CN104646852B - Pricker applies cream and its application - Google Patents
Pricker applies cream and its application Download PDFInfo
- Publication number
- CN104646852B CN104646852B CN201410852245.7A CN201410852245A CN104646852B CN 104646852 B CN104646852 B CN 104646852B CN 201410852245 A CN201410852245 A CN 201410852245A CN 104646852 B CN104646852 B CN 104646852B
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- China
- Prior art keywords
- powder
- pricker
- cream
- diamond
- alloyed powder
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/302—Cu as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/008—Soldering within a furnace
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Powder Metallurgy (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Abstract
Cream and its application are applied the invention discloses a kind of pricker.The pricker applies cream and preferably includes：65 95wt% powdery brazing materials, and to be mixed to form the bonding agent that cream is applied in the pricker of flow-like or paste with the powdery brazing material.The powdery brazing material is included：40wt% 90wt% diamond dusts, and the particle diameter of the bortz powder is 5 1000 microns, purity is more than 99%, and brazing powder, the Cu and/or Ni of element and as any two or more in Mn, Ti, Cr, Al, Sn, Fe of addition element comprising based on.Pricker of the invention applies cream has excellent thixotropy, mobility and certain viscosity, in use without compressing, the matrix surfaces such as steel part directly can be injected in by injection device, and without mould and press device, and using carrying out soldering with conventional solder material powder identical technique, and obtained brazed diamond tool has good bond strength, grinding force and service life, high yield rate, material use is high, and production efficiency is high, low production cost.
Description
Technical field
Cream, its preparation method and application are applied present invention relates particularly to a kind of pricker, belongs to diamond coating technique field.
Background technology
Hard brittle material, such as stone material, glass, ceramics common building materials, and jewel, semiconductor, engineering ceramics, optics
The processing of the high-grade advanced engineering such as crystal, magnetic material, bioceramic and functional material is, it is necessary to using the mill with more high rigidity
Expect prepare instrument, diamond compared with other abrasive materials, with high hardness, relative wear resistance high, thermal conductivity and pressure resistance
Degree.Therefore, diamond tool is the most frequently used instrument of the processing such as hard brittle material cutting, grinding.In metal-bonded diamond work
In the manufacturing process of tool, soldering, sintering and plating are three kinds of topmost manufacture methods.In three kinds of methods, soldering processes are to make
A kind of method of diamond particles bond strength highest, because brazing filler metal alloy fusing and capillary are made in brazing process
With, make alloy tight diamond, while forming strong chemical bond between diamond and brazing filler metal alloy, substantially increase work
The cutting ability and self-sharpening of tool, are particularly suitable for High speed Pyrometer processing.
Conventional soldering processes, are that the alkali cleaning of steel saw bit matrix, pickling are deoiled and oxide layer, then by diamond particles and
The mixture cloth of solder powder is formed with the green compact of some strength on steel saw bit matrix, with forming press cold pressing, most
After be put into vacuum brazing furnace and carry out soldering.CN102319934A disclose method for brazing manufacture diamond tool production technology and
The composition of brazing material powder, such brazing material powder is made up of nickel based metal powder and diamond particles, need to be by being pressed into
Soldering can be just carried out after type, but because diamond particles belong to fragile material, be not susceptible to plastic deformation in pressing process and
Cannot be engaged with neighboring particles, therefore green strength is not high, the saw blade of very thin diamond abrasive grain layer is especially required, to die mould
Control and mold design propose requirement higher, and this green compact also occur broken often when production line carries out material transfer in addition
Damage, these have resulted in the waste of raw material and have reduced yield rate.
The content of the invention
Cream is applied it is a primary object of the present invention to provide a kind of pricker, it has excellent thixotropy and mobility, is using
During need not be pressed into green compact, the deficiencies in the prior art can be overcome, and substitute traditional powdery brazing material.
Another object of the present invention is to provide a kind of method for preparing the pricker painting cream.
A further object of the present invention is to provide the application that the pricker applies cream.
To realize aforementioned invention purpose, the technical solution adopted by the present invention includes：
A kind of pricker applies cream, and it includes：
Powdery brazing material, and
Bonding agent, cream is applied to be mixed to form with the powdery brazing material in the pricker of flow-like or paste；
Wherein, the powdery brazing material is included：
Diamond dust, and
Brazing powder, comprising based on the Cu and/or Ni and the Mn as addition element of element, Ti, Cr, Al, Sn,
It is any two or more in Fe.
Used as more one of preferred embodiment, the pricker applies cream and is made up of powdery brazing material and bonding agent.
Used as more one of preferred embodiment, the pricker applies cream and includes 65-95wt% powdery brazing materials.
Used as more one of preferred embodiment, the powdery brazing material includes 40wt%-90wt% bortz powders.
Used as more one of preferred embodiment, the particle diameter of the bortz powder is 5-1000 microns, and purity is more than
99%.
Used as more one of preferred embodiment, the brazing powder includes the mixture and/or alloyed powder of metal powder,
The mixture and/or alloyed powder of the metal powder are included：Cu 11-14wt%, Mn 18-25wt%, Ti 5-10wt%, Al 8-
The alloyed powder of 11wt%, Sn 1-2.1wt%, remainder includes Ni.
Particularly preferably, the mixture and/or alloyed powder of the metal powder are included：Cu 11-14wt%, Mn 18-
The alloyed powder of 25wt%, Ti 5-10wt%, Al 8-11wt%, Sn 1-2.1wt%, balance of Ni.
Used as more one of preferred embodiment, the brazing powder includes the first alloyed powder, the second alloyed powder, the 3rd
The composition of any one or more in alloyed powder, the 4th alloyed powder.
Further, first alloyed powder is included：Mn 0.5-10wt%, Ti 0.2-15wt%, remainder are included
Cu.Particularly preferably, first alloyed powder includes Mn 0.5-10wt%, Ti 0.2-15wt%, balance of Cu.
Further, second alloyed powder is included：Mn 0.5-10wt%, Cr 0.2-10wt%, remainder are included
Cu.Particularly preferably, second alloyed powder is included：Mn 0.5-10wt%, Cr 0.2-10wt%, balance of Cu.
Further, the 3rd alloyed powder includes Sn 2-10wt%, Ni 0.2-8wt%, Cr 2-15wt%, remaining
Part includes Cu.Particularly preferably, the 3rd alloyed powder is included：Sn 2-10wt%, Ni 0.2-8wt%, Cr 2-
15wt%, balance of Cu.
Further, the 4th alloyed powder includes Sn 0.5-10wt%, Ni 0.2-15wt%, Ti 0.2-5wt%,
Remainder includes Cu.Particularly preferably, the 4th alloyed powder includes Sn 0.5-10wt%, Ni 0.2-15wt%, Ti
0.2-5wt%, balance of Cu.
As more one of preferred embodiment, mixture of the brazing powder comprising metal powder, the metal powder
Mixture include Cu powder 72-98wt%, Ni powder 0.5-15wt%, Fe powder 0.1-4wt%, Mn powder 0.2-4wt%, Cr powder 0.5-
5wt%.
It should be noted that the two or more metals of alloyed powder system mentioned above or nonmetalloid be atomized by melting or
The alloyed metal (AM) powder that the means such as diffusion are obtained, rather than several element powders are simply mixed.
Used as more one of preferred embodiment, the bonding agent increases comprising 50%-98wt% solvents, 0.5-8wt%
Thick dose, 0.2-35wt% rheological agents, 0.1-5wt% defoamers and activator.
Further, the solvent at least preferably from but be not limited to deionized water, diethylene glycol monoethyl ether, DPG
Any one or more in monomethyl ether, 1,2-PD, ethyl carbitol, ethylene glycol.
Further, the thickener preferably from but be not limited to HES, hydroxypropul starch, methyl acrylate,
Polymethyl methacrylate, CMS, hydroxyethyl cellulose, ethylhydroxyethylcellulose, dibutyl phthalate, ring
Any one or more in oxygen tree fat, chitin, guar gum, xanthans, Arabic gum, locust bean gum.
Further, the rheological agent preferably from but be not limited to rilanit special, glycerine, stearic acid, salicylamide
In any one or more.
Further, the defoamer and activator preferably from but be not limited to acetylenic glycols, the nitrogen file of benzo three, silicone oil, ore deposit
Thing oil, any one or more in vegetable oil.
Further, the viscosity that the pricker applies cream is 30000-150000cps.
Foregoing any one pricker applies the preparation method of cream, including：
1) brazing powder and bortz powder are uniformly mixed in batch mixer, is made powdery brazing material；
2) by thickener, rheological agent, defoamer and activator addition solvent, stir and formed uniform bonding agent；
3) stirred in powdery brazing material being added into bonding agent, obtain the pricker and apply cream.
Foregoing any one pricker applies application of the cream in diamond material or diamond tool is prepared.
A kind of diamond tool, it includes matrix and is incorporated into the diamond layer of matrix surface, the diamond layer master
Cream soldering is applied by any one foregoing pricker to be formed.
Further, the diamond tool includes diamond saw blade.
Present invention also offers the preparation method of the diamond tool, it includes：
Pricker painting cream is at least put on into matrix surface from injection system and forms blank；
And, the blank is carried out into soldering in vacuum environment or protective atmosphere, form the diamond tool.
For example, in an exemplary embodiments, a kind of preparation method of diamond saw blade can include：Pricker is applied into cream to load
In injection device (for example, point gum machine or paste distributor), the shape by injection device by lotion on demand is injected in steel
Saw blade substrate surface, then will send into vacuum drying oven or atmosphere protection stove containing this saw blade blank, it is identical using conventional powder soldering
Technique (850-1150 DEG C of brazing temperature, time be no more than 60min) carry out soldering, wherein, by the bonding agent for being used exists
Volatilized completely during low temperature (less than 300 DEG C), therefore, piece surface, will not in addition to diamond abrasive and brazing metal after soldering
Remain other impurity.
Compared with prior art, advantages of the present invention includes：There is provided a kind of new paste soldering material (hereinafter referred to as
" pricker painting cream "), it has excellent thixotropy, mobility and certain viscosity, in use need not be compressing, can be direct
The matrix surfaces such as steel part are injected in by injection device, and without mould and press device, and available and conventional solder material
Powder identical technique carries out soldering, and obtained brazed diamond tool has good bond strength, grinding force and uses the longevity
Life, high yield rate, material use is high, and production efficiency is high, low production cost.
Specific embodiment
Below in conjunction with the technical solution of the present invention is further explained the explanation of some embodiments.
Embodiment 1-6 applies cream according to configuration pricker is constituted table 1 Suo Shi.
The pricker configured in embodiment 1-6 is applied into shape of the cream with point gum machine or paste distributor on demand and is injected in steel saw
Piece substrate surface, then will send into vacuum drying oven or atmosphere protection stove containing this saw blade blank, using conventional powder soldering identical
Technique (850-1150 DEG C of brazing temperature, the time is no more than 60min) carries out soldering, wherein, by the bonding agent for being used is low
Volatilized completely when warm (less than 300 DEG C), therefore, after soldering piece surface in addition to diamond abrasive and brazing metal, metal light
Pool substantially, without black carbon compound residual, will not also remain other impurity, obtain multiple diamond saw blade finished products (abbreviation " embodiments
Product ").
Each powdery brazing material in reference examples 1-6 Examples 1-6 is directly as solder, and reference CN102319934A
The mode for being provided is made multiple diamond saw flake products (referred to as " reference examples product ").
Performance using same way respectively to embodiment product and reference examples product is tested, it is found that implemented
The bond strength of diamond layer and substrate is superior to reference examples product substantially in example product, and the grinding force of embodiment product and makes
Also exceed reference examples product with the life-span.In addition, the yield rate of embodiment product is 99.8% or so, and the finished product of reference examples product
Rate is 98% or so.
It should be pointed out that the specific embodiment of present invention described above, is not intended to limit the scope of the present invention..
Any technology according to the present invention design done various other corresponding change and deformation, should be included in right of the present invention
It is required that protection domain in.
Pricker applies the composition of cream in the embodiment 1-6 of table 1
Claims (8)
1. a kind of pricker applies cream, it is characterised in that including：
The powdery brazing material of 65-95wt%, and
Bonding agent, cream is applied to be mixed to form with the powdery brazing material in the pricker of flow-like or paste；
Wherein, the powdery brazing material is included：
40wt%-90wt% diamond dusts, and
Brazing powder, comprising：
The mixture or alloyed powder of metal powder, comprising：Cu 11-14wt%, Mn 18-25wt%, Ti 5-10wt%, Al 8-
The alloyed powder of 11wt%, Sn 1-2.1wt%, balance of Ni；
Or, any one or more in following first alloyed powder, the second alloyed powder, the 3rd alloyed powder, the 4th alloyed powder
Composition, wherein,
First alloyed powder, comprising：Mn 0.5-10wt%, Ti 0.2-15wt%, balance of Cu,
Second alloyed powder, comprising：Mn 0.5-10wt%, Cr 0.2-10wt%, balance of Cu,
3rd alloyed powder, comprising：Sn 2-10wt%, Ni 0.2-8wt%, Cr 2-15wt%, balance of Cu,
4th alloyed powder, comprising：Sn 0.5-10wt%, Ni 0.2-15wt%, Ti 0.2-5wt%, balance of Cu；
Or, the mixture of metal powder, comprising：Cu powder 72-98wt%, Ni powder 0.5-15wt%, Fe powder 0.1-4wt%, Mn powder
0.2-4wt%, Cr powder 0.5-5wt%.
2. pricker according to claim 1 applies cream, it is characterised in that：The particle diameter of the bortz powder is 5-1000 microns, pure
Degree is more than 99%.
3. pricker according to claim 1 applies cream, it is characterised in that：The bonding agent includes 50%-98wt% solvents, 0.5-
8wt% thickeners, 0.2-35wt% rheological agents, 0.1-5wt% defoamers and activator；
Wherein, the solvent is at least selected from deionized water, diethylene glycol monoethyl ether, dipropylene glycol monomethyl ether, 1,2-PD, second
Any one in base carbitol, ethylene glycol；
The thickener is at least selected from HES, hydroxypropul starch, methyl acrylate, polymethyl methacrylate, carboxylic first
Base starch, hydroxyethyl cellulose, ethylhydroxyethylcellulose, dibutyl phthalate, epoxy resin, chitin, guar gum,
Any one in xanthans, Arabic gum, locust bean gum；
The rheological agent is at least selected from any one in rilanit special, glycerine, stearic acid, salicylamide；
The defoamer and activator are at least selected from any one in acetylenic glycols, the nitrogen file of benzo three, silicone oil, mineral oil, vegetable oil.
4. pricker according to claim 1 applies cream, it is characterised in that：The viscosity that the pricker applies cream is 30000-150000cps.
5. pricker any one of claim 1-4 applies application of the cream in diamond material or diamond tool is prepared.
6. a kind of diamond tool, it is characterised in that including matrix and be incorporated into the diamond layer of matrix surface, the Buddha's warrior attendant
The main pricker as any one of claim 1-4 of rock layers applies cream soldering and is formed.
7. diamond tool according to claim 6, it is characterised in that it includes diamond saw blade.
8. the preparation method of diamond tool described in claim 6 or 7, it is characterised in that including：
The pricker any one of claim 1-4 is at least applied into cream from injection system and puts on matrix surface formation blank；
And, the blank is carried out into soldering in vacuum environment or protective atmosphere, form the diamond tool.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410852245.7A CN104646852B (en) | 2014-12-31 | 2014-12-31 | Pricker applies cream and its application |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410852245.7A CN104646852B (en) | 2014-12-31 | 2014-12-31 | Pricker applies cream and its application |
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| CN104646852A CN104646852A (en) | 2015-05-27 |
| CN104646852B true CN104646852B (en) | 2017-06-23 |
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|---|---|---|---|---|
| CN105171274A (en) * | 2015-09-15 | 2015-12-23 | 铜陵新鑫焊材有限公司 | Formula for brazing flux of copper welding rod |
| CN106545578B (en) * | 2015-09-23 | 2019-09-13 | 天津职业技术师范大学 | A kind of TC bearing and its manufacturing method |
| CN107486553B (en) * | 2016-06-12 | 2019-08-02 | 苏州铜宝锐新材料有限公司 | Aluminium cream and its application |
| CN107326364B (en) * | 2017-06-02 | 2023-08-11 | 泉州众志金刚石工具有限公司 | Cu-Sn-Ti diamond brazing coating and preparation method thereof |
| CN107186385A (en) * | 2017-07-31 | 2017-09-22 | 安徽华众焊业有限公司 | A kind of silverless Cu-base soldering material |
| CN108080812B (en) * | 2017-11-29 | 2020-12-11 | 温州宏丰电工合金股份有限公司 | Preparation method of paste forming body for Cu-Sn-Ti solder powder |
| CN108032003B (en) * | 2017-11-29 | 2020-12-11 | 温州宏丰电工合金股份有限公司 | Paste forming body for Cu-Sn-Ti solder powder |
| CN110508804B (en) * | 2019-09-27 | 2021-07-02 | 郑州机械研究所有限公司 | Braze coating paste and preparation method and application thereof |
| CN111037021B (en) * | 2020-01-13 | 2021-01-05 | 郑州机械研究所有限公司 | Resistance brazing method for shield machine cutter |
| CN111687509B (en) * | 2020-06-24 | 2022-09-27 | 禹州七方超硬材料制品有限公司 | Vacuum brazing diamond compound and method for manufacturing tool multi-layer brazing |
| CN113478039A (en) * | 2021-08-24 | 2021-10-08 | 华北水利水电大学 | Water turbine blade braze coating repairing method |
| CN114178738A (en) * | 2021-12-08 | 2022-03-15 | 浙江亚通焊材有限公司 | Active solder for brazing ceramic and stainless steel and solder paste |
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Effective date of registration: 20180712 Address after: 215000 No. 88 Zhen Bei Road, Tongan Zhen, hi tech Zone, Suzhou, Suzhou, Jiangsu Patentee after: Suzhou copper Rui Rui Technology Co., Ltd. Address before: 215000 110A room, A4 110A, biological nano Park, No. 218 Xing Hu Street, Suzhou Industrial Park, Jiangsu. Patentee before: Suzhou Tong Baorui new material Co., Ltd |