic probe is applied on solder trough；
Using the present embodiment method, it is good to can be obtained appearance of weld, internal flawless porous ceramics welding point.Pass through
Change the parameters such as ultrasonic time and power, can be obtained the connector of weld seam difference welding line structure；
1 is molten solder in Fig. 1, and 2 be the ceramic member after clamping, and 3 be Ultrasonic probe, and 4 be solder trough, and 5 be heating dress
It sets；
Fig. 2 is the cross-sectional morphology scanning electron microscope (SEM) photograph of porous ceramics weldment weld seam prepared by embodiment one, and 1 is porous pottery
Porcelain, 2 be weld seam, and 3 be diffusion layer；It can be obtained by the constituent analysis of surface sweeping Electronic Speculum, liquid solder is immersed in the depth of porous ceramics at this time
Degree is 42 microns；
Fig. 3 is the crack propagation pictorial diagram after porous ceramics weldment shearing experiment prepared by embodiment one, and 1 is porous pottery
Porcelain, 2 be weld seam, and 3 be crackle；To embodiment one prepare porous ceramics weldment weld size be 10mm × 10mm and shearing
Speed carries out shearing test under conditions of being 1mm/min, and as seen from the figure, in shear history, crackle expands inside ceramic matrix
Exhibition, gained shear strength are 33MPa, are higher than the ceramic intensity (about 25MPa) of the present embodiment quaternary itself, it is known that connector is strong at this time
Degree is higher than the intensity of ceramics itself, after liquid solder penetrates into base material, so that strength of parent further increases, improves about 32%.
Embodiment two:
Illustrate the present embodiment in conjunction with Fig. 4, a kind of method of ultrasonic wave added porous ceramics soldering be according to the following steps into
Capable:
One, porous ceramics pre-processes:
By polishing, polishing and ultrasonic cleaning 2 pieces of porous ceramic surfaces of cleaning, pretreated porous ceramics is obtained；
The porosity of the porous ceramics is 30%；
Two, ceramic welding:
2 pieces of pretreated porous ceramics are stacked, solder paillon is set between 2 pieces of pretreated porous ceramics, and
It is compressed under conditions of pressing force is 0.2MPa~0.4MPa, the ceramic member after compression is added under conditions of temperature is 200 DEG C
Heat applies ultrasonic activation to the ceramic member after compression under conditions of temperature is 200 DEG C to brazing filler metal melts, finally will be ultrasonic
Ceramic member afterwards takes out, and is maintained to compress under conditions of pressing force is 0.2MPa~0.4MPa and be cooled to room temperature, and obtains porous
Ceramic welding part, the i.e. method of completion ultrasonic wave added porous ceramics soldering；
The solder foil thickness is 1mm；
The ultrasonic activation is to be continuously applied, ultrasonic amplitude is 10 μm, ultrasonic frequency is 30kHz and ultrasound
Under conditions of wave power is 2000W, ultrasonic pressing 10s；
Porous ceramics described in step 1 is ZrB2、SiC、TiB2And HfB2The quaternary ceramics of composition；The ZrB2:
SiC:TiB2:HfB2Volume ratio be 16:4:4:1；
The solder paillon is Sn-9Zn solder；
The type of cooling described in step 2 is air-cooled.
The present embodiment will be arranged solder paillon and be placed in fixed device between 2 pieces of pretreated porous ceramics, Gu
The purpose for determining device is to prevent porous ceramics from occurring positional shift during ultrasonic activation, the ultrasonic activation be by
Ultrasonic probe is applied to side ceramic surface, and applies pressing force by Ultrasonic probe.
1 is solder paillon in Fig. 4, and 2 be porous ceramics, and 3 be Ultrasonic probe, and 4 be fixed device, and 5 be heating device.
Using the present embodiment method, it is good to can be obtained appearance of weld, internal flawless connector.And it is welded using this method
When, it is not required in advance soak ceramics, can further improve welding efficiency.
Claims (10)
1. a kind of method of ultrasonic wave added porous ceramics soldering, it is characterised in that a kind of method of ultrasonic wave added porous ceramics soldering
It carries out according to the following steps:
One, part to be welded pre-processes:
By polishing, polishing and ultrasonic cleaning 2 pieces~20 pieces porous ceramic surfaces of cleaning, pretreated porous ceramics is obtained；
The porosity of the porous ceramics is 10%~90%；
Two, ceramic wetting:
Solder is placed in and is heated to melting in solder trough, then under ultrasonic activation and solder melting temperature, after pretreatment
Porous ceramics immerse molten solder in soaked, obtain ultrasonic wave added wetting ceramics；
When the ultrasonic activation is to be continuously applied, ultrasonic amplitude is 0.1 μm~100 μm, ultrasonic frequency is
Under conditions of 15kHz~50kHz and ultrasonic power are 100W~2000W, ultrasonic pressing 1s~1800s；
When the ultrasonic activation is that gap applies, ultrasonic amplitude is 0.1 μm~100 μm, ultrasonic frequency is
Under conditions of 15kHz~50kHz and ultrasonic power are 100W~2000W, ultrasonic pressing 1s~100s, then pause is ultrasonic
Wave loads 10s~100s, with ultrasonic pressing and pause for one cycle, recycles 2 times~10 times；
Three, ceramic welding:
Under conditions of clamping force is 0.1MPa~10MPa, the ceramics that 2 pieces~20 pieces ultrasonic wave addeds soak are stacked and clamping arrives
Together, under solder melting temperature, the ceramic member after clamping is immersed in molten solder and applies ultrasonic activation, it finally will be ultrasonic
Ceramic member afterwards takes out and is cooled to room temperature, and removes clamping force, obtains porous ceramics weldment, i.e. the completion porous pottery of ultrasonic wave added
The method of porcelain soldering；
When the ultrasonic activation is to be continuously applied, ultrasonic amplitude is 0.1 μm~100 μm, ultrasonic frequency is
Under conditions of 15kHz~50kHz and ultrasonic power are 100W~2000W, ultrasonic pressing 1s~1800s；
When the ultrasonic activation is that gap applies, ultrasonic amplitude is 0.1 μm~100 μm, ultrasonic frequency is
Under conditions of 15kHz~50kHz and ultrasonic power are 100W~2000W, ultrasonic pressing 1s~100s, then pause is ultrasonic
Wave loads 10s~100s, with ultrasonic pressing and pause for one cycle, recycles 2 times~10 times.
2. a kind of method of ultrasonic wave added porous ceramics soldering according to claim 1, it is characterised in that described in step 1
Porous ceramics be Si3N4Ceramics, Si2N2O ceramics, SiC ceramic, SiBCN ceramics, ZrO2Ceramics, Al2O3Ceramics, TiB2Ceramics,
B4C ceramics, ZrB2Ceramics, TaB2One of ceramics, ZrC ceramics, binary ceramic, ternary ceramics and quaternary ceramics or in which several
Kind.
3. a kind of method of ultrasonic wave added porous ceramics soldering according to claim 1, it is characterised in that when step 3 institute
The porous ceramics weldment stated is 190 DEG C hereinafter, then solder described in step 2 is Sn base solder using temperature；Work as step 3
The porous ceramics weldment is 380 DEG C hereinafter, then solder described in step 2 is Zn base solder using temperature；Work as step
Porous ceramics weldment described in three is 600 DEG C hereinafter, then solder described in step 2 is Al base solder using temperature.
4. a kind of method of ultrasonic wave added porous ceramics soldering according to claim 3, it is characterised in that the Sn base
Solder is Sn-9Zn solder or Sn-4Cu solder；The Zn base solder is Zn-5Al solder；The Al base solder is Al-
12Si solder.
5. a kind of method of ultrasonic wave added porous ceramics soldering according to claim 1, it is characterised in that described in step 3
The type of cooling be water cooling or air-cooled.
6. a kind of method of ultrasonic wave added porous ceramics soldering, it is characterised in that a kind of method of ultrasonic wave added porous ceramics soldering
It carries out according to the following steps:
One, porous ceramics pre-processes:
By polishing, polishing and ultrasonic cleaning 2 pieces~20 pieces porous ceramic surfaces of cleaning, pretreated porous ceramics is obtained；
The porosity of the porous ceramics is 10%~90%；
Two, ceramic welding:
2 pieces~20 pieces pretreated porous ceramics are stacked, solder paillon is set between adjacent pretreated porous ceramics,
And compressed under conditions of pressing force is 0.1MPa~10MPa, the ceramic member after compression is heated to solder foil melts, in pricker
Expect under melting temperature, ultrasonic activation is applied to the ceramic member after compression, is finally taken out the ceramic member after ultrasound, and be maintained at
Pressing force is compressed under conditions of being 0.1MPa~10MPa and is cooled to room temperature, and obtains porous ceramics weldment, i.e. completion ultrasonic wave added
The method of porous ceramics soldering；
The solder foil thickness is 0.1mm~1mm；
When the ultrasonic activation is to be continuously applied, ultrasonic amplitude is 0.1 μm~100 μm, ultrasonic frequency is
Under conditions of 15kHz~50kHz and ultrasonic power are 100W~2000W, ultrasonic pressing 1s~1800s；
When the ultrasonic activation is that gap applies, ultrasonic amplitude is 0.1 μm~100 μm, ultrasonic frequency is
Under conditions of 15kHz~50kHz and ultrasonic power are 100W~2000W, ultrasonic pressing 1s~100s, then pause is ultrasonic
Wave loads 10s~100s, with ultrasonic pressing and pause for one cycle, recycles 2 times~10 times.
7. a kind of method of ultrasonic wave added porous ceramics soldering according to claim 6, it is characterised in that institute in step 1
The porous ceramics stated is Si3N4Ceramics, Si2N2O ceramics, SiC ceramic, SiBCN ceramics, ZrO2Ceramics, Al2O3Ceramics, TiB2Pottery
Porcelain, B4C ceramics, ZrB2Ceramics, TaB2One of ceramics, ZrC ceramics, binary ceramic, ternary ceramics and quaternary ceramics or in which
It is several.
8. a kind of method of ultrasonic wave added porous ceramics soldering according to claim 6, it is characterised in that when step 2 institute
The porous ceramics weldment stated is 190 DEG C hereinafter, then the solder paillon is Sn base solder using temperature；Described in step 2
Porous ceramics weldment the use of temperature is 380 DEG C hereinafter, then the solder paillon is Zn base solder；Described in step 2
Porous ceramics weldment is 600 DEG C hereinafter, then the solder paillon is Al base solder using temperature.
9. a kind of method of ultrasonic wave added porous ceramics soldering according to claim 8, it is characterised in that the Sn base
Solder is Sn-9Zn solder or Sn-4Cu solder；The Zn base solder is Zn-5Al solder；The Al base solder is Al-
12Si solder.
10. a kind of method of ultrasonic wave added porous ceramics soldering according to claim 6, it is characterised in that described in step 2
The type of cooling be water cooling or air-cooled.
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