CN102513636B - Brazing method capable of reducing residual stress on ceramic and metal joints - Google Patents
Brazing method capable of reducing residual stress on ceramic and metal joints Download PDFInfo
- Publication number
- CN102513636B CN102513636B CN 201110439381 CN201110439381A CN102513636B CN 102513636 B CN102513636 B CN 102513636B CN 201110439381 CN201110439381 CN 201110439381 CN 201110439381 A CN201110439381 A CN 201110439381A CN 102513636 B CN102513636 B CN 102513636B
- Authority
- CN
- China
- Prior art keywords
- pottery
- residual stress
- metal
- brazing
- welding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Abstract
The invention provides a brazing method capable of reducing residual stress on ceramic and metal joints, relates to ceramic and metal brazing connection methods and solves the technical problems that low-temperature brazing connection for ceramic and metal is difficult, residual stress at the brazing joints is high, the brazing process can be completed in high-temperature vacuum or protective atmosphere only and the like. The brazing method includes: firstly, cleaning surfaces of to-be-brazed portions of ceramic and metal and placing solder foil between to-be-connected surfaces of ceramic and metal or at the edge of a lapping gap of ceramic and metal; secondly, brazing ultrasonically, preserving heat and cooling, applying longitudinal pressure onto the brazed joints, and cooling the brazed joints along with a furnace until the temperature thereof reaches the room temperature. The brazing process is completed on the condition of atmosphere, the brazing temperature is low, and the residual stress on the ceramic/metal brazed joints is low.
Description
Technical field
The present invention relates to pottery and solder bonding metal method of attachment.
Background technology
Pottery, it is strong to have non-oxidizability, anti-wear performance is good, the hardness height, thermal coefficient of expansion is little, anti-thermal shock and resistance to chemical attack and etc. good characteristic.Therefore, be with a wide range of applications in fields such as oil, chemical industry, machinery, space flight, nuclear energy, optics.In order to give full play to the performance of pottery, therefore need solder technology to realize that pottery is connected with the reliable of metal.
Soldering is the technology that realizes the ceramic a kind of very potentialization that is connected with metal.And in the soldering connection procedure main problem---wetting combination in interface and the joint residual stress that exists aspect two.Wetting for the interface in conjunction with problem, in the joint of pottery and metal, pottery one side seems particularly outstanding, because pottery is huge with metal solder difference aspect physics and chemical property, the metal solder is to the wetting relatively difficulty of pottery, normal at present employing active soldering technology-promptly add a certain proportion of active element in solder realizes that with the chemical reaction between the ceramic material to be welded soldering is connected by active element.Ti commonly used is as active element, for fear of the loss of active element in atmosphere, active metallic soldering material is generally all finished in vacuum or inert atmosphere the wetting combination of pottery, and the temperature of active soldering is higher relatively, AgCuTi active solder commonly used, brazing temperature is generally at 850～1050 ℃, and adopts some other active solder brazing temperatures even up to more than 1300 ℃, for example the Ni51Cr active solder.
For the joint residual stress problems, because the linear expansion coefficient (CTE) of pottery and metal solder has a long way to go, can produce very big residual stress in the soldered fitting, cause joint performance to descend, interface bond strength is effectively brought into play.Particularly large-sized member not only is not easy to finish soldering in vacuum chamber, and the hard crisp pottery of postwelding may occur and directly ftracture.The size of joint residual stress depends on that the thermal coefficient of expansion between pottery, metal, the solder is unworthy of degree and the solder complete solidification temperature temperature difference to room temperature.The way of eliminating the ceramic and metal soldered joint residual stress has: one adopts the solder intermediate layer with moderate linear expansion coefficient; Two reduce the setting temperature of solder; Three adopt softer solder intermediate layer.At the ceramic/metal joint that is used under the lower temperature, reduce the setting temperature of solder, be an effective way that solves the hot residual stress problems of joint.It is higher relatively that routine is used for the solder setting temperature of ceramic/metal soldering, AgCuTi active solder for example, and its setting temperature is about 780 ℃, and other active solder setting temperature is higher.
At the cryogenic applications of ceramic/metal joint, consider from aspects such as production cost economic benefit, energy-saving and emission-reduction, need to consider to reduce the brazing temperature of ceramic/metal and the soldering environment that changes the large-size ceramic member, and reduce the residual stress of soldered fitting.Therefore, the low temperature brazing of finishing ceramic/metal under atmospheric conditions connects and the soldered fitting that obtains to have low residual stress has great importance.
Summary of the invention
The present invention to solve existing pottery is connected with the metal low temperature brazing difficulty, soldered fitting residual stress big, can only under high-temperature vacuum or protective atmosphere, finish technical problem such as brazing process, a kind of method for welding that reduces ceramic and metal joint residual stress is proposed.The present invention is pottery and solder bonding metal method of attachment under atmospheric conditions, obtains low residual stress joint.Be applicable to the occasion that pottery and metal needs under normal temperature and the cryogenic conditions will be connected.
The method for welding that reduces pottery and metal joint residual stress is undertaken by following step: one, removing surface is carried out at the position to be welded of pottery and metal, Al-Sn-Si-Zn solder paillon foil placed between to be connected of pottery and the metal or Al-Sn-Si-Zn solder piece is placed into the edge in pottery and metallic bone slit, obtain treating weldment; Two, be that 20～100kHz, amplitude are that 1～10 μ m, brazing temperature are under 600～620 ℃ of conditions ultrasonic brazing 4～30s partly to be carried out in soldering in supersonic frequency, insulation 0～30min, then with stove cooling or air cooling to 300～500 ℃, welding point is applied the longitudinal pressure of 0～100N, continue to cool to the furnace room temperature; Pottery and metal joint residual stress have promptly been realized reducing.
Adopt two kinds of welding manners, prefabricated solder intermediate layer and capillary joint filling ultrasonic brazing among the present invention.
Among the present invention the composition of solder be Al-(10～20wt.%) Sn-(6-10wt.%) Si-(4-10wt.%) Zn, the solidus temperature interval of solder sheet is 198～227 ℃, the liquidus temperature interval is 540～580 ℃, actual temp is determined by the solder composition.For example the solidus temperature of Al-15Sn-8Si-4Zn solder is low to moderate below 200 ℃, as shown in Figure 3.
Al-Sn-Si-Zn solder among the present invention, the effect of Al element are to realize solder wetting to SiC and TC4 alloy.The effect of Sn element is the setting temperature that reduces solder, and the effect of Si element is to reduce the fusing point of solder and suppress reactant A l between the Al-SiC
4C
3Generation, the effect of Zn element is to strengthen Sn to combine with the interface of Al.
The purpose of pressurizeing among the present invention is to prevent that shrinkage cavity appears in solder inside in the process of setting.
The present invention adopts the auxiliary method of ultrasonic wave to realize that the soldering of ceramic/metal connects; Under atmospheric conditions, finish brazing process; Brazing temperature is low, finishes brazing process between 580～620 ℃; Institute's ceramic and metal soldered joint joint residual stress level that obtains is low, and for example, the residual stress maximum that adopts the Al12Si solder to connect SiC and joint that TC4 obtains is 80～100MPa, and there is cracking phenomena at the interface in postwelding SiC pottery inner near.And when adopting Al-15Sn-8Si-4Zn as the intermediate layer under the condition, joint residual stress maximum is reduced to about 10MPa, and the SiC pottery does not ftracture.
Description of drawings
Fig. 1 adopts preseting solder intermediate layer method ceramic/metal low temperature low stress ultrasonic brazing Principle of Process figure; Fig. 2 adopts capillary joint filling method ceramic/metal low temperature low stress ultrasonic brazing Principle of Process figure; Fig. 3 is the differential thermal analysis result of Al-15Sn-8Si-4Zn solder; Fig. 4 is the joint welding microstructure one that adopts the Al-15Sn-8Si-4Zn solder to obtain as intermediate layer ultrasonic brazing SiC pottery/TC4 alloy; Fig. 5 is the joint welding microstructure two that adopts Al-Sn-Si-Zn solder intermediate layer ultrasonic brazing SiC/TC4 to obtain; 1 expression pottery among the figure, 2 expression ultrasonic tool heads, 3 expression metals, 4 expression heaters, 5 expression Al-Sn-Si-Zn solder paillon foils, 6 expression Al-Sn-Si-Zn solder pieces.
The specific embodiment
Technical solution of the present invention is not limited to the following cited specific embodiment, also comprises any combination between each specific embodiment.
The specific embodiment one: the method for welding that reduces pottery and metal joint residual stress in the present embodiment is undertaken by following step: one, removing surface is carried out at the position to be welded of pottery and metal, Al-Sn-Si-Zn solder paillon foil placed between to be connected of pottery and the metal or Al-Sn-Si-Zn solder piece is placed into the edge in pottery and metallic bone slit, obtain treating weldment; Two, be that 20～100kHz, amplitude are that 1～10 μ m, brazing temperature are under 600～620 ℃ of conditions ultrasonic brazing 4～30s partly to be carried out in soldering in supersonic frequency, insulation 0～30min, then with stove cooling or air cooling to 300～500 ℃, welding point is applied the longitudinal pressure of 0～100N, continue to cool to the furnace room temperature; Pottery and metal joint residual stress have promptly been realized reducing.
Shearing strength of joint can reach 70～80MPa.
The specific embodiment two: what present embodiment and the specific embodiment one were different is: the described pottery of step 1 is SiC, Al
2O
3, Si
3N
4Or TiC.Other step is identical with the specific embodiment one with parameter.
The specific embodiment three: what present embodiment was different with the specific embodiment one or two is: the described metal of step 1 is TC4 or stainless steel.Other step is identical with the specific embodiment one or two with parameter.
The specific embodiment four: what present embodiment was different with one of specific embodiment one to three is: the composition of Al-Sn-Si-Zn solder paillon foil is made up of 10%～20% Sn, 6%～10% Si, 4%～10%Zn and the Al of surplus by weight percentage, and thickness is 100～500 μ m.Other step is identical with one of specific embodiment one to three with parameter.
The specific embodiment five: what present embodiment was different with one of specific embodiment one to four is: the described supersonic frequency of step 2 is 50～80kHz.Other step is identical with one of specific embodiment one to four with parameter.
The specific embodiment six: what present embodiment was different with one of specific embodiment one to five is: the described amplitude of step 2 is 2～8 μ m.Other step is identical with one of specific embodiment one to five with parameter.
The specific embodiment seven: what present embodiment was different with one of specific embodiment one to five is: the described amplitude of step 2 is 5 μ m.Other step is identical with one of specific embodiment one to five with parameter.
The specific embodiment eight: what present embodiment was different with one of specific embodiment one to seven is: the described brazing temperature of step 2 is 610 ℃.Other step is identical with one of specific embodiment one to seven with parameter.
The specific embodiment nine: what present embodiment was different with one of specific embodiment one to eight is: the described ultrasonic brazing of the step 2 time is 10～20s.Other step is identical with one of specific embodiment one to eight with parameter.
Adopt following verification experimental verification effect of the present invention:
Test one: describe in conjunction with Fig. 1, the low temperature brazing method that realizes ceramic/metal joint low stress under the atmospheric conditions realizes according to the following steps: removing surface is carried out at a pair of pottery (SiC pottery) and metal (TC4 alloy) position to be welded, Al-Sn-Si-Zn solder paillon foil is filled between pottery and metal to be connected; Two, be heated to solder and melt fully, applying frequency is that 20kHz, amplitude are the ultrasonic wave of 10 μ m, is incubated 20min subsequently, is cooled to 300 ℃ with stove, and surface to be welded is applied longitudinal pressure 100N, continues to cool to the furnace room temperature.
The seam organization that obtains is a stratiform in the present embodiment.Adopt preseting solder intermediate layer ultrasonic brazing in the present embodiment.
Obtain joint heterogeneous microstructure pattern in the present embodiment as shown in Figure 4.
Test two: describe in conjunction with Fig. 2, the low temperature brazing method that realizes ceramic/metal joint low stress under the atmospheric conditions realizes according to the following steps: removing surface is carried out at a pair of pottery (SiC pottery) and metal (TC4 alloy) position to be welded, Al-Sn-Si-Zn solder piece is placed into the edge in pottery and metallic bone slit; Two, be heated to solder and melt fully, applying frequency is that 20kHz, amplitude are the ultrasonic wave of 20 μ m, is incubated 30min subsequently, air cooling to 450 ℃ applies longitudinal pressure 50N to surface to be welded, continues to cool to the furnace room temperature.
Institute's seam organization that obtains is for knitting shape in the present embodiment.
Adopt capillary joint filling ultrasonic brazing in the present embodiment.
Obtain joint heterogeneous microstructure pattern in the present embodiment as shown in Figure 5.
Claims (9)
1. reduce the method for welding of pottery and metal joint residual stress, it is characterized in that the method for welding that reduces pottery and metal joint residual stress is undertaken by following step: one, removing surface is carried out at the position to be welded of pottery and metal, Al-Sn-Si-Zn solder paillon foil placed between to be connected of pottery and the metal or Al-Sn-Si-Zn solder piece is placed into the edge in pottery and metallic bone slit, obtain treating weldment; Two, be that 20～100kHz, amplitude are that 1～10 μ m, brazing temperature are under 600～620 ℃ of conditions ultrasonic brazing 4～30s partly to be carried out in soldering in supersonic frequency, insulation 0～30min, then with stove cooling or air cooling to 300～500 ℃, welding point is applied the longitudinal pressure of 0～100N, continue to cool to the furnace room temperature; Pottery and metal joint residual stress have promptly been realized reducing.
2. according to the described method for welding that reduces pottery and metal joint residual stress of claim 1, it is characterized in that the described pottery of step 1 is SiC, Al
2O
3, Si
3N
4Or TiC.
3. according to the described method for welding that reduces pottery and metal joint residual stress of claim 2, it is characterized in that the described metal of step 1 is TC4 or stainless steel.
4. according to the described method for welding that reduces pottery and metal joint residual stress of claim 3, the composition that it is characterized in that Al-Sn-Si-Zn solder paillon foil is made up of 10%～20% Sn, 6%～10% Si, 4%～10%Zn and the Al of surplus by weight percentage, and thickness is 100～500 μ m.
5. according to the described method for welding that reduces pottery and metal joint residual stress of claim 4, it is characterized in that the described supersonic frequency of step 2 is 50～80kHz.
6. according to the described method for welding that reduces pottery and metal joint residual stress of claim 5, it is characterized in that the described amplitude of step 2 is 2～8 μ m.
7. according to the described method for welding that reduces pottery and metal joint residual stress of claim 5, it is characterized in that the described amplitude of step 2 is 5 μ m.
8. according to the described method for welding that reduces pottery and metal joint residual stress of each claim of claim 1-7, it is characterized in that the described brazing temperature of step 2 is 610 ℃.
9. the described according to Claim 8 method for welding that reduces pottery and metal joint residual stress is characterized in that the described ultrasonic brazing time of step 2 is 10～20s.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110439381 CN102513636B (en) | 2011-12-23 | 2011-12-23 | Brazing method capable of reducing residual stress on ceramic and metal joints |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110439381 CN102513636B (en) | 2011-12-23 | 2011-12-23 | Brazing method capable of reducing residual stress on ceramic and metal joints |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102513636A CN102513636A (en) | 2012-06-27 |
| CN102513636B true CN102513636B (en) | 2013-07-31 |
Family
ID=46284846
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201110439381 Active CN102513636B (en) | 2011-12-23 | 2011-12-23 | Brazing method capable of reducing residual stress on ceramic and metal joints |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102513636B (en) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103170723B (en) * | 2013-03-06 | 2016-01-13 | 哈尔滨工业大学深圳研究生院 | Under a kind of atmospheric environment, quick in situ generates the method for attachment of homogeneity phase alumina pottery |
| CH708666A1 (en) * | 2013-10-08 | 2015-04-15 | Kistler Holding Ag | Process for producing a metal-ceramic solder joint. |
| CN104772542B (en) * | 2015-04-14 | 2017-07-11 | 西南交通大学 | The hard alloy of WC particle In-sltu reinforcement and the ultrasonic brazing method of steel |
| CN105921839B (en) * | 2016-06-06 | 2018-08-14 | 哈尔滨工业大学（威海） | A kind of kovar alloy and ceramic material ultrasonic brazing method |
| EP3466908A4 (en) * | 2016-06-13 | 2020-01-29 | IHI Corporation | Ceramic matrix composite material component and method for producing same |
| CN106563861A (en) * | 2016-10-19 | 2017-04-19 | 哈尔滨工业大学（威海） | Ultrasonic soldering method for fast forming ceramic-metal interconnection |
| US11560913B2 (en) * | 2018-01-19 | 2023-01-24 | Applied Materials, Inc. | Brazed joint and semiconductor processing chamber component having the same |
| CN110560955B (en) * | 2019-10-25 | 2021-04-02 | 宝鸡文理学院 | Method for welding aluminum oxide ceramic and metal molybdenum |
| CN114043026B (en) * | 2021-11-12 | 2023-08-29 | 哈尔滨工业大学 | Stress relieving method in ceramic-metal |
| CN114799475A (en) * | 2022-04-14 | 2022-07-29 | 哈尔滨工业大学 | Method for low-temperature direct brazing of nonmetal and metal by using commercial inactive brazing filler metal |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101088691A (en) * | 2007-07-20 | 2007-12-19 | 哈尔滨工业大学 | Process of obtaining composite brazed seam with ultrasonic brazed aluminium-base composite material |
| CN101474699A (en) * | 2009-01-19 | 2009-07-08 | 哈尔滨工业大学 | Ultrasonic soldering method of aluminum or aluminum alloy |
| CN102260088A (en) * | 2011-06-28 | 2011-11-30 | 哈尔滨工业大学 | Low-stress low-temperature ceramic brazing method |
-
2011
- 2011-12-23 CN CN 201110439381 patent/CN102513636B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101088691A (en) * | 2007-07-20 | 2007-12-19 | 哈尔滨工业大学 | Process of obtaining composite brazed seam with ultrasonic brazed aluminium-base composite material |
| CN101474699A (en) * | 2009-01-19 | 2009-07-08 | 哈尔滨工业大学 | Ultrasonic soldering method of aluminum or aluminum alloy |
| CN102260088A (en) * | 2011-06-28 | 2011-11-30 | 哈尔滨工业大学 | Low-stress low-temperature ceramic brazing method |
Non-Patent Citations (2)
| Title |
|---|
| 超声波振动辅助钎焊技术;闫久春等;《焊接》;20090331(第3期);第6-13页 * |
| 闫久春等.超声波振动辅助钎焊技术.《焊接》.2009,(第3期),第6-13页. |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102513636A (en) | 2012-06-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102513636B (en) | Brazing method capable of reducing residual stress on ceramic and metal joints | |
| CN102554509B (en) | Vacuum brazing solder and process of Mo-Cu alloy and stainless steel | |
| CN102260088A (en) | Low-stress low-temperature ceramic brazing method | |
| CN103252572B (en) | Transient liquid phase diffusion bonding process of molybdenum copper alloy and stainless steel | |
| CN111347146B (en) | Tungsten and heat sink material connector and preparation method thereof | |
| CN104475898B (en) | The foreign material method for welding of porous interlayer structure brazed seam | |
| CN105346161A (en) | Tungsten/transition layer/steel composite material and low-temperature and low-pressure active diffusion connection preparation method thereof | |
| CN102489813B (en) | Vacuum active brazing process of molybdenum-copper alloys and stainless steel | |
| CN105272369B (en) | A kind of porous ceramics connection method | |
| CN106493443A (en) | A kind of composite interlayer ceramic soldering or the method for ceramic matric composite and metal | |
| CN102275022B (en) | Connecting method of C/C composite material and copper or copper alloy | |
| BR112019000136B1 (en) | VACUUM TEMPERED GLASS | |
| CN100376353C (en) | Carbon/carbon composite and titanium alloy welding method | |
| CN106271015B (en) | A kind of stainless steel and kovar alloy dissimilar metal diffusion welding method | |
| CN105237026A (en) | Ceramic/ceramic connection method for regulating and controlling middle solder layer through multi-physical-field coupling | |
| CN103231136B (en) | A kind of laser braze welding method of Ti-Ni marmem and xenogenesis light metal | |
| CN105195847A (en) | Multi-scale combined method for improving high hard and brittle ceramic base material soldering connection strength | |
| CN105418131A (en) | Alumina ceramic low temperature brazing connection method | |
| CN106695043A (en) | Carbon base material and copper brazing connection method | |
| CN111347147B (en) | Hot isostatic pressing connection method of tungsten and heat sink material | |
| CN113478040B (en) | Active brazing method for improving performance of graphite/copper dissimilar material joint | |
| CN103341675B (en) | Method for braze welding of Cf/SiC composite material and metal Nb by using Ti-Co-Nb brazing filler metal | |
| CN105290554B (en) | A kind of vacuum brazing technique of niobium tungsten alloy and stainless steel ring-shaped work pieces | |
| CN104741722A (en) | TiNi solder vacuum brazing TZM alloy and ZrC/W composite method | |
| CN103204694B (en) | Method for diffusely connecting TiAl-based alloy and Ti3AlC2 ceramic by adopting Zr/Ni composite intermediate layer |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |