CN102513636A - Brazing method capable of reducing residual stress on ceramic and metal joints - Google Patents
Brazing method capable of reducing residual stress on ceramic and metal joints Download PDFInfo
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- CN102513636A CN102513636A CN201110439381XA CN201110439381A CN102513636A CN 102513636 A CN102513636 A CN 102513636A CN 201110439381X A CN201110439381X A CN 201110439381XA CN 201110439381 A CN201110439381 A CN 201110439381A CN 102513636 A CN102513636 A CN 102513636A
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- pottery
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Abstract
The invention provides a brazing method capable of reducing residual stress on ceramic and metal joints, relates to ceramic and metal brazing connection methods and solves the technical problems that low-temperature brazing connection for ceramic and metal is difficult, residual stress at the brazing joints is high, the brazing process can be completed in high-temperature vacuum or protective atmosphere only and the like. The brazing method includes: firstly, cleaning surfaces of to-be-brazed portions of ceramic and metal and placing solder foil between to-be-connected surfaces of ceramic and metal or at the edge of a lapping gap of ceramic and metal; secondly, brazing ultrasonically, preserving heat and cooling, applying longitudinal pressure onto the brazed joints, and cooling the brazed joints along with a furnace until the temperature thereof reaches the room temperature. The brazing process is completed on the condition of atmosphere, the brazing temperature is low, and the residual stress on the ceramic/metal brazed joints is low.
Description
Technical field
The present invention relates to pottery and solder bonding metal method of attachment.
Background technology
Pottery, it is strong to have non-oxidizability, anti-wear performance is good, hardness is high, thermal coefficient of expansion is little, anti-thermal shock and resistance to chemical attack and etc. good characteristic.Therefore, be with a wide range of applications in fields such as oil, chemical industry, machinery, space flight, nuclear energy, optics.In order to give full play to the performance of pottery, therefore need solder technology to realize that pottery is connected with the reliable of metal.
Soldering is the technology that realizes the ceramic a kind of very potentialization that is connected with metal.And in the soldering connection procedure main problem---wetting combination in interface and the joint residual stress that exists aspect two.For the wetting combination problem in interface; In the joint of pottery and metal; Pottery one side seems particularly outstanding, because pottery is huge with metal solder difference aspect physics and chemical property, the metal solder is to the wetting relatively difficulty of pottery; Normal at present employing active soldering technology-promptly in solder, add a certain proportion of active element realizes that with the chemical reaction between the ceramic material to be welded soldering is connected through active element.Ti commonly used is as active element; For fear of the loss of active element in atmosphere, active metallic soldering material is generally all accomplished in vacuum or inert atmosphere the wetting combination of pottery, and the temperature of active soldering is higher relatively; AgCuTi active solder commonly used; Brazing temperature is generally at 850～1050 ℃, and adopts some other active solder brazing temperatures even up to more than 1300 ℃, for example the Ni51Cr active solder.
For the joint residual stress problems, because the linear expansion coefficient (CTE) of pottery and metal solder has a long way to go, can produce very big residual stress in the soldered fitting, cause joint performance to descend, interface bond strength is effectively brought into play.Particularly large-sized member not only is not easy in vacuum chamber, accomplish soldering, and the hard crisp pottery of postwelding may occur and directly ftracture.The size of joint residual stress depends on that the thermal coefficient of expansion between pottery, metal, the solder is unworthy of the temperature difference of degree and solder complete solidification temperature to room temperature.The way of eliminating the ceramic and metal soldered joint residual stress has: one adopts the solder intermediate layer with moderate linear expansion coefficient; Two reduce the setting temperature of solder; Three adopt softer solder intermediate layer.To the ceramic/metal joint that is used under the lower temperature, reduce the setting temperature of solder, be an effective way that solves the hot residual stress problems of joint.It is higher relatively that routine is used for the solder setting temperature of ceramic/metal soldering, AgCuTi active solder for example, and its setting temperature is about 780 ℃, and other active solder setting temperature is higher.
To the cryogenic applications of ceramic/metal joint, consider from aspects such as production cost economic benefit, energy-saving and emission-reduction, need to consider to reduce the brazing temperature of ceramic/metal and the soldering environment that changes the large-size ceramic member, and reduce the residual stress of soldered fitting.Therefore, the soldered fitting that the low temperature brazing connection of completion ceramic/metal and acquisition have low residual stress under atmospheric conditions has great importance.
Summary of the invention
The present invention to solve existing pottery is connected with the metal low temperature brazing difficulty, soldered fitting residual stress big, can only under high-temperature vacuum or protective atmosphere, accomplish technical problem such as brazing process, a kind of method for welding that reduces ceramic and metal joint residual stress is proposed.The present invention is pottery and solder bonding metal method of attachment under atmospheric conditions, obtains low residual stress joint.Be applicable to the occasion that pottery and metal needs under normal temperature and the cryogenic conditions will be connected.
The method for welding that reduces pottery and metal joint residual stress is undertaken by following step: one, removing surface is carried out at the position to be welded of pottery and metal; Al-Sn-Si-Zn solder paillon foil is placed between to be connected of pottery and the metal or Al-Sn-Si-Zn solder piece is placed into the edge in pottery and metallic bone slit, obtain weld parts; Two, be that 20～100kHz, amplitude are that 1～10 μ m, brazing temperature are under 600～620 ℃ of conditions ultrasonic brazing 4～30s partly to be carried out in soldering in supersonic frequency; Insulation 0～30min; Then with stove cooling or air cooling to 300～500 ℃; Welding point is applied the longitudinal pressure of 0～100N, continue to cool to the furnace room temperature; Pottery and metal joint residual stress have promptly been realized reducing.
Adopt two kinds of welding manners, prefabricated solder intermediate layer and capillary joint filling ultrasonic brazing among the present invention.
Among the present invention the composition of solder be Al-(10～20wt.%) Sn-(6-10wt.%) Si-(4-10wt.%) Zn, the solidus temperature interval of solder sheet is 198～227 ℃, the liquidus temperature interval is 540～580 ℃, actual temp is determined by the solder composition.For example the solidus temperature of Al-15Sn-8Si-4Zn solder is low to moderate below 200 ℃, and is as shown in Figure 3.
Al-Sn-Si-Zn solder among the present invention, the effect of Al element are to realize solder wetting to SiC and TC4 alloy.The effect of Sn element is the setting temperature that reduces solder, and the effect of Si element is to reduce the fusing point of solder and suppress the reactant A l between the Al-SiC
4C
3Generation, the effect of Zn element is to strengthen Sn to combine with the interface of Al.
The purpose of pressurizeing among the present invention is to prevent that shrinkage cavity appears in solder inside in the process of setting.
The present invention adopts the auxiliary method of ultrasonic wave to realize that the soldering of ceramic/metal connects; Under atmospheric conditions, accomplish brazing process; Brazing temperature is low, between 580～620 ℃, accomplishes brazing process; Institute's ceramic and metal soldered joint joint residual stress level that obtains is low, and for example, the residual stress maximum that adopts the Al12Si solder to connect SiC and joint that TC4 obtains is 80～100MPa, and there is cracking phenomena at the interface in postwelding SiC pottery inner near.And when adopting Al-15Sn-8Si-4Zn as the intermediate layer under the condition, joint residual stress maximum is reduced to about 10MPa, and the SiC pottery does not ftracture.
Description of drawings
Fig. 1 adopts preseting solder intermediate layer method ceramic/metal low temperature low stress ultrasonic brazing Principle of Process figure; Fig. 2 adopts capillary joint filling method ceramic/metal low temperature low stress ultrasonic brazing Principle of Process figure; Fig. 3 is the differential thermal analysis result of Al-15Sn-8Si-4Zn solder; Fig. 4 is the joint welding microstructure one that adopts the Al-15Sn-8Si-4Zn solder to obtain as intermediate layer ultrasonic brazing SiC pottery/TC4 alloy; Fig. 5 is the joint welding microstructure two that adopts Al-Sn-Si-Zn solder intermediate layer ultrasonic brazing SiC/TC4 to obtain; 1 expression pottery among the figure, 2 expression ultrasonic tool heads, 3 expression metals, 4 expression heaters, 5 expression Al-Sn-Si-Zn solder paillon foils, 6 expression Al-Sn-Si-Zn solder pieces.
The specific embodiment
Technical scheme of the present invention is not limited to the following cited specific embodiment, also comprises the combination in any between each specific embodiment.
The specific embodiment one: the method for welding that reduces pottery and metal joint residual stress in the present embodiment is undertaken by following step: one, removing surface is carried out at the position to be welded of pottery and metal; Al-Sn-Si-Zn solder paillon foil placed between to be connected of pottery and the metal or Al-Sn-Si-Zn solder piece is placed into the edge in pottery and metallic bone slit, obtain weld parts; Two, be that 20～100kHz, amplitude are that 1～10 μ m, brazing temperature are under 600～620 ℃ of conditions ultrasonic brazing 4～30s partly to be carried out in soldering in supersonic frequency; Insulation 0～30min; Then with stove cooling or air cooling to 300～500 ℃; Welding point is applied the longitudinal pressure of 0～100N, continue to cool to the furnace room temperature; Pottery and metal joint residual stress have promptly been realized reducing.
Shearing strength of joint can reach 70～80MPa.
The specific embodiment two: what this embodiment and the specific embodiment one were different is: the said pottery of step 1 is SiC, Al
2O
3, Si
3N
4Or TiC.Other step is identical with the specific embodiment one with parameter.
The specific embodiment three: what this embodiment was different with the specific embodiment one or two is: the said metal of step 1 is TC4 or stainless steel.Other step is identical with the specific embodiment one or two with parameter.
The specific embodiment four: what this embodiment was different with one of specific embodiment one to three is: the composition of Al-Sn-Si-Zn solder paillon foil is made up of the Al of 10%～20% Sn, 6%～10% Si, 4%～10%Zn and surplus by weight percentage, and thickness is 100～500 μ m.Other step is identical with one of specific embodiment one to three with parameter.
The specific embodiment five: what this embodiment was different with one of specific embodiment one to four is: the said supersonic frequency of step 2 is 50～80kHz.Other step is identical with one of specific embodiment one to four with parameter.
The specific embodiment six: what this embodiment was different with one of specific embodiment one to five is: the said amplitude of step 2 is 2～8 μ m.Other step is identical with one of specific embodiment one to five with parameter.
The specific embodiment seven: what this embodiment was different with one of specific embodiment one to five is: the said amplitude of step 2 is 5 μ m.Other step is identical with one of specific embodiment one to five with parameter.
The specific embodiment eight: what this embodiment was different with one of specific embodiment one to seven is: the said brazing temperature of step 2 is 610 ℃.Other step is identical with one of specific embodiment one to seven with parameter.
The specific embodiment nine: what this embodiment was different with one of specific embodiment one to eight is: the said ultrasonic brazing of the step 2 time is 10～20s.Other step is identical with one of specific embodiment one to eight with parameter.
Adopt following verification experimental verification effect of the present invention:
Test one: combine Fig. 1 to describe; The low temperature brazing method that realizes ceramic/metal joint low stress under the atmospheric conditions realizes according to the following steps: removing surface is carried out at a pair of pottery (SiC pottery) and metal (TC4 alloy) position to be welded, Al-Sn-Si-Zn solder paillon foil is filled between pottery and metal to be connected; Two, be heated to solder and melt fully, applying frequency is that 20kHz, amplitude are the ultrasonic wave of 10 μ m, is incubated 20min subsequently, is cooled to 300 ℃ with stove, and surface to be welded is applied longitudinal pressure 100N, continues to cool to the furnace room temperature.
The seam organization that obtains is a stratiform in this embodiment.Adopt preseting solder intermediate layer ultrasonic brazing in the present embodiment.
It is as shown in Figure 4 to obtain joint heterogeneous microstructure pattern in this embodiment.
Test two: combine Fig. 2 to describe; The low temperature brazing method that realizes ceramic/metal joint low stress under the atmospheric conditions realizes according to the following steps: removing surface is carried out at a pair of pottery (SiC pottery) and metal (TC4 alloy) position to be welded, Al-Sn-Si-Zn solder piece is placed into the edge in pottery and metallic bone slit; Two, be heated to solder and melt fully, applying frequency is that 20kHz, amplitude are the ultrasonic wave of 20 μ m, is incubated 30min subsequently, air cooling to 450 ℃ applies longitudinal pressure 50N to surface to be welded, continues to cool to the furnace room temperature.
Institute's seam organization that obtains is for knitting shape in this embodiment.
Adopt capillary joint filling ultrasonic brazing in the present embodiment.
It is as shown in Figure 5 to obtain joint heterogeneous microstructure pattern in this embodiment.
Claims (9)
1. reduce the method for welding of pottery and metal joint residual stress; It is characterized in that the method for welding that reduces pottery and metal joint residual stress is undertaken by following step: one, removing surface is carried out at the position to be welded of pottery and metal; Al-Sn-Si-Zn solder paillon foil is placed between to be connected of pottery and the metal or Al-Sn-Si-Zn solder piece is placed into the edge in pottery and metallic bone slit, obtain weld parts; Two, be that 20～100kHz, amplitude are that 1～10 μ m, brazing temperature are under 600～620 ℃ of conditions ultrasonic brazing 4～30s partly to be carried out in soldering in supersonic frequency; Insulation 0～30min; Then with stove cooling or air cooling to 300～500 ℃; Welding point is applied the longitudinal pressure of 0～100N, continue to cool to the furnace room temperature; Pottery and metal joint residual stress have promptly been realized reducing.
2. according to the said method for welding that reduces pottery and metal joint residual stress of claim 1, it is characterized in that the said pottery of step 1 is SiC, Al
2O
3, Si
3N
4Or TiC.
3. according to the said method for welding that reduces pottery and metal joint residual stress of claim 2, it is characterized in that the said metal of step 1 is TC4 or stainless steel.
4. according to the said method for welding that reduces pottery and metal joint residual stress of claim 3; The composition that it is characterized in that Al-Sn-Si-Zn solder paillon foil is made up of the Al of 10%～20% Sn, 6%～10% Si, 4%～10%Zn and surplus by weight percentage, and thickness is 100～500 μ m.
5. according to the said method for welding that reduces pottery and metal joint residual stress of claim 4, it is characterized in that the said supersonic frequency of step 2 is 50～80kHz.
6. according to the said method for welding that reduces pottery and metal joint residual stress of claim 5, it is characterized in that the said amplitude of step 2 is 2～8 μ m.
7. according to the said method for welding that reduces pottery and metal joint residual stress of claim 5, it is characterized in that the said amplitude of step 2 is 5 μ m.
8. according to the said method for welding that reduces pottery and metal joint residual stress of each claim of claim 1-7, it is characterized in that the said brazing temperature of step 2 is 610 ℃.
9. the said according to Claim 8 method for welding that reduces pottery and metal joint residual stress is characterized in that the said ultrasonic brazing time of step 2 is 10～20s.
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| CN103170723A (en) * | 2013-03-06 | 2013-06-26 | 哈尔滨工业大学深圳研究生院 | Connection method of rapid in-situ forming same quantity and phase aluminum oxide ceramics in atmospheric environment |
| CN104772542A (en) * | 2015-04-14 | 2015-07-15 | 西南交通大学 | WC particle in-situ reinforced hard alloy and steel ultrasonic soldering method |
| CN105612019A (en) * | 2013-10-08 | 2016-05-25 | 基斯特勒控股公司 | Method for producing a metal-ceramic soldered connection |
| CN105921839A (en) * | 2016-06-06 | 2016-09-07 | 哈尔滨工业大学（威海） | Kovar alloy and ceramic material ultrasonic brazing method |
| CN106563861A (en) * | 2016-10-19 | 2017-04-19 | 哈尔滨工业大学（威海） | Ultrasonic soldering method for fast forming ceramic-metal interconnection |
| CN109071364A (en) * | 2016-06-13 | 2018-12-21 | 株式会社Ihi | Ceramic matrix composite component and preparation method thereof |
| CN110060943A (en) * | 2018-01-19 | 2019-07-26 | 应用材料公司 | Soldered fitting and semiconductor processing chamber component with soldered fitting |
| CN110560955A (en) * | 2019-10-25 | 2019-12-13 | 宝鸡文理学院 | method for welding aluminum oxide ceramic and metal molybdenum |
| CN114043026A (en) * | 2021-11-12 | 2022-02-15 | 哈尔滨工业大学 | Stress relieving method in ceramic-metal |
| CN114799475A (en) * | 2022-04-14 | 2022-07-29 | 哈尔滨工业大学 | Method for low-temperature direct brazing of nonmetal and metal by using commercial inactive brazing filler metal |
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| CN103170723B (en) * | 2013-03-06 | 2016-01-13 | 哈尔滨工业大学深圳研究生院 | Under a kind of atmospheric environment, quick in situ generates the method for attachment of homogeneity phase alumina pottery |
| CN103170723A (en) * | 2013-03-06 | 2013-06-26 | 哈尔滨工业大学深圳研究生院 | Connection method of rapid in-situ forming same quantity and phase aluminum oxide ceramics in atmospheric environment |
| CN105612019B (en) * | 2013-10-08 | 2019-11-15 | 基斯特勒控股公司 | The method being welded to connect for realizing metal-ceramic |
| CN105612019A (en) * | 2013-10-08 | 2016-05-25 | 基斯特勒控股公司 | Method for producing a metal-ceramic soldered connection |
| CN104772542A (en) * | 2015-04-14 | 2015-07-15 | 西南交通大学 | WC particle in-situ reinforced hard alloy and steel ultrasonic soldering method |
| CN104772542B (en) * | 2015-04-14 | 2017-07-11 | 西南交通大学 | The hard alloy of WC particle In-sltu reinforcement and the ultrasonic brazing method of steel |
| CN105921839A (en) * | 2016-06-06 | 2016-09-07 | 哈尔滨工业大学（威海） | Kovar alloy and ceramic material ultrasonic brazing method |
| CN109071364A (en) * | 2016-06-13 | 2018-12-21 | 株式会社Ihi | Ceramic matrix composite component and preparation method thereof |
| CN106563861A (en) * | 2016-10-19 | 2017-04-19 | 哈尔滨工业大学（威海） | Ultrasonic soldering method for fast forming ceramic-metal interconnection |
| CN110060943A (en) * | 2018-01-19 | 2019-07-26 | 应用材料公司 | Soldered fitting and semiconductor processing chamber component with soldered fitting |
| CN110060943B (en) * | 2018-01-19 | 2023-09-08 | 应用材料公司 | Braze joint and semiconductor processing chamber component with braze joint |
| CN110560955A (en) * | 2019-10-25 | 2019-12-13 | 宝鸡文理学院 | method for welding aluminum oxide ceramic and metal molybdenum |
| CN110560955B (en) * | 2019-10-25 | 2021-04-02 | 宝鸡文理学院 | Method for welding aluminum oxide ceramic and metal molybdenum |
| CN114043026A (en) * | 2021-11-12 | 2022-02-15 | 哈尔滨工业大学 | Stress relieving method in ceramic-metal |
| CN114043026B (en) * | 2021-11-12 | 2023-08-29 | 哈尔滨工业大学 | Stress relieving method in ceramic-metal |
| CN114799475A (en) * | 2022-04-14 | 2022-07-29 | 哈尔滨工业大学 | Method for low-temperature direct brazing of nonmetal and metal by using commercial inactive brazing filler metal |
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