JPH0445277B2 - - Google Patents
Info
- Publication number
- JPH0445277B2 JPH0445277B2 JP59205108A JP20510884A JPH0445277B2 JP H0445277 B2 JPH0445277 B2 JP H0445277B2 JP 59205108 A JP59205108 A JP 59205108A JP 20510884 A JP20510884 A JP 20510884A JP H0445277 B2 JPH0445277 B2 JP H0445277B2
- Authority
- JP
- Japan
- Prior art keywords
- brazing
- weight
- strength
- metal
- ceramics
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000005219 brazing Methods 0.000 claims description 32
- 239000000463 material Substances 0.000 claims description 14
- 229910052726 zirconium Inorganic materials 0.000 claims description 9
- 229910052735 hafnium Inorganic materials 0.000 claims description 8
- 229910052738 indium Inorganic materials 0.000 claims description 3
- 229910052718 tin Inorganic materials 0.000 claims description 2
- 239000002184 metal Substances 0.000 description 20
- 229910052751 metal Inorganic materials 0.000 description 20
- 239000000919 ceramic Substances 0.000 description 11
- 239000000945 filler Substances 0.000 description 10
- 150000002739 metals Chemical class 0.000 description 7
- 238000000034 method Methods 0.000 description 6
- 239000010949 copper Substances 0.000 description 5
- 230000008018 melting Effects 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005496 eutectics Effects 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910004337 Ti-Ni Inorganic materials 0.000 description 1
- 229910011209 Ti—Ni Inorganic materials 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000005188 flotation Methods 0.000 description 1
- 238000005098 hot rolling Methods 0.000 description 1
- KHYBPSFKEHXSLX-UHFFFAOYSA-N iminotitanium Chemical compound [Ti]=N KHYBPSFKEHXSLX-UHFFFAOYSA-N 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 229910000765 intermetallic Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/3006—Ag as the principal constituent
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Ceramic Products (AREA)
Description
（産業上の利用分野）
本発明は、セラミツクスとセラミツクス、セラ
ミツクスと金属、金属と金属を接合する為のろう
付け用材料（以下「ろう材」という。）に関する
ものである。
（従来技術とその問題点）
従来よりセラミツクスと金属の接合方法として
は、一般に酸化ソルダー法、テレフンケン法、活
性金属法などがある。
活性金属法とは、非常に活性な金属Ti、Zr等
と、これらと比較的低融点の合金を作るNi、Cr
とを共晶組成になるようにしたろう材をセラミツ
クスと金属の間に挿入して真空中又は不活性ガス
中で接合する方法である。
ところで、前記金属の共晶温度は、Cr−Ti34
重量％で880℃、Ti−Ni24.5重量％で955℃であ
るので、高温で接合しなければならない。また高
温で接合するので、熱膨張も大きくなる。
このように従来の活性金属法で用いるろう材の
ろう付温度は、900℃以上の高温となるので、エ
ネルギーの損失、金属母材の軟化、熱膨張率が高
い等の問題があつた。
（発明の目的）
本発明は上記の問題を解決すべくなされたもの
で、ろう付温度が低く且つろう付継手強度を高く
できるろう材を提供することを目的とするもので
ある。
（発明の構成）
本発明のろう材の１つは、Ag47.6〜84.0重量
％、Zr、Hfの少なくとも１種4.8〜９重量％、残
部Cuから成るものである。
本発明のろう材の他の１つは、Ag47.6〜84.0重
量％、Zr、Hfの少なくとも１種4.8〜９重量％、
In、Snの少なくとも１種0.4〜20重量％、残部Cu
から成るものである。
本発明のろう材に於いて、Zr、Hfの少なくと
も１種を4.8〜９重量％とした理由は、ろう付継
手強度を高くする為で、4.8重量％未満ではセラ
ミツクスへの濡れ性が悪く、ろう付継手強度が劣
るからであり、９重量％を超えるとろうの融点が
上がり、且つZr、Hfの少なくとも１種がろう中
に多く残るので、脆い金属間化合物が多くなつて
ろう付継手強度が劣下するものである。
Zr、Hfの少なくとも１種に、Ag、Cu、In、
Snを含有させたのは、ろう材の融点を下げる為
と、ろう付け後に界面に働く熱膨張による応力を
暖和する為である。
本発明のろう材は、ろう中のZr、Hfの少なく
とも１種がろう付けの際母材の界面へ移動してセ
ラミツクスを濡らすことにより、またAgが多い
Ag−Cu−In−Snが中心部になる。従つて、やわ
らかいAg−Cu−In−Snがクツシヨンになり、強
度が向上し、セラミツクスの割れが防止される。
（実施例）
本発明のろう材の具体的な実施例を従来例と共
に説明する。
下記の表−１に示す成分組成の実施例１〜６の
ろう材は、高周波による浮揚溶解法で溶解し、銅
鋳型に鋳造し、これを切断して0.1mmの板材とな
したものである。従来例１のろう材はTi板、Cu
板、Ti板の３枚を、従来例２のろう材は、Ti板、
Ni板、Ti板の３枚を夫々熱間圧延により接合し
て0.1mmの板材となしたものである。
（以下余白）
(Industrial Application Field) The present invention relates to a brazing material (hereinafter referred to as "brazing material") for joining ceramics to ceramics, ceramics to metals, and metals to metals. (Prior art and its problems) Conventional methods for joining ceramics and metals include the oxidation solder method, the Telefunken method, and the active metal method. The active metal method uses very active metals such as Ti and Zr and Ni and Cr, which form alloys with these with relatively low melting points.
In this method, a brazing filler metal having a eutectic composition is inserted between the ceramic and the metal, and the bonding is performed in vacuum or in an inert gas. By the way, the eutectic temperature of the metal is Cr-Ti34
Since the temperature is 880°C by weight and 955°C by 24.5% by weight of Ti-Ni, it is necessary to bond at a high temperature. Furthermore, since bonding is performed at high temperatures, thermal expansion also increases. As described above, the brazing temperature of the brazing filler metal used in the conventional active metal method is a high temperature of 900° C. or higher, which has caused problems such as energy loss, softening of the metal base material, and high coefficient of thermal expansion. (Object of the Invention) The present invention was made to solve the above-mentioned problems, and an object of the present invention is to provide a brazing material that can be used at a low brazing temperature and that can increase the strength of a brazed joint. (Structure of the Invention) One of the brazing materials of the present invention is composed of 47.6 to 84.0% by weight of Ag, 4.8 to 9% by weight of at least one of Zr and Hf, and the remainder Cu. Another brazing material of the present invention includes 47.6 to 84.0% by weight of Ag, 4.8 to 9% by weight of at least one of Zr and Hf,
At least one of In and Sn 0.4 to 20% by weight, balance Cu
It consists of The reason why at least one of Zr and Hf is 4.8 to 9% by weight in the brazing filler metal of the present invention is to increase the strength of the brazed joint.If it is less than 4.8% by weight, the wettability to ceramics is poor; This is because the strength of the brazed joint is poor; if the content exceeds 9% by weight, the melting point of the solder increases, and at least one of Zr and Hf remains in large amounts in the solder, which increases the amount of brittle intermetallic compounds and reduces the strength of the brazed joint. is inferior. At least one of Zr and Hf, Ag, Cu, In,
The reason for including Sn is to lower the melting point of the brazing material and to soften the stress caused by thermal expansion that acts on the interface after brazing. The brazing filler metal of the present invention also contains a large amount of Ag because at least one of Zr and Hf in the brazing material moves to the interface of the base metal and wets the ceramic during brazing.
Ag−Cu−In−Sn forms the center. Therefore, the soft Ag-Cu-In-Sn becomes a cushion, improving the strength and preventing the ceramic from cracking. (Example) Specific examples of the brazing filler metal of the present invention will be described together with conventional examples. The brazing filler metals of Examples 1 to 6 having the compositions shown in Table 1 below were melted by high frequency flotation melting, cast into copper molds, and cut into 0.1 mm plates. . The filler metal in Conventional Example 1 is Ti plate, Cu
The brazing material of Conventional Example 2 is a Ti plate and a Ti plate.
Three sheets, a Ni plate and a Ti plate, are joined by hot rolling to form a 0.1 mm plate. (Margin below)
【表】【table】
【表】
然してこれら実施例１〜６及び従来例１、２の
各ろう材を夫々所定の付目寸法に切断或いは打抜
き加工し、これを用いてセラミツクスとセラミツ
クス、セラミツクスとFe−Ni42重量％合金との
ろう付けを行なつた。そしてその時のろう付温度
を測定し、またそれらのろう付継手の剪断試験と
割れ試験を行なつた処、下記の表−２に示すよう
な結果を得た。[Table] Each of the brazing filler metals of Examples 1 to 6 and Conventional Examples 1 and 2 was cut or punched into predetermined dimensions, and used to prepare ceramics and ceramics, and ceramics and Fe-Ni42% alloy by weight. I performed brazing with. The brazing temperature at that time was measured, and the brazed joints were subjected to shear tests and crack tests, and the results shown in Table 2 below were obtained.
【表】【table】
【表】
上記の表−２で明らかなように実施例１〜６の
ろう材は、従来例１、２のろう材に比しろう付温
度が低く、またろう付強度も著しく高く、さらに
機械的強度も高いことが判る。
（発明の効果）
以上の通り本発明のろう材は、ろう付温度が低
いので、ろう付け時のエネルギー損失を減少で
き、また金属母材の軟化を抑制でき、さらに熱膨
張率を低下できて熱応力を暖和できる。またろう
付け強度を高くでき、しかもろう付継手の機械的
強度も高くできる等の効果を有するので、従来の
ろう材にとつて代わることのできる画期的なもの
と云える。[Table] As is clear from Table 2 above, the brazing fillers of Examples 1 to 6 have lower brazing temperatures and significantly higher brazing strength than the brazing fillers of Conventional Examples 1 and 2. It can be seen that the objective strength is also high. (Effects of the Invention) As described above, the brazing material of the present invention has a low brazing temperature, so it can reduce energy loss during brazing, suppress the softening of the metal base material, and further reduce the coefficient of thermal expansion. It can relieve thermal stress. Furthermore, it has the effect of increasing the brazing strength and also increasing the mechanical strength of the brazed joint, so it can be said to be an epoch-making product that can replace conventional brazing materials.
Claims (1)
１種4.8〜９重量％、残部Cuから成るろう付け用
材料。 ２ Ag47.6〜84.0重量％、Zr、Hfの少なくとも
１種4.8〜９重量％、In、Snの少なくとも１種0.4
〜20重量％、残部Cuから成るろう付け用材料。[Claims] 1. A brazing material comprising 47.6 to 84.0% by weight of Ag, 4.8 to 9% by weight of at least one of Zr and Hf, and the balance Cu. 2 47.6 to 84.0% by weight of Ag, 4.8 to 9% by weight of at least one of Zr and Hf, 0.4% of at least one of In and Sn
Brazing material consisting of ~20% by weight, balance Cu.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20510884A JPS6182995A (en) | 1984-09-29 | 1984-09-29 | Brazing filler metal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20510884A JPS6182995A (en) | 1984-09-29 | 1984-09-29 | Brazing filler metal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6182995A JPS6182995A (en) | 1986-04-26 |
| JPH0445277B2 true JPH0445277B2 (en) | 1992-07-24 |
Family
ID=16501550
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20510884A Granted JPS6182995A (en) | 1984-09-29 | 1984-09-29 | Brazing filler metal |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6182995A (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3635369A1 (en) * | 1986-10-17 | 1988-04-28 | Degussa | METHOD FOR COATING SURFACES WITH HARD MATERIALS |
| US4883745A (en) * | 1988-11-07 | 1989-11-28 | Gte Products Corporation | Silver-copper-titanium brazing alloy containing crust inhibiting element |
| JP2686548B2 (en) * | 1988-12-14 | 1997-12-08 | 京セラ株式会社 | Brazing material |
| JP2520971B2 (en) * | 1990-05-18 | 1996-07-31 | 住友電気工業株式会社 | Bonding tools |
| JPH0725677A (en) * | 1993-05-10 | 1995-01-27 | Isuzu Motors Ltd | Method for joining ceramics to nickel or nickel-based alloy |
| KR100617398B1 (en) | 2005-09-02 | 2006-09-01 | 최진수 | Copper phosphorus blazing alloy containing cerium element |
| JP5189669B2 (en) | 2011-05-24 | 2013-04-24 | 田中貴金属工業株式会社 | Active metal brazing material |
| JP7301740B2 (en) * | 2017-05-30 | 2023-07-03 | デンカ株式会社 | Ceramic circuit board and its manufacturing method |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59232692A (en) * | 1983-06-17 | 1984-12-27 | Ngk Spark Plug Co Ltd | Brazing filler metal for joining ceramics and metal or the like and composite body composed of ceramics and metal or the like using said brazing filler metal |
-
1984
- 1984-09-29 JP JP20510884A patent/JPS6182995A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59232692A (en) * | 1983-06-17 | 1984-12-27 | Ngk Spark Plug Co Ltd | Brazing filler metal for joining ceramics and metal or the like and composite body composed of ceramics and metal or the like using said brazing filler metal |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6182995A (en) | 1986-04-26 |
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