JP6395914B1 - ヒートシンク - Google Patents
ヒートシンク Download PDFInfo
- Publication number
- JP6395914B1 JP6395914B1 JP2017166826A JP2017166826A JP6395914B1 JP 6395914 B1 JP6395914 B1 JP 6395914B1 JP 2017166826 A JP2017166826 A JP 2017166826A JP 2017166826 A JP2017166826 A JP 2017166826A JP 6395914 B1 JP6395914 B1 JP 6395914B1
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- JP
- Japan
- Prior art keywords
- radiating fin
- base plate
- heat
- radiating
- heat sink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
- F28F1/14—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending longitudinally
- F28F1/20—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending longitudinally the means being attachable to the element
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
- F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
- F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
- F28F1/34—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending obliquely
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
- F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
- F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
- F28D2021/0029—Heat sinks
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Geometry (AREA)
- Materials Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
10 ベースプレート
11、51 第1の放熱フィン
12、42 第2の放熱フィン
13、33、53 第3の放熱フィン
14、24、44 ヒートパイプ
17、57 第1の放熱フィン群
18、48 第2の放熱フィン群
19、39、59 第3の放熱フィン群
60 遮蔽部材
Claims (6)
- ベースプレートと、該ベースプレートと熱的に接続された少なくとも1つの第1の放熱フィンと、該第1の放熱フィンに対して第1の放熱フィン側の側端部にて隣接し、該ベースプレートと熱的に接続された少なくとも1つの第2の放熱フィンと、前記ベースプレートと熱的に接続された少なくとも1つの第3の放熱フィンであって、前記第2の放熱フィンの前記第3の放熱フィン側の側端部と隣接した前記第3の放熱フィンと、を有し、
前記第1の放熱フィンの表面が、前記第2の放熱フィンの表面に対して平行ではなく、前記第3の放熱フィンの表面が、前記第2の放熱フィンの表面に対して平行ではなく、
前記第1の放熱フィンが、前記第3の放熱フィンと同じ熱伝導部材を介して前記ベースプレートと熱的に接続され、前記第2の放熱フィンが、下端部において前記ベースプレートと接することで熱的に接続され、
前記第2の放熱フィンの自由端は、最上部に位置する前記第1の放熱フィン及び最上部に位置する前記第3の放熱フィンよりも前記ベースプレート側に位置しているヒートシンク。 - 複数の前記第2の放熱フィンが、前記ベースプレート表面に沿って並べられて第2の放熱フィン群が形成され、該第2の放熱フィン群の少なくとも中央部に配置された前記第2の放熱フィンが、最上部に位置する前記第1の放熱フィン及び最上部に位置する前記第3の放熱フィンよりも前記ベースプレート側の位置に設けられている請求項1に記載のヒートシンク。
- 前記第2の放熱フィンの下端部と対向した自由端側に、該自由端を外部環境から遮る遮蔽部材が、さらに設けられている請求項1または2に記載のヒートシンク。
- 前記熱伝導部材が、ヒートパイプである請求項1乃至3のいずれか1項に記載のヒートシンク。
- 前記ヒートパイプの形状が、側面視U字状、側面視L字状または側面視コ字状である請求項4に記載のヒートシンク。
- 前記側面視U字状のヒートパイプのうち、一方の直線部と底部との間の湾曲部には、第1の放熱フィンが取り付けられておらず、他方の直線部と底部との間の湾曲部には、第3の放熱フィンが取り付けられていない請求項5に記載のヒートシンク。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017166826A JP6395914B1 (ja) | 2017-08-31 | 2017-08-31 | ヒートシンク |
CN201890000466.3U CN212725282U (zh) | 2017-08-31 | 2018-08-30 | 散热器 |
PCT/JP2018/032059 WO2019044949A1 (ja) | 2017-08-31 | 2018-08-30 | ヒートシンク |
TW107130532A TWI704656B (zh) | 2017-08-31 | 2018-08-31 | 散熱器 |
US16/660,440 US10809011B2 (en) | 2017-08-31 | 2019-10-22 | Heat sink |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017166826A JP6395914B1 (ja) | 2017-08-31 | 2017-08-31 | ヒートシンク |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018154918A Division JP7157591B2 (ja) | 2018-08-21 | 2018-08-21 | ヒートシンク |
Publications (2)
Publication Number | Publication Date |
---|---|
JP6395914B1 true JP6395914B1 (ja) | 2018-09-26 |
JP2019046904A JP2019046904A (ja) | 2019-03-22 |
Family
ID=63668517
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017166826A Active JP6395914B1 (ja) | 2017-08-31 | 2017-08-31 | ヒートシンク |
Country Status (5)
Country | Link |
---|---|
US (1) | US10809011B2 (ja) |
JP (1) | JP6395914B1 (ja) |
CN (1) | CN212725282U (ja) |
TW (1) | TWI704656B (ja) |
WO (1) | WO2019044949A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11453484B2 (en) | 2018-12-17 | 2022-09-27 | Goodrich Corporation | Heat shield retainer and method |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10677535B1 (en) * | 2018-11-30 | 2020-06-09 | Furukawa Electric Co., Ltd. | Heat sink |
US10760855B2 (en) * | 2018-11-30 | 2020-09-01 | Furukawa Electric Co., Ltd. | Heat sink |
JP6640401B1 (ja) * | 2019-04-18 | 2020-02-05 | 古河電気工業株式会社 | ヒートシンク |
CN111912274A (zh) * | 2019-05-10 | 2020-11-10 | 讯凯国际股份有限公司 | 均温板及其制造方法 |
AU2021326431A1 (en) * | 2020-08-12 | 2023-03-09 | Hgci, Inc. | Light fixture including a housing for a ballast |
EP4068930B1 (en) | 2021-04-01 | 2024-03-13 | Ovh | A rack system for housing an electronic device |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003249611A (ja) * | 2002-02-26 | 2003-09-05 | Fujikura Ltd | フィン付きヒートシンク |
JP3104468U (ja) * | 2004-04-06 | 2004-09-16 | 浩▲しん▼股▲ふん▼有限公司 | 冷却装置の導風装置 |
US20060273137A1 (en) * | 2005-06-04 | 2006-12-07 | Foxconn Technology Co.,Ltd. | Heat dissipation device with heat pipes |
JP2015164166A (ja) * | 2014-02-03 | 2015-09-10 | 水谷電機工業株式会社 | 放熱器及びその製造方法 |
JP2017059768A (ja) * | 2015-09-18 | 2017-03-23 | 古河電気工業株式会社 | ヒートシンク |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11351769A (ja) * | 1998-06-12 | 1999-12-24 | Furukawa Electric Co Ltd:The | ヒートシンク |
TWI263472B (en) * | 2004-04-07 | 2006-10-01 | Delta Electronics Inc | Heat dissipation module |
US20060196640A1 (en) * | 2004-12-01 | 2006-09-07 | Convergence Technologies Limited | Vapor chamber with boiling-enhanced multi-wick structure |
JP4265632B2 (ja) * | 2006-08-31 | 2009-05-20 | セイコーエプソン株式会社 | プロジェクタ |
US7414848B2 (en) * | 2007-01-23 | 2008-08-19 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device |
US7740380B2 (en) * | 2008-10-29 | 2010-06-22 | Thrailkill John E | Solid state lighting apparatus utilizing axial thermal dissipation |
JP2011094888A (ja) | 2009-10-30 | 2011-05-12 | Fujitsu Ltd | 放熱装置、放熱装置の製造方法 |
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2017
- 2017-08-31 JP JP2017166826A patent/JP6395914B1/ja active Active
-
2018
- 2018-08-30 WO PCT/JP2018/032059 patent/WO2019044949A1/ja active Application Filing
- 2018-08-30 CN CN201890000466.3U patent/CN212725282U/zh active Active
- 2018-08-31 TW TW107130532A patent/TWI704656B/zh active
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2019
- 2019-10-22 US US16/660,440 patent/US10809011B2/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003249611A (ja) * | 2002-02-26 | 2003-09-05 | Fujikura Ltd | フィン付きヒートシンク |
JP3104468U (ja) * | 2004-04-06 | 2004-09-16 | 浩▲しん▼股▲ふん▼有限公司 | 冷却装置の導風装置 |
US20060273137A1 (en) * | 2005-06-04 | 2006-12-07 | Foxconn Technology Co.,Ltd. | Heat dissipation device with heat pipes |
JP2015164166A (ja) * | 2014-02-03 | 2015-09-10 | 水谷電機工業株式会社 | 放熱器及びその製造方法 |
JP2017059768A (ja) * | 2015-09-18 | 2017-03-23 | 古河電気工業株式会社 | ヒートシンク |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11453484B2 (en) | 2018-12-17 | 2022-09-27 | Goodrich Corporation | Heat shield retainer and method |
Also Published As
Publication number | Publication date |
---|---|
WO2019044949A1 (ja) | 2019-03-07 |
US20200049418A1 (en) | 2020-02-13 |
TW201921617A (zh) | 2019-06-01 |
US10809011B2 (en) | 2020-10-20 |
CN212725282U (zh) | 2021-03-16 |
TWI704656B (zh) | 2020-09-11 |
JP2019046904A (ja) | 2019-03-22 |
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