JP2019046904A - ヒートシンク - Google Patents
ヒートシンク Download PDFInfo
- Publication number
- JP2019046904A JP2019046904A JP2017166826A JP2017166826A JP2019046904A JP 2019046904 A JP2019046904 A JP 2019046904A JP 2017166826 A JP2017166826 A JP 2017166826A JP 2017166826 A JP2017166826 A JP 2017166826A JP 2019046904 A JP2019046904 A JP 2019046904A
- Authority
- JP
- Japan
- Prior art keywords
- heat
- radiation fin
- base plate
- radiation
- heat sink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
- F28F1/14—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending longitudinally
- F28F1/20—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending longitudinally the means being attachable to the element
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
- F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
- F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
- F28F1/34—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending obliquely
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
- F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
- F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
- F28D2021/0029—Heat sinks
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Geometry (AREA)
- Materials Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
10 ベースプレート
11、51 第1の放熱フィン
12、42 第2の放熱フィン
13、33、53 第3の放熱フィン
14、24、44 ヒートパイプ
17、57 第1の放熱フィン群
18、48 第2の放熱フィン群
19、39、59 第3の放熱フィン群
60 遮蔽部材
Claims (10)
- ベースプレートと、該ベースプレートと熱的に接続された少なくとも1つの第1の放熱フィンと、該第1の放熱フィンの側端部と隣接し、該ベースプレートと熱的に接続された少なくとも1つの第2の放熱フィンと、を有し、
前記第1の放熱フィンの表面が、前記第2の放熱フィンの表面に対して平行ではなく、
前記ベースプレート表面に対し鉛直方向において、前記第2の放熱フィンの少なくとも1つが、前記第1の放熱フィンの少なくとも1つよりも低い位置に設けられているヒートシンク。 - 複数の前記第2の放熱フィンが、前記ベースプレート表面に沿って並べられて第2の放熱フィン群が形成され、該第2の放熱フィン群の少なくとも中央部に配置された前記第2の放熱フィンが、前記第1の放熱フィンの少なくとも1つよりも低い位置に設けられている請求項1に記載のヒートシンク。
- 前記第2の放熱フィンが、下端部において前記ベースプレートと接することで熱的に接続されている請求項1または2に記載のヒートシンク。
- 前記第2の放熱フィンの下端部と対向した自由端側に、該自由端を外部環境から遮る遮蔽部材が、さらに設けられている請求項1乃至3のいずれか1項に記載のヒートシンク。
- 前記第1の放熱フィンが、熱伝導部材を介して前記ベースプレートと熱的に接続されている請求項1乃至4のいずれか1項に記載のヒートシンク。
- 前記第2の放熱フィンの側端部と隣接した、前記ベースプレートと熱的に接続された少なくとも1つの第3の放熱フィンをさらに有し、前記第3の放熱フィンの表面が、前記第2の放熱フィンの表面に対して平行ではない請求項1乃至5のいずれか1項に記載のヒートシンク。
- 前記ベースプレート表面に対し鉛直方向において、前記第2の放熱フィンの少なくとも1つが、前記第3の放熱フィンの少なくとも1つよりも低い位置に設けられている請求項6に記載のヒートシンク。
- 前記第3の放熱フィンが、熱伝導部材を介して前記ベースプレートと熱的に接続されている請求項6または7に記載のヒートシンク。
- 前記熱伝導部材が、ヒートパイプである請求項5または8に記載のヒートシンク。
- 前記ヒートパイプの形状が、側面視U字状、側面視L字状または側面視コ字状である請求項9に記載のヒートシンク。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017166826A JP6395914B1 (ja) | 2017-08-31 | 2017-08-31 | ヒートシンク |
CN201890000466.3U CN212725282U (zh) | 2017-08-31 | 2018-08-30 | 散热器 |
PCT/JP2018/032059 WO2019044949A1 (ja) | 2017-08-31 | 2018-08-30 | ヒートシンク |
TW107130532A TWI704656B (zh) | 2017-08-31 | 2018-08-31 | 散熱器 |
US16/660,440 US10809011B2 (en) | 2017-08-31 | 2019-10-22 | Heat sink |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017166826A JP6395914B1 (ja) | 2017-08-31 | 2017-08-31 | ヒートシンク |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018154918A Division JP7157591B2 (ja) | 2018-08-21 | 2018-08-21 | ヒートシンク |
Publications (2)
Publication Number | Publication Date |
---|---|
JP6395914B1 JP6395914B1 (ja) | 2018-09-26 |
JP2019046904A true JP2019046904A (ja) | 2019-03-22 |
Family
ID=63668517
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017166826A Active JP6395914B1 (ja) | 2017-08-31 | 2017-08-31 | ヒートシンク |
Country Status (5)
Country | Link |
---|---|
US (1) | US10809011B2 (ja) |
JP (1) | JP6395914B1 (ja) |
CN (1) | CN212725282U (ja) |
TW (1) | TWI704656B (ja) |
WO (1) | WO2019044949A1 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10760855B2 (en) * | 2018-11-30 | 2020-09-01 | Furukawa Electric Co., Ltd. | Heat sink |
US10677535B1 (en) * | 2018-11-30 | 2020-06-09 | Furukawa Electric Co., Ltd. | Heat sink |
US11453484B2 (en) | 2018-12-17 | 2022-09-27 | Goodrich Corporation | Heat shield retainer and method |
JP6640401B1 (ja) * | 2019-04-18 | 2020-02-05 | 古河電気工業株式会社 | ヒートシンク |
CN111912274A (zh) | 2019-05-10 | 2020-11-10 | 讯凯国际股份有限公司 | 均温板及其制造方法 |
AU2021326431A1 (en) * | 2020-08-12 | 2023-03-09 | Hgci, Inc. | Light fixture including a housing for a ballast |
EP4068930B1 (en) | 2021-04-01 | 2024-03-13 | Ovh | A rack system for housing an electronic device |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003249611A (ja) * | 2002-02-26 | 2003-09-05 | Fujikura Ltd | フィン付きヒートシンク |
JP3104468U (ja) * | 2004-04-06 | 2004-09-16 | 浩▲しん▼股▲ふん▼有限公司 | 冷却装置の導風装置 |
US20060273137A1 (en) * | 2005-06-04 | 2006-12-07 | Foxconn Technology Co.,Ltd. | Heat dissipation device with heat pipes |
JP2015164166A (ja) * | 2014-02-03 | 2015-09-10 | 水谷電機工業株式会社 | 放熱器及びその製造方法 |
JP2017059768A (ja) * | 2015-09-18 | 2017-03-23 | 古河電気工業株式会社 | ヒートシンク |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11351769A (ja) * | 1998-06-12 | 1999-12-24 | Furukawa Electric Co Ltd:The | ヒートシンク |
TWI263472B (en) * | 2004-04-07 | 2006-10-01 | Delta Electronics Inc | Heat dissipation module |
US20060196640A1 (en) * | 2004-12-01 | 2006-09-07 | Convergence Technologies Limited | Vapor chamber with boiling-enhanced multi-wick structure |
JP4265632B2 (ja) * | 2006-08-31 | 2009-05-20 | セイコーエプソン株式会社 | プロジェクタ |
US7414848B2 (en) * | 2007-01-23 | 2008-08-19 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device |
US7740380B2 (en) * | 2008-10-29 | 2010-06-22 | Thrailkill John E | Solid state lighting apparatus utilizing axial thermal dissipation |
JP2011094888A (ja) | 2009-10-30 | 2011-05-12 | Fujitsu Ltd | 放熱装置、放熱装置の製造方法 |
-
2017
- 2017-08-31 JP JP2017166826A patent/JP6395914B1/ja active Active
-
2018
- 2018-08-30 CN CN201890000466.3U patent/CN212725282U/zh active Active
- 2018-08-30 WO PCT/JP2018/032059 patent/WO2019044949A1/ja active Application Filing
- 2018-08-31 TW TW107130532A patent/TWI704656B/zh active
-
2019
- 2019-10-22 US US16/660,440 patent/US10809011B2/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003249611A (ja) * | 2002-02-26 | 2003-09-05 | Fujikura Ltd | フィン付きヒートシンク |
JP3104468U (ja) * | 2004-04-06 | 2004-09-16 | 浩▲しん▼股▲ふん▼有限公司 | 冷却装置の導風装置 |
US20060273137A1 (en) * | 2005-06-04 | 2006-12-07 | Foxconn Technology Co.,Ltd. | Heat dissipation device with heat pipes |
JP2015164166A (ja) * | 2014-02-03 | 2015-09-10 | 水谷電機工業株式会社 | 放熱器及びその製造方法 |
JP2017059768A (ja) * | 2015-09-18 | 2017-03-23 | 古河電気工業株式会社 | ヒートシンク |
Also Published As
Publication number | Publication date |
---|---|
JP6395914B1 (ja) | 2018-09-26 |
TW201921617A (zh) | 2019-06-01 |
CN212725282U (zh) | 2021-03-16 |
US20200049418A1 (en) | 2020-02-13 |
US10809011B2 (en) | 2020-10-20 |
TWI704656B (zh) | 2020-09-11 |
WO2019044949A1 (ja) | 2019-03-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6395914B1 (ja) | ヒートシンク | |
JP6062516B1 (ja) | ヒートシンク | |
US9246037B2 (en) | Folded fin heat sink | |
JP5878352B2 (ja) | ヒートシンク | |
JP2020106949A (ja) | 電子機器、及び電子機器の筐体ユニット | |
US9995537B2 (en) | Heat pipe | |
JP6738226B2 (ja) | 冷却装置 | |
JP6546521B2 (ja) | 液冷式冷却装置 | |
JP6542914B2 (ja) | ヒートパイプ | |
JP6358872B2 (ja) | 発熱素子用沸騰冷却器 | |
WO2017061408A1 (ja) | ヒートシンク | |
JP2016004828A (ja) | 液冷式冷却装置 | |
JP2019047116A (ja) | ヒートシンク | |
US9342110B2 (en) | Heat dissipating device | |
JP2005229102A (ja) | ヒートシンク | |
JP2007080989A (ja) | ヒートシンク | |
JP3198319U (ja) | 放熱器 | |
JP7328213B2 (ja) | ヒートシンク | |
JP2004047789A (ja) | ヒートシンク | |
JP2017069522A (ja) | コールドプレート | |
WO2019168146A1 (ja) | ヒートシンク | |
JP5681092B2 (ja) | パワーモジュールの冷却装置 | |
WO2019106873A1 (ja) | ヒートシンク及び電子部品パッケージ | |
JP2023030327A (ja) | 冷却装置 | |
JP2013084661A (ja) | ヒートシンク |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20180213 |
|
A871 | Explanation of circumstances concerning accelerated examination |
Free format text: JAPANESE INTERMEDIATE CODE: A871 Effective date: 20180213 |
|
A975 | Report on accelerated examination |
Free format text: JAPANESE INTERMEDIATE CODE: A971005 Effective date: 20180214 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20180312 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20180508 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20180730 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20180828 |
|
R151 | Written notification of patent or utility model registration |
Ref document number: 6395914 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R151 |
|
S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |