CN102260088A - Low-stress low-temperature ceramic brazing method - Google Patents
Low-stress low-temperature ceramic brazing method Download PDFInfo
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- CN102260088A CN102260088A CN201110176784XA CN201110176784A CN102260088A CN 102260088 A CN102260088 A CN 102260088A CN 201110176784X A CN201110176784X A CN 201110176784XA CN 201110176784 A CN201110176784 A CN 201110176784A CN 102260088 A CN102260088 A CN 102260088A
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Abstract
The invention discloses a low-stress low-temperature ceramic brazing method, and relates to a ceramic brazing method. The invention aims to solve the problems that low-temperature ceramic brazing connection is difficult, a brazed joint has large residual stress, and the brazing process can be only completed in high temperature vacuum or protective atmosphere in the conventional ceramic brazing technology. The method comprises the following steps of: sandwiching an aluminum-based composite material foil between two solder foils to form a sandwich-structure filling material; and 2, filling the filling material between two surfaces of a ceramic to be welded, heating until the solder foils are completely melted, performing ultrasonic treatment, applying pressure vertical to the surfaces to be welded, keeping the temperature, and cooling to room temperature with a furnace. By an ultrasonic assistance method, the ceramic brazing connection is realized, and the brazing process can be completed under the atmosphere condition; the brazing temperature is low, a brazed joint of the ceramic is high in strength and low in residual stress; and the method is applied to the field of ceramic brazing.
Description
Technical field
The present invention relates to a kind of ceramic method for welding.
Background technology
Pottery, it is strong to have oxidation-resistance, wear resisting property is good, the hardness height, Heat stability is good, hot strength is big, thermal expansivity is little, anti-thermal shock and resistance to chemical attack and etc. good characteristic.Therefore, be with a wide range of applications in fields such as oil, chemical industry, machinery, space flight, nuclear energy, optics.Because poor processability, ductility and the impact toughness of stupalith are low, therefore the member difficulty that manufacturing dimension is big and complex-shaped needs welding technique to realize reliable connection between the pottery.
Soldering is the technology that realizes a kind of very potentialization of pottery connection.And in the soldering connection procedure of pottery main problem---wetting combination in interface and the joint unrelieved stress that exists aspect two.Pottery is huge with metal solder difference aspect physics and chemical property, the metal solder is to the wetting relatively difficulty of pottery, normal at present employing active soldering technology-promptly add a certain proportion of active element in solder realizes that with the chemical reaction between the stupalith to be welded soldering is connected by active element.And for pottery, Ti commonly used is as active element, for fear of the loss of active element in atmosphere, active metallic soldering material is generally all finished in vacuum or inert atmosphere the wetting combination of pottery, and the temperature of active soldering is higher relatively, AgCuTi active solder commonly used, and brazing temperature is generally at 850～1050 ℃, and adopt some other active solder brazing temperatures even up to more than 1300 ℃, Ni51Cr active solder for example.The pottery low temperature brazing connects difficulty, uses at the non high temperature of pottery, reduces brazing temperature and seems particularly important.In addition, existing ceramic soldering tech also exist the brazed joint unrelieved stress big, can only under high-temperature vacuum or protective atmosphere, finish defective such as brazing process.
Summary of the invention
The present invention will solve existing ceramic soldering tech to exist ceramic low temperature brazing to connect difficulty, and the brazed joint unrelieved stress is big, can only finish the problem of brazing process under high-temperature vacuum or protective atmosphere, and low-stress low-temp ceramics method for welding is provided.
Low-stress low-temp ceramics method for welding of the present invention carries out: one, with folder a slice aluminum matrix composite paillon foil in two solder paillon foils, form the packing material of solder/aluminum matrix composite/solder " sandwich " structure according to the following steps; Two, sanding and polishing is carried out at pottery position to be welded, place acetone ultrasonic cleaning 15min then, the packing material that step 1 is made is filled between two surfaces to be welded of pottery, being heated to the solder paillon foil melts fully, in frequency is that 20～100kHz, amplitude are ultrasonication 1～10s under the condition of 1～10 μ m, and butt welded seam applies the pressure 10～50N perpendicular to surface to be welded then, insulation 0～30min, cool to room temperature afterwards with the furnace, promptly finish the soldering of low-stress low-temp ceramics; Wherein the thickness of the described aluminum matrix composite paillon foil of step 1 is 50～500 μ m, and the thickness of solder paillon foil is 50～300 μ m; The described solder paillon foil of step 1 is ZnAl paillon foil or AlSiCuZn paillon foil; The volume percent content that strengthens body in the described aluminum matrix composite of step 1 is 50%～70%.
Advantage of the present invention is as follows:
1, the present invention adopts the auxiliary method of ultrasonic wave to realize that ceramic soldering connects, and can finish brazing process under atmospheric condition;
2, brazing temperature of the present invention is low, can finish brazing process at 410～620 ℃;
3, obtain the strength of ceramic soldered joint height, for example, the shearing resistance of SiC ceramic soldered joint can reach 130～150MPa;
4, the brazed joint unrelieved stress of the present invention's acquisition is low, as for the SiC pottery, when face of weld is of a size of 10mm * 20mm, adopting the unrelieved stress maximum value of traditional Z n5Al joint that solder obtains is 50～60MPa, and with adopting method of the present invention under the condition, during as the middle layer, joint unrelieved stress maximum value only is 15～20MPa with Zn5Al/ (55%SiCp/A356)/Zn5Al.
Description of drawings
Fig. 1 is the synoptic diagram of embodiment one described low-stress low-temp ceramics method for welding; Fig. 2 is the enlarged diagram at I place among Fig. 1; Fig. 3 is the joint welding micro-structure diagram that embodiment 25 obtains.
Embodiment
Technical solution of the present invention is not limited to following cited embodiment, also comprises the arbitrary combination between each embodiment.
Embodiment one: present embodiment low-stress low-temp ceramics method for welding, carry out according to the following steps:, form the packing material of solder/aluminum matrix composite/solder " sandwich " structure one, with folder a slice aluminum matrix composite paillon foil in two solder paillon foils; Two, sanding and polishing is carried out at pottery position to be welded, place acetone ultrasonic cleaning 15min then, the packing material that step 1 is made is filled between two surfaces to be welded of pottery, being heated to the solder paillon foil melts fully, in frequency is that 20～100kHz, amplitude are ultrasonication 1～10s under the condition of 1～10 μ m, and butt welded seam applies the pressure 10～50N perpendicular to surface to be welded then, insulation 0～30min, cool to room temperature afterwards with the furnace, promptly finish the soldering of low-stress low-temp ceramics; Wherein the thickness of the described aluminum matrix composite paillon foil of step 1 is 50～500 μ m, and the thickness of solder paillon foil is 50～300 μ m; The described solder paillon foil of step 1 is ZnAl paillon foil or AlSiCuZn paillon foil; The volume percent content that strengthens body in the described aluminum matrix composite of step 1 is 50%～70%.
The described solder paillon foil of present embodiment step 1 is bought from Zhejiang Yatong Welding Co., Ltd.
The fusing point of aluminum matrix composite will be higher than the fusing point of solder in the present embodiment, utilizes action of ultrasonic waves to realize the wetting combination of solder to high-volume fractional aluminum matrix composite and pottery.
The purpose that applies in the present embodiment perpendicular to the pressure of surface to be welded is to extrude the excess liquid solder, makes the volume fraction that strengthens body in the joint reach the highest.
The synoptic diagram of present embodiment low-stress low-temp ceramics method for welding as shown in Figure 1,1 is ultrasonic tool head among the figure, 2 are the direction of exerting pressure, 3 be packing layer, 4 is ceramic, 5 is thermal source.Fig. 2 is the enlarged diagram at I place among Fig. 1, and 6 is solder among Fig. 2, and 7 is aluminum matrix composite, and 8 is pottery.
Embodiment two: what present embodiment and embodiment one were different is: the preparation method of the described aluminum matrix composite paillon foil of step 1 is: adopt Wire EDM that aluminum matrix composite is cut into the paillon foil that thickness is 100～600 μ m, adopting 180 orders, 360 orders and 500 purpose sand paper that the paillon foil both side surface is mechanical grinding to thickness successively is 50～500 μ m.Other is identical with embodiment one.
Embodiment three: what present embodiment was different with embodiment one or two is: the thickness of the described aluminum matrix composite paillon foil of step 1 is 50 μ m.Other is identical with embodiment one or two.
Embodiment four: what present embodiment was different with embodiment one or two is: the thickness of the described aluminum matrix composite paillon foil of step 1 is 100～400 μ m.Other is identical with embodiment one or two.
Embodiment five: what present embodiment was different with embodiment one or two is: the thickness of the described aluminum matrix composite paillon foil of step 1 is 200 μ m.Other is identical with embodiment one or two.
Embodiment six: what present embodiment was different with one of embodiment one to five is: the thickness of the described solder paillon foil of step 1 is 50 μ m.Other is identical with one of embodiment one to five.
Embodiment seven: what present embodiment was different with one of embodiment one to five is: the thickness of the described solder paillon foil of step 1 is 300 μ m.Other is identical with one of embodiment one to five.
Embodiment eight: what present embodiment was different with one of embodiment one to five is: the thickness of the described solder paillon foil of step 1 is 100～250 μ m.Other is identical with one of embodiment one to five.
Embodiment nine: what present embodiment was different with one of embodiment one to five is: the thickness of the described solder paillon foil of step 1 is 200 μ m.Other is identical with one of embodiment one to five.
Embodiment ten: what present embodiment was different with one of embodiment one to nine is: the volume percent content that strengthens body in the described aluminum matrix composite of step 1 is 50%.Other is identical with one of embodiment one to nine.
Embodiment 11: what present embodiment was different with one of embodiment one to nine is: the volume percent content that strengthens body in the described aluminum matrix composite of step 1 is 70%.Other is identical with one of embodiment one to nine.
Embodiment 12: what present embodiment was different with one of embodiment one to nine is: the volume percent content that strengthens body in the described aluminum matrix composite of step 1 is 60%.Other is identical with one of embodiment one to nine.
Embodiment 13: what present embodiment was different with one of embodiment one to 12 is: the step 2 medium frequency is 40～80kHz.Other is identical with one of embodiment one to 12.
Embodiment 14: what present embodiment was different with one of embodiment one to 12 is: the step 2 medium frequency is 60kHz.Other is identical with one of embodiment one to 12.
Embodiment 15: what present embodiment was different with one of embodiment one to 14 is: amplitude is 3～8 μ m in the step 2.Other is identical with one of embodiment one to 14.
Embodiment 16: what present embodiment was different with one of embodiment one to 14 is: amplitude is 5 μ m in the step 2.Other is identical with one of embodiment one to 14.
Embodiment 17: what present embodiment was different with one of embodiment one to 16 is: ultrasonication 3～7s in the step 2.Other is identical with one of embodiment one to 16.
Embodiment 18: what present embodiment was different with one of embodiment one to 16 is: ultrasonication 5s in the step 2.Other is identical with one of embodiment one to 16.
Embodiment 19: what present embodiment was different with one of embodiment one to 18 is: butt welded seam applies the pressure 10N perpendicular to surface to be welded in the step 2.Other is identical with one of embodiment one to 18.
Embodiment 20: what present embodiment was different with one of embodiment one to 18 is: butt welded seam applies the pressure 50N perpendicular to surface to be welded in the step 2.Other is identical with one of embodiment one to 18.
Embodiment 21: what present embodiment was different with one of embodiment one to 18 is: butt welded seam applies the pressure 30N perpendicular to surface to be welded in the step 2.Other is identical with one of embodiment one to 18.
Embodiment 22: what present embodiment was different with one of embodiment one to 21 is: be incubated 0min in the step 2.Other is identical with one of embodiment one to 21.
Embodiment 23: what present embodiment was different with one of embodiment one to 21 is: be incubated 30min in the step 2.Other is identical with one of embodiment one to 21.
Embodiment 24: what present embodiment was different with one of embodiment one to 21 is: be incubated 15min in the step 2.Other is identical with one of embodiment one to 21.
Embodiment 25: present embodiment low-stress low-temp ceramics method for welding, carry out according to the following steps:, form the packing material of ZnAl solder/aluminum matrix composite/ZnAl solder " sandwich " structure one, with folder a slice aluminum matrix composite paillon foil in two ZnAl paillon foils; Two, sanding and polishing is carried out at pottery position to be welded, place acetone ultrasonic cleaning 15min then, the packing material that step 1 is made is filled between two surfaces to be welded of pottery, being heated to 420 ℃, melting fully to the ZnAl paillon foil, is that 20KHz, amplitude are ultrasonication 2s under the condition of 5 μ m in frequency, butt welded seam applies the pressure 30N perpendicular to surface to be welded then, insulation 0min cools to room temperature afterwards with the furnace, promptly finishes the soldering of low-stress low-temp ceramics; Wherein the thickness of the described aluminum matrix composite paillon foil of step 1 is 400 μ m, and the thickness of ZnAl paillon foil is 100 μ m; The volume percent content that strengthens body in the described aluminum matrix composite of step 1 is 55%.
Pottery is SiC in the present embodiment, and the composition of ZnAl paillon foil is Zn-5Al (wt.%).
Strengthening body in the present embodiment aluminum matrix composite is the SiC particle, strengthens body and is of a size of 5～100 μ m.
The joint welding micro-structure diagram that present embodiment obtains as shown in Figure 3, the wild phase of the contained low linear expansion coefficient of ceramic soldered joint is very high, fully reduced middle weighting material in the joint and thermal expansion between the pottery degree that do not match, thereby weakened the residual thermal stress of joint, improved the intensity of joint.Strength of joint can reach 130～138MPa, and joint unrelieved stress maximum value is that (the present embodiment face of weld is of a size of 10mm * 20mm) to 15MPa, compares with adopting simple ZnAl paillon foil, has reduced by 60%～75% with condition lower sub unrelieved stress maximum value.
Embodiment 26: present embodiment low-stress low-temp ceramics method for welding, carry out according to the following steps:, form the packing material of AlSiCuZn solder/aluminum matrix composite/AlSiCuZn solder " sandwich " structure one, with folder a slice aluminum matrix composite paillon foil in two AlSiCuZn paillon foils; Two, sanding and polishing is carried out at pottery position to be welded, place acetone ultrasonic cleaning 15min then, the packing material that step 1 is made is filled between two surfaces to be welded of pottery, being heated to 570 ℃, melting fully to the AlSiCuZn paillon foil, is that 20KHz, amplitude are ultrasonication 4s under the condition of 5 μ m in frequency, butt welded seam applies the pressure 20N perpendicular to surface to be welded then, insulation 15min cools to room temperature afterwards with the furnace, promptly finishes the soldering of low-stress low-temp ceramics; Wherein the thickness of the described aluminum matrix composite paillon foil of step 1 is 250 μ m, and the thickness of AlSiCuZn paillon foil is 200 μ m; The volume percent content that strengthens body in the described aluminum matrix composite of step 1 is 55%.
Pottery is SiC in the present embodiment, and the composition of AlSiCuZn paillon foil is Al-9.6Si-10Cu-10Zn (wt.%).
Strengthening body in the present embodiment aluminum matrix composite is the SiC particle, strengthens body and is of a size of 5～100 μ m.
The strength of joint that obtains can reach 143～152MPa in the present embodiment, joint unrelieved stress maximum value is that (the present embodiment face of weld is of a size of 10mm * 20mm) to 18MPa, compare with adopting simple AlSiCuZn paillon foil, reduced by 65%～75% with condition lower sub unrelieved stress maximum value.
Claims (10)
1. low-stress low-temp ceramics method for welding, it is characterized in that low-stress low-temp ceramics method for welding, carry out according to the following steps:, form the packing material of solder/aluminum matrix composite/solder " sandwich " structure one, with folder a slice aluminum matrix composite paillon foil in two solder paillon foils; Two, sanding and polishing is carried out at pottery position to be welded, place acetone ultrasonic cleaning 15min then, the packing material that step 1 is made is filled between two surfaces to be welded of pottery, being heated to the solder paillon foil melts fully, in frequency is that 20～100kHz, amplitude are ultrasonication 1～10s under the condition of 1～10 μ m, and butt welded seam applies the pressure 10～50N perpendicular to surface to be welded then, insulation 0～30min, cool to room temperature afterwards with the furnace, promptly finish the soldering of low-stress low-temp ceramics; Wherein the thickness of the described aluminum matrix composite paillon foil of step 1 is 50～500 μ m, and the thickness of solder paillon foil is 50～300 μ m; The described solder paillon foil of step 1 is ZnAl paillon foil or AlSiCuZn paillon foil; The volume percent content that strengthens body in the described aluminum matrix composite of step 1 is 50%～70%.
2. low-stress low-temp ceramics method for welding according to claim 1, the preparation method who it is characterized in that the described aluminum matrix composite paillon foil of step 1 is: adopt Wire EDM that aluminum matrix composite is cut into the paillon foil that thickness is 100～600 μ m, adopting 180 orders, 360 orders and 500 purpose sand paper that the paillon foil both side surface is mechanical grinding to thickness successively is 50～500 μ m.
3. low-stress low-temp ceramics method for welding according to claim 1 and 2, the thickness that it is characterized in that the described aluminum matrix composite paillon foil of step 1 are 100～400 μ m.
4. low-stress low-temp ceramics method for welding according to claim 3, the thickness that it is characterized in that the described solder paillon foil of step 1 are 100～250 μ m.
5. low-stress low-temp ceramics method for welding according to claim 4 is characterized in that the volume percent content of enhancing body in the described aluminum matrix composite of step 1 is 60%.
6. low-stress low-temp ceramics method for welding according to claim 5 is characterized in that the step 2 medium frequency is 40～80kHz.
7. low-stress low-temp ceramics method for welding according to claim 6 is characterized in that amplitude is 5 μ m in the step 2.
8. low-stress low-temp ceramics method for welding according to claim 7 is characterized in that ultrasonication 3～7s in the step 2.
9. low-stress low-temp ceramics method for welding according to claim 8 is characterized in that butt welded seam in the step 2 applies the pressure 30N perpendicular to surface to be welded.
10. low-stress low-temp ceramics method for welding according to claim 9 is characterized in that being incubated in the step 2 15min.
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Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102513636A (en) * | 2011-12-23 | 2012-06-27 | 哈尔滨工业大学 | Brazing method capable of reducing residual stress on ceramic and metal joints |
| CN103342584A (en) * | 2013-07-03 | 2013-10-09 | 哈尔滨工业大学 | Ultrasonic-assisted local metallizing method on surface of ceramic |
| CN104889594A (en) * | 2015-06-08 | 2015-09-09 | 哈尔滨工业大学 | Low-temperature ultrasonic SnBi-based brazing filter metal, production method thereof and method for ultrasonically brazing ceramics and/or ceramic-based composite |
| CN105174990A (en) * | 2015-10-20 | 2015-12-23 | 哈尔滨工业大学 | High-temperature-application-based composite active middle layer diffusion bonding method for implementing interstitial carbide or nitride ceramic seamless connection |
| CN105237026A (en) * | 2015-11-12 | 2016-01-13 | 天津理工大学 | Ceramic/ceramic connection method for regulating and controlling middle solder layer through multi-physical-field coupling |
| CN105541366A (en) * | 2016-02-19 | 2016-05-04 | 武汉理工大学 | Low-temperature brazing method for ceramics |
| CN105618885A (en) * | 2016-03-25 | 2016-06-01 | 天津理工大学 | Method for forming reinforced-phase-strengthened composite welding seam structural material by regulating |
| CN106041768A (en) * | 2016-05-27 | 2016-10-26 | 华侨大学 | Method for preparing superhard abrasive particle tool through ultrasonic-assisted active connection |
| CN106944698A (en) * | 2017-05-12 | 2017-07-14 | 哈尔滨工业大学 | The SiC ceramic and the direct method for welding of SiC ceramic reinforced aluminum matrix composites ultrasonic cryogenic being modified based on thermal oxide surface |
| CN111659967A (en) * | 2020-06-12 | 2020-09-15 | 中南大学 | Composite lock welding connecting device and method with ultrasonic brazing effect |
| CN112570832A (en) * | 2020-11-12 | 2021-03-30 | 岭东核电有限公司 | Silicon carbide cladding and brazing connection method thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101088691A (en) * | 2007-07-20 | 2007-12-19 | 哈尔滨工业大学 | Process of obtaining composite brazed seam with ultrasonic brazed aluminium-base composite material |
| CN101734941A (en) * | 2008-11-20 | 2010-06-16 | 北京有色金属研究总院 | Vacuum active brazing process for C/C or C/SiC composite material and metal |
-
2011
- 2011-06-28 CN CN201110176784XA patent/CN102260088A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101088691A (en) * | 2007-07-20 | 2007-12-19 | 哈尔滨工业大学 | Process of obtaining composite brazed seam with ultrasonic brazed aluminium-base composite material |
| CN101734941A (en) * | 2008-11-20 | 2010-06-16 | 北京有色金属研究总院 | Vacuum active brazing process for C/C or C/SiC composite material and metal |
Non-Patent Citations (1)
| Title |
|---|
| 张洋 等: "SiCp/A356复合材料超声波辅助钎焊", 《焊接学报》, vol. 30, no. 3, 31 March 2009 (2009-03-31), pages 82 - 94 * |
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| CN102513636B (en) * | 2011-12-23 | 2013-07-31 | 哈尔滨工业大学 | Brazing method capable of reducing residual stress on ceramic and metal joints |
| CN102513636A (en) * | 2011-12-23 | 2012-06-27 | 哈尔滨工业大学 | Brazing method capable of reducing residual stress on ceramic and metal joints |
| CN103342584A (en) * | 2013-07-03 | 2013-10-09 | 哈尔滨工业大学 | Ultrasonic-assisted local metallizing method on surface of ceramic |
| CN103342584B (en) * | 2013-07-03 | 2014-09-03 | 哈尔滨工业大学 | Ultrasonic-assisted local metallizing method on surface of ceramic |
| CN104889594A (en) * | 2015-06-08 | 2015-09-09 | 哈尔滨工业大学 | Low-temperature ultrasonic SnBi-based brazing filter metal, production method thereof and method for ultrasonically brazing ceramics and/or ceramic-based composite |
| CN105174990B (en) * | 2015-10-20 | 2018-03-30 | 哈尔滨工业大学 | A kind of composite reactive intermediate layer diffusion connection method realized gap carbide or nitride ceramics and be seamlessly connected based on high temperature application |
| CN105174990A (en) * | 2015-10-20 | 2015-12-23 | 哈尔滨工业大学 | High-temperature-application-based composite active middle layer diffusion bonding method for implementing interstitial carbide or nitride ceramic seamless connection |
| CN105237026A (en) * | 2015-11-12 | 2016-01-13 | 天津理工大学 | Ceramic/ceramic connection method for regulating and controlling middle solder layer through multi-physical-field coupling |
| CN105541366A (en) * | 2016-02-19 | 2016-05-04 | 武汉理工大学 | Low-temperature brazing method for ceramics |
| CN105618885A (en) * | 2016-03-25 | 2016-06-01 | 天津理工大学 | Method for forming reinforced-phase-strengthened composite welding seam structural material by regulating |
| CN105618885B (en) * | 2016-03-25 | 2019-01-18 | 浙江邦驰汽车零部件有限公司 | A method of reinforced phase is formed by regulation and strengthens composite weld structural material |
| CN106041768A (en) * | 2016-05-27 | 2016-10-26 | 华侨大学 | Method for preparing superhard abrasive particle tool through ultrasonic-assisted active connection |
| CN106041768B (en) * | 2016-05-27 | 2018-05-25 | 华侨大学 | A kind of method that ultrasonic wave auxiliary activity connection prepares super-hard abrasive particle tool |
| CN106944698A (en) * | 2017-05-12 | 2017-07-14 | 哈尔滨工业大学 | The SiC ceramic and the direct method for welding of SiC ceramic reinforced aluminum matrix composites ultrasonic cryogenic being modified based on thermal oxide surface |
| CN106944698B (en) * | 2017-05-12 | 2019-12-10 | 哈尔滨工业大学 | SiC ceramic or SiC ceramic reinforced aluminum matrix composite material ultrasonic low-temperature direct brazing method based on thermal oxidation surface modification |
| CN111659967A (en) * | 2020-06-12 | 2020-09-15 | 中南大学 | Composite lock welding connecting device and method with ultrasonic brazing effect |
| CN112570832A (en) * | 2020-11-12 | 2021-03-30 | 岭东核电有限公司 | Silicon carbide cladding and brazing connection method thereof |
| CN112570832B (en) * | 2020-11-12 | 2021-12-14 | 岭东核电有限公司 | Silicon carbide cladding and brazing connection method thereof |
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Application publication date: 20111130 |