TW201108921A - Plate type heat pipe and heat sink using the same - Google Patents

Plate type heat pipe and heat sink using the same Download PDF

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Publication number
TW201108921A
TW201108921A TW98128214A TW98128214A TW201108921A TW 201108921 A TW201108921 A TW 201108921A TW 98128214 A TW98128214 A TW 98128214A TW 98128214 A TW98128214 A TW 98128214A TW 201108921 A TW201108921 A TW 201108921A
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Taiwan
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portions
support
heat pipe
support body
casing
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TW98128214A
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Chinese (zh)
Inventor
Chuen-Shu Hou
Jiang-Jun Hu
Min Lu
De-Yu Wang
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Foxconn Tech Co Ltd
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Priority to TW98128214A priority Critical patent/TW201108921A/en
Publication of TW201108921A publication Critical patent/TW201108921A/en

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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A plate type heat pipe includes a sealed shell in which a working fluid is filled, a wick layer formed on an inner face of the shell and a supporting member disposed in the shell. The supporting member includes a plurality of supporting portions and a plurality of bodies connecting the supporting portions. Each supporting portion includes a plurality of convex portions contacting a top of the wick layer and a plurality of concave portions contacting a bottom of the wick layer. The convex portions and the concave portions of each supporting portion are alternately arrayed. Each convex portion and an adjacent concave portion cooperatively enclose a first through hole for the working fluid flowing therethrough.

Description

201108921 六、發明說明: 【發明所屬之技術領域】 本發明涉及一種傳熱裝置,特別涉及一種平板式 熱管。 【先前技術】 電子元件在運行過程中通常產生大量的熱量,為 確保電子元件正常運行,該等熱量需要及時散熱出 • =,該電子元件上通常加裝一散熱器為其散熱。該 散熱器通常包括-吸熱板及設置於該吸熱板上的散 熱鰭片。該吸熱板由銅、紹等熱傳導性良好的金屬 材料製成,但金屬板受制於材料本身有限的熱傳導 I·生’右對尚發熱量的電子元件,會產生明顯的熱阻 而無法達到良好散熱,影響電子元件的運行穩定性。 為提升散熱器的效率,業界亦採用在吸熱板内設 置一腔體,該腔體内密封有水、乙醇等工作流體, 利用工作流體的相變化來提高傳熱速度。工作時, 工作流體在吸熱板的吸熱區吸熱氣化到達吸熱板的 放熱區,而後冷卻液化。為使液化後的工作流體能 $决回抓至吸熱板的吸熱區,該吸熱板於腔體周邊 叹置一種毛細結構。毛細結構一般分為粉末燒結毛 細結構、網線毛細結構、溝槽毛細結構三種。液化 後的工作流體在毛細結構中回流至吸熱區參與相變 化循%。然而,在使用的過程中,該散熱器的吸熱 201108921 板在受到來自外部和内部的壓力作用容易出現產品 . 杨’甚至導致吸熱板内的毛細結構㈣,嚴重影 響了散熱器的散熱效率和穩定性。 【發明内容】 有鑒於此,實有必要提供一種結構穩固的平板式 熱官及應用S玄平板式熱管的散熱器。 一種平板式熱管,其包括一密封的殼體及貼附在 • 殼體内表面的一毛細結構層’該殼體内填充有一定 量的工作流體,該殼體内設置有一支撐體,該支撐 體包括複數支撐部及連接該複數支撐部的複數本體 4,每一支撐部均包括複數交替排列且分別抵頂該 殼體的兩相對側壁的上凸部及下凹部,每一上凸部 均與相鄰的一下凹部合圍形成一第一通孔,用以為 工作流體条汽流動提供通路。 • 一種散熱器,其包括一鰭片組及與鰭片組結合的 一平板式熱管,該平板式熱管包括一密封的殼體及 貼附在殼體内表面的一毛細結構層,該殼體内填充 有一定量的工作流體,該殼體内設置有一支撐體, 該支撐體包括複數支撐部及連接該複數支撐部的複 數本體部,每一支撐部均包括複數交替排列且分別 抵頂該殼體的兩相對側壁的上凸部及下凹部,每一 上凸部均與相鄰的一下凹部合圍形成一第一通孔, 用以為工作流體蒸汽流動提供通路。 201108921 • 與習知技術相比’本發明散熱器的平板式熱管内 .2置有支撐體,該支撐體位於殼體内且抵壓毛細結 層,能夠對其兩側的毛細結構層及殼體提供有力 的支撐’防止平板式熱管在内、外力的作用下發生 變形,以保證平板式熱管的平面度。 【實施方式】 如圖1及® 2所示,本發明第一實施例散熱器包 • 括一鰭片組10及與鰭片組10結合的一平板式熱管 20。該鰭片組10包括一基板12及從基板12向上延 伸出的複數鰭片14。一熱源30與平板式熱管20的 底部導熱接觸。 忒平板式熱管20包括一密封的殼體22、貼附在 设體22内表面的一毛細結構層24及設置在該毛細 結構層24内的一支撐體26。該殼體22内填充有一 _ 定置的工作流體(未標號),工作流體可以從毛細結 構層24頂部回流入毛細結構層24的底部。該毛細 結構層24由金屬網線編制而成,可以理解地,該毛 細結構層24也可由金屬粉末燒結而成或由在殼體22 内表面上刻溝槽形成。 請同時參照圖3及圖4,該支撐體26由一金屬 片藉由衝壓等工藝一體拉伸而成,其具有一定強 度’以對其兩側的毛細結構層24及殼體22提供有 力的支撐,防止平板式熱管2〇在内、外力的作用下 201108921 ^形,以保證平板式熱管20的平面度。在本實施例 中,該支撑體%由一金屬片向兩側衝壓形成,其包 括複數支撐部262及連接該複數支撐部262的複數 本體部⑽。相㈣二支撐部262藉由一本體部篇 連接。每一本體部268為矩形條狀,各本體部268 均在同一平面内。每一支撐部如均包括複數交替 排列且分別抵頂該殼體22的上、下表面的上凸部264 及下凹部266。上凸部264和下凹部266分別位於各 本體部268所在平面的相對兩側。沿與支撐部262 垂直的方向被各本體部268連接的各上凸部 264或 下凹部266位於各本體部268所在平面的同一侧。 每:上凸部264均與相鄰的一下凹部266合圍形成 第一通孔267’用以為氣態的工作流體蒸汽向殼體 22上部流動提供通路。所有的上凸部264頂端都處 於同一水平面,以抵壓毛細結構層24的上表面,所 • 有的下凹部266底端都處於同一水平面,以抵壓毛 細結構層24的下表面。在本實施例中,每一上凸部 264或下凹部266的截面係梯形(如圖5 6所示)。 可以理解地,在其他實施例中,支撐體的上巴部或 下凹部的戴面可以係矩形、半圓形、三角形等形狀 (如圖7、8所示)。 使用時,散熱器的平板式熱管2〇底部緊貼熱源 =,熱,殼體22内的工作流體從其底部吸熱氣化為 瘵汽而上升穿過支撐體26的第一通孔267到達殼體 201108921 - 22頂部,氣態的工作流體在該處遇冷放出埶量而冷 . 卻為液態,該熱量進而傳遞至鰭片組10,藉由錯片7 14政毛出去。液態的工作流體藉由毛細結構層%頂 部流回至毛細結構層24底部進行相變化循環\ 、 圖9示出了本發明第二實施例中散熱器的截面 圖,该貫拖例與第一實施例的不同點在於:第二實 把例的散熱益的支撐體26a的上凸部264a、下凹部 • 26^及本體部268a開設有複數第二通孔269a(如圖 10所示)’複數銅柱265a穿過支撐體26a的本體部 268a開設的第二通孔269a,銅柱加化的兩端分別焊 接在殼體22a #上、下表面,以進一步對其兩側的 殼體22a提供有力的支撐,防止平板式熱管2〇&在 内、外力的作用下變形。沒有銅柱265a穿過的第二 通孔269a可用以為氣態的工作流體蒸汽向殼體22a 上部流動提供通路。 ® 與習知技術相比,本發明散熱器的平板式熱管 20、2〇a内設置有支撐體26、26a,該支撐體26、26a 位於殼體22、22a内且抵壓毛細結構層24、24a,能 夠對其兩側的毛細結構層24、24a及殼體22、22a 提供有力的支撐,防止平板式熱管2〇、2〇a在内、 外力的作用下發生變形,以保證平板式熱管2〇、2〇a 的平面度。 综上所述’本發明確已符合發明專利之要件,遂 201108921 提出專利申請。惟,以上所述者僅為本發明之 二佳實施方式,自不能以此限制本案之申請專利範 f凡熟悉本案技藝之人士援依本發明之精神所 作之等效修飾或變化,皆應涵蓋於以下申請專利範 圍内。 【圖式簡單說明】 圖1係本發明第一實施例散熱器的立體圖。201108921 VI. Description of the Invention: [Technical Field] The present invention relates to a heat transfer device, and more particularly to a flat plate heat pipe. [Prior Art] Electronic components usually generate a large amount of heat during operation. To ensure proper operation of the electronic components, the heat needs to be dissipated in time. • The electronic components are usually equipped with a heat sink for heat dissipation. The heat sink typically includes a heat absorbing plate and a heat sink fin disposed on the heat absorbing plate. The heat absorbing plate is made of a metal material with good thermal conductivity such as copper or sho, but the metal plate is subject to the limited heat conduction of the material itself, and the right electronic component of the right heat is generated, and the heat resistance is not good enough. Heat dissipation affects the operational stability of electronic components. In order to improve the efficiency of the heat sink, the industry also adopts a cavity in the heat absorbing plate. The cavity is sealed with working fluids such as water and ethanol, and the phase change of the working fluid is used to increase the heat transfer speed. During operation, the working fluid absorbs heat in the heat absorption zone of the heat absorbing plate to reach the heat release zone of the heat absorbing plate, and then liquefies. In order to enable the liquefied working fluid to be grasped to the heat absorbing zone of the heat absorbing plate, the heat absorbing plate sighs a capillary structure around the cavity. The capillary structure is generally classified into three types: powder sintered capillary structure, mesh capillary structure, and groove capillary structure. The liquefied working fluid is returned to the endothermic zone in the capillary structure to participate in the phase change cycle. However, in the process of use, the heat sink of the heat sink 201108921 board is exposed to pressure from the outside and the inside is easy to appear. Yang 'even the capillary structure inside the heat absorbing plate (four), seriously affecting the heat dissipation efficiency and stability of the heat sink Sex. SUMMARY OF THE INVENTION In view of the above, it is necessary to provide a structurally stable flat-type thermal officer and a heat sink using the S-shaped flat heat pipe. A flat heat pipe includes a sealed casing and a capillary structure layer attached to an inner surface of the casing. The casing is filled with a certain amount of working fluid, and a support body is disposed in the casing. a plurality of supporting portions and a plurality of main bodies 4 connected to the plurality of supporting portions, each supporting portion includes a plurality of upper convex portions and lower concave portions alternately arranged and respectively abutting opposite side walls of the housing, each upper convex portion being The adjacent lower recesses are formed to define a first through hole for providing a passage for the working fluid to flow. A heat sink comprising a fin set and a flat heat pipe combined with the fin set, the flat heat pipe comprising a sealed casing and a capillary structure layer attached to an inner surface of the casing, the casing Filled with a certain amount of working fluid, the housing is provided with a support body, the support body includes a plurality of support portions and a plurality of body portions connecting the plurality of support portions, each support portion includes a plurality of alternately arranged and respectively abutting the shell The upper convex portion and the lower concave portion of the opposite side walls of the body, each of the upper convex portions and the adjacent lower concave portion are combined to form a first through hole for providing a passage for the working fluid vapor flow. 201108921 • Compared with the prior art, the flat heat pipe of the radiator of the present invention is provided with a support body which is located in the casing and abuts the capillary layer, and can have capillary structure layers and shells on both sides thereof. The body provides a strong support to prevent the flat heat pipe from deforming under the action of internal and external forces to ensure the flatness of the flat heat pipe. [Embodiment] As shown in Figs. 1 and 2, a heat sink package according to a first embodiment of the present invention includes a fin set 10 and a flat heat pipe 20 combined with the fin set 10. The fin set 10 includes a substrate 12 and a plurality of fins 14 extending upward from the substrate 12. A heat source 30 is in thermal contact with the bottom of the flat heat pipe 20. The flat plate heat pipe 20 includes a sealed casing 22, a capillary structure layer 24 attached to the inner surface of the body 22, and a support body 26 disposed in the capillary structure layer 24. The housing 22 is filled with a stationary working fluid (not labeled) from which the working fluid can flow from the top of the capillary structure layer 24 into the bottom of the capillary structure layer 24. The capillary structure layer 24 is formed from a metal mesh wire. It will be understood that the capillary structure layer 24 may also be formed by sintering a metal powder or by engraving a groove on the inner surface of the casing 22. Referring to FIG. 3 and FIG. 4 simultaneously, the support body 26 is integrally stretched by a metal sheet by a stamping process or the like, and has a certain strength to provide a strong force to the capillary structure layer 24 and the shell 22 on both sides thereof. Support, to prevent the flat heat pipe 2 〇 under the action of internal and external forces 201108921 ^ shape to ensure the flatness of the flat heat pipe 20. In the present embodiment, the support body % is formed by stamping a metal sheet to both sides, and includes a plurality of support portions 262 and a plurality of body portions (10) connecting the plurality of support portions 262. The phase (four) two support portions 262 are connected by a body portion. Each of the body portions 268 has a rectangular strip shape, and each of the body portions 268 is in the same plane. Each of the support portions includes a plurality of upper convex portions 264 and lower concave portions 266 which are alternately arranged and respectively abut against the upper and lower surfaces of the casing 22. The upper convex portion 264 and the lower concave portion 266 are respectively located on opposite sides of the plane in which the respective body portions 268 are located. The upper convex portions 264 or the lower concave portions 266 which are connected to the main body portions 268 in the direction perpendicular to the support portion 262 are located on the same side of the plane in which the main body portions 268 are located. Each of the upper convex portions 264 is surrounded by the adjacent lower concave portions 266 to form a first through hole 267' for providing a path for the gaseous working fluid vapor to flow toward the upper portion of the casing 22. The top ends of all of the upper projections 264 are at the same level to resist the upper surface of the capillary structure layer 24, and the bottom ends of the lower recesses 266 are at the same level to resist the lower surface of the capillary structure layer 24. In the present embodiment, each of the upper convex portion 264 or the lower concave portion 266 has a trapezoidal cross section (as shown in Fig. 56). It will be appreciated that in other embodiments, the wear surface of the upper or lower recess of the support may be rectangular, semi-circular, triangular or the like (as shown in Figures 7, 8). In use, the bottom of the flat heat pipe 2 of the radiator is in close contact with the heat source=, heat, and the working fluid in the casing 22 is vaporized from the bottom thereof to vaporize and rises through the first through hole 267 of the support body 26 to reach the shell. At the top of the body 201108921 - 22, the gaseous working fluid is cooled and released in the cold. However, it is liquid, and the heat is transferred to the fin group 10, and the hair is released by the wrong piece. The liquid working fluid flows back to the bottom of the capillary structure layer 24 by the top of the capillary structure layer to perform a phase change cycle. FIG. 9 shows a cross-sectional view of the heat sink in the second embodiment of the present invention. The difference between the embodiments is that the upper convex portion 264a, the lower concave portion 26^ and the main body portion 268a of the second heat dissipation support body 26a are provided with a plurality of second through holes 269a (as shown in FIG. 10). The plurality of copper pillars 265a pass through the second through holes 269a of the main body portion 268a of the support body 26a, and the two ends of the copper pillars are respectively welded to the upper and lower surfaces of the casing 22a # to further further the casings 22a on both sides thereof. Provides strong support to prevent the flat heat pipe 2〇& deformation under the action of internal and external forces. The second through hole 269a through which the copper post 265a passes can be used to provide a path for the gaseous working fluid vapor to flow to the upper portion of the housing 22a. In comparison with the prior art, the flat heat pipes 20, 2a of the heat sink of the present invention are provided with support bodies 26, 26a which are located in the casings 22, 22a and which resist the capillary structure layer 24. 24a, capable of providing strong support to the capillary structure layers 24, 24a and the shells 22, 22a on both sides thereof, preventing deformation of the flat heat pipe 2〇, 2〇a under the action of internal and external forces to ensure the flat type The flatness of the heat pipe 2〇, 2〇a. In summary, the present invention has indeed met the requirements of the invention patent, 遂 201108921 filed a patent application. However, the above is only the second preferred embodiment of the present invention, and the invention should not limit the scope of the patent application. Any equivalent modifications or changes made by those skilled in the art to the spirit of the present invention should be covered. It is within the scope of the following patent application. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view of a heat sink according to a first embodiment of the present invention.

圖2係圖χ中散熱器沿π_π線的剖視圖。 圖3係圖2中支撐體的立體圖。 圖4係圖3中圈IV部分的放大示意圖。 圖5係圖2中支撐體的截面圖。 圖6係圖5中圈vi部分的放大示意圖。 圖7-8係本發明其他實施例中支撐體的局 大圖。 °双 圖9為本發明第二實施例的散熱器的戴面圖。 圖10為圖9中支撐體的立體圖。 【主要元件符號說明】 鳍片組 10 鳍片 14 殼體 22 支標體 26 上凸部 264 本體部 268 基板 12 平板式熱管 20 毛細結構層 24 支撐部 262 下凹部 266 第一通孔 267 201108921 平板式熱管 20a 殼體 22a 毛細結構層 24a 支撐體 26a 銅柱 265a 上凸部 264a 下凹部 266a 本體部 268a 第二通孔 269a 熱源 30 102 is a cross-sectional view of the heat sink along the π_π line in FIG. Figure 3 is a perspective view of the support of Figure 2. Figure 4 is an enlarged schematic view of a portion of the circle IV of Figure 3. Figure 5 is a cross-sectional view of the support of Figure 2. Figure 6 is an enlarged schematic view of a portion of the circle vi in Figure 5. Fig. 7-8 is a plan view of a support body in another embodiment of the present invention. ° double Fig. 9 is a front view of a heat sink according to a second embodiment of the present invention. Figure 10 is a perspective view of the support body of Figure 9. [Main component symbol description] Fin set 10 Fin 14 Housing 22 Support body 26 Upper convex portion 264 Main body portion 268 Substrate 12 Flat plate heat pipe 20 Capillary structure layer 24 Support portion 262 Lower concave portion 266 First through hole 267 201108921 Flat plate Heat pipe 20a housing 22a capillary structure layer 24a support body 26a copper column 265a upper convex portion 264a lower concave portion 266a main body portion 268a second through hole 269a heat source 30 10

Claims (1)

201108921 -七、申請專利範圍: 1·-種平板式熱管,其包括—密封的殼體及貼附在殼體 内表面的一毛細結構層,該殼體内填充有一定量的工 作流體,其改良在於:該殼體内設置有一支撐體,該 支撐體包括複數支撐部及連接該複數支撐部的複數 本體部’每一支撐部均包括複數交替排列且分別抵頂 5亥设體的兩相對侧壁的上凸部及下凹部,每一上凸部 肖與相鄰的一下凹部合圍形成一第一通孔,用以為工 作流體蒸汽流動提供通路。 2·根據中請專利範圍第1項所述的平板式熱管,其中每 上凸。卩或下凹部的截面呈梯形、半圓形或三角形。 3. 根據申請專利範圍第1項所述的平板式熱管,其中各 本體部均在同一平面内。 4. 根據申請專利範圍第3項所述的平板式熱管,其中沿 與支撐部垂直的方向被各本體部連接的各上凸部或 魯 下凹。卩位於各本體部所在平面的同一側。 5. 根據申請專利範圍第1項所述的平板式熱管,其中該 支撐體的上凸部、下凹部及本體部開設有複數第二通 孑L 。 6. 根據申請專利範圍第5項所述的平板式熱管,其中複 數銅柱穿過支撐體的本體部開設的第二通孔,銅柱的 兩端分別焊接在殼體的兩相對側壁。 7. 種散熱器’其包括一鰭片組及與鰭片組結合的—平 板式熱管’該平板式熱管包括一密封的殼體及貼附在 11 201108921 殼體内表面的一毛細結構層,該殼體内填充有一定量 的工作流體,其改良在於:該殼體内設置有一支撐 體’該支撐體包括複數支撑部及連接該複數支撐部的 複數本體部’每-支#部均包括複數交#排列且分別 抵頂該殼體的兩相對側壁的上凸部及下凹部,每一上 凸部均與相鄰的一下凹部合圍形成一第一通孔,用以 為工作流體蒸汽流動提供通路。201108921 - VII, the scope of application for patents: 1 - a flat type of heat pipe, comprising - a sealed casing and a capillary structure layer attached to the inner surface of the casing, the casing is filled with a certain amount of working fluid, the improvement A support body is disposed in the housing, the support body includes a plurality of support portions and a plurality of body portions connecting the plurality of support portions. Each support portion includes a plurality of opposite sides that are alternately arranged and respectively abut the top of the body. The upper convex portion and the lower concave portion of the wall, each of the upper convex portions and the adjacent lower concave portions are combined to form a first through hole for providing a passage for the working fluid vapor flow. 2. The flat heat pipe according to the first aspect of the patent application, wherein each of the convex heat pipes is convex. The cross section of the crucible or the recess is trapezoidal, semi-circular or triangular. 3. The flat heat pipe according to claim 1, wherein each of the body portions is in the same plane. 4. The flat heat pipe according to claim 3, wherein each of the upper convex portions connected to each of the main body portions in a direction perpendicular to the support portion is sagged.卩 is located on the same side of the plane where each body part is located. 5. The flat heat pipe according to claim 1, wherein the upper convex portion, the lower concave portion and the main body portion of the support body are provided with a plurality of second through holes L. 6. The flat heat pipe according to claim 5, wherein the plurality of copper posts pass through the second through hole formed in the body portion of the support body, and the two ends of the copper post are respectively welded to the opposite side walls of the casing. 7. A heat sink comprising a fin set and a flat heat pipe combined with a fin set. The flat heat pipe comprises a sealed casing and a capillary structure layer attached to the inner surface of the casing 11201108921. The housing is filled with a certain amount of working fluid, and the improvement is that a support body is disposed in the housing. The support body includes a plurality of support portions and a plurality of body portions connecting the plurality of support portions. Each of the branches includes a plurality of The upper and lower concave portions of the opposite side walls of the housing are respectively arranged to form a first through hole for providing a passage for the working fluid vapor flow. . 8.根據中請專利範圍第7項所述的散熱器,其中該支 撐體由一金屬片向兩側衝壓形成。 9·^據中請專利範圍第7項所述的散熱器,其中該支 *體的上凸部、下凹部及本體部開設有複數第二通 =據巾%專利粑圍第9項所述的散熱器,其中複數 二、穿過支撐體的本體部開設的第二通孔,銅柱的兩 蜢刀別焊接在殼體的兩相對側壁。8. The heat sink of claim 7, wherein the support body is stamped from a metal sheet to both sides. The heat sink according to the seventh aspect of the invention, wherein the upper convex portion, the lower concave portion and the main body portion of the support body are provided with a plurality of second passages; The heat sink, wherein the plurality of second through holes are formed through the body portion of the support body, the two files of the copper column are not welded to the opposite side walls of the housing. 1212
TW98128214A 2009-08-21 2009-08-21 Plate type heat pipe and heat sink using the same TW201108921A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI810448B (en) * 2019-04-18 2023-08-01 日商古河電氣工業股份有限公司 heat sink

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI810448B (en) * 2019-04-18 2023-08-01 日商古河電氣工業股份有限公司 heat sink

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