JPH0323277B2 - - Google Patents
Info
- Publication number
- JPH0323277B2 JPH0323277B2 JP62129822A JP12982287A JPH0323277B2 JP H0323277 B2 JPH0323277 B2 JP H0323277B2 JP 62129822 A JP62129822 A JP 62129822A JP 12982287 A JP12982287 A JP 12982287A JP H0323277 B2 JPH0323277 B2 JP H0323277B2
- Authority
- JP
- Japan
- Prior art keywords
- silver
- melting point
- low
- brazing
- bismuth
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000005219 brazing Methods 0.000 claims description 25
- 238000002844 melting Methods 0.000 claims description 25
- 229910052709 silver Inorganic materials 0.000 claims description 18
- 239000004332 silver Substances 0.000 claims description 17
- 239000000463 material Substances 0.000 claims description 16
- 229910000679 solder Inorganic materials 0.000 claims description 11
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 8
- 229910052797 bismuth Inorganic materials 0.000 claims description 8
- 229910052738 indium Inorganic materials 0.000 claims description 8
- 229910052718 tin Inorganic materials 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 7
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 7
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 7
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 7
- 239000012535 impurity Substances 0.000 claims description 4
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- 230000008018 melting Effects 0.000 description 20
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 12
- 239000000945 filler Substances 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 230000000694 effects Effects 0.000 description 7
- 229910045601 alloy Inorganic materials 0.000 description 5
- 239000000956 alloy Substances 0.000 description 5
- 239000000203 mixture Substances 0.000 description 4
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 3
- 229910052748 manganese Inorganic materials 0.000 description 3
- 239000011572 manganese Substances 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 229910018645 Mn—Sn Inorganic materials 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 229910017566 Cu-Mn Inorganic materials 0.000 description 1
- 229910017871 Cu—Mn Inorganic materials 0.000 description 1
- 229910001297 Zn alloy Inorganic materials 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
Landscapes
- Ceramic Products (AREA)
- Conductive Materials (AREA)
Description
［産業上の利用分野］
本発明は、低融点低銀ろう材に係り、大気中で
も比較的低温度でろう付することができるもので
ある。
［従来の技術］
大気中でろう付することができ、ろう付部の強
度が高いろう材としては、従来、銀ろうが知られ
ている。この合金は国内外で規格化されている
が、日本では表１の如く、JIS Z3261として規定
されている。
[Industrial Application Field] The present invention relates to a low-melting point, low-silver brazing material that can be brazed at a relatively low temperature even in the atmosphere. [Prior Art] Silver solder is conventionally known as a brazing material that can be brazed in the atmosphere and has a high strength brazed portion. This alloy is standardized both domestically and internationally, but in Japan it is specified as JIS Z3261, as shown in Table 1.
【表】【table】
【表】
又、大気中でろう付が可能で銀を含まないろう
材としては、Cu−38Mn−9Ni（AMS−4764）が
知られている。
V.R.Millerらは銀ろうの置換材としてCu−Mn
−Zn系合金およびCu−Mn−Sn系合金の試験結
果を報知している（Rep.Invest US Bur Mines、
1983）
［発明が解決しようとする問題点］
銀ろうは銀含有量が高い（＞30％）ため、高価
であり、銀の価格と共に変動する。又、有害な元
素Cdを含んだものであり、ろう付作業には最新
の注意が必要である。
Cu−38Mn−9Ni（AMS−4764）は融点が925℃
と高いので、ろう付作業がむずかしく、母材に与
える熱影響が大きい。
Cu−Mn−Zn系合金は、融点が高く（＞812
℃）、ぬれ性および接合強度も銀ろうより劣る。
Cu−Mn−Sn系合金は銀ろうに近似した特性をも
つが、融点は760〜810℃と高い。又、これらの合
金は加工性が悪く、線あるいはは薄板にするのは
非常に困難である。
そこで、本発明では、従来の銀ろうより銀含有
量が低く、融点は銀ろうと同様に低く、大気中ろ
う付が可能なろう材を提供することを目的とす
る。
［問題点を解決するための手段］
本発明の第１発明は、重量基準0.1〜45％のマ
ンガン、１〜20％未満の銀および錫、鉛、インジ
ウム、ビスマスのうち少なくとも１種の合計で１
〜45％含み、残部が銅および不可避不純物である
ことを特徴とする低融点低銀ろう材である。
さらに第２発明は重量基準で0.1〜45％のマン
ガン、25％未満の銀、１〜15％のニツケルおよび
錫、鉛、インジウム、ビスマスのうち少なくとも
１種を合計で１〜45％含み、残部が銅および不可
避不純物であることを特徴とする低融点低銀ろう
材である。
上記組成において、マンガンは添加量が0.1％
より低いとろう材の融点が下がらず、また45％を
越えると融点が上がるので適当ではない。特に３
〜20％が適当である。
第１、第２発明における銀は１％未満ではろう
材の靭性あるいは可とう性を向上させる効果はほ
とんどなく、また第１発明においては20％以上、
第２発明においては25％以上になると加工性が下
がるので適当ではない。
ニツケルはぬれ性を改善する効果があるが、１
％未満ではその効果はなく、15％を越えると融点
を上げるので好ましくない。
錫及びインジウムは添加量が１％未満では融点
が下がらず、目的に合致しない。また、20％を越
えると脆弱になる。鉛、ビスマスは１％以上では
融点を下げる効果があるが、ろう材は脆弱になる
傾向にあり、特に20％を越えると著しく脆弱にな
る。これら選択成分の合計量は加工性の点から45
％を超えないようにする。
上記の範囲内で種々の組合せについて検討した
結果、特に良好な性質を示す組成は下記のとおり
である。
マンガン３〜20％、銀10〜20％未満、錫、
鉛、インジウム、ビスマスのうち少くとも１種
を合計で５〜30％、残部銅。
マンガン３〜20％、銀10〜20％、ニツケル１
〜７％、錫、鉛、インジウム、ビスマスのうち
少くとも１種を合計で５〜30％、残部銅。
［実施例］
以下、本発明を実施例によりさらに詳細に説明
する。
実施例 １
表２および第１図に融点に及ぼす添加元素およ
び添加量の影響を示す。第１図の横軸は融点を下
げるのに効果がある元素のSn、Ag、Pb、In、Bi
などの単独あるいは複合添加量を示す。これらの
元素の添加量が増加すると融点は低下している。
前述の元素の添加によつて銀ろうに相当する融点
が得られることがわかる。例えば、Cu−20Mn−
10Sn−10Agの融点は銀ろうのBg−４、８と同じ
780℃である。[Table] Additionally, Cu-38Mn-9Ni (AMS-4764) is known as a brazing material that can be brazed in the atmosphere and does not contain silver. VRMiller et al. used Cu-Mn as a silver solder replacement material.
- Announces test results for Zn-based alloys and Cu-Mn-Sn-based alloys (Rep. Invest US Bur Mines,
1983) [Problem to be solved by the invention] Silver solder has a high silver content (>30%), so it is expensive and fluctuates with the price of silver. Also, it contains the harmful element Cd, so special care must be taken during brazing work. Cu-38Mn-9Ni (AMS-4764) has a melting point of 925℃
This makes brazing work difficult and has a large thermal effect on the base material. Cu-Mn-Zn alloy has a high melting point (>812
°C), wettability and bonding strength are also inferior to silver solder.
Cu-Mn-Sn alloy has properties similar to silver solder, but its melting point is as high as 760-810℃. Furthermore, these alloys have poor workability and are extremely difficult to form into wires or thin plates. Therefore, an object of the present invention is to provide a brazing material that has a lower silver content than conventional silver solders, has a melting point as low as silver solders, and can be brazed in the atmosphere. [Means for Solving the Problems] The first invention of the present invention is based on a total of 0.1 to 45% manganese, 1 to less than 20% silver, and at least one of tin, lead, indium, and bismuth. 1
It is a low-melting point, low-silver brazing filler metal characterized by containing ~45% copper and the remainder being copper and unavoidable impurities. Furthermore, the second invention contains 0.1 to 45% manganese, less than 25% silver, 1 to 15% nickel, and at least one of tin, lead, indium, and bismuth in a total amount of 1 to 45% on a weight basis, and the balance This is a low-melting point, low-silver brazing filler metal characterized by containing copper and unavoidable impurities. In the above composition, the amount of manganese added is 0.1%.
If it is lower, the melting point of the brazing filler metal will not drop, and if it exceeds 45%, the melting point will rise, which is not appropriate. Especially 3
~20% is appropriate. In the first and second inventions, if silver is less than 1%, it has little effect on improving the toughness or flexibility of the brazing material, and in the first invention, if it is 20% or more,
In the second invention, if it exceeds 25%, the workability decreases, so it is not suitable. Nickel has the effect of improving wettability, but 1
If it is less than 15%, there is no effect, and if it exceeds 15%, it increases the melting point, which is not preferable. If the amount of tin and indium added is less than 1%, the melting point will not be lowered and the purpose will not be met. Also, if it exceeds 20%, it becomes vulnerable. When lead and bismuth exceed 1%, they have the effect of lowering the melting point, but the brazing filler metal tends to become brittle, especially when it exceeds 20%. The total amount of these selected ingredients is 45% from the viewpoint of processability.
Do not exceed %. As a result of examining various combinations within the above range, compositions showing particularly good properties are as follows. Manganese 3-20%, silver 10-20%, tin,
A total of 5 to 30% of at least one of lead, indium, and bismuth, and the balance is copper. Manganese 3-20%, silver 10-20%, nickel 1
~7%, at least one of tin, lead, indium, and bismuth in a total of 5 to 30%, the balance being copper. [Example] Hereinafter, the present invention will be explained in more detail with reference to Examples. Example 1 Table 2 and FIG. 1 show the effects of added elements and their amounts on the melting point. The horizontal axis in Figure 1 shows the elements Sn, Ag, Pb, In, and Bi that are effective in lowering the melting point.
Indicates the amount added individually or in combination. As the amount of these elements added increases, the melting point decreases.
It can be seen that by adding the above-mentioned elements, a melting point corresponding to that of silver solder can be obtained. For example, Cu−20Mn−
The melting point of 10Sn-10Ag is the same as silver solder Bg-4 and 8.
The temperature is 780℃.
【表】
番号１は比較材を示す。
実施例 ２
表３に示す種々の組成のろう材を使用し、第２
図に示す継手を大気中でトーチろう付をおこなつ
た。第２図において、１は超硬合金（使用分類信
号E4）、２は中空鋼（JIS SKC24）からなり、３
はろう材である。[Table] Number 1 indicates the comparative material.
Example 2 Using brazing fillers with various compositions shown in Table 3, the second
The joint shown in the figure was torch-brazed in air. In Figure 2, 1 is made of cemented carbide (use classification signal E4), 2 is made of hollow steel (JIS SKC24), and 3 is made of cemented carbide (use classification signal E4).
It is a brazing material.
【表】
ろう付製品の室温およよび400℃における剪断
試験結果を第３図に示す。融点の低いろう材では
室温および400℃の剪断強度とも低い傾向になつ
ている。逆に融点の高いろう材では室温およびび
400℃の剪断強度は高い傾向になつている。
本発明のろう材５および６の融点は超硬工具の
ろう付用の従来の銀ろうBAg−６（34）の融点よ
り低いにもかかわらず、室温の強度ほぼ等しく、
400℃の強度はそれより高くなつている。本発明
のろう材２、３および14の融点はBAg−６より
やや高いが、室温強度はほぼ等しい(2)が高く
（３、14）、400℃の強度はBAg−６の２倍以上あ
り、他の超硬工具用のろう材（22）より高い値と
なつている。
以上から、本発明のろう材は優れたろう材と言
える。
［発明の効果］
本発明によれば、低融点を有し、大気中でろう
付が可能であり、しかもぬれ性および浸透性の良
好なろう材が、銀含有量を低く、カドミウムのよ
うな有害な元素を含まない組成で得られる。
したがつて、本発明によれば種々のろう付を大
気中で良好な作業性のもとに高信頼度で行うこと
ができる。[Table] Figure 3 shows the shear test results of the brazed product at room temperature and 400°C. Brazing fillers with low melting points tend to have low shear strengths at both room temperature and 400°C. Conversely, brazing filler metals with high melting points are
The shear strength at 400℃ tends to be high. Although the melting points of brazing filler metals 5 and 6 of the present invention are lower than that of conventional silver solder BAg-6 (34) for brazing cemented carbide tools, they have almost the same strength at room temperature.
The strength at 400℃ is higher than that. The melting points of brazing materials 2, 3, and 14 of the present invention are slightly higher than BAg-6, but the room temperature strengths (2) are almost the same but higher (3, 14), and the strength at 400°C is more than twice that of BAg-6. , which is higher than other filler metals for carbide tools (22). From the above, it can be said that the brazing material of the present invention is an excellent brazing material. [Effects of the Invention] According to the present invention, a brazing material that has a low melting point, can be brazed in the atmosphere, and has good wettability and permeability has a low silver content and a brazing material such as cadmium. Obtained with a composition that does not contain harmful elements. Therefore, according to the present invention, various types of brazing can be performed in the atmosphere with good workability and with high reliability.
第１図は、本発明の各実施例の融点を示すグラ
フ、第２図イは試験のためのろう接継手を示す平
面図、第２図ロは同一部切断正面図、第３図はろ
う接継手の剪断強度の試験結果を示すグラフであ
る。
１……超硬合金、２……中空鋼、３……ろう
材。
Fig. 1 is a graph showing the melting point of each example of the present invention, Fig. 2 A is a plan view showing a soldered joint for testing, Fig. 2 B is a partially cutaway front view of the same, and Fig. 3 is a soldered joint for testing. It is a graph which shows the test result of the shear strength of a joint. 1... Cemented carbide, 2... Hollow steel, 3... Brazing metal.
Claims (1)
未満の銀及び錫、鉛、インジウム、ビスマスのう
ち少なくとも１種を合計で１〜45％含み、残部が
銅及び不可避不純物であることを特徴とする低融
点低銀ろう材。 ２ 重量基準で0.1〜45％のマンガン、１〜25％
未満の銀、１〜15％のニツケルおよび錫、鉛、イ
ンジウム、ビスマスのうち少なくとも１種を合計
で１〜45％含み、残部が銅及び不可避不純物であ
ることを特徴とする低融点低銀ろう材。[Claims] 1. 0.1-45% manganese, 1-20% by weight
1. A low-melting, low-silver brazing material characterized by containing 1 to 45% in total of at least one of tin, lead, indium, and bismuth, with the remainder being copper and unavoidable impurities. 2 0.1-45% manganese, 1-25% by weight
A low-melting point, low-silver solder characterized by containing less than 1% silver, 1-15% nickel and at least one of tin, lead, indium, and bismuth in a total of 1-45%, with the remainder being copper and inevitable impurities. Material.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61-201860 | 1986-08-29 | ||
| JP20186086 | 1986-08-29 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63154290A JPS63154290A (en) | 1988-06-27 |
| JPH0323277B2 true JPH0323277B2 (en) | 1991-03-28 |
Family
ID=16448086
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12982287A Granted JPS63154290A (en) | 1986-08-29 | 1987-05-28 | Low melting silver brazing filler metal |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63154290A (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5242952B2 (en) * | 2007-06-27 | 2013-07-24 | 日本特殊陶業株式会社 | Solid electrolyte fuel cell and manufacturing method thereof |
| EP2505680B1 (en) * | 2011-03-30 | 2015-05-06 | MEDIKA S.r.l. | Copper metal alloy |
| JP5432231B2 (en) * | 2011-11-21 | 2014-03-05 | 日本特殊陶業株式会社 | Joining member for solid oxide fuel cell |
| CN104057212A (en) * | 2014-07-01 | 2014-09-24 | 张家港市佳晟机械有限公司 | High-performance silver-based solder |
| CN104227267A (en) * | 2014-09-27 | 2014-12-24 | 宁波银马焊材科技有限公司 | Silver-based braze welding material and preparing method of silver-based braze welding material |
| CN112004638A (en) | 2018-04-23 | 2020-11-27 | 田中贵金属工业株式会社 | Silver solder and bonding method using the same |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4834495A (en) * | 1971-09-01 | 1973-05-18 | ||
| JPS52126660A (en) * | 1976-04-19 | 1977-10-24 | Ishifuku Metal Ind | Silverrbrazing alloy |
| JPS5355438A (en) * | 1976-10-29 | 1978-05-19 | Ebara Mfg | Brazing filler |
| JPS5355442A (en) * | 1976-10-29 | 1978-05-19 | Ebara Mfg | Brazing filler |
| JPS5355439A (en) * | 1976-10-29 | 1978-05-19 | Ebara Mfg | Brazing filler |
| JPS5365219A (en) * | 1976-11-25 | 1978-06-10 | Tokuriki Honten Kk | Silver solder alloy |
| JPS61242787A (en) * | 1985-04-22 | 1986-10-29 | Tokuriki Honten Co Ltd | Silver brazing filler metal |
-
1987
- 1987-05-28 JP JP12982287A patent/JPS63154290A/en active Granted
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4834495A (en) * | 1971-09-01 | 1973-05-18 | ||
| JPS52126660A (en) * | 1976-04-19 | 1977-10-24 | Ishifuku Metal Ind | Silverrbrazing alloy |
| JPS5355438A (en) * | 1976-10-29 | 1978-05-19 | Ebara Mfg | Brazing filler |
| JPS5355442A (en) * | 1976-10-29 | 1978-05-19 | Ebara Mfg | Brazing filler |
| JPS5355439A (en) * | 1976-10-29 | 1978-05-19 | Ebara Mfg | Brazing filler |
| JPS5365219A (en) * | 1976-11-25 | 1978-06-10 | Tokuriki Honten Kk | Silver solder alloy |
| JPS61242787A (en) * | 1985-04-22 | 1986-10-29 | Tokuriki Honten Co Ltd | Silver brazing filler metal |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63154290A (en) | 1988-06-27 |
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