JPS59232692A - Brazing filler metal for joining ceramics and metal or the like and composite body composed of ceramics and metal or the like using said brazing filler metal - Google Patents

Abstract

PURPOSE:To provide a titled brazing filler metal which can join ceramics and a metal, etc. having considerably different coeffts. of thermal expansion with one heating operation by consisting the material of a specifically composed alloy of Ti and one kind of Ag or Cu. CONSTITUTION:A brazing filler metal consists of an alloy contg. 3-80wt% Ti and >=1 kind of Ag or Cu and joins securely ceramics and a material such as a metal, glass, ceramics or the like having considerably different coeffts. of thermal expansion with one heating operation in a non-oxidizing atmosphere so that the composite body composed of said materials can be formed. The above- mentioned brazing filler metal is preferably used as a clad brazing filler metal for joining by laminating and uniting said material with a metal having a low coefft. of expansion such as W, ''Kovar'' or the like or a metal having a low Young's modulus such as Cu, Ag or the like, by which the residual stress or strain to be applied on the composite body after cooling is decreased.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a single or gund type solder which is used for joining ceramics to materials such as metals, glass or ceramics (in the present invention, these are collectively referred to as metals, etc.). The present invention relates to materials and composites joined using the same.

Conventionally known methods for joining ceramics and metals include joining alumina ceramics and Kovar using a high melting point metal method, and joining alumina ceramics and niobium using an oxide solder method.

The former high-melting point metal method, for example, involves applying a Mo-Mn metallizing paste to sintered alumina ceramic, baking it at 1300 to 17oO°C in a hydrogen furnace, and then applying nickel plating at about 800°C in a hydrogen furnace. This method involves heat treatment, metallization, and bonding with Kovar using a silver-steel eutectic solder.

In addition, the latter oxide solder method uses cuQ-MgO-Af
This is a joining method in which a mixture of 203-B203 is applied to a sintered alumina ceramic, metal niobium is set thereon, and then heated at about 1500°C in a vacuum of 105 Torr.

Both methods are limited to joining materials with similar expansion coefficients, while the former method requires a complicated process.

Since the latter method also uses a vacuum, it is difficult to produce a bonded product in one liquid.

Also, regarding joining non-oxide ceramics,
There are bonding methods in which metallization is performed using metal vapor deposition or copper sulfide, followed by brazing, but this method requires multiple heating operations and is complicated, as both metallization and brazing must be performed in completely separate processes. be.

The present invention is directed to one of these conventional joining methods. i′! This problem was solved by focusing on point i, and in particular, it simplified the heating operation and made it possible to join materials with considerably different coefficients of thermal expansion.The present invention is capable of joining with a single heating operation. It is a characteristic of

Specifically, the present invention relates to a brazing material for joining ceramics, metals, etc., and a composite body joined using this brazing material.

The first invention is a bonding between a ceramic and a metal, etc., which is an alloy of titanium (T1) and one or more of silver (Ag) or copper (Ou) and has a Ti content of 3 to 80% by weight. It is a brazing filler metal.

Ceramics generally have poor melting properties for molten metals, but the brazing filler metal (eutectic) described above is active against ceramics. It has good IQ resistance and can be well bonded to materials such as high carbon steel or stainless steel.

However, the reason why the total amount of T1 is limited to 6 to 80% by weight in the composition is that if it is less than 3% by weight, the bonding strength will be weak due to less activity against ceramics, and if it exceeds 80% by weight, the alloy will become brittle. This is because the bonding strength of the composite is low and is not practical, but it is more preferably in the range of 5 to 20 weight coefficients.

Further, the second invention includes a brazing material having a clad structure in which a low expansion coefficient metal layer, a low Young's modulus metal layer, or both are laminated in random order on the brazing material of the first invention,
It is a composite type clad brazing filler metal that is sometimes combined with other brazing filler metals. And here, in the low expansion coefficient metal layer, W,
Mo, Kobar.

Fe-Ni 42 alloy, Invar, Ou-Mo
alloy.

Contains metals with relatively small expansion coefficients such as 0u-W alloys,
It acts as a buffer when joining materials with different expansion coefficients.

Moreover, OuAg etc. are applied as a low Young's modulus metal. The layers of these low expansion metals and low Young's modulus metals can be arbitrarily selected depending on the dimensions and shape of the joined body. Furthermore, by selecting a metal having a coefficient of thermal expansion close to that of the ceramic, residual stress in the ceramic after cooling can be reduced. Further, when metals having a low Young's modulus are used for bonding, they have the effect of reducing distortion of the bonded body after cooling.

Next, the brazing material of the present invention will be explained with reference to the drawings. It should be noted that the composite of the present invention will naturally be understood from the explanation of the brazing material.

FIG. 1 is related to the first invention, in which the solder I layer a is made of Ti.
-Ag, Ti-Ou or Ti-Ag-C
It is made of u alloy (hereinafter referred to as titanium-containing brazing material).

Figure 2 relates to the second invention, (a) shows a case where a low expansion metal layer is provided in contact with the titanium content j brazing filler metal layer a, and (b) a low expansion metal layer is provided in contact with the titanium-containing brazing filler metal layer aK14. P-1 shows the case where a titanium-containing (+') brazing material layer a is followed by a low expansion metal layer and then a low Young's modulus metal layer C is provided in this order.

Moreover, it is natural that the order of b and C may be changed from the case shown in FIG.

Next, a solder column structure according to an applied example of the present invention will be explained with reference to FIGS. 3 and 4.

Figure 6 shows, for example, an alloy layer a of Ti and one or more of Ag and O, an Ou or Ag layer C with a low Young's modulus, a low expansion coefficient metal layer, an Ou or Ag layer C with a low Young's modulus, and an Ag-O layer.
It shows a brazing material in which u eutectic brazing layers d are sequentially provided and each layer is clad and integrated. Here a.

The effects of each layer b, C are as described above, but the last (bottom) layer d is relatively easy to bond to metal, and alloy layer a has good wettability to ceramic. Not, but
It is easy to use with high carbon steel, stainless steel, etc. and has excellent bonding strength.

Figure 4 shows a brazing filler metal in which alloy layers a of T1 and one or more of Ag, 0 (1) are placed on both sides, and a low expansion coefficient metal layer or low Young's modulus metal layer C is bonded to the center. is used selectively depending on the substrate to be bonded. Such a brazing material can be applied to alumina, zirconia, silicon nitride, and carbon ceramic as ceramics.

Next, Table 1 shows the results of measuring the shear strength of ceramics and metals bonded using the brazing material of the present invention. However, at the same time, a comparative example is shown, which has a braze column structure different from that of the present invention, but is outside the scope of the composite forming means of the present invention, such as performing the bonding step to create the composite in an oxidizing atmosphere. This is the case.

The following procedure was used to prepare the sample.

Residential sintered silicon nitride with a porosity of 2 and a silicon nitride content of 90% (
Si3N4) Residential sintered silicon carbide (Si3N4) with a porosity of 3% and a silicon carbide content of 95%
SiO) Alumina sintered body with 3% porosity and 95% alumina content (A
l2O3) Each of the mulberry stabilized zirconia sintered bodies (zrO2) with 1% porosity and 90% zirconia content is 15X1
Clean the ceramic bonding surface (15 x 15 mz surface) processed with a diamond grindstone to a size of 5 x 10 mm,
After washing with acetone, the Clara 9° shown in Table 1 was washed.
was installed so that one layer was on the ceramic side, and heat-bonded with the other metal etc. in the cases listed in Table 1 under the temperature and atmosphere conditions listed in the same table.

The dimensions of the brazing material are 15x15xt (t is thickness), and the dimensions of the mating material are 15x15x10.

Examples of the present invention are shown in boxes 1 to 6, comparative examples are shown in boxes 7 to 9, and examples of the invention are shown in boxes 10 to 18.

In addition, the shear strength of the bonded composite is as shown in FIG.
The metal part 2 is fitted and fixed in a jig 4, and a load is applied to the ceramic 1 in the direction of the arrow to measure the autograph 9 made by Shimadzu Corporation, and the loading rate is 2πrs.
/fni n.

Next, the silicon nitride sintered body and the alumina sintered body used as the ceramics in the examples were processed with a diamond grindstone into a size of about 20×10×2.

Then, as shown in FIG. 6, the brazing material 5-a is placed between the two layers 2, or as shown in FIG.
The brazing filler metal 5-a is clad through b. As shown in Figure 7, this is done on a substrate I made of silicon oxide, alumina, etc.
5°C indicates the fused brazing filler metal. The properties and compositions of the electrodes, intermediate layer, etc. are shown in Table 2. Thus, the electrode is cut and separated at the position indicated by the dotted line in FIG. 7, and a φ0.
nickel wire 8 of 57+iW is half ILI fJ' 9,
The opposite side was hung on the hook 10 and the tensile strength was measured upward. 5B load f4'+(y, I m(ba2,
I) 1fNn 1 +1 and the data are in patient 19 of Table 2.
-22 are shown as the first column of implementation.

Consideration 23 uses the ↑Ao -Mn method (high i (
This is a comparative example using the 1+ point metal method).

That is, the alumina sintered body has a weight i′a, the ratio is 8/1.7.
/ 0.3 = Mo / Mn / 5i02 metallization paste was printed in two layers with a dimension of 2 mm and heated in an H2 furnace.
s o O' (return 7 at E, N1 plating 4μ by electrolytic method) Ji+i, (heat treated at 800°C in 2 furnaces).

Next, electrode Ag-C! The u-eutectic solder was set on the substrate and heated and bonded in a hydrogen furnace at 850°C. Then, similar to the example of the present invention, Nl wires were soldered and the tensile strength was measured.

According to the present invention, it is possible to join ceramics and metals without worrying about the details of the materials, and compared to the conventional high-melting point metal method, the process is simpler and takes less time, resulting in a one-piece product. can be expected to reduce costs.

[Brief explanation of the drawing]

Fig. 1 is a sectional view showing the structure of the cladding brazing material according to the first invention, and Figs. , FIG. 5, and FIG. 4 are cross-sectional views showing other application examples of the present invention, and FIG. 3S5 is a cross-sectional view of the bonded sample attached to a jig for determining the shear strength +7i'l of the brazing filler metal. Figures 6 (b) and (b) are perspective views showing two examples in which the electrode is clad with a large number of bonding filler metals, and Figure 7 is a perspective view showing two examples in which the electrode is clad with a large number of bonding filler metals, and Figure 7 shows an electric (hi) Fig. 8 is a perspective view showing the condition before each part of the ligature is separated, and Fig. 8 is a perspective view showing the state in which the tensile load is measured using a Ni wire. C: Low Young's modulus metal layer a: Ag-Cu eutectic wax layer Patent attorney Mamoru Takeuchi

Claims (1)

[Claims] (1) Titanium (Ti) and silver (Ag) or copper (
(Ou) with a T1 content of 3
Brazing filler metal for joining ceramics and metals, etc. characterized by ~80% by weight (2) An alloy of titanium (Tj, ) and one or more of silver (Ag) or copper (Ou). A titanium-containing brazing material that includes a bonding brazing material (hereinafter referred to as a titanium-containing brazing material) layer having a T1 content of 3 to 80M, and at least one or both of a low expansion metal layer and a low Young's modulus metal layer. A brazing material (3) for clad bonding in which either the low expansion metal Nobi 1 or the low Young's modulus metal layer is bonded to the material layer, and each layer is integrated (3) titanium (T1) and silver (
It is made of an alloy with one or more of Ag) or copper (Cu), and is bonded in a non-oxidizing atmosphere with a brazing filler metal for bonding ceramic and metal, etc., with a Ti content of 6 to 80% by weight. A composite of ceramic and metal etc. characterized by the following. (4) An alloy of f Ti (Ti) and one or more of silver (Ag) or copper (Ou), containing T1.
of 3 to 80% by weight (hereinafter referred to as titanium-containing brazing material) and at least one or both of a low expansion metal layer or a low Young's modulus metal layer, and either of the titanium-containing brazing material layers is adjacent to the brazing material. A composite of ceramic and metal, etc., characterized in that each layer is bonded in a non-oxidizing atmosphere with a titanium-containing brazing material adjacent to the ceramic using a clad bonding brazing material in which each layer is integrated. .