CN109822260A - Solder and its method for welding for air atmosphere soldering SiC ceramic - Google Patents
Solder and its method for welding for air atmosphere soldering SiC ceramic Download PDFInfo
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Abstract
For the solder and its method for welding of air atmosphere soldering SiC ceramic, the invention belongs to SiC ceramic interconnection technique fields, it will solve the problems such as connection atmosphere requirements present in existing SiC ceramic brazing process are high, apparatus and process is complicated and Joint Reliability is poor.Solder system used is Ag-V2O5, wherein Ag powder is matrix, V2O5Powder is reaction addition phase.Method for welding: one, surface grinding process is carried out to SiC ceramic；Two, by Ag powder and V2O5Sphere of powder mill is uniformly mixed；Three, binder is prepared；Four, solder mixed-powder and binder are mixed to get solder paste；Five, solder paste is coated in ceramic surface to be welded；Six, it is placed in Muffle furnace after the assembly is completed, completes soldering connection in 950-1100 DEG C of temperature range.The present invention realizes SiC ceramic being reliably connected in air atmosphere, and apparatus and process is easy, high production efficiency.Meanwhile connector oxidation resistance is excellent, stable mechanical performance.
Description
Technical field
The invention belongs to SiC ceramic interconnection technique fields, and in particular to one kind can be used for being brazed SiC ceramic in air atmosphere
Novel solder system and its method for welding.
Background technique
Silicon carbide ceramics (Silica Carbide, SiC) have high mechanical strength, chemical property is stable, high-temperature behavior is excellent
Therefore the features such as different and radiation resistance ability is strong has in the energy, chemical industry, aerospace and nuclear industry field and extremely widely answers
Use background.As a kind of typical structure/function ceramics, SiC ceramic is processed into generally according to actual demand in industrial production
The component of various complicated shapes.Due to itself extreme hardness, brittleness is larger, it is difficult to be carried out by traditional mechanical processing tools
Machine-shaping significantly limits the further expansion of its application prospect.In ceramic joining field, soldering because it is efficiently convenient,
The features such as repeatable good and joint performance is stablized and be used widely.
Currently, the method for welding for SiC ceramic mainly has vacuum active soldering and glass soldering.Wherein, vacuum active
Soldering is chemically reacted mainly by means of the Ti/Zr/Ni/Cr/Co isoreactivity metal in solder with SiC ceramic, realizes solder
In the good wet of SiC ceramic surface and being reliably connected between ceramic base material.To avoid active element oxidation deactivation, entirely connect
It must assure that excellent vacuum condition or stable protective atmosphere in termination process, while more demanding to brazing equipment.?
Higher economic cost is necessarily brought in actual industrial production.In addition, vacuum active soldered fitting do not have generally it is resistance to anti-oxidant
Ability certainly will influence the reliability and applicability of connector, limit application of the SiC ceramic in high temperature oxidation stability environment.With glass
Although the glass soldering that glass is solder can connect SiC ceramic in air atmosphere, glass itself has larger brittleness, intolerant to
The defects of impact, easy crack initiation.In sintering and brazing process crystalline polamer inevitably occurs for glass solder, solder
Linear expansion coefficient changes therewith, leads in soldered fitting that there are larger residual stress, reduces soldered fitting mechanical performance.
Air reaction is brazed (Reactive air brazing, RAB) method usually with noble metal-metal oxide system
(such as Ag-CuO/V2O5Deng) it is solder, it has been successfully applied to the connection of the oxide ceramics such as zirconium oxide and aluminium oxide at present.Solder
Itself has splendid oxidation resistance, and connection procedure can be carried out directly in high temperature air atmosphere, simple process, production efficiency
It is high.Ag base solder plasticity is excellent, can be by being plastically deformed the thermal stress being effectively reduced in soldered fitting.Air reaction soldering connects
Head performance is stablized, and applicability is good.But this method is only used for the connection of oxide ceramics at present.Thought by using for reference the design
Think, air reaction method for welding is introduced to the connection area of SiC ceramic, solves to need height in SiC ceramic brazing process by direct
The problems such as vacuum environment, connector be not anti-oxidant and performance is unstable pushes SiC ceramic answering in high temperature oxidation stability environment extensively
With, while soldering production cost and device requirement can be significantly reduced, greatly improve production efficiency.So far, not yet related
In any report of the air reaction soldering for the connection of the non-oxide ceramics such as SiC, noble metal-metal oxygen in air atmosphere is solved
Combination problem between compound solder and SiC ceramic matrix is crucial research object.
Summary of the invention
The invention aims to solve connection atmosphere requirements height, equipment work present in existing SiC ceramic brazing process
The problems such as skill complexity and poor Joint Reliability.Meanwhile the good oxidation resistance of soldered fitting and reliable mechanical performance are assigned,
To meet SiC ceramic in the extensive use demand of a variety of industrial circles, so that providing one kind can be used for air atmosphere soldering SiC
The novel solder system and method for welding of ceramics.
The present invention is brazed the solder of SiC ceramic by Ag powder and V for air atmosphere2O5Powder composition, wherein Ag powder is solder base
Body, V2O5Powder is reaction addition phase, V2O5The additive amount of powder is 1~20mol%.
Solder of the present invention for air atmosphere soldering SiC ceramic can carry out brazing process in air atmosphere, be brazed
When specimen surface need to apply certain pressure, brazing process carries out in Muffle furnace.
Method for welding of the present invention for the solder of air atmosphere soldering SiC ceramic is realized according to the following steps:
One, SiC ceramic to be welded is surface-treated, i.e., is polished with sand paper welding surface, then by burnishing part
SiC ceramic after reason, which immerses in acetone soln, to be cleaned by ultrasonic, the SiC ceramic after being surface-treated；
Two, by Ag powder and V2O5Powder mull mixes, wherein V2O5The additive amount of powder is 1~20mol%, after grinding
To mixed-powder, then dehydrated alcohol will be added in mixed-powder and carry out ball-milling treatment, be sieved after drying, obtain uniform solder
Mixed-powder；
Three, ethyl cellulose is dissolved in terpinol, obtains ethyl cellulose-terpineol solution binder；
Four, solder mixed-powder obtained in step 2 is added in ethyl cellulose-terpineol solution binder, stirring
Solder paste is obtained after mixing；
Five, solder paste is coated uniformly on to the surface to be welded of SiC ceramic by the way of silk-screen printing；
Six, it will be coated with the SiC ceramic surface to be welded fitting assembly of solder paste, be put into Muffle furnace, applied soldering pressure, add
200 DEG C of 30~60min of degasification are warming up to when hot first, are then warming up to 400~500 DEG C of 30~60min of plastic removal, then be warming up to
950~1100 DEG C of ranges keep the temperature 10~60min, then cool to room temperature with the furnace, complete the soldering of SiC ceramic.
The advantages of novel solder system and technique of the present invention for being used to be brazed SiC ceramic, is:
(a) the reliable soldering that SiC ceramic can be realized in air atmosphere, does not need high vacuum or protective atmosphere, shows
Work simplifies soldering processes, and production efficiency greatly improves, while brazing equipment used is Muffle furnace, and device requirement threshold is low；
(b) solder system is Ag-V2O5, itself has splendid oxidation resistance, and gained SiC ceramic soldered fitting can answer
For various oxidative environments, SiC ceramic can effectively be pushed to be applied to more extensive industrial circle；
(c) V in solder2O5The SiO of continuous uniform can be generated in ceramic surface with SiC ceramic vigorous reaction2Layer, really
Combining closely between solder and ceramic matrix is protected, while brazed seam matrix is Ag, can be effectively relieved and be connect by plastic deformation
Head residual stress, ensure that the reliable mechanical performance of SiC ceramic connector.
Detailed description of the invention
Fig. 1 is that embodiment one selects Ag-V2O5Joint interface tissue topography obtained by solder brazing SiC ceramic；
Fig. 2 is that embodiment one selects Ag-V2O5Connector room temperature shear strength test figure obtained by solder brazing SiC ceramic.
Specific embodiment
Specific embodiment 1: present embodiment is brazed the solder of SiC ceramic by Ag powder and V for air atmosphere2O5Powder group
At wherein Ag powder is solder matrix, V2O5Powder is reaction addition phase, V2O5The additive amount of powder is 1~20mol%.
Specific embodiment 2: the present embodiment is different from the first embodiment in that the partial size of the Ag powder is 5
~10 μm.
Specific embodiment 3: the present embodiment is different from the first and the second embodiment in that the V2O5The grain of powder
Diameter is 5~10 μm.
Specific embodiment 4: present embodiment for air atmosphere soldering SiC ceramic solder method for welding according to
The following steps are implemented:
One, SiC ceramic to be welded is surface-treated, i.e., is polished with sand paper welding surface, then by burnishing part
SiC ceramic after reason, which immerses in acetone soln, to be cleaned by ultrasonic, the SiC ceramic after being surface-treated；
Two, by Ag powder and V2O5Powder mull mixes, wherein V2O5The additive amount of powder is 1~20mol%, after grinding
To mixed-powder, then dehydrated alcohol will be added in mixed-powder and carry out ball-milling treatment, be sieved after drying, obtain uniform solder
Mixed-powder；
Three, ethyl cellulose is dissolved in terpinol, obtains ethyl cellulose-terpineol solution binder；
Four, solder mixed-powder obtained in step 2 is added in ethyl cellulose-terpineol solution binder, stirring
Solder paste is obtained after mixing；
Five, solder paste is coated uniformly on to the surface to be welded of SiC ceramic by the way of silk-screen printing；
Six, it will be coated with the SiC ceramic surface to be welded fitting assembly of solder paste, be put into Muffle furnace, applied soldering pressure, add
200 DEG C of 30~60min of degasification are warming up to when hot first, are then warming up to 400~500 DEG C of 30~60min of plastic removal, then be warming up to
950~1100 DEG C of ranges keep the temperature 10~60min, then cool to room temperature with the furnace, complete the soldering of SiC ceramic.
Specific embodiment 5: mixed-powder is placed in by present embodiment from step 2 unlike specific embodiment four
In agate jar and dehydrated alcohol progress ball-milling treatment, mixed-powder and dehydrated alcohol weight ratio in the ball grinder is added
For (1~2): 1, drum's speed of rotation 300-400r/min, Ball-milling Time 3h.
Specific embodiment 6: present embodiment unlike specific embodiment four or five in step 2 dry after mistake
300~400 meshes.
Specific embodiment 7: described in step 3 unlike one of present embodiment and specific embodiment four to six
The content of ethyl cellulose is 2~10wt% in ethyl cellulose-terpineol solution binder.
Specific embodiment 8: described in step 4 unlike one of present embodiment and specific embodiment four to seven
Solder mixed-powder and ethyl cellulose-terpineol solution binder weight ratio are (2~4): 1.
Specific embodiment 9: described in step 5 unlike one of present embodiment and specific embodiment four to eight
The mesh number of web plate used by method for printing screen is 300~400, and screen thickness is 100~200 μm.
Specific embodiment 10: applying in step 6 unlike one of present embodiment and specific embodiment four to nine
Soldering pressure is 2~30kPa.
Specific embodiment 11: described in step 6 unlike one of present embodiment and specific embodiment four to ten
Muffle furnace heating with rate of temperature fall control in 2~15 DEG C/min.
Specific embodiment 12: present embodiment exists from step 6 unlike specific embodiment four to one of 11
Brazing temperature is that 25~45min is kept the temperature at 950~1100 DEG C.
Specific embodiment 13: present embodiment from unlike specific embodiment four to one of 11 in step 2
By Ag powder and V2O5Powder mull mixes, wherein V2O5The additive amount of powder is 4~10mol%.
Embodiment one: the present embodiment is used for the method for welding of the solder of air atmosphere soldering SiC ceramic according to the following steps
Implement:
One, SiC ceramic to be welded is surface-treated, #1000 sand paper is selected to beat the welding surface of SiC ceramic
Mill obtains uniform ceramic surface to be welded, then immerses in acetone soln the SiC ceramic after grinding process and be cleaned by ultrasonic
15min, the impurity such as removal surface and oil contaminant, the SiC ceramic after being surface-treated；
Two, Ag and V is weighed according to Mol ratio2O5Powder, V2O5Content is 8mol%, by powder after the completion of weighing
End is placed in ground and mixed in agate crucible, and then mixed-powder is placed in agate jar and dehydrated alcohol, mixed powder is added
The weight ratio of end and dehydrated alcohol is 1:1, the ball-milling treatment 3h under 300r/min speed conditions, crosses 300 mesh after 100 DEG C of drying
Sieve, obtains uniform solder mixed-powder；
Three, it takes appropriate ethyl cellulose to be dissolved in terpinol, obtains ethyl cellulose-terpineol solution binder,
The additive amount of middle ethyl cellulose is 2wt%；
Four, solder mixed-powder obtained in step 2 is added in ethyl cellulose-terpineol solution binder, solder
Mixed-powder and ethyl cellulose-terpineol solution binder weight ratio are 2:1, obtain solder paste after being uniformly mixed；
Five, solder paste obtained in step 4 is coated uniformly on using with a thickness of 100 μm of 300 mesh silk-screen printing web plates
SiC ceramic surface to be welded；
Six, it will be coated with the SiC ceramic surface to be welded fitting assembly of solder paste obtained in step 5, be then placed in Muffle furnace
In, apply 20kPa pressure in sample top, it is ensured that be in close contact between solder and ceramics, when heating is warming up to 200 DEG C first and removes
Gas 30min is then warming up to 400 DEG C of plastic removal 30min, then is warming up to 1050 DEG C of heat preservation 30min, then cools to room temperature with the furnace,
Complete the soldering of SiC ceramic.
For the quality of directly perceived characterization soldered fitting of the present invention, the SiC ceramic joint interface tissue after soldering is seen
It examines, the typical interface tissue scanning Electronic Speculum back scattering photo that embodiment one obtains is as shown in Figure 1.The result shows that Ag-V2O5Solder
It is well combined with two sides ceramics base material, the defects of pore-free crackle.Brazed seam center is with Ag+VO2For matrix, a small amount of remaining V2O5
For Dispersed precipitate in brazed seam, two sides SiC ceramic surface generates uniformly continuous SiO2Conversion zone.It meanwhile being characterization soldering
The mechanical property of connector carries out room temperature shear strength test to SiC ceramic soldered fitting, as a result as shown in Figure 2.The result shows that
Connector highest shear strength is close to 60MPa, it was demonstrated that the novel solder system and method for welding that the present invention is developed can be in air
The reliable SiC ceramic soldered fitting of performance is obtained in atmosphere.
Embodiment two: the present embodiment is used for the method for welding of the solder of air atmosphere soldering SiC ceramic according to the following steps
Implement:
One, SiC ceramic is surface-treated, #1000 sand paper is selected to polish its surface, obtained uniform to be welded
Then ceramics after grinding process are immersed in acetone soln and are cleaned by ultrasonic 15min by ceramic surface, removal surface and oil contaminant etc. is miscellaneous
Matter, the SiC ceramic after being surface-treated；
Two, Ag and V is weighed according to Mol ratio2O5Powder, V2O5Content is 8mol%, by powder after the completion of weighing
End is placed in ground and mixed in agate crucible, and then mixed-powder is placed in agate jar and dehydrated alcohol, solder powder is added
Weight ratio with dehydrated alcohol is 1:1, the ball-milling treatment 3h under 350r/min speed conditions, crosses 300 meshes after 100 DEG C of drying,
Obtain uniform solder mixed-powder；
Three, it takes appropriate ethyl cellulose to be dissolved in terpinol, obtains ethyl cellulose-terpineol solution binder,
The additive amount of middle ethyl cellulose is 2wt%；
Four, solder mixed-powder obtained in step 2 is added in ethyl cellulose-terpineol solution binder, solder
Mixed-powder and ethyl cellulose-terpineol solution binder weight ratio are 2:1, obtain solder paste after being uniformly mixed；
Five, solder paste obtained in step 4 is coated uniformly on using with a thickness of 200 μm of 300 mesh silk-screen printing web plates
SiC ceramic surface to be welded；
Six, it will be coated with the SiC ceramic surface to be welded fitting assembly of solder paste obtained in step 5, be then placed in Muffle furnace
In, apply 20kPa pressure in sample top, it is ensured that be in close contact between solder and ceramics, when heating is warming up to 200 DEG C first and removes
Gas 30min is then warming up to 400 DEG C of plastic removal 30min, then is warming up to 1050 DEG C of heat preservation 10min, then cools to room temperature with the furnace,
Complete the soldering of SiC ceramic.
Shear strength test is carried out to SiC ceramic soldered fitting obtained by the present embodiment, connector average shear strength is
52Mpa。
Embodiment three: the present embodiment is used for the method for welding of the solder of air atmosphere soldering SiC ceramic according to the following steps
Implement:
One, SiC ceramic is surface-treated, selects #1000 sand paper to polish SiC ceramic welding surface, obtains
Then ceramics after grinding process are immersed in acetone soln and are cleaned by ultrasonic 15min, remove surface by uniform ceramic surface to be welded
The impurity such as greasy dirt, the SiC ceramic after being surface-treated；
Two, Ag and V is weighed according to Mol ratio2O5Powder, V2O5Content is 8mol%, by powder after the completion of weighing
End is placed in ground and mixed in agate crucible, and then mixed-powder is placed in agate jar and dehydrated alcohol, mixed powder is added
The weight ratio of end and dehydrated alcohol is 2:1, the ball-milling treatment 3h under 350r/min speed conditions, crosses 300 mesh after 100 DEG C of drying
Sieve, obtains uniform solder mixed-powder；
Three, it takes appropriate ethyl cellulose to be dissolved in terpinol, obtains ethyl cellulose-terpineol solution binder,
The additive amount of middle ethyl cellulose is 4wt%；
Four, solder mixed-powder obtained in step 2 is added in ethyl cellulose-terpineol solution binder, solder
Mixed-powder and ethyl cellulose-terpineol solution binder weight ratio are 2:1, obtain solder paste after being uniformly mixed；
Five, solder paste obtained in step 4 is coated uniformly on using with a thickness of 100 μm of 300 mesh silk-screen printing web plates
SiC ceramic surface to be welded；
Six, it will be coated with the SiC ceramic surface to be welded fitting assembly of solder paste obtained in step 5, be then placed in Muffle furnace
In, apply 20kPa pressure in sample top, it is ensured that be in close contact between solder and ceramics, when heating is warming up to 200 DEG C first and removes
Gas 30min is then warming up to 400 DEG C of plastic removal 30min, then is warming up to 1100 DEG C of heat preservation 10min, then cools to room temperature with the furnace,
Complete the soldering of SiC ceramic.
Shear strength test is carried out to SiC ceramic soldered fitting obtained by the present embodiment, connector average shear strength is
45MPa。
Example IV: the present embodiment is used for the method for welding of the solder of air atmosphere soldering SiC ceramic according to the following steps
Implement:
One, SiC ceramic is surface-treated, selects #1000 sand paper to polish the welding surface of SiC ceramic, obtains
To uniform ceramic surface to be welded, then the ceramics after grinding process are immersed in acetone soln and are cleaned by ultrasonic 15min, remove table
The impurity such as face greasy dirt, the SiC ceramic after being surface-treated；
Two, Ag and V is weighed according to Mol ratio2O5Powder, V2O5Content is 4mol%, by powder after the completion of weighing
End is placed in ground and mixed in agate crucible, and then mixed-powder is placed in agate jar and dehydrated alcohol, mixed powder is added
The weight ratio of end and dehydrated alcohol is 2:1, the ball-milling treatment 3h under 400r/min speed conditions, crosses 300 mesh after 100 DEG C of drying
Sieve, obtains uniform solder mixed-powder；
Three, it takes appropriate ethyl cellulose to be dissolved in terpinol, obtains ethyl cellulose-terpineol solution binder,
The additive amount of middle ethyl cellulose is 8wt%；
Four, solder mixed-powder obtained in step 2 is added in ethyl cellulose-terpineol solution binder, solder
Mixed-powder and ethyl cellulose-terpineol solution binder weight ratio are 3:1, obtain solder paste after being uniformly mixed；
Five, solder paste obtained in step 4 is coated uniformly on using with a thickness of 100 μm of 300 mesh silk-screen printing web plates
SiC ceramic surface to be welded；
Six, it will be coated with the SiC ceramic surface to be welded fitting assembly of solder paste obtained in step 5, be then placed in Muffle furnace
In, apply 20kPa pressure in sample top, it is ensured that be in close contact between solder and ceramics, when heating is warming up to 200 DEG C first and removes
Gas 30min is then warming up to 400 DEG C of plastic removal 30min, then is warming up to 950 DEG C of heat preservation 30min, then cools to room temperature with the furnace, complete
At the soldering of SiC ceramic.
Shear strength test is carried out to SiC ceramic soldered fitting obtained by the present embodiment, connector average shear strength is
40MPa。
Embodiment five: the present embodiment is used for the method for welding of the solder of air atmosphere soldering SiC ceramic according to the following steps
Implement:
One, SiC ceramic is surface-treated, selects #1000 sand paper to polish the welding surface of SiC ceramic, obtains
To uniform ceramic surface to be welded, then the ceramics after grinding process are immersed in acetone soln and are cleaned by ultrasonic 15min, remove table
The impurity such as face greasy dirt, the SiC ceramic after being surface-treated；
Two, Ag and V is weighed according to Mol ratio2O5Powder, V2O5Content is 20mol%, by powder after the completion of weighing
End is placed in ground and mixed in agate crucible, and then mixed-powder is placed in agate jar and dehydrated alcohol, solder powder is added
Weight ratio with dehydrated alcohol is 2:1, the ball-milling treatment 3h under 400r/min speed conditions, crosses 300 meshes after 100 DEG C of drying,
Obtain uniform solder mixed-powder；
Three, it takes appropriate ethyl cellulose to be dissolved in terpinol, obtains ethyl cellulose-terpineol solution binder,
The additive amount of middle ethyl cellulose is 10wt%；
Four, solder mixed-powder obtained in step 2 is added in ethyl cellulose-terpineol solution binder, solder
Mixed-powder and ethyl cellulose-terpineol solution binder weight ratio are 3.5:1, obtain solder after being uniformly mixed
Cream；
Five, solder paste obtained in step 4 is coated uniformly on using with a thickness of 100 μm of 300 mesh silk-screen printing web plates
SiC ceramic surface to be welded；
Six, it will be coated with the SiC ceramic surface to be welded fitting assembly of solder paste obtained in step 5, be then placed in Muffle furnace
In, apply 30kPa pressure in sample top, it is ensured that be in close contact between solder and ceramics, when heating is warming up to 200 DEG C first and removes
Gas 30min is then warming up to 400 DEG C of plastic removal 30min, then is warming up to 900 DEG C of heat preservation 30min, then cools to room temperature with the furnace, complete
At the soldering of SiC ceramic.
Shear strength test is carried out to SiC ceramic soldered fitting obtained by the present embodiment, connector average shear strength is
34MPa。
Embodiment six: the present embodiment is used for the method for welding of the solder of air atmosphere soldering SiC ceramic according to the following steps
Implement:
One, SiC ceramic is surface-treated, selects #1000 sand paper to polish the welding surface of SiC ceramic, obtains
To uniform ceramic surface to be welded, then the ceramics after grinding process are immersed in acetone soln and are cleaned by ultrasonic 15min, remove table
The impurity such as face greasy dirt, the SiC ceramic after being surface-treated；
Two, Ag and V is weighed according to Mol ratio2O5Powder, V2O5Content is 2mol%, by powder after the completion of weighing
End is placed in ground and mixed in agate crucible, and then mixed-powder is placed in agate jar and dehydrated alcohol, solder powder is added
Weight ratio with dehydrated alcohol is 2:1, the ball-milling treatment 3h under 400r/min speed conditions, crosses 300 meshes after 100 DEG C of drying,
Obtain uniform solder mixed-powder；
Three, it takes appropriate ethyl cellulose to be dissolved in terpinol, obtains ethyl cellulose-terpineol solution binder,
The additive amount of middle ethyl cellulose is 10wt%；
Four, solder mixed-powder obtained in step 2 is added in ethyl cellulose-terpineol solution binder, solder
Mixed-powder and ethyl cellulose-terpineol solution binder weight ratio are 4:1, obtain solder paste after being uniformly mixed；
Five, solder paste obtained in step 4 is coated uniformly on using with a thickness of 100 μm of 400 mesh silk-screen printing web plates
SiC ceramic surface to be welded；
Six, it will be coated with the SiC ceramic surface to be welded fitting assembly of solder paste obtained in step 5, be then placed in Muffle furnace
In, apply 5kPa pressure in sample top, it is ensured that be in close contact between solder and ceramics, when heating is warming up to 200 DEG C first and removes
Gas 30min is then warming up to 500 DEG C of plastic removal 30min, then is warming up to 900 DEG C of heat preservation 60min, then cools to room temperature with the furnace, complete
At the soldering of SiC ceramic.
Shear strength test is carried out to SiC ceramic soldered fitting obtained by the present embodiment, connector average shear strength is
37MPa。
Claims (10)
1. the solder for air atmosphere soldering SiC ceramic, it is characterised in that this is used for the solder of air atmosphere soldering SiC ceramic
By Ag powder and V2O5Powder composition, wherein Ag powder is solder matrix, V2O5Powder is reaction addition phase, V2O5The additive amount of powder be 1~
20mol%.
2. the solder according to claim 1 for air atmosphere soldering SiC ceramic, it is characterised in that the Ag powder
Partial size is 5~10 μm.
3. the solder according to claim 1 for air atmosphere soldering SiC ceramic, it is characterised in that the V2O5Powder
Partial size be 5~10 μm.
4. the method for welding of the solder for air atmosphere soldering SiC ceramic, it is characterised in that the method for welding is according to following step
It is rapid to realize:
One, SiC ceramic to be welded is surface-treated, i.e., is polished with sand paper welding surface, it then will be after grinding process
SiC ceramic immerse acetone soln in be cleaned by ultrasonic, the SiC ceramic after being surface-treated；
Two, by Ag powder and V2O5Powder mull mixes, wherein V2O5The additive amount of powder is 1~20mol%, is mixed after grinding
Then powder will be added dehydrated alcohol and carry out ball-milling treatment, is sieved after drying, obtains uniform solder mixed powder in mixed-powder
End；
Three, ethyl cellulose is dissolved in terpinol, obtains ethyl cellulose-terpineol solution binder；
Four, solder mixed-powder obtained in step 2 is added in ethyl cellulose-terpineol solution binder, is stirred
Solder paste is obtained after uniformly；
Five, solder paste is coated uniformly on to the surface to be welded of SiC ceramic by the way of silk-screen printing；
Six, it will be coated with the SiC ceramic surface to be welded fitting assembly of solder paste, be put into Muffle furnace, apply soldering pressure, when heating
It is warming up to 200 DEG C of 30~60min of degasification first, is then warming up to 400~500 DEG C of 30~60min of plastic removal, then it is warming up to 950~
1100 DEG C of ranges keep the temperature 10~60min, then cool to room temperature with the furnace, complete the soldering of SiC ceramic.
5. the method for welding of the solder according to claim 4 for air atmosphere soldering SiC ceramic, it is characterised in that step
300~400 meshes are crossed after drying in rapid two.
6. the method for welding of the solder according to claim 4 for air atmosphere soldering SiC ceramic, it is characterised in that step
The content of ethyl cellulose is 2~10wt% in ethyl cellulose described in rapid three-terpineol solution binder.
7. the method for welding of the solder according to claim 4 for air atmosphere soldering SiC ceramic, it is characterised in that step
Solder mixed-powder described in rapid four and ethyl cellulose-terpineol solution binder weight ratio are (2~4): 1.
8. the method for welding of the solder according to claim 4 for air atmosphere soldering SiC ceramic, it is characterised in that step
The mesh number of web plate used by method for printing screen described in rapid five is 300~400, and screen thickness is 100~200 μm.
9. the method for welding of the solder according to claim 4 for air atmosphere soldering SiC ceramic, it is characterised in that step
Applying soldering pressure in rapid six is 2~30kPa.
10. the method for welding of the solder according to claim 4 for air atmosphere soldering SiC ceramic, it is characterised in that
Step 6 keeps the temperature 25~45min at being 950~1100 DEG C in brazing temperature.
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| CN111482731A (en) * | 2020-05-11 | 2020-08-04 | 湖南翰坤实业有限公司 | Preparation method and application of metal welding material |
| CN111644739A (en) * | 2020-06-15 | 2020-09-11 | 哈尔滨工业大学 | Brazing filler metal system for air atmosphere brazing YSZ ceramic and brazing method |
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| CN113245653B (en) * | 2021-06-04 | 2022-03-25 | 哈尔滨工业大学 | Method for connecting ceramic and metal in air by using solid silver |
| CN113857605A (en) * | 2021-09-13 | 2021-12-31 | 哈尔滨工业大学 | Method for aluminizing surface of low-carbon steel and performing air reaction brazing with alumina ceramic |
| CN115213583A (en) * | 2022-07-15 | 2022-10-21 | 西北工业大学 | Brazing filler metal for SiCf/SiC composite material connection and brazing connection method |
| CN115213583B (en) * | 2022-07-15 | 2024-04-12 | 西北工业大学 | Brazing connection method for SiCf/SiC composite material connection |
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