JP2020166029A5 - - Google Patents

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JP2020166029A5
JP2020166029A5 JP2019063799A JP2019063799A JP2020166029A5 JP 2020166029 A5 JP2020166029 A5 JP 2020166029A5 JP 2019063799 A JP2019063799 A JP 2019063799A JP 2019063799 A JP2019063799 A JP 2019063799A JP 2020166029 A5 JP2020166029 A5 JP 2020166029A5
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Japan
Prior art keywords
chip components
board
mounting method
transfer
mounting
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JP2019063799A
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Japanese (ja)
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JP7319070B2 (ja
JP2020166029A (ja
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JP2019063799A 2019-03-28 2019-03-28 実装方法および画像表示装置の製造方法 Active JP7319070B2 (ja)

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JP2019063799A JP7319070B2 (ja) 2019-03-28 2019-03-28 実装方法および画像表示装置の製造方法

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Application Number Priority Date Filing Date Title
JP2019063799A JP7319070B2 (ja) 2019-03-28 2019-03-28 実装方法および画像表示装置の製造方法

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JP2020166029A JP2020166029A (ja) 2020-10-08
JP2020166029A5 true JP2020166029A5 (enExample) 2022-02-07
JP7319070B2 JP7319070B2 (ja) 2023-08-01

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Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112992878B (zh) * 2021-02-05 2023-01-13 惠州市聚飞光电有限公司 一种芯片转移方法及显示装置
WO2023095672A1 (ja) * 2021-11-26 2023-06-01 信越エンジニアリング株式会社 レーザリフトオフ方法、レセプター基板の製造方法、レーザリフトオフ装置及びフォトマスク

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2501205B2 (ja) * 1986-11-26 1996-05-29 シチズン時計株式会社 電子部品自動挿入機における部品挿入位置補正方法
JP2000323508A (ja) 1999-05-11 2000-11-24 Sumitomo Bakelite Co Ltd 転写バンプシート
JP4403422B2 (ja) 2000-07-18 2010-01-27 ソニー株式会社 画像表示装置の製造方法
JP2003347524A (ja) 2002-05-28 2003-12-05 Sony Corp 素子の転写方法、素子の配列方法及び画像表示装置の製造方法
JP2010251360A (ja) 2009-04-10 2010-11-04 Sony Corp 表示装置の製造方法および表示装置
WO2014128923A1 (ja) 2013-02-22 2014-08-28 上野精機株式会社 マップ照合装置、照合方法及び照合プログラム
JP2015190021A (ja) 2014-03-28 2015-11-02 ソニー株式会社 蒸着用マスクの製造方法および表示装置の製造方法
JP2018060993A (ja) 2016-09-29 2018-04-12 東レエンジニアリング株式会社 転写方法、実装方法、転写装置、及び実装装置
JP2019015899A (ja) 2017-07-10 2019-01-31 株式会社ブイ・テクノロジー 表示装置の製造方法、チップ部品の転写方法、および転写部材

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