CN106563861A - Ultrasonic soldering method for fast forming ceramic-metal interconnection - Google Patents
Ultrasonic soldering method for fast forming ceramic-metal interconnection Download PDFInfo
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- CN106563861A CN106563861A CN201610909875.2A CN201610909875A CN106563861A CN 106563861 A CN106563861 A CN 106563861A CN 201610909875 A CN201610909875 A CN 201610909875A CN 106563861 A CN106563861 A CN 106563861A
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- Prior art keywords
- mother metal
- interconnected
- intermediate layer
- ultrasonic
- test specimen
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/06—Soldering, e.g. brazing, or unsoldering making use of vibrations, e.g. supersonic vibrations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
- B23K1/206—Cleaning
Abstract
The invention belongs to the technical field of welding, and particularly relates to a simple, fast and easily-implemented ultrasonic soldering method for fast forming ceramic-metal interconnection. The ultrasonic soldering method for fast forming ceramic-metal interconnection is characterized by including the following steps that surface treatment is carried out on base materials to be interconnected; then, the base materials to be interconnected are assembled into a sandwiching structure of the first base material/the middle layer/the third base material and placed on a heating table; the structure in the second step is heated and pressurized so that the middle layer can melt; and ultrasonic application is stopped, ballasting on a test piece is canceled, the test piece is taken down after the test piece is cooled, and the interconnection process is completed. Compared with the prior art, the ultrasonic soldering method for fast forming ceramic-metal interconnection is advantageous in that a joint compact and uniform in structure can be obtained in extremely short time, and the reliability problem caused by too long isothermal holding time is avoided; and in addition, oxide films on surfaces to be interconnected are destroyed by the ultrasonic effect, wetting and spreading of the middle layer in a molten state on the base materials are facilitated, and the quality of the joint is improved.
Description
Technical field
The invention belongs to welding technology field, is concretely quick formation pottery that is a kind of simple, quick and being easily achieved
The ultrasonic brazing method of porcelain metal interconnection.
Background technology
Ceramic material is widely used in many necks such as Aero-Space, petrochemical industry, automobile making due to its excellent performance
Domain.For example, TiC, Ti (C, N) base metal-ceramic material has hardness, good wearability, the excellent chemically stable of superelevation
Property, have developed into the cutter material of independent series；The broad-band gap half as a new generation such as SiC, GaN, diamond, ZnO, AlN
Conductor material, the features such as possess high heat conductance, big energy gap, excellent chemical property, mechanical property, is made based on it
Standby high temperature power device is developed rapidly and is widely applied, and its highest service temperature is up to 600 DEG C.But ceramic material
It is difficult to, generally requires to be coupled together with metal, realizes the complementation in performance.
Due to ceramics and metal mechanical joining methods complex process and intensity is relatively low, therefore ceramics and metal connection skill
In art, often realizing the interconnection of the two by the way of welding.Soldering is technique most widely used at present, but in traditional pricker
There are problems that during Welding as follows：Welding process is generally required to be entered under vacuum environment or inert gas shielding environment
OK, process cycle is long, relatively costly；Often there is larger residual stress in metal and ceramic joining interface, cause joint
Reliability decrease.
Ultrasonic wave added soldering tech can be carried out under atmospheric environment, without the need for inert gas shielding or vacuum environment, technique
Simply, production cost is reduced.Additionally, in the technical process, due to the cavitation and acoustic streaming effect of ultrasound so that joint
Tissue more even compact, is conducive to improving the reliability of interconnection joint.
The content of the invention
To achieve these goals, the present invention propose one kind can overcome long conventional brazing process cycle, complex process,
The ultrasonic brazing method of the quick formation ceramet interconnection of the problems such as high cost, relatively low reliability.
The present invention is reached by following measures：
A kind of ultrasonic brazing method of quick formation ceramet interconnection, connecting material includes mother metal one, intermediate layer two and mother metal
Three, it is characterised in that comprise the following steps：
Step 1：Treat interconnection mother metal surface to be processed, by mother metal one, intermediate layer two and mother metal three, polished, polished, with
After be cleaned by ultrasonic；
Step 2：Test specimen to be interconnected is assembled into into the sandwich of one/intermediate layer of mother metal/mother metal three, is placed on warm table；
Step 3：Heating pressurization is carried out to the structure in step 2 melts intermediate layer, and heating-up temperature is 220-300 DEG C, heating temperature
Degree is higher than the fusing point in intermediate layer, and the continuous heating time is 20-60s so that intermediate layer is melted completely, with after-applied ultrasound, ultrasound
Signal frequency is 20-40KHz, and amplitude is 10-60 μm, and action time is 2-10s；
Step 4：Stop applying ultrasound, remove the ballast to test specimen, treat that test specimen is cooled down:Afterwards, test specimen is removed, completes interconnection process.
In the present invention in above-mentioned steps 1, mother metal one for plated surface Ni ceramic material, such as Al2O3、BeO、ZrO2、Si3N4、
AlN, SiC, GaN, diamond, ZnO etc., it is shaped as lamellar or bulk；Intermediate layer two is that common Sn bases are fine expects, such as pure Sn,
Sn-Ag, Sn-Ag-Cu, Sn-Cu etc., intermediate layer two is shaped as lamellar or foil-like；Mother metal three for high-purity metal basal board or
Lead frame, its material is Cu or Ni, and mother metal three is shaped as bulk, lamellar or tabular；In above-mentioned steps 1, using 3000 mesh
Sand paper mechanical grinding is carried out to surface to be treated, be polished for 1 ~ 2.5 μm of diamond polishing liquid with granularity afterwards, to go
Except the oxide-film and Organic substance for the treatment of interconnection surface, the test specimen handled well is successively placed in afterwards clear respectively in clear oil and acetone soln
1 ~ 3min is washed, above-mentioned material dries up standby under Ar compression rings border.
In step 2 of the present invention, mother metal one is placed in bottom, during the course of the reaction, from chopping block to test specimen to be interconnected transmission heat
Amount, and play a part of fixed mother metal one so as to can not all around move.
In step 2 of the present invention, the thickness in intermediate layer two is 30 ~ 50 μm, is dimensioned slightly smaller than mother metal one and mother metal three.
In above-mentioned steps of the present invention 3, treat interconnection test specimen pressure by ultrasonic applicator provide, pressure size be 0.2 ~
1.0MPa；In step 3, treat interconnection test specimen and continue on-load pressure effect, until welding process terminates；In step 3, heating-up temperature
For 220 ~ 300 DEG C, the slightly above fusing point in intermediate layer；In step 3, the continuous heating time is 20 ~ 60s so that melted completely in intermediate layer
Change；In above-mentioned steps 3, supersonic frequency is 20 ~ 40KHz, and amplitude is 10 ~ 60 μm, and action time is 2 ~ 10s.
The present invention is realized based on following principles：Ultrasound wave in communication process, is imitated in liquid phase medium along with cavitation
Should and acoustic streaming effect, and be converted into corresponding physical chemistry effect, promote the wetting and spreading of the fine material of molten state.Cavitation bubble explosion
Shock wave and microjet being formed afterwards, cavitation corrosion effect being produced to metal basal board, simultaneous surface energy is to heat energy and chemistry
Transformation of energy, is being partially formed High Temperature High Pressure, and in these regions, the metal particle for peeling off dissolves rapidly, has broken metal
The restriction of substrate element equilbrium solubility in the fine material of molten state, causes supersaturation of the substrate metal element in the fine material of liquid phase to show
As, and the uniform joint of dense structure is formed in subsequent cooling procedure.
The present invention has the advantages that relative to prior art：The ultrasonic wave added soldering processes that the present invention is adopted can
Obtaining the uniform joint of dense structure within the extremely short time, it is to avoid the integrity problem that long isothermal time brings, this
Outer ultrasonic action breaks down treats interconnection surface oxide-film, contributes to the moistening on mother metal of molten state intermediate layer and sprawls, and improves
Joint quality.
The present invention is carried out under atmospheric environment, without the need for inert gas shielding or vacuum environment, simplifies Joining Technology, is dropped
Low production cost, has greatly facilitated the raising of production efficiency.
Specific embodiment：
With reference to embodiment, the present invention is further illustrated.
Embodiment 1：
A kind of ultrasonic brazing method of quick formation ceramet interconnection, including following step：
Step 1：Treat interconnection mother metal be surface-treated, by mother metal one, intermediate layer two and mother metal three, carry out slight polishing,
Polishing, the test specimen handled well to ensure to remove oxide film dissolving and greasy dirt, be subsequently successively placed in clear oil and acetone and surpassed respectively
Sound is cleaned, and scavenging period is respectively 1 ~ 3min；
Step 2：Test specimen to be interconnected is assembled into into the sandwich of one/intermediate layer of mother metal/mother metal three, is placed on chopping block, its
Middle mother metal one is placed in bottom；
Step 3：Heating pressurization is carried out to structure in step 2 melts intermediate layer, and heating-up temperature is 280 DEG C, the duration of heat
For 60s, moulding pressure is 0.5MPa, and with after-applied ultrasound, amplitude is 48 μm, and supersonic frequency is 40kHz, and the ultrasonication time is
8~10s；
Step 4：Stop applying ultrasound, remove the ballast to test specimen, treat after test specimen cooling a period of time, to remove test specimen, complete
Interconnection process.
In above-mentioned steps 1：The mother metal one for plated surface Ni ceramic material, such as Al2O3、BeO、ZrO2、Si3N4、AlN、
SiC, GaN, diamond, ZnO etc.；Mother metal three is industrial pure Ni substrates, and intermediate layer two is the fine material of common Sn bases, such as pure
Sn, Sn-Ag, Sn-Ag-Cu, Sn-Cu etc., intermediate layer two is shaped as lamellar or foil-like, is dimensioned slightly smaller than mother metal one and mother metal
Three, thickness is 30 ~ 50 μm.
The joint obtained using the implementation case mode is mainly by Ni3Sn4Intermetallic compound is constituted, and its remelting temperature is high
Up to 794 DEG C, and joint microstructure is fine and close, and uniform small grains can meet the requirement to mechanical property and high temperature reliability.
Embodiment 2：
A kind of ultrasonic brazing method of quick formation ceramet interconnection, it includes following step：
Step 1：Treat interconnection mother metal be surface-treated, by mother metal one, intermediate layer two and mother metal three, carry out slight polishing,
Polishing, the test specimen handled well to ensure to remove oxide film dissolving and greasy dirt, be subsequently successively placed in clear oil and acetone and surpassed respectively
Sound is cleaned, and scavenging period is respectively 1 ~ 3min；
Step 2：Test specimen to be interconnected is assembled into into the sandwich of one/intermediate layer of mother metal/mother metal three, is placed on chopping block, its
Middle mother metal one is placed in bottom；
Step 3：The heating pressurization of certain hour is carried out to structure in step 2 melts intermediate layer, and heating-up temperature is 260 DEG C, plus
Thermal endurance is 40s, and moulding pressure is 0.4MPa, and with after-applied certain amplitude and the ultrasound of frequency, amplitude is 42 μm, ultrasound
Frequency is 30kHz, and the ultrasonication time is 6 ~ 8s；
Step 4：Stop applying ultrasound, remove the ballast to test specimen, treat after test specimen cooling a period of time, to remove test specimen, complete
Interconnection process.
In above-mentioned steps 1：The mother metal one for plated surface Ni ceramic material, such as Al2O3、BeO、ZrO2、Si3N4、AlN、
SiC, GaN, diamond, ZnO etc.；Mother metal three is industrial pure Cu substrates, and intermediate layer two is the fine material of common Sn bases, such as pure
Sn, Sn-Ag, Sn-Ag-Cu, Sn-Cu etc., intermediate layer two is shaped as lamellar or foil-like, is dimensioned slightly smaller than mother metal one and mother metal
Three, thickness is 30 ~ 50 μm.
The joint obtained using the implementation case mode is mainly by (Cu, Ni)6Sn5Intermetallic compound is constituted, its remelting temperature
About 418 DEG C of degree, and joint microstructure is fine and close, uniform, can meet the requirement to mechanical property and high temperature reliability.
Embodiment 3：
A kind of ultrasonic brazing method of quick formation ceramet interconnection, it includes following step：
Step 1：Mother metal surface treatment to be interconnected, by mother metal one, intermediate layer two and mother metal three, carries out slight polishing, polishing, with
Oxide film dissolving and greasy dirt are removed in guarantee, subsequently the test specimen handled well is successively placed in clear oil and acetone and is cleaned by ultrasonic respectively,
Scavenging period is respectively 1 ~ 3min；
Step 2：Test specimen to be interconnected is assembled into into the sandwich of one/intermediate layer of mother metal/mother metal three, is placed on chopping block, its
Middle mother metal one is placed in bottom；
Step 3：The heating pressurization of certain hour is carried out to structure in step 2 melts intermediate layer, and heating-up temperature is 240 DEG C, plus
Thermal endurance is 30s, and moulding pressure is 0.3MPa, and with after-applied certain amplitude and the ultrasound of frequency, amplitude is 36 μm, ultrasound
Frequency is 20kHz, and the ultrasonication time is 4 ~ 8s；
Step 4：Stop applying ultrasound, remove the ballast to test specimen, treat after test specimen cooling a period of time, to remove test specimen, complete
Interconnection process.
In above-mentioned steps 1：The mother metal one for plated surface Ni ceramic material, such as Al2O3、BeO、ZrO2、Si3N4、AlN、
SiC, GaN, diamond, ZnO etc.；Mother metal three is industrial pure Cu substrates, and intermediate layer two is the fine material of common Sn bases, such as pure
Sn, Sn-Ag, Sn-Ag-Cu, Sn-Cu etc., intermediate layer two is shaped as lamellar or foil-like, is dimensioned slightly smaller than mother metal one and mother metal
Three, thickness is 30 ~ 50 μm.
Using the implementation case mode, the joint obtained when the ultrasonication time is shorter is mainly by Cu6Sn5Change between metal
Compound is constituted, and its remelting temperature is about 415 DEG C, and the joint obtained when the ultrasonication time is longer is mainly by Cu3Between Sn metals
Compound group is into its remelting temperature is about up to 600 DEG C, and joint microstructure is fine and close, and uniform little crystal grain is formed in weld seam, can be full
Requirement of the foot to mechanical property and high temperature reliability.
The present invention has the advantages that relative to prior art：The ultrasonic wave added soldering processes that the present invention is adopted can
Obtaining the uniform joint of dense structure within the extremely short time, it is to avoid the integrity problem that long isothermal time brings, this
Outer ultrasonic action breaks down treats interconnection surface oxide-film, contributes to the moistening on mother metal of molten state intermediate layer and sprawls, and improves
Joint quality.
The present invention is carried out under atmospheric environment, without the need for inert gas shielding or vacuum environment, simplifies Joining Technology, is dropped
Low production cost, has greatly facilitated the raising of production efficiency.
Claims (10)
1. a kind of ultrasonic brazing method that quick formation ceramet is interconnected, connecting material includes mother metal one, intermediate layer two and mother
Material three, it is characterised in that comprise the following steps：
Step 1：Treat interconnection mother metal surface to be processed, by mother metal one, intermediate layer two and mother metal three, carry out slight polishing,
Polishing, is subsequently cleaned by ultrasonic；
Step 2：Test specimen to be interconnected is assembled into into the sandwich of one/intermediate layer of mother metal/mother metal three, is placed on chopping block, its
Middle mother metal one is placed in bottom；
Step 3：To step:Structure carries out the heating pressurization of time in 2 melts intermediate layer, with after-applied:Time and frequency
Ultrasound；
Step 4：Stop applying ultrasound, remove the ballast to test specimen, treat after test specimen cooling a period of time, to remove test specimen, complete
Interconnection process.
2. the ultrasonic brazing method that a kind of quick formation ceramet according to claim 1 is interconnected, it is characterised in that female
Material one for plated surface Ni ceramic material, such as Al2O3、BeO、ZrO2、Si3N4, AlN, SiC, GaN, diamond, ZnO, it is shaped as
Lamellar or bulk.
3. ultrasonic wave added method for welding according to claim 1, it is characterised in that intermediate layer two is the fine material of Sn bases, such as pure
Sn, Sn-Ag, Sn-Ag-Cu, Sn-Cu, intermediate layer two is shaped as lamellar or foil-like.
4. the ultrasonic brazing method that a kind of quick formation ceramet according to claim 1 is interconnected, it is characterised in that female
Material three is high-purity metal basal board or lead frame, and its material is Cu or Ni, and mother metal three is shaped as bulk, lamellar or plate
Shape.
5. the ultrasonic brazing method that a kind of quick formation ceramet according to claim 1 is interconnected, it is characterised in that step
In rapid 1, mechanical grinding is carried out to surface to be treated using the sand paper of 3000 mesh, afterwards the diamond with granularity for 1 ~ 2.5 μm is thrown
Light liquid is polished, and to remove the oxide-film and Organic substance for the treatment of interconnection surface, afterwards successively the test specimen handled well is placed in into clear oil
With 1 ~ 3min is respectively washed in acetone soln, above-mentioned material dries up standby under Ar compression rings border.
6. the ultrasonic brazing method that a kind of quick formation ceramet according to claim 1 is interconnected, it is characterised in that on
In stating step 2, mother metal one is placed in bottom, during the course of the reaction, from chopping block to test specimen to be interconnected heat is transmitted, and plays fixation
The effect of mother metal one so as to can not all around move；The thickness in intermediate layer two is 30 ~ 50 μm, is dimensioned slightly smaller than the He of mother metal one
Mother metal three.
7. the ultrasonic brazing method that a kind of quick formation ceramet according to claim 1 is interconnected, it is characterised in that on
In stating step 3, the pressure for treating interconnection test specimen is provided by ultrasonic applicator, and pressure size is 0.2 ~ 1.0MPa.
8. the ultrasonic brazing method that a kind of quick formation ceramet according to claim 1 is interconnected, it is characterised in that on
In stating step 3, treat interconnection test specimen and continue on-load pressure effect, until welding process terminates.
9. the ultrasonic brazing method that a kind of quick formation ceramet according to claim 1 is interconnected, it is characterised in that on
In stating step 3, heating-up temperature is 220 ~ 300 DEG C, slightly above the fusing point in intermediate layer；The continuous heating time is 20 ~ 60s so that in
Interbed is completely melt.
10. the ultrasonic brazing method that a kind of quick formation ceramet according to claim 1 is interconnected, it is characterised in that on
In stating step 3, supersonic frequency is 20 ~ 40KHz, and amplitude is 10 ~ 60 μm, and action time is 2 ~ 10s.
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Cited By (6)
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| CN108465891A (en) * | 2018-03-22 | 2018-08-31 | 哈尔滨工业大学 | A kind of connection method of yttrium iron garnet ferrite ceramics and copper |
| CN109759662A (en) * | 2019-01-16 | 2019-05-17 | 哈尔滨工业大学 | A kind of method of ultrasonic wave added porous ceramics soldering |
| CN110776330A (en) * | 2018-12-31 | 2020-02-11 | 深圳硅基仿生科技有限公司 | Brazing method of ceramic and metal |
| CN111604558A (en) * | 2019-02-25 | 2020-09-01 | 邢台职业技术学院 | Low-cost, self-activating method for welding ceramics and application thereof |
| CN114799475A (en) * | 2022-04-14 | 2022-07-29 | 哈尔滨工业大学 | Method for low-temperature direct brazing of nonmetal and metal by using commercial inactive brazing filler metal |
| CN114951880A (en) * | 2022-06-13 | 2022-08-30 | 宁波江丰电子材料股份有限公司 | Method for welding three-layer structure ceramic target |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108465891A (en) * | 2018-03-22 | 2018-08-31 | 哈尔滨工业大学 | A kind of connection method of yttrium iron garnet ferrite ceramics and copper |
| CN108465891B (en) * | 2018-03-22 | 2020-08-25 | 哈尔滨工业大学 | Method for connecting yttrium iron garnet ferrite ceramic and copper |
| CN110776330A (en) * | 2018-12-31 | 2020-02-11 | 深圳硅基仿生科技有限公司 | Brazing method of ceramic and metal |
| CN109759662A (en) * | 2019-01-16 | 2019-05-17 | 哈尔滨工业大学 | A kind of method of ultrasonic wave added porous ceramics soldering |
| CN109759662B (en) * | 2019-01-16 | 2020-07-07 | 哈尔滨工业大学 | Ultrasonic-assisted porous ceramic brazing method |
| CN111604558A (en) * | 2019-02-25 | 2020-09-01 | 邢台职业技术学院 | Low-cost, self-activating method for welding ceramics and application thereof |
| CN111604558B (en) * | 2019-02-25 | 2022-07-12 | 邢台职业技术学院 | Low-cost, self-activating method for welding ceramics and application thereof |
| CN114799475A (en) * | 2022-04-14 | 2022-07-29 | 哈尔滨工业大学 | Method for low-temperature direct brazing of nonmetal and metal by using commercial inactive brazing filler metal |
| CN114951880A (en) * | 2022-06-13 | 2022-08-30 | 宁波江丰电子材料股份有限公司 | Method for welding three-layer structure ceramic target |
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Application publication date: 20170419 |