JPH046476B2 - - Google Patents

Info

Publication number
JPH046476B2
JPH046476B2 JP63141586A JP14158688A JPH046476B2 JP H046476 B2 JPH046476 B2 JP H046476B2 JP 63141586 A JP63141586 A JP 63141586A JP 14158688 A JP14158688 A JP 14158688A JP H046476 B2 JPH046476 B2 JP H046476B2
Authority
JP
Japan
Prior art keywords
brazing
silver
brazing filler
test
filler metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP63141586A
Other languages
Japanese (ja)
Other versions
JPH01313198A (en
Inventor
Itaru Tamura
Kazuo Akazawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Steel Mfg Co Ltd
Original Assignee
Mitsubishi Steel Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Steel Mfg Co Ltd filed Critical Mitsubishi Steel Mfg Co Ltd
Priority to JP14158688A priority Critical patent/JPH01313198A/en
Publication of JPH01313198A publication Critical patent/JPH01313198A/en
Publication of JPH046476B2 publication Critical patent/JPH046476B2/ja
Granted legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24Selection of soldering or welding materials proper
    • B23K35/30Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/302Cu as the principal constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Ceramic Products (AREA)

Description

【発明の詳細な説明】[Detailed description of the invention]

[産業上の利用分野] 本発明は銀ろう材、特に、銀の含有量が少な
く、かつ、低融点である銀ろう材である。 [従来の技術] 銅と鋼を大気中でろう付することができ、か
つ、ろう付部の強度が高いろう材としては、従
来、銀ろうが知られている。この合金は国内外で
規格化されており、日本では、下記表1のとお
り、JIS Z 3261として規定されている。
[Industrial Field of Application] The present invention relates to a silver brazing material, particularly a silver brazing material having a low silver content and a low melting point. [Prior Art] Silver solder is conventionally known as a brazing material that can braze copper and steel in the atmosphere and has a high strength brazed portion. This alloy has been standardized both domestically and internationally, and in Japan it is specified as JIS Z 3261 as shown in Table 1 below.

【表】【table】

【表】 また、大気中でろう付が可能で銀を含まないろ
う材としては、Cu−38Mn−9Ni(AMS−4674)
が知られている。 V.R.Millerらは銀ろうに代るろう材としてCu
−Mn−Zn系合金およびCu−Mn−Sn系合金の試
験結果を報告している(Rep.lnvcst US Bur
Mines、1983)。 通常の銀ろうは銀含有量が高い(35℃以上)た
め、高価であり、銀の価格と共に変動する。又、
有害な元素Cdを含んだものもあり、ろう付作業
には細心の注意が必要である。 上記合金AMS−4764は融点が925℃と高いので
ろう付作業がむずかしく、母材に与える熱影響も
大きい。 Cu−Mn−Zn系合金は融点が高く(812℃以
上)、ぬれ性および接合強度も銀ろうより劣る。
また、Cu−Mn−Sn系合金は銀ろうに近似した特
性をもつが、融点は760〜810℃と高い。更に、こ
れらの合金は加工性が悪く、線あるいは薄板にす
るのが非常に困難である。 [発明が解決しようとする課題] 本発明は、従来の銀ろうより銀含有量が低く、
かつ、従来の銀ろうと同等の特性および作業性を
有するろう材を提供しようとするものである。 [課題を解決するための手段] 上記課題を解決するための本発明の構成は、組
成を重量基準で表わすと、 亜 鉛 25〜40% 銀 1〜35% マンガン 0.1〜15% 錫 0.1〜5% ニツケル 0.1以上、1%未満 銅および不可避不純物 残部 である低融点低銀ろう材である。 上記組成において、マンガンはその添加量が
0.1%より低いと、ろう材の融点が下がらず、ま
た15%を越えると加工が難しくなる。特に0.3〜
10%が適当である。 銀は1%未満では、ろう材の靭性あるいは可撓
性を向上させる効果はほとんどなく、また35%を
越えると加工性が低下する。 ニツケルは加工性、および、ろうのぬれ性を改
善する効果があるが、0.1%未満ではその効果は
なく、1%を越えて増やしても改善効果の向上は
ほとんどなく、また融点を上げるので好ましくな
い。 錫は添加量が0.1%未満では融点が下がらず、
目的に合致しない。又、5%を越えると脆弱にな
る。 亜鉛は融点を下げる効果があるが25%未満では
その効果が小である。40%を越えると著しく脆弱
になる。 上記の範囲内で種々の組合せについて検討した
結果、特に良好な性質を示す組成は下記のとおり
である。 亜 鉛 30〜35% 銀 10〜30% マンガン 0.3〜10% 錫 1〜3% ニツケル 0.3〜0.9% 銅 残部 [実施例] 以下、本発明を実施例によりさらに詳細に説明
する。 組成と溶融温度 表1に種々の組成のろう材の固相線温度および
液相線温度を示す。 Ag、Zn、Mn、Sn、Inはこれらの温度を下げ
る効果があり、Niは上げる効果がある。 たとえば試料CはGに比べ、銀含有量は低いが
液相線温度は低く、液相線温度と固相線温度との
温度差も小さく(前者が58℃、後者が95℃)、溶
け分れ現象が起りにくく、作業性が良いと言え
る。
[Table] Cu-38Mn-9Ni (AMS-4674) is a brazing material that can be brazed in the atmosphere and does not contain silver.
It has been known. VRMiller et al. used Cu as a brazing material instead of silver solder.
- Reports test results for Mn-Zn alloys and Cu-Mn-Sn alloys (Rep.lnvcst US Bur.
Mines, 1983). Regular silver solder has a high silver content (above 35 degrees Celsius), so it is expensive and fluctuates with the price of silver. or,
Some contain the harmful element Cd, so extreme caution is required during brazing work. The above-mentioned alloy AMS-4764 has a high melting point of 925°C, making brazing work difficult and having a large thermal effect on the base material. Cu-Mn-Zn alloy has a high melting point (812°C or higher), and its wettability and bonding strength are also inferior to silver solder.
In addition, Cu-Mn-Sn alloy has properties similar to silver solder, but its melting point is as high as 760-810°C. Furthermore, these alloys have poor processability and are very difficult to form into wires or thin sheets. [Problems to be solved by the invention] The present invention has a lower silver content than conventional silver solder,
Moreover, the present invention aims to provide a brazing material having properties and workability equivalent to those of conventional silver solder. [Means for Solving the Problems] The structure of the present invention for solving the above problems has the following compositions expressed on a weight basis: Zinc 25-40% Silver 1-35% Manganese 0.1-15% Tin 0.1-5 % Nickel 0.1 or more, less than 1% copper and unavoidable impurities The balance is a low melting point, low silver brazing filler metal. In the above composition, the amount of manganese added is
If it is lower than 0.1%, the melting point of the brazing filler metal will not be lowered, and if it exceeds 15%, processing will become difficult. Especially from 0.3
10% is appropriate. If silver is less than 1%, it has little effect on improving the toughness or flexibility of the brazing filler metal, and if it exceeds 35%, workability decreases. Nickel has the effect of improving processability and wax wettability, but if it is less than 0.1%, it has no effect, and if it is increased beyond 1%, there is almost no improvement in the improvement effect, and it also increases the melting point, so it is preferable. do not have. If the amount of tin added is less than 0.1%, the melting point will not decrease;
Not fit for purpose. Moreover, if it exceeds 5%, it becomes fragile. Zinc has the effect of lowering the melting point, but if it is less than 25%, the effect is small. If it exceeds 40%, it becomes extremely vulnerable. As a result of examining various combinations within the above range, compositions showing particularly good properties are as follows. Zinc 30-35% Silver 10-30% Manganese 0.3-10% Tin 1-3% Nickel 0.3-0.9% Copper Balance [Examples] The present invention will now be described in more detail with reference to Examples. Composition and Melting Temperature Table 1 shows the solidus temperature and liquidus temperature of brazing filler metals with various compositions. Ag, Zn, Mn, Sn, and In have the effect of lowering these temperatures, and Ni has the effect of raising them. For example, sample C has a lower silver content than sample G, but its liquidus temperature is lower, and the temperature difference between the liquidus and solidus temperatures is also small (the former is 58°C and the latter is 95°C), and the amount of dissolved It can be said that the phenomenon of cracking is less likely to occur and the workability is good.

【表】 * 本発明のろう材
ろう材の広がり試験1 表2の試料A、B、C、H、I、Jのろう材の
広がり試験をJIS Z 3191「硬ろうの広がり試験
方法」に準じて行なつた。 母材は普通鋼板(SPCC、1×50×50mm)と銅
板(C1201P、1×50×50mm)とし、フラツクス
はN社製F 101とした。 試験結果を第1図(普通鋼板)と第2図(銅
板)に示す。各値は3つのデータの平均値であ
る。 たとえば、試料C(30%Ag)とJ(40%Ag)の
ろう材の広がり面積を比較すると、鋼板上では試
料Cの方が大きく、銅板上ではJの方が大きくな
つている。従つて鋼と銅のろう付では、試料Cと
Jはほぼ同じろう回りと考えられる。 ろう材の広がり試験2 同様の試験条件でフラツクスのみを変えた(C
社製Mフラツクス)場合の結果を第3図と第4図
に示す。 同様に試料C(30%Ag)と試料J(40%Ag)を
比較すると、鋼板上および銅板上とも試料Cの広
がり面積の方が大きい。 以上のろう材の広がり試験1と2から本発明の
30%Agろうは従来の40%Agろうと同等あるいは
それ以上の広がり特性を示すことが判る。 ろう材の広がり試験3 同様の試験条件で、比較するろう材およびフラ
ツクス(H社製AフラツクスおよびN社製F101)
を変えた場合の結果を第5図と第6図に示す。 ろう材B、A、C、FはH社製Aフラツクスを
用い、* Fはろう材FにN社製F 101フラツクス
を用いた例である。 たとえば、試料B(25%Ag)と試料F(30%
Ag)のろう材の広がり面積を比較すると、鋼板
上(第5図)および銅板上(第6図)とも本発明
の試料Bの方が大きい。 ろう材の広がり試験4 同様の試験条件で、比較するろう材を変えた場
合の結果を(フラツクスはN社製開発フラツク
ス)第7図と第8図に示す。 たとえば、試料C(30%Ag)と試料G(35%
Ag)のろう材の広がり面積を比較すると、鋼板
上では試料Cの方が大きく、銅板上では試料Gの
方法がやや大きい。従つて、鋼と銅のろう付で
は、試料Cと試料Gはほぼ同じろう回りと考えら
れる。 継手の引張試験 表2の試料A、B、C、Jのろう材を用いたろ
う付継手の引張試験をJIS Z 3194(ろう付継手
の引張試験片)、JIS Z 3193(ろう付継手の引張
試験方法)に準じて行つた。 試験に用いた試験片の形状および寸法を第9図
に示す。試験は容量20トンのアムスラー型万能試
験機で行つた。 母材は銅(C1020)、黄銅(C2600)。軟鋼
(SS41)あるいはステンレス(SUS304)とした。
試験結果を第10図に示す。各値は3つのデータ
の平均値である。 いずれの母材においても試料Jの継手強度がや
や高い傾向にあるが、本発明の試料A、B、Cの
継手強度も実用上問題ない強度が得られている。 継手の剪断試験 引張試験と同様のろう材を用いたろう付継手の
剪断試験をJIS Z 3192(ろう付継手の剪断試験
方法)に準じて行なつた。試験に用いた試験片の
形状および寸法を第11図に示す。 母材は引張試験と同様とし、試験結果を第12
図に示す。 引張試験結果と同様の傾向を示し、本発明の試
料A、B、Cの剪断強度は実用上問題ないことが
わかる。 以上の結果から、本発明のろう材は、従来のろ
う材より5〜15%低い銀含有量で同等の作業性お
よび特性が得られる優れたろう材である。 [発明の効果] 以上説明したように、本発明のろう材は、銀含
有量が低く、カドミウムのような有害な元素を含
有しないで、かつ、融点が低く、ぬれ性および浸
透性が良好で、大気中でろう付が可能である。 したがつて、本発明によれば種々のろう付を大
気中で良好な作業性のもとに高信頼度で行うこと
ができる。
[Table] * Spreading test of brazing filler metal of the present invention 1 The spreading test of the brazing filler metal of samples A, B, C, H, I, and J in Table 2 was conducted according to JIS Z 3191 "Hard solder spreading test method". I did it. The base materials were an ordinary steel plate (SPCC, 1 x 50 x 50 mm) and a copper plate (C1201P, 1 x 50 x 50 mm), and the flux was F 101 manufactured by N Company. The test results are shown in Figure 1 (ordinary steel plate) and Figure 2 (copper plate). Each value is the average value of three data. For example, when comparing the spread area of the brazing filler metal of Samples C (30%Ag) and J (40%Ag), Sample C is larger on the steel plate, and J is larger on the copper plate. Therefore, in brazing steel and copper, samples C and J are considered to have approximately the same brazing circumference. Brazing filler metal spreading test 2 Same test conditions, only flux changed (C
The results are shown in Figs. Similarly, when comparing sample C (30%Ag) and sample J (40%Ag), the spread area of sample C is larger on both the steel plate and the copper plate. From the above brazing filler metal spread tests 1 and 2, the present invention
It can be seen that the 30% Ag solder exhibits spreading characteristics that are equal to or better than the conventional 40% Ag solder. Brazing filler metal spreading test 3 Comparing brazing filler metals and fluxes (A flux manufactured by Company H and F101 manufactured by Company N) under similar test conditions
Figures 5 and 6 show the results when changing . * F is an example in which A flux manufactured by Company H is used for the brazing filler metals B, A, C, and F, and F 101 flux manufactured by Company N is used for the brazing filler metal F. For example, sample B (25%Ag) and sample F (30%
Comparing the spread area of the brazing filler metal (Ag), Sample B of the present invention is larger on both the steel plate (FIG. 5) and the copper plate (FIG. 6). Brazing filler metal spreading test 4 Figures 7 and 8 show the results when different brazing filler metals were used under the same test conditions (the flux was a flux developed by N Company). For example, sample C (30%Ag) and sample G (35%
Comparing the spread area of the brazing filler metal (Ag), sample C is larger on the steel plate, and sample G is slightly larger on the copper plate. Therefore, in brazing steel and copper, samples C and G are considered to have approximately the same brazing circumference. Tensile test of joints Tensile tests of brazed joints using filler metals of samples A, B, C, and J in Table 2 were conducted according to JIS Z 3194 (Tensile test pieces for brazed joints) and JIS Z 3193 (Tensile test for brazed joints. method). Figure 9 shows the shape and dimensions of the test piece used in the test. The test was conducted in an Amsler type universal testing machine with a capacity of 20 tons. Base materials are copper (C1020) and brass (C2600). Made of mild steel (SS41) or stainless steel (SUS304).
The test results are shown in Figure 10. Each value is the average value of three data. In any of the base materials, the joint strength of sample J tends to be somewhat high, but the joint strength of samples A, B, and C of the present invention also has a strength that does not pose any practical problem. Shear test for joints A shear test for brazed joints using a brazing filler metal similar to the tensile test was conducted in accordance with JIS Z 3192 (shear test method for brazed joints). FIG. 11 shows the shape and dimensions of the test piece used in the test. The base material is the same as the tensile test, and the test results are
As shown in the figure. It can be seen that the shear strengths of Samples A, B, and C of the present invention have no practical problems, showing the same tendency as the tensile test results. From the above results, the brazing filler metal of the present invention is an excellent brazing filler metal that can provide the same workability and properties as conventional brazing fillers with a silver content that is 5 to 15% lower. [Effects of the Invention] As explained above, the brazing material of the present invention has a low silver content, does not contain harmful elements such as cadmium, has a low melting point, and has good wettability and permeability. , brazing is possible in the atmosphere. Therefore, according to the present invention, various types of brazing can be performed in the atmosphere with good workability and with high reliability.

【図面の簡単な説明】[Brief explanation of drawings]

第1図〜第8図は本発明のろう材、比較する従
来のろう材およびフラツクスを種々に変えたとき
の、各温度(800、850、900℃)における鋼板あ
るいは銅板上のろうの広がり面積を示すグラフ、
第9図イは引張試験片(JIS Z 3194)を示す平
面図、同ロは側面図、第10図は種々の母材にお
ける引張試験結果を示すグラフ、第11図イは剪
断試験片(JIS Z 3192)を示す平面図、同ロは
正面図、第12図は種々の母材における剪断試験
結果を示すグラフである。 1……母材、2……母材。
Figures 1 to 8 show the spread area of the solder on a steel plate or copper plate at various temperatures (800, 850, and 900°C) when using the brazing filler metal of the present invention, conventional brazing filler metals for comparison, and various fluxes. A graph showing,
Figure 9A is a plan view showing a tensile test piece (JIS Z 3194), Figure 10 is a side view, Figure 10 is a graph showing tensile test results for various base materials, and Figure 11A is a shear test piece (JIS Z 3194). Z 3192) is a plan view, B is a front view, and FIG. 12 is a graph showing shear test results for various base materials. 1... Base material, 2... Base material.

Claims (1)

【特許請求の範囲】 1 組成を重量基準で表わすと、 亜 鉛 25〜40% 銀 1〜35% マンガン 0.1〜15% 錫 0.1〜5% ニツケル 0.1以上、1%未満 銅および不可避不純物 残部 であることを特徴とする低融点低銀ろう材。[Claims] 1 When the composition is expressed on a weight basis, Zinc 25-40% Silver 1-35% Manganese 0.1-15% Tin 0.1-5% Nickel 0.1 or more, less than 1% Copper and unavoidable impurities balance A low melting point, low silver brazing filler metal.
JP14158688A 1988-06-10 1988-06-10 Low melting low silver brazing filler metal Granted JPH01313198A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14158688A JPH01313198A (en) 1988-06-10 1988-06-10 Low melting low silver brazing filler metal

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14158688A JPH01313198A (en) 1988-06-10 1988-06-10 Low melting low silver brazing filler metal

Publications (2)

Publication Number Publication Date
JPH01313198A JPH01313198A (en) 1989-12-18
JPH046476B2 true JPH046476B2 (en) 1992-02-05

Family

ID=15295450

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14158688A Granted JPH01313198A (en) 1988-06-10 1988-06-10 Low melting low silver brazing filler metal

Country Status (1)

Country Link
JP (1) JPH01313198A (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3232963B2 (en) * 1994-10-11 2001-11-26 株式会社日立製作所 Lead-free solder for connecting organic substrates and mounted products using the same
JP5242952B2 (en) * 2007-06-27 2013-07-24 日本特殊陶業株式会社 Solid electrolyte fuel cell and manufacturing method thereof
CN101985193B (en) * 2010-11-18 2012-09-05 常熟市华银焊料有限公司 Cadmium-free silver solder and preparation method thereof
JP5432231B2 (en) * 2011-11-21 2014-03-05 日本特殊陶業株式会社 Joining member for solid oxide fuel cell
EP2832488A1 (en) * 2013-07-31 2015-02-04 Umicore AG & Co. KG Brazing alloys
CN107478799B (en) * 2017-08-24 2019-07-16 华北水利水电大学 A method of prediction low melting point element regulates and controls soldered fitting mechanical property
CN107505445B (en) * 2017-08-24 2020-01-10 华北水利水电大学 Prediction method for mechanical property of low-melting-point element regulated silver-based solder soldered joint
WO2019207823A1 (en) 2018-04-23 2019-10-31 田中貴金属工業株式会社 Silver brazing material and joining method using said silver brazing material

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50136254A (en) * 1974-04-18 1975-10-29
JPS61242787A (en) * 1985-04-22 1986-10-29 Tokuriki Honten Co Ltd Silver brazing filler metal

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50136254A (en) * 1974-04-18 1975-10-29
JPS61242787A (en) * 1985-04-22 1986-10-29 Tokuriki Honten Co Ltd Silver brazing filler metal

Also Published As

Publication number Publication date
JPH01313198A (en) 1989-12-18

Similar Documents

Publication Publication Date Title
JP5152150B2 (en) Lead-free solder alloy
US6299835B1 (en) Cadmium-free silver alloy as low-melting brazing filler material
JP2885773B2 (en) Lead-free alloy for soldering
JP3220635B2 (en) Solder alloy and cream solder
US6156132A (en) Solder alloys
US4684052A (en) Method of brazing carbide using copper-zinc-manganese-nickel alloys
JP3736819B2 (en) Lead-free solder alloy
US4631171A (en) Copper-zinc-manganese-nickel alloys
JPH046476B2 (en)
JPH06182582A (en) Aluminum alloy brazing filler metal for brazing heat exchanger and aluminum alloy brazing sheet for heat exchanger
JP2000280090A (en) Solder alloy
EP0135603B1 (en) Ductile low temperature brazing alloy
JP3386009B2 (en) Solder alloy
JP2001287082A (en) Solder
US4444719A (en) Gold solders
JPH0323277B2 (en)
US3356494A (en) Fluxless aluminum brazing alloys
JP3210766B2 (en) Sn-based low melting point brazing material
JP2001225188A (en) Solder alloy
CA1293394C (en) Copper-zinc-manganese-nickel alloys
JPS6113911B2 (en)
KR20040095650A (en) SnCu-based lead-free soldering alloy
JPH09285888A (en) Brazing filter metal for stainless steel
JPS5915754B2 (en) Gold wax
US2125228A (en) Brazing alloy