JP2020176774A - ヒートシンク - Google Patents
ヒートシンク Download PDFInfo
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- JP2020176774A JP2020176774A JP2019079602A JP2019079602A JP2020176774A JP 2020176774 A JP2020176774 A JP 2020176774A JP 2019079602 A JP2019079602 A JP 2019079602A JP 2019079602 A JP2019079602 A JP 2019079602A JP 2020176774 A JP2020176774 A JP 2020176774A
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- Prior art keywords
- heat
- flat plate
- plate portion
- transport member
- heat sink
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/043—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure forming loops, e.g. capillary pumped loops
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
- F28F9/26—Arrangements for connecting different sections of heat-exchange elements, e.g. of radiators
- F28F9/262—Arrangements for connecting different sections of heat-exchange elements, e.g. of radiators for radiators
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
[1]発熱体と熱的に接続される受熱部を有する熱輸送部材と、該熱輸送部材の放熱部にて接続された、複数の放熱フィンが配置された放熱フィン群と、を備え、
前記熱輸送部材が、前記受熱部から前記放熱部まで連通し、且つ作動流体が封入された一体である内部空間を有し、
前記受熱部の内部空間に、受熱部内面表面積増大部と支持部材が設けられ、該支持部材が、該受熱部内面表面積増大部と面接触しているヒートシンク。
[2]前記発熱体と熱的に接続される前記受熱部を有する熱輸送部材と、該熱輸送部材の放熱部にて接続された管体と、該管体と熱的に接続された、前記複数の放熱フィンが配置された放熱フィン群と、を備え、
前記熱輸送部材が、前記受熱部から前記管体との接続部まで連通し、且つ前記作動流体が封入された一体である内部空間を有し、前記熱輸送部材の内部空間が、前記管体の内部空間と連通し、
前記受熱部の内部空間に、前記受熱部内面表面積増大部と前記支持部材が設けられ、該支持部材が、該受熱部内面表面積増大部と面接触している[1]に記載のヒートシンク。
[3]前記支持部材が、前記受熱部内面表面積増大部と面接触する第1の平板部と、該第1の平板部と対向した第2の平板部と、該第1の平板部と該第2の平板部を繋ぐ第3の平板部と、を有する[1]または[2]に記載のヒートシンク。
[4]前記第1の平板部の面積が、前記第2の平板部の面積よりも大きい[3]に記載のヒートシンク。
[5]前記第3の平板部が、前記熱輸送部材の熱輸送方向に沿って延在している[3]または[4]に記載のヒートシンク。
[6]前記第1の平板部の幅方向の一端及び他端からそれぞれ前記第3の平板部が延在し、前記第2の平板部が該第3の平板部から外方向へ延在している[3]乃至[5]のいずれか1つに記載のヒートシンク。
[7]前記第1の平板部の幅方向の一端及び他端からそれぞれ前記第3の平板部が延在し、前記第2の平板部が該第3の平板部から内方向へ延在している[3]乃至[5]のいずれか1つに記載のヒートシンク。
[8]前記第1の平板部に貫通口が設けられている[3]乃至[7]のいずれか1つに記載のヒートシンク。
[9]前記第1の平板部が、平面視において、前記受熱部内面表面積増大部全体を覆っている[3]乃至[8]のいずれか1つに記載のヒートシンク。
[10]前記管体が、前記放熱フィンの配置方向に沿って延在している[2]に記載のヒートシンク。
[11]前記管体の延在方向が、前記熱輸送部材の熱輸送方向と平行ではない[2]に記載のヒートシンク。
[12]前記管体が、複数設けられ、前記熱輸送部材から複数の方向に延在している[2]に記載のヒートシンク。
[13]前記熱輸送部材の少なくとも一面が、平面形状である[1]乃至[12]のいずれか1つに記載のヒートシンク。
10 熱輸送部材
14 ウィック構造体
20 放熱フィン群
31 管体
41 受熱部
42 放熱部
43 断熱部
44 受熱部内面表面積増大部
50 支持部材
51 第1の平板部
52 第2の平板部
53 第3の平板部
Claims (13)
- 発熱体と熱的に接続される受熱部を有する熱輸送部材と、該熱輸送部材の放熱部にて接続された、複数の放熱フィンが配置された放熱フィン群と、を備え、
前記熱輸送部材が、前記受熱部から前記放熱部まで連通し、且つ作動流体が封入された一体である内部空間を有し、
前記受熱部の内部空間に、受熱部内面表面積増大部と支持部材が設けられ、該支持部材が、該受熱部内面表面積増大部と面接触しているヒートシンク。 - 前記発熱体と熱的に接続される前記受熱部を有する熱輸送部材と、該熱輸送部材の放熱部にて接続された管体と、該管体と熱的に接続された、前記複数の放熱フィンが配置された放熱フィン群と、を備え、
前記熱輸送部材が、前記受熱部から前記管体との接続部まで連通し、且つ前記作動流体が封入された一体である内部空間を有し、前記熱輸送部材の内部空間が、前記管体の内部空間と連通し、
前記受熱部の内部空間に、前記受熱部内面表面積増大部と前記支持部材が設けられ、該支持部材が、該受熱部内面表面積増大部と面接触している請求項1に記載のヒートシンク。 - 前記支持部材が、前記受熱部内面表面積増大部と面接触する第1の平板部と、該第1の平板部と対向した第2の平板部と、該第1の平板部と該第2の平板部を繋ぐ第3の平板部と、を有する請求項1または2に記載のヒートシンク。
- 前記第1の平板部の面積が、前記第2の平板部の面積よりも大きい請求項3に記載のヒートシンク。
- 前記第3の平板部が、前記熱輸送部材の熱輸送方向に沿って延在している請求項3または4に記載のヒートシンク。
- 前記第1の平板部の幅方向の一端及び他端からそれぞれ前記第3の平板部が延在し、前記第2の平板部が該第3の平板部から外方向へ延在している請求項3乃至5のいずれか1項に記載のヒートシンク。
- 前記第1の平板部の幅方向の一端及び他端からそれぞれ前記第3の平板部が延在し、前記第2の平板部が該第3の平板部から内方向へ延在している請求項3乃至5のいずれか1項に記載のヒートシンク。
- 前記第1の平板部に貫通口が設けられている請求項3乃至7のいずれか1項に記載のヒートシンク。
- 前記第1の平板部が、平面視において、前記受熱部内面表面積増大部全体を覆っている請求項3乃至8のいずれか1項に記載のヒートシンク。
- 前記管体が、前記放熱フィンの配置方向に沿って延在している請求項2に記載のヒートシンク。
- 前記管体の延在方向が、前記熱輸送部材の熱輸送方向と平行ではない請求項2に記載のヒートシンク。
- 前記管体が、複数設けられ、前記熱輸送部材から複数の方向に延在している請求項2に記載のヒートシンク。
- 前記熱輸送部材の少なくとも一面が、平面形状である請求項1乃至12のいずれか1項に記載のヒートシンク。
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019079602A JP6640401B1 (ja) | 2019-04-18 | 2019-04-18 | ヒートシンク |
PCT/JP2020/015595 WO2020213464A1 (ja) | 2019-04-18 | 2020-04-07 | ヒートシンク |
EP20775153.8A EP3761353A4 (en) | 2019-04-18 | 2020-04-07 | HEAT SINK |
CN202010305323.7A CN111836516B (zh) | 2019-04-18 | 2020-04-17 | 散热器 |
CN202020583539.5U CN212876432U (zh) | 2019-04-18 | 2020-04-17 | 散热器 |
TW109112972A TWI810448B (zh) | 2019-04-18 | 2020-04-17 | 散熱器 |
US17/010,599 US11112186B2 (en) | 2019-04-18 | 2020-09-02 | Heat pipe heatsink with internal structural support plate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019079602A JP6640401B1 (ja) | 2019-04-18 | 2019-04-18 | ヒートシンク |
Publications (2)
Publication Number | Publication Date |
---|---|
JP6640401B1 JP6640401B1 (ja) | 2020-02-05 |
JP2020176774A true JP2020176774A (ja) | 2020-10-29 |
Family
ID=69320928
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2019079602A Active JP6640401B1 (ja) | 2019-04-18 | 2019-04-18 | ヒートシンク |
Country Status (6)
Country | Link |
---|---|
US (1) | US11112186B2 (ja) |
EP (1) | EP3761353A4 (ja) |
JP (1) | JP6640401B1 (ja) |
CN (2) | CN212876432U (ja) |
TW (1) | TWI810448B (ja) |
WO (1) | WO2020213464A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE112019006900T5 (de) * | 2019-02-22 | 2021-11-11 | Mitsubishi Electric Corporation | Kühlvorrichtung und leistungsumwandlungsvorrichtung |
JP6640401B1 (ja) * | 2019-04-18 | 2020-02-05 | 古河電気工業株式会社 | ヒートシンク |
USD953280S1 (en) * | 2020-01-17 | 2022-05-31 | Furukawa Electric Co., Ltd | Heat sink |
JP7029009B1 (ja) * | 2021-03-09 | 2022-03-02 | 古河電気工業株式会社 | ヒートシンク |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55102889A (en) * | 1979-02-01 | 1980-08-06 | Pioneer Electronic Corp | Natural convection type radiator |
JPH10209356A (ja) * | 1996-11-25 | 1998-08-07 | Denso Corp | 沸騰冷却装置 |
US20040163798A1 (en) * | 2003-02-25 | 2004-08-26 | Debashis Ghosh | Compact thermosiphon for dissipating heat generated by electronic components |
JP2016092173A (ja) * | 2014-11-04 | 2016-05-23 | 富士通株式会社 | 蒸発器、冷却装置、及び電子機器 |
Family Cites Families (79)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3777811A (en) * | 1970-06-01 | 1973-12-11 | Trw Inc | Heat pipe with dual working fluids |
JPS4715741A (ja) * | 1971-01-27 | 1972-08-25 | ||
US4489777A (en) * | 1982-01-21 | 1984-12-25 | Del Bagno Anthony C | Heat pipe having multiple integral wick structures |
US4523636A (en) * | 1982-09-20 | 1985-06-18 | Stirling Thermal Motors, Inc. | Heat pipe |
US5076351A (en) * | 1989-07-19 | 1991-12-31 | Showa Aluminum Corporation | Heat pipe |
US5522455A (en) * | 1994-05-05 | 1996-06-04 | Northrop Grumman Corporation | Heat pipe manifold with screen-lined insert |
JP3164518B2 (ja) * | 1995-12-21 | 2001-05-08 | 古河電気工業株式会社 | 平面型ヒートパイプ |
US6269866B1 (en) * | 1997-02-13 | 2001-08-07 | The Furukawa Electric Co., Ltd. | Cooling device with heat pipe |
DE19805930A1 (de) * | 1997-02-13 | 1998-08-20 | Furukawa Electric Co Ltd | Kühlvorrichtung |
TW407455B (en) * | 1997-12-09 | 2000-10-01 | Diamond Electric Mfg | Heat pipe and its processing method |
WO1999053254A1 (en) * | 1998-04-13 | 1999-10-21 | Furukawa Electric Co., Ltd. | Plate type heat pipe and its mounting structure |
JP2000124374A (ja) * | 1998-10-21 | 2000-04-28 | Furukawa Electric Co Ltd:The | 板型ヒートパイプとそれを用いた冷却構造 |
US20020020518A1 (en) * | 2000-05-22 | 2002-02-21 | Li Jia Hao | Supportive wick structure of planar heat pipe |
JP2004506866A (ja) * | 2000-08-11 | 2004-03-04 | ラムコ ホールディングス リミテッド | 改良型ヒータ |
US6675874B2 (en) * | 2001-06-29 | 2004-01-13 | Thermal Corp. | Heat pipe system for cooling flywheel energy storage systems |
JP2003110072A (ja) | 2001-09-28 | 2003-04-11 | Fujikura Ltd | ヒートパイプ式ヒートシンク |
US7093647B2 (en) * | 2001-12-27 | 2006-08-22 | Showa Denko K.K. | Ebullition cooling device for heat generating component |
JP2003322484A (ja) * | 2002-04-30 | 2003-11-14 | Furukawa Electric Co Ltd:The | 板型ヒートパイプおよびその実装構造 |
JP2004028442A (ja) * | 2002-06-25 | 2004-01-29 | Furukawa Electric Co Ltd:The | 板型ヒートパイプおよびその実装構造 |
JP2004125381A (ja) * | 2002-08-02 | 2004-04-22 | Mitsubishi Alum Co Ltd | ヒートパイプユニット及びヒートパイプ冷却器 |
US7044201B2 (en) * | 2002-08-21 | 2006-05-16 | Samsung Electronics Co., Ltd. | Flat heat transferring device and method of fabricating the same |
US7823629B2 (en) * | 2003-03-20 | 2010-11-02 | Thermal Corp. | Capillary assisted loop thermosiphon apparatus |
US20050173098A1 (en) * | 2003-06-10 | 2005-08-11 | Connors Matthew J. | Three dimensional vapor chamber |
US20050098300A1 (en) * | 2003-09-12 | 2005-05-12 | Kenya Kawabata | Heat sink with heat pipes and method for manufacturing the same |
US20050077030A1 (en) * | 2003-10-08 | 2005-04-14 | Shwin-Chung Wong | Transport line with grooved microchannels for two-phase heat dissipation on devices |
US7322402B2 (en) * | 2004-01-05 | 2008-01-29 | Hul-Chun Hsu | Heat pipe structure and method for fabricating the same |
US20060162906A1 (en) * | 2005-01-21 | 2006-07-27 | Chu-Wan Hong | Heat pipe with screen mesh wick structure |
US7770407B1 (en) * | 2005-02-18 | 2010-08-10 | Motion Computing, Inc. | Fuel cell having an integrated, porous thermal exchange mechanism |
EP1859336A2 (de) * | 2005-03-07 | 2007-11-28 | Asetek A/S | Kühlsystem für elektronische geräte, insbesondere computer |
JP4551261B2 (ja) | 2005-04-01 | 2010-09-22 | 株式会社日立製作所 | 冷却ジャケット |
CN2874398Y (zh) * | 2005-05-10 | 2007-02-28 | 苏子欣 | 一体化热导管散热结构 |
CN100561105C (zh) * | 2006-02-17 | 2009-11-18 | 富准精密工业(深圳)有限公司 | 热管 |
CN101055158A (zh) * | 2006-04-14 | 2007-10-17 | 富准精密工业(深圳)有限公司 | 热管 |
US20070240859A1 (en) * | 2006-04-17 | 2007-10-18 | Chaun-Choung Technology Corp. | Capillary structure of heat pipe |
KR100775013B1 (ko) * | 2006-04-18 | 2007-11-09 | (주)셀시아테크놀러지스한국 | 판형 열전달 장치 |
JP4714638B2 (ja) * | 2006-05-25 | 2011-06-29 | 富士通株式会社 | ヒートシンク |
US8042606B2 (en) * | 2006-08-09 | 2011-10-25 | Utah State University Research Foundation | Minimal-temperature-differential, omni-directional-reflux, heat exchanger |
TWM336673U (en) * | 2008-02-04 | 2008-07-11 | Celsia Technologies Taiwan Inc | Vapor chamber and supporting structure thereof |
TW201108921A (en) * | 2009-08-21 | 2011-03-01 | Foxconn Tech Co Ltd | Plate type heat pipe and heat sink using the same |
CN102042776A (zh) * | 2009-10-16 | 2011-05-04 | 富准精密工业(深圳)有限公司 | 回路热管 |
CN201892459U (zh) * | 2009-11-27 | 2011-07-06 | 周业勋 | 具有毛细微结构的热导装置 |
WO2011145618A1 (ja) * | 2010-05-19 | 2011-11-24 | 日本電気株式会社 | 沸騰冷却器 |
CN201758510U (zh) * | 2010-07-05 | 2011-03-09 | 周业勋 | 具有毛细微结构的薄型导热装置 |
US20120048516A1 (en) * | 2010-08-27 | 2012-03-01 | Forcecon Technology Co., Ltd. | Flat heat pipe with composite capillary structure |
TW201213760A (en) * | 2010-09-23 | 2012-04-01 | Gao-De Cai | Heat dissipation device with multiple heat pipes |
TWM412344U (en) * | 2011-05-11 | 2011-09-21 | Celsia Technologies Taiwan Inc | Planar heat pipe having one expanded side |
US20120325438A1 (en) * | 2011-06-27 | 2012-12-27 | Celsia Technologies Taiwan | Heat pipe with flexible support structure |
US20130037242A1 (en) * | 2011-08-09 | 2013-02-14 | Cooler Master Co., Ltd. | Thin-type heat pipe structure |
TWI530654B (zh) * | 2011-12-26 | 2016-04-21 | 鴻準精密工業股份有限公司 | 扁平熱管 |
US20130174966A1 (en) * | 2012-01-11 | 2013-07-11 | Forcecon Technology Co., Ltd. | Molding method of a heat pipe for capillary structure with controllable sintering position |
TWM447490U (zh) * | 2012-09-06 | 2013-02-21 | Cooler Master Co Ltd | 板型熱交換器及其支撐結構 |
US9752832B2 (en) * | 2012-12-21 | 2017-09-05 | Elwha Llc | Heat pipe |
US20140290929A1 (en) * | 2013-03-26 | 2014-10-02 | Ge Energy Power Conversion Technology Ltd | Heat pipe heat sink with heating unit |
US20140345831A1 (en) * | 2013-05-23 | 2014-11-27 | Cooler Master Co., Ltd. | Plate-type heat pipe and method of manufacturing the same |
US10107558B2 (en) * | 2013-09-02 | 2018-10-23 | Asia Vital Components Co., Ltd. | Thermal module |
CN203934263U (zh) * | 2014-07-04 | 2014-11-05 | 讯凯国际股份有限公司 | 具有毛细构件的散热装置 |
CN104654670B (zh) * | 2015-02-03 | 2016-11-02 | 青岛海尔股份有限公司 | 换热装置及具有其的半导体制冷冰箱 |
CN104729182B (zh) * | 2015-02-03 | 2016-11-23 | 青岛海尔股份有限公司 | 半导体制冷冰箱 |
US20170122673A1 (en) * | 2015-11-02 | 2017-05-04 | Acmecools Tech. Ltd. | Micro heat pipe and method of manufacturing micro heat pipe |
JP6542915B2 (ja) * | 2015-12-28 | 2019-07-10 | 古河電気工業株式会社 | ヒートパイプ |
US10330392B2 (en) * | 2016-02-05 | 2019-06-25 | Cooler Master Co., Ltd. | Three-dimensional heat transfer device |
CN107148192B (zh) * | 2016-03-01 | 2020-01-31 | 讯凯国际股份有限公司 | 热管模块及应用其的散热装置 |
US10349561B2 (en) * | 2016-04-15 | 2019-07-09 | Google Llc | Cooling electronic devices in a data center |
CN105873415A (zh) * | 2016-04-26 | 2016-08-17 | 东莞汉旭五金塑胶科技有限公司 | 散热器的基座与热导管组合 |
TWM532046U (zh) * | 2016-06-02 | 2016-11-11 | Tai Sol Electronics Co Ltd | 具有液汽分離結構的均溫板 |
US10663231B2 (en) * | 2016-06-08 | 2020-05-26 | Delta Electronics, Inc. | Manufacturing method of heat conducting device |
CN206626989U (zh) * | 2017-04-18 | 2017-11-10 | 富奥汽车零部件股份有限公司 | 一种散热器 |
WO2018198354A1 (ja) * | 2017-04-28 | 2018-11-01 | 株式会社村田製作所 | ベーパーチャンバー |
CN110088556B (zh) * | 2017-04-28 | 2021-06-25 | 株式会社村田制作所 | 均热板 |
CN114423232A (zh) | 2017-04-28 | 2022-04-29 | 株式会社村田制作所 | 均热板、散热设备以及电子设备 |
WO2018198372A1 (ja) * | 2017-04-28 | 2018-11-01 | 株式会社村田製作所 | ベーパーチャンバー |
TWI635386B (zh) * | 2017-08-18 | 2018-09-11 | 雙鴻科技股份有限公司 | 散熱裝置 |
JP6395914B1 (ja) * | 2017-08-31 | 2018-09-26 | 古河電気工業株式会社 | ヒートシンク |
JP2021036175A (ja) * | 2017-09-29 | 2021-03-04 | 株式会社村田製作所 | ベーパーチャンバー |
US10746479B2 (en) | 2018-02-09 | 2020-08-18 | General Electric Company | Additively manufactured structures for thermal and/or mechanical systems, and methods for manufacturing the structures |
US10595439B2 (en) * | 2018-06-25 | 2020-03-17 | Intel Corporation | Movable heatsink utilizing flexible heat pipes |
JP6560425B1 (ja) * | 2018-11-09 | 2019-08-14 | 古河電気工業株式会社 | ヒートパイプ |
US10677535B1 (en) * | 2018-11-30 | 2020-06-09 | Furukawa Electric Co., Ltd. | Heat sink |
JP6640401B1 (ja) * | 2019-04-18 | 2020-02-05 | 古河電気工業株式会社 | ヒートシンク |
-
2019
- 2019-04-18 JP JP2019079602A patent/JP6640401B1/ja active Active
-
2020
- 2020-04-07 WO PCT/JP2020/015595 patent/WO2020213464A1/ja unknown
- 2020-04-07 EP EP20775153.8A patent/EP3761353A4/en not_active Withdrawn
- 2020-04-17 TW TW109112972A patent/TWI810448B/zh active
- 2020-04-17 CN CN202020583539.5U patent/CN212876432U/zh active Active
- 2020-04-17 CN CN202010305323.7A patent/CN111836516B/zh active Active
- 2020-09-02 US US17/010,599 patent/US11112186B2/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55102889A (en) * | 1979-02-01 | 1980-08-06 | Pioneer Electronic Corp | Natural convection type radiator |
JPH10209356A (ja) * | 1996-11-25 | 1998-08-07 | Denso Corp | 沸騰冷却装置 |
US20040163798A1 (en) * | 2003-02-25 | 2004-08-26 | Debashis Ghosh | Compact thermosiphon for dissipating heat generated by electronic components |
JP2016092173A (ja) * | 2014-11-04 | 2016-05-23 | 富士通株式会社 | 蒸発器、冷却装置、及び電子機器 |
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US11112186B2 (en) | 2021-09-07 |
CN111836516A (zh) | 2020-10-27 |
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WO2020213464A1 (ja) | 2020-10-22 |
TW202040081A (zh) | 2020-11-01 |
CN111836516B (zh) | 2022-04-29 |
US20200400381A1 (en) | 2020-12-24 |
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