CN104057212A - High-performance silver-based solder - Google Patents
High-performance silver-based solder Download PDFInfo
- Publication number
- CN104057212A CN104057212A CN201410306471.5A CN201410306471A CN104057212A CN 104057212 A CN104057212 A CN 104057212A CN 201410306471 A CN201410306471 A CN 201410306471A CN 104057212 A CN104057212 A CN 104057212A
- Authority
- CN
- China
- Prior art keywords
- accounts
- silver
- performance
- base solder
- money base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/3006—Ag as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Conductive Materials (AREA)
Abstract
The invention discloses a high-performance silver-based solder. The high-performance silver-based solder is composed of the following six ingredients in percentage by weight: 57.6%-61.9% of silver, 18.7%-19.6% of copper, 12.4%-13.3% of zinc, 2.3%-3.2% of cadmium, 3.6%-4.4% of tin and 1.1%-1.9% of nickel. The high-performance silver-based solder is composed of the six metals of silver, copper, zinc, cadmium, tin and nickel, and has the characteristics of good manufacturability, good wettability, good caulking performance, high strength, good plasticity, good electrical conductivity and excellent corrosion resistance.
Description
Technical field
The present invention relates to a kind of alloy, be specifically related to a kind of high-performance money base solder.
Background technology
Silver-base solder is the alloy as leading taking silver or money base solid solution normally.Can be used to nearly all ferrous metal and the non-ferrous metal of soldering except aluminium, magnesium and other low-melting-point metal, thereby be widely used.But along with the constant growth of productivity instantly, the various aspects of performance of the silver-base solder on market cannot meet the user demand of society instantly.
Summary of the invention
The object of the present invention is to provide a kind of good manufacturability, wetability is good, joint filling is good, intensity is high, plasticity is good, the high-performance money base solder of good conductivity and corrosion resistance excellent.
Technical scheme of the present invention is, a kind of high-performance money base solder, described high-performance money base solder is combined by silver, copper, zinc, cadmium, tin and six kinds of metal ingredients of nickel, in described high-performance money base solder, the shared percentage by weight of each composition is respectively: described silver accounts for 61.4%, described copper accounts for 18.7%-19.6%, and described zinc accounts for 12.4%-13.3%, and described cadmium accounts for 2.3%-3.2%, described tin accounts for 3.6%-4.4%, and described nickel accounts for 1.1%-1.9%.
In a preferred embodiment of the present invention, in described high-performance money base solder, the shared percentage by weight of each composition is specially: described silver accounts for 57.6%-61.9%, and described copper accounts for 18.8%, described zinc accounts for 12.5%, described cadmium accounts for 2.4%, and described tin accounts for 3.7%, and described nickel accounts for 1.2%.
In a preferred embodiment of the present invention, in described high-performance money base solder, the shared percentage by weight of each composition is specially: described silver accounts for 58.1%, and described copper accounts for 19.5%, described zinc accounts for 13.2%, described cadmium accounts for 3.1%, and described tin accounts for 4.3%, and described nickel accounts for 1.8%.
Of the present invention is a kind of high-performance money base solder, is made up of six kinds of metallic elements such as silver, copper, zinc, cadmium, tin and nickel, has good manufacturability, wetability is good, joint filling is good, intensity is high, plasticity is good, the feature of good conductivity and corrosion resistance excellent.
Detailed description of the invention
Below preferred embodiment of the present invention is described in detail, thereby so that advantages and features of the invention can be easier to be it will be appreciated by those skilled in the art that, protection scope of the present invention is made to more explicit defining.
Of the present invention is a kind of high-performance money base solder, described high-performance money base solder is combined by silver, copper, zinc, cadmium, tin and six kinds of metal ingredients of nickel, in described high-performance money base solder, the shared percentage by weight of each composition is respectively: described silver accounts for 61.4%, described copper accounts for 18.7%-19.6%, described zinc accounts for 12.4%-13.3%, described cadmium accounts for 2.3%-3.2%, and described tin accounts for 3.6%-4.4%, and described nickel accounts for 1.1%-1.9%.
Further, in described high-performance money base solder, the shared percentage by weight of each composition is specially: described silver accounts for 57.6%-61.9%, and described copper accounts for 18.8%, and described zinc accounts for 12.5%, and described cadmium accounts for 2.4%, and described tin accounts for 3.7%, and described nickel accounts for 1.2%.
Further, in described high-performance money base solder, the shared percentage by weight of each composition is specially: described silver accounts for 58.1%, and described copper accounts for 19.5%, and described zinc accounts for 13.2%, and described cadmium accounts for 3.1%, and described tin accounts for 4.3%, and described nickel accounts for 1.8%.
In addition, can be by regulating the Different Weight percentage of each composition in alloy, the alloy property height obtaining is differed.
Of the present invention is a kind of high-performance money base solder, is made up of six kinds of metallic elements such as silver, copper, zinc, cadmium, tin and nickel, has good manufacturability, wetability is good, joint filling is good, intensity is high, plasticity is good, the feature of good conductivity and corrosion resistance excellent.
The foregoing is only the specific embodiment of the present invention; but protection scope of the present invention is not limited to this; any those of ordinary skill in the art are in the disclosed technical scope of the present invention; the variation that can expect without creative work or replacement, within all should being encompassed in protection scope of the present invention.Therefore, protection scope of the present invention should be as the criterion with the protection domain that claims were limited.
Claims (3)
1. a high-performance money base solder, it is characterized in that: described high-performance money base solder is combined by silver, copper, zinc, cadmium, tin and six kinds of metal ingredients of nickel, in described high-performance money base solder, the shared percentage by weight of each composition is respectively: described silver accounts for 57.6%-61.9%, described copper accounts for 18.7%-19.6%, described zinc accounts for 12.4%-13.3%, described cadmium accounts for 2.3%-3.2%, and described tin accounts for 3.6%-4.4%, and described nickel accounts for 1.1%-1.9%.
2. high-performance money base solder according to claim 1, it is characterized in that: in described high-performance money base solder, the shared percentage by weight of each composition is specially: described silver accounts for 61.4%, described copper accounts for 18.8%, described zinc accounts for 12.5%, described cadmium accounts for 2.4%, described tin accounts for 3.7%, and described nickel accounts for 1.2%.
3. high-performance money base solder according to claim 1, it is characterized in that: in described high-performance money base solder, the shared percentage by weight of each composition is specially: described silver accounts for 58.1%, described copper accounts for 19.5%, described zinc accounts for 13.2%, described cadmium accounts for 3.1%, described tin accounts for 4.3%, and described nickel accounts for 1.8%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410306471.5A CN104057212A (en) | 2014-07-01 | 2014-07-01 | High-performance silver-based solder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410306471.5A CN104057212A (en) | 2014-07-01 | 2014-07-01 | High-performance silver-based solder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104057212A true CN104057212A (en) | 2014-09-24 |
Family
ID=51545299
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410306471.5A Pending CN104057212A (en) | 2014-07-01 | 2014-07-01 | High-performance silver-based solder |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104057212A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104227267A (en) * | 2014-09-27 | 2014-12-24 | 宁波银马焊材科技有限公司 | Silver-based braze welding material and preparing method of silver-based braze welding material |
| CN106563893A (en) * | 2016-10-21 | 2017-04-19 | 四川科力特硬质合金股份有限公司 | Silver brazing solder of cemented carbide and steel and silver brazing method thereof |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5074551A (en) * | 1973-11-05 | 1975-06-19 | ||
| JPS5171839A (en) * | 1974-12-13 | 1976-06-22 | Chromalloy American Corp | Sukunakutomo itsukashonisetsugobuo jusuru aruminiumuhifukuo hodokoshita tetsukinzokubutsupinto sono seizohoho |
| JPS5476462A (en) * | 1977-11-30 | 1979-06-19 | Yaskawa Denki Seisakusho Kk | Silver solder |
| JPS5939493A (en) * | 1982-08-27 | 1984-03-03 | Tanaka Kikinzoku Kogyo Kk | Brazing material |
| JPS63154290A (en) * | 1986-08-29 | 1988-06-27 | Mitsubishi Steel Mfg Co Ltd | Low melting silver brazing filler metal |
| JPH04162982A (en) * | 1990-10-24 | 1992-06-08 | Nippon Stainless Steel Co Ltd | Brazing of tini alloy |
| CN1404957A (en) * | 2001-09-18 | 2003-03-26 | 北京航空材料研究院 | Cadmium-free silver-base solder |
-
2014
- 2014-07-01 CN CN201410306471.5A patent/CN104057212A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5074551A (en) * | 1973-11-05 | 1975-06-19 | ||
| JPS5171839A (en) * | 1974-12-13 | 1976-06-22 | Chromalloy American Corp | Sukunakutomo itsukashonisetsugobuo jusuru aruminiumuhifukuo hodokoshita tetsukinzokubutsupinto sono seizohoho |
| JPS5476462A (en) * | 1977-11-30 | 1979-06-19 | Yaskawa Denki Seisakusho Kk | Silver solder |
| JPS5939493A (en) * | 1982-08-27 | 1984-03-03 | Tanaka Kikinzoku Kogyo Kk | Brazing material |
| JPS63154290A (en) * | 1986-08-29 | 1988-06-27 | Mitsubishi Steel Mfg Co Ltd | Low melting silver brazing filler metal |
| JPH04162982A (en) * | 1990-10-24 | 1992-06-08 | Nippon Stainless Steel Co Ltd | Brazing of tini alloy |
| CN1404957A (en) * | 2001-09-18 | 2003-03-26 | 北京航空材料研究院 | Cadmium-free silver-base solder |
Non-Patent Citations (1)
| Title |
|---|
| 张启运等: "《钎焊手册》", 31 January 1999 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104227267A (en) * | 2014-09-27 | 2014-12-24 | 宁波银马焊材科技有限公司 | Silver-based braze welding material and preparing method of silver-based braze welding material |
| CN106563893A (en) * | 2016-10-21 | 2017-04-19 | 四川科力特硬质合金股份有限公司 | Silver brazing solder of cemented carbide and steel and silver brazing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20140924 |