CN110776330A - Brazing method of ceramic and metal - Google Patents
Brazing method of ceramic and metal Download PDFInfo
- Publication number
- CN110776330A CN110776330A CN201911268867.4A CN201911268867A CN110776330A CN 110776330 A CN110776330 A CN 110776330A CN 201911268867 A CN201911268867 A CN 201911268867A CN 110776330 A CN110776330 A CN 110776330A
- Authority
- CN
- China
- Prior art keywords
- welded
- metal
- brazing
- ceramic
- examples
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 336
- 239000002184 metal Substances 0.000 title claims abstract description 336
- 238000005219 brazing Methods 0.000 title claims abstract description 194
- 239000000919 ceramic Substances 0.000 title claims abstract description 169
- 238000000034 method Methods 0.000 title claims abstract description 60
- 239000000945 filler Substances 0.000 claims abstract description 77
- 150000002739 metals Chemical class 0.000 claims abstract description 16
- 238000010438 heat treatment Methods 0.000 claims abstract description 12
- 238000003466 welding Methods 0.000 claims abstract description 6
- 238000001465 metallisation Methods 0.000 claims description 15
- 229910000679 solder Inorganic materials 0.000 claims description 13
- 238000003825 pressing Methods 0.000 claims description 12
- 229910052758 niobium Inorganic materials 0.000 claims description 10
- 229910045601 alloy Inorganic materials 0.000 claims description 9
- 239000000956 alloy Substances 0.000 claims description 9
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 8
- 238000001816 cooling Methods 0.000 claims description 8
- 238000004381 surface treatment Methods 0.000 claims description 7
- 229910052719 titanium Inorganic materials 0.000 claims description 7
- 229910052737 gold Inorganic materials 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 5
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 4
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims description 4
- 238000004544 sputter deposition Methods 0.000 claims description 4
- ULGYAEQHFNJYML-UHFFFAOYSA-N [AlH3].[Ca] Chemical class [AlH3].[Ca] ULGYAEQHFNJYML-UHFFFAOYSA-N 0.000 claims description 3
- 229910000323 aluminium silicate Inorganic materials 0.000 claims description 3
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 claims description 3
- 238000007747 plating Methods 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 238000005245 sintering Methods 0.000 claims description 3
- 238000001704 evaporation Methods 0.000 claims description 2
- 230000008020 evaporation Effects 0.000 claims description 2
- 238000000137 annealing Methods 0.000 claims 1
- 239000000377 silicon dioxide Substances 0.000 claims 1
- 238000007711 solidification Methods 0.000 claims 1
- 230000008023 solidification Effects 0.000 claims 1
- 230000008646 thermal stress Effects 0.000 abstract description 13
- 238000005476 soldering Methods 0.000 abstract description 3
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 23
- 239000010936 titanium Substances 0.000 description 20
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 14
- 239000010955 niobium Substances 0.000 description 14
- 239000000463 material Substances 0.000 description 13
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 12
- 230000009286 beneficial effect Effects 0.000 description 8
- 244000137852 Petrea volubilis Species 0.000 description 6
- 238000009826 distribution Methods 0.000 description 6
- 239000010953 base metal Substances 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- 229910052581 Si3N4 Inorganic materials 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 239000002969 artificial stone Substances 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 229910002804 graphite Inorganic materials 0.000 description 4
- 239000010439 graphite Substances 0.000 description 4
- 238000001755 magnetron sputter deposition Methods 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 4
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 4
- 238000009423 ventilation Methods 0.000 description 4
- 229910004298 SiO 2 Inorganic materials 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 3
- 238000011109 contamination Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 3
- 238000005240 physical vapour deposition Methods 0.000 description 3
- 229910010271 silicon carbide Inorganic materials 0.000 description 3
- 229910052814 silicon oxide Inorganic materials 0.000 description 3
- 230000007704 transition Effects 0.000 description 3
- 229910052580 B4C Inorganic materials 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- FFBGYFUYJVKRNV-UHFFFAOYSA-N boranylidynephosphane Chemical compound P#B FFBGYFUYJVKRNV-UHFFFAOYSA-N 0.000 description 2
- INAHAJYZKVIDIZ-UHFFFAOYSA-N boron carbide Chemical compound B12B3B4C32B41 INAHAJYZKVIDIZ-UHFFFAOYSA-N 0.000 description 2
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 2
- 239000003575 carbonaceous material Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000011777 magnesium Substances 0.000 description 2
- 239000000395 magnesium oxide Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 2
- 239000010944 silver (metal) Substances 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- 238000009736 wetting Methods 0.000 description 2
- 229910001928 zirconium oxide Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 229910001069 Ti alloy Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000000292 calcium oxide Substances 0.000 description 1
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- FZFYOUJTOSBFPQ-UHFFFAOYSA-M dipotassium;hydroxide Chemical compound [OH-].[K+].[K+] FZFYOUJTOSBFPQ-UHFFFAOYSA-M 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 229910052574 oxide ceramic Inorganic materials 0.000 description 1
- 239000011224 oxide ceramic Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- KKCBUQHMOMHUOY-UHFFFAOYSA-N sodium oxide Chemical compound [O-2].[Na+].[Na+] KKCBUQHMOMHUOY-UHFFFAOYSA-N 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
- C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
- C04B37/023—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
- C04B2237/12—Metallic interlayers
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
- C04B2237/52—Pre-treatment of the joining surfaces, e.g. cleaning, machining
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
- C04B2237/55—Pre-treatments of a coated or not coated substrate other than oxidation treatment in order to form an active joining layer
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Ceramic Products (AREA)
Abstract
本公开提供了一种陶瓷与金属的钎焊方法,包括:准备待焊陶瓷和待焊金属,并且对待焊陶瓷进行表面处理,以使待焊陶瓷的表面形成为光滑表面;在待焊陶瓷的表面进行金属化处理,形成与待焊陶瓷结合的中间金属层,待焊陶瓷的热膨胀系数与中间金属层的热膨胀系数匹配;并将待焊陶瓷、金属钎料与待焊金属依次叠放进行钎焊,金属钎料于中间金属层与待焊金属之间,钎焊时,通过加热使金属钎料熔融,熔融的金属钎料浸润中间金属层,并保持预定时间的熔融状态,使金属钎料与具有中间金属层的待焊陶瓷之间的界面形成焊接面,并进行退火和固化。根据本公开能够提供一种能够减小界面层的热应力并且提高界面层的气密性和剪切强度的陶瓷与金属的钎焊方法。
The present disclosure provides a brazing method for ceramics and metals, comprising: preparing ceramics to be welded and metals to be welded, and surface-treating the ceramics to be welded, so that the surface of the ceramics to be welded is formed into a smooth surface; The surface is metallized to form an intermediate metal layer combined with the ceramic to be welded, and the thermal expansion coefficient of the ceramic to be welded matches the thermal expansion coefficient of the intermediate metal layer; Soldering, the metal brazing filler metal is placed between the intermediate metal layer and the metal to be welded. During brazing, the metal brazing filler metal is melted by heating, and the molten metal brazing filler metal infiltrates the intermediate metal layer and maintains the molten state for a predetermined time, so that the metal brazing filler metal is melted. The interface with the ceramic to be welded with the intermediate metal layer forms the welding surface, and is annealed and cured. According to the present disclosure, it is possible to provide a ceramic-to-metal brazing method capable of reducing thermal stress of an interface layer and improving airtightness and shear strength of the interface layer.
Description
技术领域technical field
本公开特别涉及一种陶瓷与金属的钎焊方法。In particular, the present disclosure relates to a brazing method of ceramics and metals.
背景技术Background technique
陶瓷作为高温结构材料因其具有良好的生物相容性、耐热、耐腐蚀和电气绝缘性能等而被广泛用于各个领域。不过在实际应用中,为了解决陶瓷本身硬度过大造成的加工性差的问题,需要将陶瓷和金属通过一定方法连接起来形成金属-陶瓷复合结构件。Ceramics, as high-temperature structural materials, are widely used in various fields due to their good biocompatibility, heat resistance, corrosion resistance and electrical insulation properties. However, in practical applications, in order to solve the problem of poor workability caused by the excessive hardness of the ceramic itself, it is necessary to connect the ceramic and the metal by a certain method to form a metal-ceramic composite structure.
目前,连接陶瓷和金属材料最常用的方法是钎焊。钎焊具有热影响区小、形成的接头可靠等优点,非常适合用于异种材料之间的连接。但是由于陶瓷自身的润湿性很差,使得陶瓷与金属材料之间难以形成良好的连接。而且陶瓷与金属彼此的热膨胀系数差异较大,会导致接头中热应力过大,影响接头的强度和气密性等性能。Currently, the most common method for joining ceramic and metallic materials is brazing. Brazing has the advantages of small heat affected zone and reliable joints, and is very suitable for the connection between dissimilar materials. However, due to the poor wettability of ceramics, it is difficult to form a good connection between ceramics and metal materials. Moreover, the thermal expansion coefficients of ceramics and metals are quite different from each other, which will lead to excessive thermal stress in the joint and affect the strength and air tightness of the joint.
发明内容SUMMARY OF THE INVENTION
本公开有鉴于上述现有技术的状况而完成,其目的在于提供一种能够减小界面层的热应力并且提高界面层的气密性和剪切强度的陶瓷与金属的钎焊方法。The present disclosure has been made in view of the above-mentioned state of the art, and an object of the present disclosure is to provide a ceramic-metal brazing method capable of reducing the thermal stress of the interface layer and improving the airtightness and shear strength of the interface layer.
为此,本公开提供了一种陶瓷与金属的钎焊方法,包括:准备待焊陶瓷和待焊金属,并且对所述待焊陶瓷进行表面处理,以使所述待焊陶瓷的表面形成为光滑表面;在所述待焊陶瓷的表面进行金属化处理,形成与所述待焊陶瓷结合的中间金属层,所述待焊陶瓷的热膨胀系数与所述中间金属层的热膨胀系数匹配;并且将所述待焊陶瓷、金属钎料与所述待焊金属依次叠放并进行钎焊,所述金属钎料位于所述中间金属层与所述待焊金属之间,在钎焊过程中,通过加热使所述金属钎料熔融,熔融的金属钎料浸润所述中间金属层,并保持预定时间的熔融状态,使所述金属钎料与具有所述中间金属层的待焊陶瓷之间的界面形成焊接面,并进行退火和固化。To this end, the present disclosure provides a method for brazing a ceramic and a metal, including: preparing a ceramic to be welded and a metal to be welded, and performing surface treatment on the ceramic to be welded, so that the surface of the ceramic to be welded is formed as smooth surface; metallization is performed on the surface of the ceramic to be welded to form an intermediate metal layer combined with the ceramic to be welded, the thermal expansion coefficient of the ceramic to be welded matches the thermal expansion coefficient of the intermediate metal layer; and the The ceramic to be welded, the metal brazing filler metal and the metal to be welded are stacked and brazed in sequence, and the metal brazing filler metal is located between the intermediate metal layer and the metal to be welded. Heating to melt the metal brazing filler metal, the molten metal brazing filler metal infiltrates the intermediate metal layer, and maintains the molten state for a predetermined time, so that the interface between the metal brazing filler metal and the ceramic to be welded with the intermediate metal layer is formed. Weld faces are formed, annealed and cured.
在本公开中,陶瓷与金属的钎焊方法包括了对待焊陶瓷进行表面处理,且待焊陶瓷的表面经过金属化处理形成具有匹配热膨胀系数的中间金属层,钎焊时金属钎料能够熔融并浸润中间金属层,在这种情况下,熔融的金属钎料能够很好的浸润表面经过金属化处理的待焊陶瓷,并且中间金属层能够使待焊陶瓷与待焊金属的钎焊界面热膨胀系数呈现梯度过渡,从而能够减小界面间因材料不同导致的热膨胀系数差异,减小界面层的热应力并且提高气密性能。In the present disclosure, the brazing method of ceramics and metals includes surface treatment of the ceramics to be welded, and the surface of the ceramics to be welded is metallized to form an intermediate metal layer with a matching thermal expansion coefficient, and the metal brazing filler metal can be melted and melted during brazing. Wetting the intermediate metal layer, in this case, the molten metal brazing filler metal can well infiltrate the ceramic to be welded whose surface has been metallized, and the intermediate metal layer can make the thermal expansion coefficient of the brazing interface between the ceramic to be welded and the metal to be welded. It presents a gradient transition, which can reduce the difference in thermal expansion coefficient between the interfaces due to different materials, reduce the thermal stress of the interface layer and improve the air tightness.
另外,在本公开所涉及的钎焊方法中,所述待焊陶瓷的表面的粗糙度可以小于0.05μm。在这种情况下,能够使待焊陶瓷的表面光滑且平整,有利于后续陶瓷与金属之间的钎焊。In addition, in the brazing method involved in the present disclosure, the roughness of the surface of the ceramic to be welded may be less than 0.05 μm. In this case, the surface of the ceramic to be welded can be made smooth and flat, which is beneficial to the subsequent brazing between the ceramic and the metal.
另外,在本公开所涉及的钎焊方法中,所述金属化处理的方法可以为溅射、蒸镀、PVD、CVD、镀覆、高温烧结。由此,能够在待焊陶瓷表面上形成紧密结合的中间金属层。In addition, in the brazing method involved in the present disclosure, the metallization treatment method may be sputtering, vapor deposition, PVD, CVD, plating, and high-temperature sintering. Thereby, a tightly bonded intermediate metal layer can be formed on the surface of the ceramic to be welded.
另外,在本公开所涉及的钎焊方法中,所述中间金属层可以由选自Nb、 Au、Ti及它们的合金中的至少一种构成。由此,能够使金属钎料很好地润湿表面具有中间金属层的待焊陶瓷。In addition, in the brazing method according to the present disclosure, the intermediate metal layer may be composed of at least one selected from the group consisting of Nb, Au, Ti, and alloys thereof. In this way, the metal brazing filler metal can well wet the ceramic to be soldered with the intermediate metal layer on the surface.
另外,在本公开所涉及的钎焊方法中,所述金属钎料可以选自Au、Ag、 Ti、Nb及它们的合金中的至少一种。在这种情况下,能够改善钎料对待焊陶瓷与待焊金属的润湿性。In addition, in the brazing method according to the present disclosure, the metal brazing filler metal may be at least one selected from Au, Ag, Ti, Nb and alloys thereof. In this case, the wettability of the brazing filler metal to the ceramic to be soldered and the metal to be soldered can be improved.
另外,在本公开所涉及的钎焊方法中,可选地,所述待焊陶瓷、所述待焊金属与所述金属钎料的尺寸相匹配。由此,能够有利于待焊陶瓷与待焊金属进行钎焊。In addition, in the brazing method involved in the present disclosure, optionally, the size of the ceramic to be welded, the metal to be welded, and the metal brazing filler metal are matched. Therefore, the brazing of the ceramic to be welded and the metal to be welded can be facilitated.
另外,在本公开所涉及的钎焊方法中,可选地,对所述待焊陶瓷、金属钎料与所述待焊金属依次叠放形成的待焊件施加压力。由此,能够在钎焊时固定待焊件,并且能够控制钎缝宽度及其边缘的一致性。另外,在本公开所涉及的钎焊方法中,可选地,在进行钎焊前,对所述待焊金属进行表面处理。由此,能够增加待焊金属的表面润湿性能。In addition, in the brazing method involved in the present disclosure, optionally, pressure is applied to the to-be-welded member formed by stacking the ceramic to be welded, the metal brazing filler metal, and the metal to be welded in sequence. Thereby, the workpiece to be welded can be fixed during brazing, and the uniformity of the width of the brazing seam and its edge can be controlled. In addition, in the brazing method involved in the present disclosure, optionally, before brazing, the metal to be welded is surface-treated. Thereby, the surface wettability of the metal to be welded can be increased.
另外,在本公开所涉及的钎焊方法中,可选地,在所述钎焊中,以1℃1mi1 至50℃1mi1的加热速率升温至1060℃至1150℃,保温1mi1至30mi1,然后以 2℃1mi1至20℃1mi1的降温速率降温至200℃至400℃,然后随炉冷却至150℃以下。在这种情况下,能够改善界面间脆性相的产生和分布,增加强度、减小热应力和母材的热变形,消除焊缝中的裂纹,提高待焊陶瓷与待焊金属之间界面层的气密性和剪切强度。In addition, in the brazing method involved in the present disclosure, optionally, in the brazing, the temperature is raised to 1060° C. to 1150° C. at a heating rate of 1° C. 1 mi 1 to 50° C. 1 mi 1 , maintained for 1 mi 1 to 30 mi 1 , and then The cooling rate of 2°C 1mi1 to 20°C 1mi1 is cooled to 200°C to 400°C, and then cooled to below 150°C with the furnace. In this case, it is possible to improve the generation and distribution of brittle phases between the interfaces, increase the strength, reduce thermal stress and thermal deformation of the base metal, eliminate cracks in the weld, and improve the interface layer between the ceramic to be welded and the metal to be welded. air tightness and shear strength.
另外,在本公开所涉及的钎焊方法中,所述待焊陶瓷可以由选自氧化铝、氧化锆、氧化硅、碳素材料、氮化硅、碳化硅、氧化钛、硅铝酸盐或钙铝系中的至少一种构成。在这种情况下,能够获得具有生物兼容性的待焊陶瓷。In addition, in the brazing method involved in the present disclosure, the ceramic to be welded may be made of aluminum oxide, zirconium oxide, silicon oxide, carbon material, silicon nitride, silicon carbide, titanium oxide, aluminosilicate or At least one kind of calcium-aluminum-based composition. In this case, a biocompatible ceramic to be welded can be obtained.
根据本公开,能够提供一种能够减小界面层的热应力并且提高界面层的气密性和剪切强度的陶瓷与金属的钎焊方法。According to the present disclosure, it is possible to provide a ceramic-metal brazing method capable of reducing the thermal stress of the interface layer and improving the airtightness and shear strength of the interface layer.
附图说明Description of drawings
图1示出了本公开的示例所涉及的陶瓷与金属的钎焊方法的流程示意图。FIG. 1 shows a schematic flowchart of a brazing method for ceramics and metals involved in an example of the present disclosure.
图2示出了本公开的示例所涉及的治具的立体图。FIG. 2 shows a perspective view of a jig according to an example of the present disclosure.
图3示出了图2所示的治具沿着线A-A'的截面图。FIG. 3 shows a cross-sectional view of the fixture shown in FIG. 2 along line AA'.
图4示出了本公开的示例所涉及的装配有待焊件的治具的截面图。4 shows a cross-sectional view of a jig fitted with a piece to be welded according to an example of the present disclosure.
图5示出了本公开的示例所涉及的待焊件的装配结构图。FIG. 5 shows an assembly structure diagram of a to-be-welded part involved in an example of the present disclosure.
图6示出了本公开的示例所涉及的待焊件的截面图。6 shows a cross-sectional view of a workpiece to be welded according to an example of the present disclosure.
图7示出了本公开的实施例中所涉及的Al2O3陶瓷与纯Ti金属的钎焊接头的切片图。7 shows a slice view of a brazed joint of Al 2 O 3 ceramic and pure Ti metal involved in an embodiment of the present disclosure.
具体实施方式Detailed ways
以下,参考附图,详细地说明本公开的优选实施方式。在下面的说明中,对于相同的部件赋予相同的符号,省略重复的说明。另外,附图只是示意性的图,部件相互之间的尺寸的比例或者部件的形状等可以与实际的不同。Hereinafter, preferred embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. In the following description, the same reference numerals are assigned to the same components, and overlapping descriptions are omitted. In addition, the drawings are only schematic diagrams, and the ratios of the dimensions of the members, the shapes of the members, and the like may be different from the actual ones.
图1示出了本公开的示例所涉及的陶瓷与金属的钎焊方法的流程示意图。FIG. 1 shows a schematic flowchart of a brazing method for ceramics and metals involved in an example of the present disclosure.
本实施方式所涉及的陶瓷与金属的钎焊方法包括:准备待焊陶瓷31和待焊金属33,并且对待焊陶瓷31进行表面处理,以使待焊陶瓷31的表面形成为光滑表面(步骤S10);在待焊陶瓷31的表面进行金属化处理,形成与待焊陶瓷31结合的中间金属层,待焊陶瓷31的热膨胀系数与中间金属层的热膨胀系数匹配(步骤S20);将待焊陶瓷31、金属钎料32与待焊金属33依次叠放并进行钎焊(步骤S30)。在本实施方式中,待焊件30可以包括待焊陶瓷31、金属钎料32和待焊金属33。待焊件30的形状没有特别限制,在一些示例中,待焊件30可以为圆柱状。The brazing method for ceramics and metals involved in this embodiment includes: preparing the
在一些示例中,金属钎料32可以位于中间金属层与待焊金属33之间。另外,在一些示例中,可选地,在钎焊过程中,通过加热使金属钎料32熔融,熔融的金属钎料32浸润中间金属层,并保持预定时间的熔融状态,使金属钎料32与具有中间金属层的待焊陶瓷31之间的界面形成焊接面,并进行退火和固化。In some examples, the
在本实施方式所涉及的陶瓷与金属的钎焊方法中,陶瓷与金属的钎焊方法包括了对待焊陶瓷31进行表面处理,且待焊陶瓷31的表面经过金属化处理形成具有匹配热膨胀系数的中间金属层,钎焊时金属钎料32能够熔融并浸润中间金属层,在这种情况下,熔融的金属钎料32能够很好的浸润表面经过金属化处理的待焊陶瓷31,并且中间金属层能够使待焊陶瓷31与待焊金属33的钎焊界面热膨胀系数呈现梯度过渡,从而能够减小界面间因材料不同导致的热膨胀系数差异,减小界面层热应力并且提高气密性能。In the brazing method for ceramics and metals according to the present embodiment, the brazing method for ceramics and metals includes surface treatment of the
此外,在本实施方式中,在钎焊时还可以通过选用适宜的钎焊温度和保温时间可以改善界面间脆性相(脆性化合物)的产生和分布,增加强度、减小热应力和母材(待焊陶瓷31、待焊金属33)的热变形,消除焊缝中的裂纹,提高待焊陶瓷31与待焊金属33之间界面层的气密性和剪切强度。In addition, in this embodiment, the generation and distribution of brittle phases (brittle compounds) between interfaces can be improved by selecting appropriate brazing temperature and holding time during brazing, increasing strength, reducing thermal stress and base metal ( The thermal deformation of the ceramic to be welded 31 and the metal to be welded 33) eliminates cracks in the weld and improves the air tightness and shear strength of the interface layer between the ceramic to be welded 31 and the metal to be welded 33 .
在一些示例中,在步骤S10中,可以对待焊陶瓷31的表面进行研磨及抛光处理至表面粗糙度小于0.05μm。在这种情况下,待焊陶瓷31的表面光滑且平整,有利于后续陶瓷与金属之间的钎焊。在一些示例中,在步骤S10中,待焊陶瓷31的表面可以经研磨处理形成研磨面。In some examples, in step S10 , the surface of the ceramic to be welded 31 may be ground and polished until the surface roughness is less than 0.05 μm. In this case, the surface of the ceramic 31 to be welded is smooth and flat, which is beneficial to the subsequent brazing between the ceramic and the metal. In some examples, in step S10, the surface of the ceramic to be welded 31 may be ground to form a ground surface.
在一些示例中,待焊陶瓷31可以包括上下表面。由此,能够获得由待焊陶瓷31的上下表面中的至少一个表面研磨而成的研磨面。在这种情况下,由于研磨的对象为待焊陶瓷31的上下表面中的至少一个表面,因此能够降低研磨工艺的难度,有助于将待焊陶瓷31表面研磨至平整光滑,从而提高待焊陶瓷31的表面润湿性能。In some examples, the ceramic to be welded 31 may include upper and lower surfaces. Thereby, a polished surface obtained by grinding at least one of the upper and lower surfaces of the ceramic to be welded 31 can be obtained. In this case, since the object to be ground is at least one of the upper and lower surfaces of the
另外,在一些示例中,待焊陶瓷31的上下表面的至少一个表面的粗糙度可以小于0.05μm。在这种情况下,能够使待焊陶瓷31的表面光滑且平整,有利于后续陶瓷与金属之间的钎焊。在一些示例中,待焊陶瓷31的表面的粗糙度可以为0.04μm、0.03μm、0.02μm、0.01μm等。In addition, in some examples, the roughness of at least one of the upper and lower surfaces of the ceramic to be welded 31 may be less than 0.05 μm. In this case, the surface of the ceramic 31 to be welded can be made smooth and flat, which is beneficial to the subsequent brazing between the ceramic and the metal. In some examples, the roughness of the surface of the ceramic to be welded 31 may be 0.04 μm, 0.03 μm, 0.02 μm, 0.01 μm, or the like.
在一些示例中,待焊陶瓷31可以具有生物兼容性。由此,能够减小对人体的破坏性,并且能够与人体组织具有相互适应性。另外,在一些示例中,待焊陶瓷31可以为氧化陶瓷。由此,能够获得化学性能稳定的待焊陶瓷31。In some examples, the ceramic to be welded 31 may be biocompatible. Thereby, damage to the human body can be reduced, and compatibility with human tissue can be achieved. Additionally, in some examples, the ceramic to be welded 31 may be an oxide ceramic. Thereby, the ceramic to be welded 31 with stable chemical properties can be obtained.
在一些示例中,待焊陶瓷31可以由选自氧化铝(Al2O3)、氧化锆(ZrO2)、氧化硅(SiO2)、氧化钛(TiO2)、硅铝酸盐(Na2O·Al2O3·SiO2)或钙铝系(CaO·Al2O3)中的至少一种构成。由此,能够获得具有生物兼容性的待焊陶瓷31。In some examples, the ceramic to be welded 31 may be made of a material selected from the group consisting of aluminum oxide (Al 2 O 3 ), zirconium oxide (ZrO 2 ), silicon oxide (SiO 2 ), titanium oxide (TiO 2 ), aluminosilicate (Na 2 O ·Al 2 O 3 ·SiO 2 ) or at least one of calcium-aluminum-based (CaO·Al 2 O 3 ). Thereby, the ceramic to be welded 31 having biocompatibility can be obtained.
在本实施方式中,待焊陶瓷31可以为氧化铝(Al2O3)陶瓷。在一些示例中,待焊陶瓷31优选由质量分数为96%以上的氧化铝(Al2O3)构成。更优选地,待焊陶瓷31由质量分数为99%以上的氧化铝(Al2O3)构成,最优选地,待焊陶瓷31由质量分数为99.99%以上的氧化铝(Al2O3)构成。一般而言,在待焊陶瓷31中,氧化铝(Al2O3)质量分数的增加,能够使其主晶相增多,待焊陶瓷31的物理性能也能够提高,例如抗压前度、抗弯强度、弹性模量也相应地提高,由此可以认为,质量分数更高的氧化铝(Al2O3)会呈现更好的生物兼容性和长期可靠性。在另一些示例中,待焊陶瓷31还可以为氧化锆(ZrO2) 陶瓷。In this embodiment, the ceramic to be welded 31 may be an alumina (Al 2 O 3 ) ceramic. In some examples, the ceramic to be welded 31 is preferably composed of alumina (Al 2 O 3 ) with a mass fraction of 96% or more. More preferably, the ceramic to be welded 31 is composed of alumina (Al 2 O 3 ) with a mass fraction of 99% or more, and most preferably, the ceramic to be welded 31 is composed of alumina (Al 2 O 3 ) with a mass fraction of 99.99% or more constitute. Generally speaking, in the ceramic 31 to be welded, the increase in the mass fraction of alumina (Al 2 O 3 ) can increase its main crystalline phase, and the physical properties of the ceramic to be welded 31 can also be improved, such as compressive strength, resistance The flexural strength and elastic modulus are also increased accordingly, so it can be considered that alumina (Al 2 O 3 ) with a higher mass fraction will exhibit better biocompatibility and long-term reliability. In other examples, the ceramic to be welded 31 may also be a zirconia (ZrO 2 ) ceramic.
在一些示例中,待焊陶瓷31可以为非氧化陶瓷。例如,待焊陶瓷31可以为碳素材料(C)、氮化硅(Si3N4)、碳化硅(SiC)中的至少一种构成。In some examples, the ceramic to be welded 31 may be a non-oxidizing ceramic. For example, the ceramic to be welded 31 may be made of at least one of carbon material (C), silicon nitride (Si 3 N 4 ), and silicon carbide (SiC).
在一些示例中,根据使用场合,待焊陶瓷31也可以由选自氧化硅(SiO2)、氧化钾(K2O)、氧化钠(Na2O)、氧化钙(CaO)、氧化镁(MgO)、氧化铁(Fe2O3) 中的至少一种构成。In some examples, the ceramic to be welded 31 can also be made of silicon oxide (SiO 2 ), potassium oxide (K 2 O), sodium oxide (Na 2 O), calcium oxide (CaO), magnesium oxide ( At least one of MgO) and iron oxide (Fe 2 O 3 ).
在一些示例中,待焊陶瓷31可以为圆盘状。但本发明的示例不限于此,例如,待焊陶瓷31可以为方形。In some examples, the ceramic to be welded 31 may be disk-shaped. However, the example of the present invention is not limited thereto, for example, the ceramic to be welded 31 may be square.
在本实施方式中,待焊金属33可以具有生物兼容性。由此,能够减小对人体的破坏性,并且能够与人体组织具有相互适应性。在一些示例中,在步骤 S10中,待焊金属33可以选自Ti(钛)、Nb(铌)、Ni(镍)、Zr(锆)、Ta(钽) 及它们的合金中的至少一种。由此,能够获得具有生物兼容性的待焊金属33。另外,在一个示例中,待焊金属33可以为纯Ti。在另一个示例中,待焊金属 33可以为Ti合金。另外,在又一个示例中,待焊金属33可以为铁镍合金。In this embodiment, the metal to be welded 33 may have biocompatibility. Thereby, damage to the human body can be reduced, and compatibility with human tissue can be achieved. In some examples, in step S10, the metal to be welded 33 may be selected from at least one of Ti (titanium), Nb (niobium), Ni (nickel), Zr (zirconium), Ta (tantalum) and alloys thereof . Thereby, the metal to be welded 33 having biocompatibility can be obtained. Additionally, in one example, the metal to be welded 33 may be pure Ti. In another example, the metal to be welded 33 may be a Ti alloy. In addition, in yet another example, the metal to be welded 33 may be an iron-nickel alloy.
在一些示例中,待焊金属33可以为非生物兼容性的金属。例如,待焊金属33可以由选自铜(Cu)、铁(Fe)、镁(Mg)、铅(Pb)、铝(Al)及它们的合金中的至少一种等。In some examples, the metal to be welded 33 may be a non-biocompatible metal. For example, the metal to be welded 33 may be made of at least one selected from copper (Cu), iron (Fe), magnesium (Mg), lead (Pb), aluminum (Al), and alloys thereof, or the like.
图6示出了本公开的示例所涉及的待焊件30的截面图。FIG. 6 shows a cross-sectional view of a
在一些示例中,如图6所示,待焊金属33可以具有环状突起331。在这种情况下,便于待焊件30后续与其他部件(未图示)的配合。在一些示例中,待焊金属33可以一体成型。In some examples, as shown in FIG. 6 , the metal to be welded 33 may have an
在一些示例中,环状突起331可以沿着内径方向延伸。另外,在一些示例中,环状突起331的内径可以小于金属钎料32(稍后介绍)的内径,即环状突起331的内直径可以小于金属钎料32的内直径。由此,能够与金属钎料32相配合,从而有利于钎焊。In some examples, the
在本实施方式中,在步骤S20之前,还可以包括对待焊金属33进行表面处理。由此,能够增加待焊金属33的表面润湿性能。In this embodiment, before step S20, surface treatment of the metal to be welded 33 may also be included. Thereby, the surface wettability of the metal to be welded 33 can be increased.
在一些示例中,待焊金属33可以使用砂纸逐级打磨来对待焊金属33进行表面处理。由此,能够更好地将待焊金属33的表面打磨成合适的粗糙度,增加待焊金属33的润湿性。例如,在一个示例中,待焊金属33可以用#200、#400、 #600、#1200、#2000和#4000砂纸逐级打磨。在另一个示例中,待焊金属33 可以用#100、#300、#500、#1000、#1500、#2500和#4000砂纸逐级打磨。另外,在又一个示例中,待焊金属33可以用#280、#400、#800、#1600、#2500、 #3500和#5000砂纸逐级打磨。In some examples, the metal to be welded 33 may be surface treated by sanding in stages using sandpaper. In this way, the surface of the metal to be welded 33 can be better polished to a suitable roughness, thereby increasing the wettability of the metal to be welded 33 . For example, in one example, the
在一些示例中,待焊金属33经表面处理后的平面度可以为8-10μm。在这种情况下,能够更好地与金属钎料32贴合,有利于钎焊。例如,待焊金属33 经表面处理后的平面度可以为8μm、8.2μm、8.5μm、8.8μm、9μm、9.2μm、9.5μm、 9.8μm或10μm。In some examples, the surface-treated flatness of the metal to be welded 33 may be 8-10 μm. In this case, it can better adhere to the metal
另外,在一些示例中,待焊金属33的平面度可以考虑金属钎料32的厚度的因素。在一些示例中,金属钎料32厚度越厚,待焊金属33能够容忍的平面度越大,反之,待焊金属33能够容忍的平面度越小。Additionally, in some examples, the flatness of the
另外,在本实施方式中,在步骤S20之前,可以包括对打磨后的待焊金属 33进行清洗。在一些示例中,可以对打磨后的待焊金属33用乙醇清洗10mi1 至20mi1,再用异丙醇清洗10mi1至20mi1。例如,可以对打磨后的待焊金属 33用乙醇清洗15mi1,再用异丙醇清洗15mi1。由此,能够去除待焊技术的表面的异物利于后续的钎焊。In addition, in this embodiment, before step S20, cleaning the
在一些示例中,在步骤S20中,金属化处理的方法可以为溅射、蒸镀、镀覆或高温烧结。由此,能够在待焊陶瓷31表面形成与之结合的中间金属层。在另一些示例中,金属化处理的方法优选为溅射。In some examples, in step S20, the method of metallization may be sputtering, evaporation, plating or high temperature sintering. Thereby, an intermediate metal layer combined with the ceramic 31 to be welded can be formed on the surface. In other examples, the method of metallization is preferably sputtering.
在一些示例中,金属化处理的方法可以为PVD(物理气相沉积)或CVD (化学气相淀积)。在另一些示例中,金属化处理的方法可以为磁控溅射。另外,在一些示例中,金属化处理的方法可以为低温处理方法。例如,磁控溅射的温度可以不超过300℃。In some examples, the method of metallization may be PVD (Physical Vapor Deposition) or CVD (Chemical Vapor Deposition). In other examples, the method of metallization may be magnetron sputtering. Additionally, in some examples, the method of metallization may be a low temperature processing method. For example, the temperature of magnetron sputtering may not exceed 300°C.
在一些示例中,在步骤S20中,中间金属层可以由选自Nb、Au、Ti及它们的合金中的至少一种构成。由此,能够很好地润湿表面具有中间金属层的待焊陶瓷31。另外,在一些示例中,中间金属层可以由Nb构成,换言之,中间金属层可以由Nb形成的铌层。此外,由Nb构成的中间金属层与氧化铝陶瓷具有良好的结合能力,由此,能够有助于提高待焊陶瓷31与待焊金属33钎焊的可靠性。In some examples, in step S20, the intermediate metal layer may be composed of at least one selected from the group consisting of Nb, Au, Ti and alloys thereof. Thereby, the ceramic to be welded 31 having the intermediate metal layer on the surface can be well wetted. Additionally, in some examples, the intermediate metal layer may be composed of Nb, in other words, the intermediate metal layer may be a niobium layer formed of Nb. In addition, the intermediate metal layer composed of Nb has good bonding ability with the alumina ceramics, thereby helping to improve the reliability of the brazing of the ceramics to be welded 31 and the metals to be welded 33 .
在一些示例中,可以对待焊陶瓷31的研磨面进行金属化处理形成中间金属层。也即,可以在待焊陶瓷31的研磨面形成中间金属层。在另一些示例中,待焊陶瓷31的表面可以经表面研磨和金属化处理而形成为钎焊面。In some examples, the ground surface of the ceramic to be welded 31 may be metallized to form an intermediate metal layer. That is, the intermediate metal layer may be formed on the ground surface of the ceramic to be welded 31 . In other examples, the surface of the ceramic to be welded 31 may be surface ground and metallized to form a brazing surface.
另外,在本实施方式中,在步骤S20中,待焊陶瓷31的热膨胀系数与中间金属层的热膨胀系数匹配,即中间金属层的热膨胀系数可以介于待焊陶瓷31 的热膨胀系数和待焊金属33的热膨胀系数之间,由此能够使待焊陶瓷31与待焊金属33的界面间的热膨胀系数呈现梯度过渡,减小界面间由于材料不同导致的热膨胀系数差异,进而减小界面的热应力,提高性能。In addition, in this embodiment, in step S20, the thermal expansion coefficient of the ceramic to be welded 31 matches the thermal expansion coefficient of the intermediate metal layer, that is, the thermal expansion coefficient of the intermediate metal layer may be between the thermal expansion coefficient of the ceramic to be welded 31 and the metal to be welded. 33, so that the thermal expansion coefficient between the interface of the ceramic to be welded 31 and the metal to be welded 33 presents a gradient transition, reducing the difference in the thermal expansion coefficient between the interfaces due to different materials, thereby reducing the thermal stress of the interface , to improve performance.
在一些示例中,金属化处理可以仅限于在钎焊面的边缘位置进行。换言之,可以在研磨面的边缘位置进行金属化处理形成与金属钎料32相匹配的经金属化处理的钎焊面。在这种情况下,能够在与待焊金属33进行钎焊的待焊陶瓷 31的位置上形成中间金属层。在另一些示例中,金属化处理可以对整个研磨面进行。在另一些示例中,金属化处理可以仅在研磨面的中间位置进行。In some examples, metallization may be limited to the edge locations of the brazed face. In other words, metallization can be performed at the edge of the ground surface to form a metallized brazing surface that matches the metal
在一些示例中,钎焊面的边缘位置可以形成有中间金属层。由此,能够有利于待焊陶瓷31与待焊金属33之间的焊接。In some examples, an intermediate metal layer may be formed at the edge locations of the brazing surface. Thus, the welding between the ceramic to be welded 31 and the metal to be welded 33 can be facilitated.
在一些示例中,中间金属层的形状可以在待焊金属33的形状的基础上进行选择。例如,待焊金属33呈环状,中间金属层可以为环形。另外,在一些示例中,中间金属层可以具有与待焊金属33相等的环宽。由此,能够更有利于待焊陶瓷31与待焊金属33之间的焊接。In some examples, the shape of the intermediate metal layer may be selected based on the shape of the
在一些示例中,中间金属层可以置于显微镜下放大500倍到1000倍观察中间金属层质量。例如,观察中间金属层是否紧密、外观是否平整等。In some examples, the intermediate metal layer can be placed under a microscope to magnify 500 times to 1000 times to observe the quality of the intermediate metal layer. For example, observe whether the intermediate metal layer is tight, whether the appearance is smooth, etc.
在一些示例中,在步骤S20中,可以采用磁控溅射法溅射Nb到待焊陶瓷 31的待钎焊位置上,溅射的Nb可以在待钎焊位置上成为平整的中间金属层。例如,待钎焊位置可以是图6中的金属钎料32所覆盖的待焊陶瓷31的边缘位置。In some examples, in step S20, magnetron sputtering can be used to sputter Nb onto the to-be-brazed position of the ceramic 31 to be brazed, and the sputtered Nb can become a flat intermediate metal layer at the to-be-brazed position. For example, the position to be brazed may be the edge position of the ceramic to be welded 31 covered by the metal
另外,在本实施方式中,在步骤S20中,可以包括对具有中间金属层的待焊陶瓷31进行清洗。由此,能够去除待焊陶瓷31的表面的异物利于后续的钎焊。在一些示例中,可以对具有中间金属层的待焊陶瓷31用乙醇清洗3mi1至 5mi1,再用异丙醇清洗3mi1至5mi1。例如,在一个示例中,可以对具有中间金属层的待焊陶瓷31用乙醇清洗4mi1,再用异丙醇清洗4mi1。In addition, in this embodiment, step S20 may include cleaning the ceramic to be welded 31 having the intermediate metal layer. Thus, foreign matter on the surface of the ceramic to be welded 31 can be removed, which is beneficial for subsequent brazing. In some examples, the ceramic to be welded 31 with the intermediate metal layer may be cleaned with ethanol for 3 to 5 mi, and then cleaned with isopropanol for 3 to 5 mi. For example, in one example, the ceramic 31 to be welded with the intermediate metal layer may be cleaned with ethanol for 4mi1, and then cleaned with isopropanol for 4mi1.
在一些示例中,在步骤S30之前,还可以包括准备金属钎料32。在另一些示例中,金属钎料32可以为薄片状。在这种情况下,能够有助于金属钎料32 熔融及浸润待焊材料(待焊陶瓷31、待焊金属33等)。例如,如图6所示,金属钎料32可以为环形的薄片状。但是本实施方式不限于此,在一些示例中,金属钎料32可以为粉末状、膏状、丝状、条状等。In some examples, before step S30, preparing metal
在一些示例中,金属钎料32可以具有生物兼容性。金属钎料32可以选自 Au、Ag、Ti、Nb及它们的合金中的至少一种。在这种情况下,能够形成具有生物安全性的钎焊层。例如,金属钎料32可以为纯Au。另外,在一些示例中,熔融的纯Au对于铌层具有良好的浸润性,由此,能够有助于提高待焊陶瓷31 与待焊金属33钎焊的可靠性。In some examples, the
另外,金属钎料32可以布置在钎焊面上。在一些示例中,金属钎料32可以置于中间金属层上。In addition, metal
在一些示例中,如图2所示,金属钎料32可以布置于边缘位置上。在这种情况下,能够在待焊陶瓷31的中间金属层上进行钎焊。在另一些示例中,金属钎料32可以布置于整个钎焊面。在一些示例中,金属钎料32可以布置于钎焊面的中间位置。In some examples, as shown in FIG. 2 , the
另外,在本实施方式中,在步骤S30中,可以包括对金属钎料32进行预处理。在一些示例中,金属钎料32可以使用砂纸逐级打磨来对金属钎料32进行表面处理。由此,能够去除表面的氧化膜。例如,在一个示例中,金属钎料 32可以用#200、#400、#600、#1200、#2000和#4000砂纸逐级打磨。在另一个示例中,金属钎料32可以用#100、#300、#500、#1000、#1500、#2500和#4000 砂纸逐级打磨。另外,在又一个示例中,金属钎料32可以用#280、#400、#800、#1600、#2500、#3500和#5000砂纸逐级打磨。In addition, in this embodiment, in step S30 , pretreatment of the metal
在一些示例中,待焊陶瓷31、待焊金属33与金属钎料32的尺寸可以相配合。由此,能够有利于待焊陶瓷31与待焊金属33进行钎焊。例如,金属钎料 32的外直径可以小于待焊陶瓷31的外直径,待焊金属33的外直径可以与待焊陶瓷31的外直径相等。In some examples, the sizes of the ceramic to be welded 31 , the metal to be welded 33 and the metal
在一些示例中,金属钎料32的外直径可以小于待焊陶瓷31的外直径。在另一些示例中,待焊陶瓷31的外直径与金属钎料32的外直径之差可以不超过 0.05mm。例如,待焊陶瓷31的外直径与金属钎料32的外直径之差可以为 0.01mm、0.02mm、0.03mm、0.04mm、0.05mm等。In some examples, the outer diameter of the
在一些示例中,待焊金属33的内直径可以小于待焊陶瓷31的直径。另外,待焊金属33可以具有与待焊陶瓷31相等的外直径。In some examples, the inner diameter of the metal to be welded 33 may be smaller than the diameter of the ceramic to be welded 31 . In addition, the metal to be welded 33 may have the same outer diameter as the ceramic to be welded 31 .
在一些示例中,待焊金属33的外直径可以大于待焊陶瓷31的外直径。在另一些示例中,待焊金属33的外直径可以小于待焊陶瓷31的外直径。In some examples, the outer diameter of the metal to be welded 33 may be larger than the outer diameter of the ceramic to be welded 31 . In other examples, the outer diameter of the metal to be welded 33 may be smaller than the outer diameter of the ceramic to be welded 31 .
在一些示例中,金属钎料32的内直径可以小于待焊金属33的内直径。换言之,金属钎料32的环宽可以小于待焊金属33的环宽。在另一些示例中,金属钎料32的内直径与待焊金属33的内直径之差可以不超过0.05mm。例如,金属钎料32的内直径与待焊金属33的内直径之差可以为0.01mm、0.02mm、 0.03mm、0.04mm、0.05mm等。另外,待焊金属33的内直径可以是指环状突起331的内直径。In some examples, the inner diameter of the
在一些示例中,中间金属层可以与待焊金属33相匹配。另外,在一些示例中,中间金属层的内直径可以与待焊金属33的内直径相等。在另一些示例中,中间金属层的外直径可以与待焊金属33的外直径相等。In some examples, the intermediate metal layer may match the metal to be welded 33 . Additionally, in some examples, the inner diameter of the intermediate metal layer may be equal to the inner diameter of the metal to be welded 33 . In other examples, the outer diameter of the intermediate metal layer may be equal to the outer diameter of the metal to be welded 33 .
在一些示例中,中间金属层的环宽可以与待焊金属33的环宽相等。在一些示例中,中间金属层的环宽可以大于与待焊金属33的环宽。In some examples, the ring width of the intermediate metal layer may be equal to the ring width of the metal to be welded 33 . In some examples, the ring width of the intermediate metal layer may be greater than the ring width of the metal to be welded 33 .
在一些示例中,待焊陶瓷31的外直径可以10mm至9.9mm。例如,待焊陶瓷31的外直径可以为9.9mm、9.91mm、9.92mm、9.93mm、9.94mm、9.95mm、 9.96mm、9.97mm、9.98mm、9.99mm或10mm。In some examples, the outer diameter of the ceramic to be welded 31 may be 10 mm to 9.9 mm. For example, the outer diameter of the ceramic to be welded 31 may be 9.9 mm, 9.91 mm, 9.92 mm, 9.93 mm, 9.94 mm, 9.95 mm, 9.96 mm, 9.97 mm, 9.98 mm, 9.99 mm or 10 mm.
在一些示例中,待焊金属33的外直径可以为10.1mm至9.9mm。例如,待焊金属33的外直径可以为9.9mm、9.92mm、9.95mm、9.98mm、10mm、 10.02mm、10.05mm、10.08mm或10.1mm。In some examples, the outer diameter of the metal to be welded 33 may be 10.1 mm to 9.9 mm. For example, the outer diameter of the metal to be welded 33 may be 9.9 mm, 9.92 mm, 9.95 mm, 9.98 mm, 10 mm, 10.02 mm, 10.05 mm, 10.08 mm or 10.1 mm.
在一些示例中,待焊金属33的内直径可以为8.9mm至8.7mm。例如,待焊金属33的内直径可以为8.7mm、8.72mm、8.75mm、8.78mm、8.8mm、8.82mm、 8.85mm、8.88mm或8.9mm。In some examples, the inner diameter of the metal to be welded 33 may be 8.9 mm to 8.7 mm. For example, the inner diameter of the metal to be welded 33 may be 8.7mm, 8.72mm, 8.75mm, 8.78mm, 8.8mm, 8.82mm, 8.85mm, 8.88mm or 8.9mm.
在一些示例中,待焊金属33的环宽可以为0.5mm至0.7mm。例如,待焊金属33的环宽可以为0.5mm、0.52mm、0.55mm、0.58mm、0.6mm、0.62mm、 0.65mm、0.68mm或0.7mm。In some examples, the ring width of the metal to be welded 33 may be 0.5 mm to 0.7 mm. For example, the ring width of the metal to be welded 33 may be 0.5mm, 0.52mm, 0.55mm, 0.58mm, 0.6mm, 0.62mm, 0.65mm, 0.68mm or 0.7mm.
在另一些示例中,金属钎料32的厚度可以为80μm至120μm。例如,金属钎料32的厚度可以为80μm、85μm、90μm、95μm、100μm、105μm、110μm、 115μm或120μm。In other examples, the thickness of the metal
在一些示例中,可选地,对待焊陶瓷31、金属钎料32与待焊金属33依次叠放形成的待焊件30施加压力。由此,能够在钎焊时固定待焊件30,并且能够控制钎缝宽度及其边缘的一致性。In some examples, optionally, pressure is applied to the workpiece to be welded 30 formed by stacking the ceramic to be welded 31 , the metal
以下,结合图示详细地描述本实施方式所涉及的步骤30中所使用的钎焊用的治具1。Hereinafter, the jig 1 for soldering used in
图2示出了本公开的示例所涉及的治具1的立体图。图3示出了图2所示的治具1沿着线A-A'的截面图。在图3中,为了方便表示载物台10的结构,省略了与载物台10配合的盖体。FIG. 2 shows a perspective view of the jig 1 according to the example of the present disclosure. FIG. 3 shows a cross-sectional view of the jig 1 shown in FIG. 2 along the line AA'. In FIG. 3 , for the convenience of showing the structure of the
在本实施方式中,钎焊用的治具(以下有时称“治具”)1可以具有载物台10和与载物台10配合的压块20。在步骤S30中,通过将待焊件30(待焊陶瓷31、金属钎料32和待焊金属33)依次置于载物台10,并且将与载物台 10配合的压块20配置在待焊件30上,从而能够实现待焊件30实现钎焊。In the present embodiment, a jig for soldering (hereinafter sometimes referred to as a “jig”) 1 may include a
另外,在一些示例中,载物台10可以呈半圆柱状。在这种情况下,能够更好地进行钎焊。例如,半圆柱状的载物台10可以置于具有圆柱状的炉体管的钎焊管式炉(未图示)中进行钎焊。另外,载物台10的形状可以与钎焊管式炉的炉体管的形状匹配。在这种情况下,有利于治具1在钎焊管式炉中的固定,能够更好地进行钎焊。例如,钎焊管式炉的炉体管可以呈棱柱状,载物台 10可以也呈棱柱状。Additionally, in some examples,
另外,在本实施方式中,钎焊管式炉可以连接真空泵(未图示)。在一些示例中,钎焊管式炉(未图示)内的真空度可以为10-4pa。在另一些示例中,钎焊管式炉(未图示)内的真空度可以为10-3pa。另外,在又一示例中,钎焊管式炉(未图示)内的真空度可以为10-2pa。In addition, in this embodiment, a vacuum pump (not shown) may be connected to the brazing tube furnace. In some examples, the vacuum level within the brazed tube furnace (not shown) may be 10 −4 pa. In other examples, the vacuum level in the brazed tube furnace (not shown) may be 10 −3 pa. In addition, in yet another example, the degree of vacuum in the brazed tube furnace (not shown) may be 10 −2 pa.
另外,在一些示例中,根据选择的钎料(金属钎料32),钎焊管式炉(未图示)内的真空度还可以为8×10-3pa、5×10-3pa、3×10-3pa、7×10-2pa、5× 10-2pa、2×10-2pa或1pa。In addition, in some examples, according to the selected brazing filler metal (metal brazing filler metal 32 ), the vacuum degree in the brazing tube furnace (not shown) can also be 8×10 -3 Pa, 5×10 -3 Pa, 3×10-3pa, 7× 10-2pa , 5× 10-2pa , 2 × 10-2pa or 1pa.
另外,在一些示例中,载物台10可以具有贯通孔12(参见图4)。另外,贯通孔12可以贯通凹槽11的底部11a。在一些示例中,载物台10可以具有至少一个凹槽(例如图3中的凹槽11,图3示出了四个凹槽11的例子)、以及从凹槽(凹槽11)的底部11a贯穿载物台10的贯通孔(贯通孔12)。Additionally, in some examples,
在一些示例中,凹槽11可以用于放置待焊件30(包括待焊陶瓷31、金属钎料32和待焊金属33),并且能够与压块20配合。另外,在一些示例中,压块20可以具有通气孔21。In some examples, the
另外,在载物台10设置多个凹槽11的情况下,能够同时对多个待焊件30 进行批量钎焊,提高作业效率。例如,除了图3的图示外,载物台10中可以具有2个、8个、12个、16个或20个凹槽11。In addition, when the
在一些示例中,压块20能够在钎焊过程中固定待焊件30,避免在钎焊过程中待焊件30发生位移。另外,治具1的贯通孔12与通气孔21中可以形成气体流动,因此在钎焊过程中能够使治具1温度分布均匀而使待焊件30受热均匀,并且通气孔21能够排出钎焊过程中所产生的金属蒸汽等杂质,从而避免待焊件30受到污染。In some examples, the
在一些示例中,凹槽11的底部11a可以为平坦状(参见图3)。由此,在凹槽11的底部11a能够平稳地放置待焊件30。In some examples, the bottom 11a of the
在一些示例中,凹槽11可以呈圆柱体状。在这种情况下,能够特别适用于同样也是圆柱状待焊件30。但是本实施方式不限于此,在一些示例中,凹槽 11也可以呈棱柱状等。例如,在一个示例中,凹槽11也可以呈长方体状。在另一个示例中,凹槽11也可以呈正方体状。In some examples, the
另外,在一些示例中,凹槽11的内径可以等于待焊件30钎焊温度下膨胀尺寸加上治具1钎焊温度下膨胀尺寸再加上预留尺寸。在一些示例中,预留尺寸可以为0.02mm-0.03mm。例如,预留尺寸可以为0.02mm、0.022mm、0.025mm、 0.028mm、0.03mm等。In addition, in some examples, the inner diameter of the
另外,在一些示例中,贯通孔12中能够具有热气的流动,从而能够在钎焊过程使载物台10内温度分布均匀,进而使待焊件30均匀受热。另外,贯通孔12的存在还能够更方便地清洁凹槽11。另外,由于贯通孔12能够贯通凹槽 11的底部11a,凹槽11可以用于放置待焊件30,因此贯通孔12能够利于取件。In addition, in some examples, the through
另外,在一些示例中,治具1还可以包括覆盖载物台10的盖体(未图示)。在这种情况下,能够保护钎焊时的气氛,能够很好地维持真空度。In addition, in some examples, the jig 1 may further include a cover (not shown) covering the
另外,在一些示例中,载物台10可以具有环绕凹槽11的沟槽13,盖体(未图示)的边缘可以与沟槽13配合。由此,盖体(未图示)能够覆盖载物台10。在一些示例中,盖体的边缘可以与沟槽13卡合。Additionally, in some examples, the
另外,在一些示例中,如图4所示,压块20可以为内径不同的两个圆柱体的组合体。在这种压块20中,内径小的圆柱体的直径小,因而可以与凹槽 11配合,而内径大的圆柱体的直径大,因而可以覆盖凹槽11。在这种情况下,能够通过压块20来实现对待焊件30的施压。In addition, in some examples, as shown in FIG. 4 , the
在一些示例中,在压块20中,内径小的圆柱体的直径可以小于凹槽11的内径。另外,在一些示例中,在压块20中,内径小的圆柱体的直径可以大于待焊金属33的内径。在另一些示例中,在压块20中,内径大的圆柱体的直径可以大于凹槽11的内径。In some examples, in the compact 20 , the diameter of the cylinder with a small inner diameter may be smaller than the inner diameter of the
在另一些示例中,压块20可以为棱柱体。另外,在一些示例中,压块20 可以为圆台。另外,在一些示例中,压块20一体成型。另外,在一些示例中,可以利用压块20对待焊陶瓷31和待焊金属33施加压力。In other examples, the compact 20 may be a prism. Additionally, in some examples, the
在一些示例中,在压块20中可以设置有通气孔21。另外,在一些示例中,压块20可以具有多个通气孔21,例如压块20可以具有2个、3个通气孔21。在这种情况下,由于通气孔21内能够形成气体流动,从而能够在钎焊过程使载物台10内温度分布均匀,进而能够使待焊件30均匀受热。另外,通气孔21 也能够帮助排出钎焊过程中所产生的金属蒸汽等杂质,从而避免待焊件30被污染。In some examples, vent holes 21 may be provided in the compact 20 . In addition, in some examples, the
在一些示例中,在多个通气孔21中,可以具有沿着长度方向贯通的通气孔21。在这种情况下,能够进一步提高待焊件30受热的均匀性,并且能够更好地避免待焊件30被污染。In some examples, among the plurality of ventilation holes 21 , there may be ventilation holes 21 penetrating in the longitudinal direction. In this case, the uniformity of heating of the parts to be welded 30 can be further improved, and the contamination of the parts to be welded 30 can be better avoided.
在一些示例中,压块20可以用于对待焊陶瓷31和待焊金属33分别施加压力。在这种情况下,能够较好地控制钎缝宽度及其边缘的一致性并在钎焊时固定待焊件30。In some examples, the compact 20 may be used to separately apply pressure to the ceramic to be welded 31 and the metal to be welded 33 . In this case, the uniformity of the width of the brazing seam and its edges can be better controlled and the
另外,在一些示例中,待焊件30可以位于凹槽11的底部11a与压块20 之间。由此,能够使待焊件30很好地被固定在凹槽11内。In addition, in some examples, the part to be welded 30 may be located between the bottom 11 a of the
另外,在本实施方式中,载物台10的材料可以选自石墨、硅、合成石、碳化硼、碳化硅、氮化硼、氮化硅、磷化硼、磷化硅中的至少一种构成。在一个示例中,载物台10的材料可以为石墨。在另一个示例中,载物台10的材料可以为合成石。In addition, in this embodiment, the material of the
另外,在本实施方式中,压块20的材料可以选自石墨、硅、合成石、碳化硼、碳化硅、氮化硼、氮化硅、磷化硼、磷化硅中的至少一种构成。在一个示例中,压块20的材料可以为石墨。在另一个示例中,压块20的材料可以为合成石。In addition, in the present embodiment, the material of the compact 20 may be composed of at least one selected from the group consisting of graphite, silicon, synthetic stone, boron carbide, silicon carbide, boron nitride, silicon nitride, boron phosphide, and silicon phosphide. . In one example, the material of the compact 20 may be graphite. In another example, the material of the compact 20 may be synthetic stone.
另外,在一些示例中,治具1的长度和凹槽11可以分布于钎焊管式炉的温度均匀的温区。由此,能够同时对多个待焊件30进行很好地钎焊。Additionally, in some examples, the length of the fixture 1 and the
另外,在本实施方式中,如图4所示,在步骤S30中可以将待焊件30放置于载物台10上的凹槽11中,再用压块20将待焊件30压住,即可完成装配。接着,装配好的载物台10、压块20和待焊件30送入例如钎焊管式炉进行钎焊。在一些示例中,装配好的载物台10、压块20和待焊件30被送入钎焊管式炉的温度均匀的温区。由此,能够同时对多个待焊件30进行较好地钎焊。In addition, in this embodiment, as shown in FIG. 4 , in step S30, the
另外,在一些示例中,图4中的待焊件30的各部件在凹槽11内从下而上叠放的顺序可以为待焊陶瓷31、金属钎料32与待焊金属33(参见图2和图6)。例如,待焊件30各部件在凹槽11内从下而上叠放的顺序可以为圆盘状Al2O3陶瓷、纯Au钎料环与纯Ti金属环,并且圆盘状Al2O3陶瓷、纯Au钎料环与纯Ti金属环的圆心可以在同一点,圆盘状Al2O3陶瓷与纯Ti金属环的外直径大致相同,且纯Au钎料环的外直径比圆盘状Al2O3陶瓷的外直径最多小 0.05mm。In addition, in some examples, the order of stacking the components of the
在一些示例中,压块20与载物台10的凹槽11的侧壁之间可以存在间隙。另外,在一些示例中,压块20与载物台10的凹槽11的侧壁之间的间隙H可以为0.05mm至0.06mm(参见图6),在这种情况下,能够预留治具1与待焊件30的膨胀尺寸,并且能够在钎焊完成时顺利地取出器件。另外,压块20与凹槽11的侧壁之间具有间隙,由此能够进一步排出钎焊过程中所产生的金属蒸汽等杂质。In some examples, a gap may exist between the
在一些示例中,治具1还可以具有套环。在另一些示例中,套环可以放置于凹槽11内并且可以包围待焊件30。在这种情况下,能够减少金属钎料32 熔融后外淌。In some examples, the jig 1 may also have a collar. In other examples, a collar may be placed within
在一些示例中,凹槽11的内径可以等于待焊件30钎焊温度下的膨胀尺寸加上治具1钎焊温度下的膨胀尺寸再加上套环的厚度和预留尺寸。In some examples, the inner diameter of the
另外,在一些示例中,为了使待焊件30中的金属钎料32在钎焊过程中不外淌,可以通过计算金属钎料32的用量、控制保温时间及母材的表面状态等方式来实现。In addition, in some examples, in order to prevent the metal
图4示出了本公开的示例所涉及的装配有待焊件30的治具1的截面图。FIG. 4 shows a cross-sectional view of a jig 1 equipped with a to-
图5示出了本公开的示例所涉及的待焊件30的装配结构图。FIG. 5 shows an assembly structure diagram of the to-
另外,在本实施方式中,在步骤S30中,如图4所示,可以将待焊件30 放置于载物台10上的凹槽11中,再用压块20将待焊件30压住,即可完成装配。接着,装配好的载物台10、压块20和待焊件30送入例如钎焊管式炉进行钎焊。在一些示例中,装配好的载物台10、压块20和待焊件30被送入钎焊管式炉的温度均匀的温区。由此,能够同时对多个待焊件30进行很好地钎焊。In addition, in this embodiment, in step S30 , as shown in FIG. 4 , the
另外,在一些示例中,压块20与载物台10的凹槽11的侧壁之间的间隙 H可以为0.05mm至0.06mm(参见图4),在这种情况下,能够在钎焊完成时顺利地取出焊接件。另外,如上所述,载物台10可以具有多个凹槽11,由此能够同时对多个待焊件30进行钎焊。例如,除了图2和图3的图示外,载物台10中可以具有4个、12个、16个或20个凹槽11。In addition, in some examples, the gap H between the
另外,在一些示例中,待焊件30各部件在凹槽11内从下而上叠放的顺序可以为待焊陶瓷31、金属钎料32与待焊金属33(参见图5)。例如,待焊件 30各部件在凹槽11内从下而上叠放的顺序可以为圆形Al2O3陶瓷基底、纯Au 钎料环与纯Ti金属环,并且圆形Al2O3陶瓷基底、纯Au钎料环与纯Ti金属环的外直径大致相同。In addition, in some examples, the order of stacking the components of the
另外,在本实施方式中,在步骤S30中,对待焊件30可以以1℃1mi1至 50℃1mi1的加热速率升温至1060℃至1150℃,保温1mi1至30mi1,然后以 2℃1mi1至20℃1mi1的降温速率降温至200℃至400℃,然后随炉冷却至150℃以下。其中,1060℃至1150℃可以作为钎焊温度。在这种情况下,能够改善界面间脆性相的产生和分布,增加强度、减小热应力和母材的热变形,消除焊缝中的裂纹,提升待焊陶瓷31与待焊金属33之间界面层的气密性和剪切强度。In addition, in this embodiment, in step S30, the
另外,在一些示例中,在步骤S30中,可以以20℃1mi1的加热速率升温至1060℃,保温1mi1,然后以10℃1mi1的降温速率降温至400℃,然后随炉冷却至150℃。在另一些示例中,可以以15℃1mi1的加热速率升温至1065℃,保温3mi1,然后以12℃1mi1的降温速率降温至250℃,然后随炉冷却至140℃。另外,在又一示例中,可以以30℃1mi1的加热速率升温至1100℃,保温5mi1,然后以8℃1mi1的降温速率降温至300℃,然后随炉冷却至120℃。In addition, in some examples, in step S30, the temperature may be raised to 1060°C at a heating rate of 20°C 1mi1, maintained for 1mi1, then cooled to 400°C at a cooling rate of 10°C 1mi1, and then cooled to 150°C with the furnace. In other examples, the temperature can be raised to 1065°C at a heating rate of 15°C 1mi1, maintained for 3mi1, then cooled to 250°C at a cooling rate of 12°C 1mi1, and then cooled to 140°C with the furnace. In addition, in another example, the temperature can be raised to 1100°C at a heating rate of 30°C 1mi1, maintained for 5mi1, then cooled to 300°C at a cooling rate of 8°C 1mi1, and then cooled to 120°C with the furnace.
另外,根据选择的钎料(金属钎料32),钎焊温度还可以为850℃、900 ℃、950℃、1000℃、1050℃、1150℃、1200℃等。In addition, the brazing temperature may be 850°C, 900°C, 950°C, 1000°C, 1050°C, 1150°C, 1200°C, etc. depending on the selected brazing filler metal (metal brazing filler metal 32 ).
在一些示例中,钎焊后,待焊陶瓷31与待焊金属33的界面之间可以形成界面层。另外,在一些示例中,界面层可以包括金属钎料32和IMC层。在另一些示例中,IMC层可以为连续的IMC层。在一些示例中,IMC层可以为不连续的IMC层。In some examples, after brazing, an interface layer may be formed between the interface of the ceramic to be welded 31 and the metal to be welded 33 . Additionally, in some examples, the interfacial layer may include the
在一些示例中,IMC层可以位于待焊金属33与金属钎料32之间。另外,在一些示例中,界面层可以包括多层的IMC层。例如,界面层中可以具有2 层、3层、4层或5层的IMC层。另外,在一些示例中,多层的IMC层均可以位于待焊金属33与金属钎料32之间。In some examples, the IMC layer may be located between the metal to be soldered 33 and the metal
在一些示例中,多层的IMC层可以包括脆性相层。另外,在一些示例中,脆性相层可以是指脆性相(脆性化合物)含量较多的合金层。在另一些示例中,脆性相层的厚度可以不超过2μm。例如,脆性相层的厚度可以为0.5μm、0.8μm、 1μm、1.1μm、1.2μm、1.3μm、1.4μm、1.5μm、1.6μm、1.7μm、1.8μm或2μm。In some examples, the multilayered IMC layer may include a brittle phase layer. In addition, in some examples, the brittle phase layer may refer to an alloy layer with a high content of brittle phase (brittle compound). In other examples, the thickness of the brittle phase layer may not exceed 2 μm. For example, the thickness of the brittle phase layer may be 0.5 μm, 0.8 μm, 1 μm, 1.1 μm, 1.2 μm, 1.3 μm, 1.4 μm, 1.5 μm, 1.6 μm, 1.7 μm, 1.8 μm or 2 μm.
根据本公开,能够提供一种能够减小界面层的热应力并且提高界面层的气密性和剪切强度的陶瓷与金属的钎焊方法。According to the present disclosure, it is possible to provide a ceramic-metal brazing method capable of reducing the thermal stress of the interface layer and improving the airtightness and shear strength of the interface layer.
为了进一步说明本公开,以下结合实施例对本公开提供的陶瓷与金属的钎焊方法进行详细描述,并对本公开实现的有益效果进行充分说明。In order to further illustrate the present disclosure, the brazing method for ceramics and metals provided by the present disclosure will be described in detail below with reference to the embodiments, and the beneficial effects achieved by the present disclosure will be fully explained.
图7示出了本公开的实施例中所涉及的Al2O3陶瓷与纯Ti金属的钎焊接头的切片图。7 shows a slice view of a brazed joint of Al 2 O 3 ceramic and pure Ti metal involved in an embodiment of the present disclosure.
【实施例】【Example】
(1)对圆盘状的Al2O3陶瓷的上表面进行表面研磨及抛光至表面粗糙度为 0.02μm;(1) Surface grinding and polishing the upper surface of the disc-shaped Al 2 O 3 ceramic to a surface roughness of 0.02 μm;
(2)对抛光后的Al2O3陶瓷的上表面进行金属化处理,处理方式为采用磁控溅射法溅射Nb到Al2O3陶瓷的待焊面上,得到待焊金属化陶瓷;(2) Metallization is performed on the upper surface of the polished Al 2 O 3 ceramic, and the treatment method is to sputter Nb onto the surface to be welded of the Al 2 O 3 ceramic by using a magnetron sputtering method to obtain the to-be-welded metallized ceramic ;
(3)将待焊金属化陶瓷用乙醇清洗4mi1,再用异丙醇清洗4mi1,得到干净的待焊金属化陶瓷;(3) cleaning the metallized ceramics to be welded with ethanol for 4ml, and then cleaning 4ml of isopropyl alcohol to obtain clean metallized ceramics to be welded;
(4)将环状的纯Ti金属和环形薄片状的纯Au箔状钎料用#200、#400、 #600、#1200、#2000、#4000砂纸逐级打磨,然后用乙醇清洗10mi1,再用异丙醇清洗15mi1,得到干净的纯Ti金属和纯Au箔状钎料;(4) Grind the ring-shaped pure Ti metal and the ring-shaped pure Au foil-shaped brazing filler metal with #200, #400, #600, #1200, #2000, #4000 sandpaper step by step, and then clean it with ethanol for 10mi1, Then use isopropanol to clean 15mi1 to get clean pure Ti metal and pure Au foil brazing filler metal;
(5)将干净的待焊金属化陶瓷、纯Au箔状钎料和纯Ti金属按顺序依次从下而上叠放在治具中,固定后得到待焊件;(5) The clean metallized ceramics to be welded, pure Au foil brazing filler metal and pure Ti metal are stacked in the jig in order from bottom to top, and the parts to be welded are obtained after fixing;
(6)将装配有待焊件的治具置于真空钎焊炉中,以20℃1mi1的加热速率升温至1060℃,保温1mi1,然后以10℃1mi1的降温速率降温至400℃,最后随炉冷却至150℃,即完成钎焊。(6) Place the fixture with the parts to be welded in a vacuum brazing furnace, heat it up to 1060°C at a heating rate of 20°C 1mi1, keep the temperature for 1mi1, and then cool it down to 400°C at a cooling rate of 10°C 1mi1, and finally follow the furnace. After cooling to 150°C, the brazing is completed.
最后,开炉取出Al2O3陶瓷与纯Ti金属的钎焊接头,然后对钎焊接头进行气密性测试和室温抗剪强度测试,并且对钎焊接头进行切片观察钎焊接头的组织结构。Finally, open the furnace and take out the brazed joint of Al 2 O 3 ceramic and pure Ti metal, then carry out the air tightness test and room temperature shear strength test of the brazed joint, and slice the brazed joint to observe the microstructure of the brazed joint .
本实施例中钎焊接头的气密性测试和室温抗剪强度测试的测试结果为:气密性为1E-10*m31s,室温抗剪强度为20Mpa。The test results of the air tightness test and the room temperature shear strength test of the brazed joint in this embodiment are: the air tightness is 1E-10*m 3 1s, and the room temperature shear strength is 20Mpa.
另外,钎焊接头的切片结果如图7所示,由图7可观察到纯Au钎料完全填充钎缝,焊缝中未出现气孔、未焊合等缺陷,钎料与两侧母材(Al2O3陶瓷和纯Ti金属)界面反应充分,形成了良好的冶金结合,并且Al2O3陶瓷侧和钎缝中都没有出现裂纹,而且脆性相仅分布在纯Ti金属侧。此外,钎缝大部分为纯Au钎料,能够有效缓解钎焊接头的热应力以及提高钎焊接头强度。In addition, the slicing results of the brazed joint are shown in Figure 7. From Figure 7, it can be observed that the pure Au solder fills the brazing joint completely, and there are no defects such as pores and unwelded joints in the solder joint. The solder and the base metal on both sides ( Al 2 O 3 ceramics and pure Ti metal) interface reaction is sufficient, forming a good metallurgical bond, and no cracks appear on the Al 2 O 3 ceramic side and in the brazing seam, and the brittle phase is only distributed on the pure Ti metal side. In addition, most of the brazing seam is pure Au solder, which can effectively relieve the thermal stress of the brazed joint and improve the strength of the brazed joint.
综上所述,实施例中所获得的钎焊接头的热应力小,且具有良好的气密性和剪切强度。To sum up, the brazed joints obtained in the examples have small thermal stress, and have good air tightness and shear strength.
虽然以上结合附图和实施方式对本公开进行了具体说明,但是可以理解,上述说明不以任何形式限制本公开。本领域技术人员在不偏离本公开的实质精神和范围的情况下可以根据需要对本公开进行变形和变化,这些变形和变化均落入本公开的范围内。Although the present disclosure has been specifically described above with reference to the accompanying drawings and embodiments, it should be understood that the above description does not limit the present disclosure in any form. Those skilled in the art can make modifications and changes of the present disclosure as required without departing from the essential spirit and scope of the present disclosure, and these modifications and changes all fall within the scope of the present disclosure.
Claims (10)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201811650747.6A CN109734469A (en) | 2018-12-31 | 2018-12-31 | The method for welding of ceramics and metal |
CN2018116507476 | 2018-12-31 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN110776330A true CN110776330A (en) | 2020-02-11 |
Family
ID=66362937
Family Applications (5)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201811650747.6A Pending CN109734469A (en) | 2018-12-31 | 2018-12-31 | The method for welding of ceramics and metal |
CN201922231700.2U Active CN211522037U (en) | 2018-12-31 | 2019-12-11 | Brazing structure of ceramic and metal |
CN201911266054.1A Pending CN110776329A (en) | 2018-12-31 | 2019-12-11 | Brazing method of ceramic and metal |
CN201911268867.4A Pending CN110776330A (en) | 2018-12-31 | 2019-12-11 | Brazing method of ceramic and metal |
CN201911268811.9A Pending CN110734298A (en) | 2018-12-31 | 2019-12-11 | Brazing structure of ceramic and metal |
Family Applications Before (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201811650747.6A Pending CN109734469A (en) | 2018-12-31 | 2018-12-31 | The method for welding of ceramics and metal |
CN201922231700.2U Active CN211522037U (en) | 2018-12-31 | 2019-12-11 | Brazing structure of ceramic and metal |
CN201911266054.1A Pending CN110776329A (en) | 2018-12-31 | 2019-12-11 | Brazing method of ceramic and metal |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201911268811.9A Pending CN110734298A (en) | 2018-12-31 | 2019-12-11 | Brazing structure of ceramic and metal |
Country Status (1)
Country | Link |
---|---|
CN (5) | CN109734469A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112723899A (en) * | 2020-12-31 | 2021-04-30 | 淮安市浩远机械制造有限公司 | Aluminum oxide ceramic brazing alloy steel composite wear-resisting plate and preparation process thereof |
CN114014683A (en) * | 2021-11-16 | 2022-02-08 | 西安赛尔电子材料科技有限公司 | Brazing method for improving sealing strength of metal lead and ceramic insulator |
CN114669816A (en) * | 2022-04-22 | 2022-06-28 | 湖南省新化县鑫星电子陶瓷有限责任公司 | Alumina ceramic-metal brazing method |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110369907B (en) * | 2019-08-01 | 2021-05-11 | 衢州学院 | Brazing filler metal for connecting high Nb-TiAl alloy and alumina ceramic and connecting method thereof |
CN112658976B (en) * | 2019-12-17 | 2022-07-22 | 深圳硅基仿生科技有限公司 | Method for grinding the surface of ceramics |
CN113492255A (en) * | 2020-04-08 | 2021-10-12 | 昆山微电子技术研究院 | Sample welding method |
CN112802732B (en) * | 2021-01-07 | 2023-04-07 | 上海奕瑞光电子科技股份有限公司 | Ceramic migration tube and manufacturing method thereof |
CN112975032B (en) * | 2021-02-23 | 2022-09-27 | 浙江浙能兰溪发电有限责任公司 | Brazing method of silicon carbide ceramic |
CN112851389B (en) * | 2021-04-14 | 2022-03-15 | 哈尔滨工业大学 | A method for connecting SiC ceramic materials using calcium oxide/alumina/silicon dioxide/lithium oxide glass solder |
CN113732424B (en) * | 2021-09-14 | 2022-08-02 | 哈尔滨工业大学 | A low-expansion 4J42 alloy interlayer auxiliary brazing material to improve the quality of silicon carbide-niobium brazing connection |
CN114105669A (en) * | 2021-11-11 | 2022-03-01 | 南京理工大学 | Composite manufacturing and stress releasing method of engine ceramic-clad cylinder liner |
CN114874024A (en) * | 2022-06-22 | 2022-08-09 | 衡阳凯新特种材料科技有限公司 | Composite material, manufacturing method of composite material and piston |
CN115302033B (en) * | 2022-08-22 | 2023-11-21 | 哈尔滨工业大学(威海) | Low-temperature indirect brazing method for zirconia ceramic and titanium alloy |
CN115805349A (en) * | 2022-12-02 | 2023-03-17 | 浙江工业大学 | Connecting process of copper-clad plate ceramic and oxygen-free copper foil of IGBT module |
CN115625394A (en) * | 2022-12-21 | 2023-01-20 | 中国机械总院集团北京机电研究所有限公司 | Active brazing method for large-size graphite/copper dissimilar material joint |
CN116283337B (en) * | 2023-03-30 | 2024-02-06 | 中国科学院上海硅酸盐研究所 | A boron carbide ceramic-metal gradient connection structure and its preparation method |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS645982A (en) * | 1987-06-26 | 1989-01-10 | Fujikura Ltd | Method for bonding ceramics |
JPH01179769A (en) * | 1988-01-11 | 1989-07-17 | Showa Denko Kk | Method of joining ceramic materials and metal materials |
CN1121499A (en) * | 1994-08-02 | 1996-05-01 | 住友电气工业株式会社 | Metallized ceramic substrate with smooth coating and method of manufacturing the same |
CN1903795A (en) * | 2006-08-02 | 2007-01-31 | 哈尔滨工业大学 | Method of low temperature active vacuum diffusion connecting ceramic |
CN101182230A (en) * | 2007-11-28 | 2008-05-21 | 哈尔滨工业大学 | A method of vacuum diffusion bonding ceramics |
CN105149717A (en) * | 2015-10-19 | 2015-12-16 | 哈尔滨工业大学 | Silicon-based ceramic surface metallization method |
CN105436643A (en) * | 2016-01-07 | 2016-03-30 | 上海电机学院 | Direct aluminum or aluminum alloy brazing method for aluminum oxide ceramics |
CN106563861A (en) * | 2016-10-19 | 2017-04-19 | 哈尔滨工业大学(威海) | Ultrasonic soldering method for fast forming ceramic-metal interconnection |
CN108546095A (en) * | 2018-05-23 | 2018-09-18 | 广东工业大学 | A kind of method that oxide ceramics is welded to connect with metal |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2822627A1 (en) * | 1978-05-24 | 1979-11-29 | Volkswagenwerk Ag | CERANOX COMPOUND AND METHOD OF MANUFACTURING IT |
US4883218A (en) * | 1989-03-17 | 1989-11-28 | Gte Laboratories Incorporated | Method of brazing a ceramic article to a metal article |
JP5686338B2 (en) * | 2009-12-22 | 2015-03-18 | 日鉄住金防蝕株式会社 | Rotary grinding tool and manufacturing method thereof |
CN101786898B (en) * | 2010-01-15 | 2011-12-28 | 北京科技大学 | Method for connecting Cf/SiC composite material and Ni-based high-temperature alloy |
CN102294528B (en) * | 2011-08-12 | 2013-05-22 | 江苏华昌工具制造有限公司 | Process for carrying out entire high-frequency brazing by welding jig |
JP5959170B2 (en) * | 2011-09-05 | 2016-08-02 | 三井金属鉱業株式会社 | Ceramic bonded body and manufacturing method thereof |
CN102825354B (en) * | 2012-09-20 | 2015-08-05 | 北京科技大学 | A kind of C fcompound-the diffusion soldering method of/SiC ceramic based composites and titanium alloy |
EP2913140B1 (en) * | 2014-02-26 | 2018-01-03 | Heraeus Precious Metals North America Conshohocken LLC | Molybdenum-containing glass frit for electroconductive paste composition |
CN104722955A (en) * | 2015-03-20 | 2015-06-24 | 江苏科技大学 | A kind of high-temperature solder for brazing Si3N4 ceramics and stainless steel and its preparation method and brazing process |
CN105036783B (en) * | 2015-07-09 | 2018-07-17 | 清华大学 | A kind of method for welding of ceramics and metal or ceramics and ceramics |
CN106493443B (en) * | 2016-10-25 | 2018-10-09 | 哈尔滨工业大学 | A kind of method of composite interlayer ceramic soldering or ceramic matric composite and metal |
CN207186714U (en) * | 2017-03-06 | 2018-04-06 | 河北鼎瓷电子科技有限公司 | Multilayer ceramic substrate |
CN107096994A (en) * | 2017-04-25 | 2017-08-29 | 南京云启金锐新材料有限公司 | The diffusion welding (DW) fitting and its production method of a kind of high-purity zirconia composite ceramics and red copper |
CN106944698B (en) * | 2017-05-12 | 2019-12-10 | 哈尔滨工业大学 | SiC ceramic or SiC ceramic reinforced aluminum matrix composite material ultrasonic low-temperature direct brazing method based on thermal oxidation surface modification |
CN107457499B (en) * | 2017-08-09 | 2020-01-17 | 合肥工业大学 | Preparation and brazing process of high temperature brazing filler metal for silicon carbide ceramics and their composites |
CN107649758B (en) * | 2017-09-29 | 2019-08-02 | 哈尔滨工业大学 | A method of porous silicon nitride ceramic and invar alloy are brazed using composite soldering |
CN108672965B (en) * | 2018-05-07 | 2020-08-28 | 中国工程物理研究院电子工程研究所 | Method for relieving residual stress of ceramic and metal soldered joint |
-
2018
- 2018-12-31 CN CN201811650747.6A patent/CN109734469A/en active Pending
-
2019
- 2019-12-11 CN CN201922231700.2U patent/CN211522037U/en active Active
- 2019-12-11 CN CN201911266054.1A patent/CN110776329A/en active Pending
- 2019-12-11 CN CN201911268867.4A patent/CN110776330A/en active Pending
- 2019-12-11 CN CN201911268811.9A patent/CN110734298A/en active Pending
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS645982A (en) * | 1987-06-26 | 1989-01-10 | Fujikura Ltd | Method for bonding ceramics |
JPH01179769A (en) * | 1988-01-11 | 1989-07-17 | Showa Denko Kk | Method of joining ceramic materials and metal materials |
CN1121499A (en) * | 1994-08-02 | 1996-05-01 | 住友电气工业株式会社 | Metallized ceramic substrate with smooth coating and method of manufacturing the same |
CN1903795A (en) * | 2006-08-02 | 2007-01-31 | 哈尔滨工业大学 | Method of low temperature active vacuum diffusion connecting ceramic |
CN101182230A (en) * | 2007-11-28 | 2008-05-21 | 哈尔滨工业大学 | A method of vacuum diffusion bonding ceramics |
CN105149717A (en) * | 2015-10-19 | 2015-12-16 | 哈尔滨工业大学 | Silicon-based ceramic surface metallization method |
CN105436643A (en) * | 2016-01-07 | 2016-03-30 | 上海电机学院 | Direct aluminum or aluminum alloy brazing method for aluminum oxide ceramics |
CN106563861A (en) * | 2016-10-19 | 2017-04-19 | 哈尔滨工业大学(威海) | Ultrasonic soldering method for fast forming ceramic-metal interconnection |
CN108546095A (en) * | 2018-05-23 | 2018-09-18 | 广东工业大学 | A kind of method that oxide ceramics is welded to connect with metal |
Non-Patent Citations (1)
Title |
---|
小西良弘 等: "《电子陶瓷基础和应用》", 31 May 1983, 机械工业出版社 * |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112723899A (en) * | 2020-12-31 | 2021-04-30 | 淮安市浩远机械制造有限公司 | Aluminum oxide ceramic brazing alloy steel composite wear-resisting plate and preparation process thereof |
CN114014683A (en) * | 2021-11-16 | 2022-02-08 | 西安赛尔电子材料科技有限公司 | Brazing method for improving sealing strength of metal lead and ceramic insulator |
CN114669816A (en) * | 2022-04-22 | 2022-06-28 | 湖南省新化县鑫星电子陶瓷有限责任公司 | Alumina ceramic-metal brazing method |
CN114669816B (en) * | 2022-04-22 | 2023-08-22 | 湖南省新化县鑫星电子陶瓷有限责任公司 | Alumina ceramic-metal brazing method |
Also Published As
Publication number | Publication date |
---|---|
CN211522037U (en) | 2020-09-18 |
CN110776329A (en) | 2020-02-11 |
CN110734298A (en) | 2020-01-31 |
CN109734469A (en) | 2019-05-10 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN110776330A (en) | Brazing method of ceramic and metal | |
US4602731A (en) | Direct liquid phase bonding of ceramics to metals | |
CN106493443B (en) | A kind of method of composite interlayer ceramic soldering or ceramic matric composite and metal | |
TWI321127B (en) | ||
JP3967278B2 (en) | Joining member and electrostatic chuck | |
JP7000347B2 (en) | Heat dissipation parts for semiconductor devices | |
JP2012025654A (en) | Process for joining carbon steel and zirconia ceramic and composite article made by the same | |
JPH0247428B2 (en) | ||
CN111892418A (en) | A connecting material for connecting silicon carbide ceramics and application method thereof | |
US5525432A (en) | Internal soldering in metal/ceramic composites | |
CN106862693A (en) | A kind of tungsten/copper or tungsten/steel joint and preparation method thereof | |
CN110734297A (en) | Connection method and joint structure of ceramic and metal | |
JP6082524B2 (en) | Bonded body of ceramic member and metal member and manufacturing method thereof | |
CN109604761B (en) | Jig for soldering | |
JP6546953B2 (en) | Sputtering target-backing plate assembly and method for manufacturing the same | |
JPH09249462A (en) | Bonded material, its production and brazing material for ceramic member | |
CN105436643A (en) | Direct aluminum or aluminum alloy brazing method for aluminum oxide ceramics | |
JP2519578B2 (en) | Method of joining metal member and ceramics or cermet member | |
JPS59232692A (en) | Brazing filler metal for joining ceramics and metal or the like and composite body composed of ceramics and metal or the like using said brazing filler metal | |
CN211688841U (en) | Joint structure for connecting ceramic and metal | |
CN209532350U (en) | The jig of soldering with venthole | |
JP2020059915A (en) | Sputtering target/backing plate conjugate, and manufacturing method therefor | |
JPS6197174A (en) | Diffusion bonding method between ceramics and metal | |
CN110683855A (en) | A Biocompatible Al2O3/Ti Diffusion Bonding Method | |
JPS5895671A (en) | How to join ceramics and metal |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CB02 | Change of applicant information |
Address after: 518000 area a, 4th floor, building 3, Tingwei Industrial Park, No.6 Liufang Road, Xin'an street, Shenzhen City, Guangdong Province Applicant after: Shenzhen Silicon Bionics Technology Co.,Ltd. Address before: 518000 area a, 4th floor, building 3, Tingwei Industrial Park, No.6 Liufang Road, Xin'an street, Shenzhen City, Guangdong Province Applicant before: SHENZHEN SIBIONICS TECHNOLOGY Co.,Ltd. |
|
CB02 | Change of applicant information | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20200211 |
|
RJ01 | Rejection of invention patent application after publication |