WO2017041436A1 - 显示面板的制备方法、绑定切割装置 - Google Patents

显示面板的制备方法、绑定切割装置 Download PDF

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Publication number
WO2017041436A1
WO2017041436A1 PCT/CN2016/073839 CN2016073839W WO2017041436A1 WO 2017041436 A1 WO2017041436 A1 WO 2017041436A1 CN 2016073839 W CN2016073839 W CN 2016073839W WO 2017041436 A1 WO2017041436 A1 WO 2017041436A1
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WIPO (PCT)
Prior art keywords
display
cutting
display panel
binding
substrate
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PCT/CN2016/073839
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English (en)
French (fr)
Inventor
何全华
张�浩
时凌云
Original Assignee
京东方科技集团股份有限公司
北京京东方光电科技有限公司
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Application filed by 京东方科技集团股份有限公司, 北京京东方光电科技有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US15/324,595 priority Critical patent/US10186490B2/en
Publication of WO2017041436A1 publication Critical patent/WO2017041436A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133351—Manufacturing of individual cells out of a plurality of cells, e.g. by dicing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54426—Marks applied to semiconductor devices or parts for alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54453—Marks applied to semiconductor devices or parts for use prior to dicing
    • H01L2223/5446—Located in scribe lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
    • H01L2223/54486—Located on package parts, e.g. encapsulation, leads, package substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0228—Cutting, sawing, milling or shearing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/163—Monitoring a manufacturing process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/166—Alignment or registration; Control of registration

Definitions

  • the present invention belongs to the field of display technologies, and in particular, to a method for preparing a display panel and a binding and cutting device.
  • A represents a display panel
  • a cutting board is used along the cutting line to display the mother board.
  • a plurality of display panels are obtained by cutting, and each of the display panels includes a display area 11 and a bonding area 12.
  • the flexible circuit board is not bound to the binding area 12 of each display panel obtained by cutting, so the binding process needs to be performed separately for each display panel.
  • the driver chip (IC) needs to be bound to the flexible circuit board before the flexible circuit board is bound to the display panel.
  • the present invention provides a method for preparing a display panel and a binding and cutting device, which can improve production efficiency, in view of the above problems in the preparation method of the existing display panel.
  • the preparation method further comprises: simultaneously performing the step of binding the respective flexible circuit boards to the binding area of the display panel corresponding thereto:
  • each driver chip is bound to a flexible circuit board corresponding thereto.
  • the display mother board includes: a first substrate and a second substrate disposed on the box, wherein the second substrate of the display mother board is in contact with the cutting machine; wherein
  • the steps of cutting along the display mother board cutting line and simultaneously bonding the respective flexible circuit boards to the binding area of the corresponding display panel include:
  • the display mother board is turned over so that the first substrate is in contact with the cutting machine table, and the second substrate is cut along the cutting line.
  • the display mother board includes: a first substrate and a second substrate disposed on the box, wherein the second substrate of the display mother board is in contact with the cutting machine; wherein
  • the step of cutting along the display mother board cutting line includes cutting from the first substrate side along the cutting line to the second substrate to cut the display mother board into a plurality of display panels.
  • the preparation method further comprises: before the step of cutting along the cutting line of the display mother board:
  • a step of forming an alignment mark at an intermediate position of any two adjacent display panels In the peripheral region of the display mother board, a step of forming an alignment mark at an intermediate position of any two adjacent display panels.
  • the preparing method further comprises, before the step of cutting along the display mother board cutting line, forming at least one circle defining line around the display panel in the cutting area of the display mother board.
  • the at least one circle defining line is two circle defining lines, and the spacing between the two circle defining lines is equal to the blade thickness of the cutting blade.
  • the material defining the line is a fluorescent material.
  • a preparation for the above display panel a method of binding a cutting device comprising a plurality of robots and a cutting knife; wherein
  • the cutting blade is configured to cut the display mother board into a plurality of display panels along the cutting line;
  • the plurality of robots are configured to simultaneously bind each flexible circuit board to a binding area of a display panel corresponding thereto.
  • each robot has two contact pins, one of which is used to grasp the flexible circuit board and the other of which is used to grasp the driver chip.
  • the robot hand is further provided with a aligning module and a first camera;
  • the first camera is configured to collect an alignment mark on the display mother board
  • the aligning module is configured to fine tune the two contact pins according to the information collected by the first camera.
  • the cutting blade is further provided with a second camera
  • the second camera is configured to collect fluorescence emitted by the fluorescent material.
  • the flexible circuit boards of the same display panel on the same display board are simultaneously bound by a single binding process, so that the production efficiency of the display panel can be greatly improved.
  • the flexible circuit board for displaying the display panels on the motherboard can be bound by a binding process, so that the production efficiency of the display panel can be greatly improved.
  • 1 is a schematic view of a conventional display mother board
  • FIG. 2 is a flowchart of a method for preparing a display panel according to Embodiment 2 of the present invention
  • FIG. 3 is a schematic view of a display mother board according to Embodiment 2 of the present invention.
  • FIG. 4 is a flowchart of a method for preparing another display panel according to Embodiment 2 of the present invention.
  • FIG. 5 is a flowchart of a method for preparing a display panel according to Embodiment 3 of the present invention.
  • FIG. 6 is a schematic diagram of a display panel according to Embodiment 3 of the present invention.
  • FIG. 7 is a flowchart of a method for preparing another display panel according to Embodiment 3 of the present invention.
  • reference numerals are: 1. display mother board; 11, display area; 12, binding area; 13, limit line.
  • the embodiment provides a method for preparing a display panel.
  • the display panel includes a display area and a binding area.
  • the preparation method of this embodiment includes:
  • FIG. 2 is a flow chart of the first method
  • FIG. 3 is a schematic view showing the display mother board provided by the embodiment.
  • the display mother board 1 includes a first substrate and a second substrate disposed on the box, and the display board 1 is cut to obtain a plurality of display panels A.
  • Each display panel A includes a display area 11 and a binding area 12.
  • the first method includes the following steps one to four.
  • Step 1 Take a display mother board 1 and place it on the cutting machine table (the second substrate of the display mother board 1 is placed on the cutting machine table and in contact with the cutting machine table), in the peripheral area of the display mother board 1, An intermediate position of any two adjacent display panels forms an alignment mark, as shown in FIG. 3; optionally, step one may also be: taking a display motherboard 1, In the peripheral area of the display mother board 1, an alignment mark is formed at an intermediate position of any two adjacent display panels, as shown in FIG. 3, and then a display of the alignment mark is formed in such a manner that the second substrate is in contact with the cutting machine table.
  • the motherboard 1 is placed on a cutting machine.
  • Step 2 cutting the first substrate of the display mother board 1 by using a cutting blade.
  • the trajectory of the cutting blade following the cutting of the first substrate of the display mother board 1 is corrected to prevent cutting to the display area 11 of the display panel to cause display.
  • the phenomenon of panel damage It should be noted that, when cutting the first substrate, the area corresponding to the binding region 12 on the first substrate needs to be cut off to expose the binding region 12 of the second substrate.
  • Step 3 Using a robot, the flexible circuit board corresponding to each display panel is bound to the corresponding binding area 12 on the second substrate.
  • the step further comprises simultaneously binding the respective driving chips to the corresponding flexible circuit boards.
  • the number of contact pins on the robot should be equal to the sum of the number of flexible circuit boards and the driving chips, so that a plurality of flexible circuit boards and a plurality of driving chips are used in a single bonding process. Bind at the same time, which greatly improves production efficiency.
  • Step 4 The display mother board 1 is turned over as a whole, so that the first substrate is in contact with the cutting machine, and the second substrate is cut by using a cutting knife, thereby completing the preparation of the display panel.
  • the first method a plurality of flexible circuit boards and a plurality of driving chips are simultaneously bound by a single bonding process, thereby greatly improving production efficiency; and in the first method, the first substrate of the display mother board 1 is first cut, After the second substrate is then cut, it is possible to effectively reduce the probability that the first substrate and the second substrate are simultaneously cut to cause the glass substrate of the display panel to be shredded.
  • This embodiment also provides a method for preparing another display panel.
  • the preparation method is referred to as a second method.
  • Figure 4 is a flow chart of the second method.
  • the step of binding the flexible wiring board and the driving chip in the second method is the same as the corresponding step in the first method.
  • the difference between the second method and the first method is:
  • the first substrate and the second substrate of the display mother board 1 are simultaneously cut by using a cutting blade (that is, Directly from the side of the first substrate Cutting down to the second substrate) to cut the display mother board 1 into a plurality of display panels, and then using a robot, while binding the flexible circuit boards corresponding to the respective display panels and the driving chips corresponding to the respective flexible circuit boards .
  • a cutting blade that is, Directly from the side of the first substrate Cutting down to the second substrate
  • the other steps of the second method are the same as the corresponding steps in the first method and will not be described in detail herein.
  • the embodiment further provides a binding cutting device applied to the preparation method of the above display panel, which comprises a plurality of robots and a cutting blade; wherein the cutting blade is used for cutting the display mother board 1
  • the wire is cut into a plurality of display panels; the plurality of robots are used to simultaneously bind the respective flexible circuit boards to the binding regions 12 of the display panels corresponding thereto. That is to say, the number of robots is equal to the number of display panels on the display motherboard 1.
  • each of the robots has two contact pins, one of which is used to grasp the flexible circuit board and the other of which is used to grasp the driving chip.
  • a plurality of flexible circuit boards and a plurality of driving chips can be simultaneously bound by a single binding process, thereby greatly improving the production efficiency of the display panel.
  • the mechanical hand is further provided with a aligning module and a first camera;
  • the first camera is configured to collect an alignment mark on the display motherboard 1;
  • the aligning module is configured according to the first camera The collected information, fine-tuning the two contact pins to more accurately bind each flexible circuit board to the binding area of the corresponding display panel and bind each driving chip to the corresponding flexible circuit board, thereby improving The precision of the binding process.
  • FIG. 5 is a flowchart of a third method
  • FIG. 6 is a schematic diagram showing a display panel provided by the embodiment.
  • the display panel includes a display area 11 and a binding area 12, and the display mother board 1 includes a first substrate and a second substrate disposed on the box.
  • the third method includes the following steps one to four.
  • Step 1 Take a display mother board 1 and place it on the cutting machine table (the second substrate of the display mother board 1 is placed on the cutting machine table and is in contact with the cutting machine table), and is displayed.
  • the cutting area of the motherboard 1 forms at least one circle defining line 13 around each display panel, as shown in FIG. 6; alternatively, step one may also be: taking a display mother board 1 in the cutting area of the display mother board 1.
  • At least one circle defining line 13 is formed around each of the display panels, and as shown in FIG. 6, the display mother board 1 on which the defining line 13 is formed is then placed on the cutting machine in such a manner that the second substrate is in contact with the cutting machine.
  • two circle defining lines 13 are preferably formed around the respective display panels, and the pitch of the two ring defining lines 13 can be set to the blade thickness of the cutting blade to make the cutting more precise.
  • the material of the defining line 13 may be a fluorescent material.
  • a camera is disposed on the cutting blade, and the camera is capable of collecting fluorescence emitted by the fluorescent material, thereby further preventing the occurrence of erroneous cutting.
  • Step 2 cutting the first substrate of the display mother board 1 by using a cutting blade.
  • the trajectory of the cutting blade following the cutting of the first substrate of the display mother board 1 is corrected to prevent cutting to the display area 11 of the display panel to cause display.
  • the phenomenon of panel damage It should be noted that, when cutting the first substrate, the area corresponding to the binding region 12 on the first substrate needs to be cut off to expose the binding region 12 of the second substrate.
  • Step 3 Using a robot, the flexible circuit board corresponding to each display panel 11 is bound to the corresponding binding area 12 on the second substrate.
  • the step further comprises simultaneously binding the respective driving chips to the corresponding flexible circuit boards.
  • the number of contact pins on the robot should be equal to the sum of the number of flexible circuit boards and the driving chips, so that a plurality of flexible circuit boards and a plurality of driving chips are used in a single bonding process. Bind at the same time, which greatly improves production efficiency.
  • Step 4 The display mother board 1 is turned over as a whole, so that the first substrate is in contact with the cutting machine, and the second substrate is cut by using a cutting knife, thereby completing the preparation of the display panel.
  • a plurality of flexible circuit boards and a plurality of driving chips are simultaneously bound by a single bonding process, thereby greatly improving production efficiency; and in the third method, the first substrate of the display mother board 1 is first cut, After the second substrate is then cut, it is possible to effectively reduce the probability that the first substrate and the second substrate are simultaneously cut to cause the glass substrate of the display panel to be shredded.
  • This embodiment also provides a method for preparing another display panel.
  • the preparation method is referred to as a fourth method.
  • Figure 7 is a flow chart of the fourth method.
  • the step of binding the flexible wiring board and the driving chip to the display panel in the fourth method is the same as the corresponding step in the third method.
  • the difference between the fourth method and the third method is:
  • the first substrate and the second substrate of the display mother board 1 are simultaneously cut by using a cutting blade (that is, Cutting directly from the first substrate side to the second substrate to cut the display mother board 1 into a plurality of display panels and simultaneously exposing the binding area of the second substrate, and then using a robot, and simultaneously
  • the flexible circuit boards corresponding to the respective display panels 11 and the driving chips corresponding to the respective flexible circuit boards are bonded to the binding regions 12 of the second substrate.
  • the other steps of the fourth method are the same as the corresponding steps in the third method, and will not be described in detail herein.
  • the embodiment further provides a binding cutting device applied to the manufacturing method of the above display panel, which comprises a plurality of robots and a cutting blade; wherein the cutting blade is used to display the display board 1 along The cutting line is cut into a plurality of display panels; the plurality of robots are used to simultaneously bind the respective flexible circuit boards to the binding area 12 of the display panel corresponding thereto. That is to say, the number of robots is equal to the number of display panels on the display motherboard 1.
  • each of the robots has two contact pins, one of which is used to grasp the flexible circuit board and the other of which is used to grasp the driving chip.
  • a plurality of flexible circuit boards and a plurality of driving chips can be simultaneously bound by a single binding process, thereby greatly improving the production efficiency of the display panel.
  • the mechanical hand is further provided with a aligning module and a first camera;
  • the first camera is configured to collect an alignment mark on the display motherboard 1;
  • the aligning module is configured according to the first camera The collected information, fine-tuning the two contact pins to more accurately bind each flexible circuit board to the binding area of the corresponding display panel and bind each driving chip to the corresponding flexible circuit board, thereby improving The precision of the binding process.
  • the cutting blade of the embodiment is further provided with a second camera for collecting The fluorescence emitted by the fluorescent material is collected to further prevent the occurrence of mis-cutting.

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Abstract

一种显示面板的制备方法、绑定切割装置，属于显示技术领域。所述显示面板包括显示区（11）和绑定区（12），所述制备方法包括：沿显示母板（1）切割线进行切割的步骤，以及同时将各个柔性线路板绑定至与其对应的显示面板的绑定区的步骤，可解决现有的显示面板的制备效率低的问题。

Description

显示面板的制备方法、绑定切割装置 技术领域
本发明属于显示技术领域，具体涉及一种显示面板的制备方法、绑定切割装置。
背景技术
图1示出一种现有的显示母板1，该显示母板1包括由切割线划分出来的多个显示面板(图中A代表一个显示面板)，采用切割刀沿切割线对显示母板切割即可得到多个显示面板，每个显示面板上均包括显示区11和绑定(Bonding)区12。切割得到的每个显示面板的绑定区12上均未绑定柔性线路板，故需要对每个显示面板分别进行绑定工艺。需要说明的是，在将柔性线路板绑定到显示面板之前，还需要将驱动芯片(IC)绑定到柔性线路板上。
无论是对驱动芯片进行绑定还是对柔性线路板进行绑定，均需要一个对位(驱动芯片与柔性线路板之间的对位；柔性线路板与显示面板之间的对位)的过程。一般情况下，对于每一个显示面板，柔性线路板和驱动芯片绑定工艺分别需要大约3.5s的时间。假若一张显示母板上能够切割出24个显示面板，则对24个显示面板进行绑定工艺共需要24*2*3.5＝168s。对于量产显示面板而言，如何节省绑定工艺所需要的时间，以提高产能，是一个需要解决的技术问题。
发明内容
针对现有的显示面板的制备方法存在的上述问题，本发明实施例提供显示面板的制备方法、绑定切割装置，能够提高生产效率。
根据本发明的一个方面，提供一种显示面板的制备方法，所述显示面板包括显示区和绑定区，所述制备方法包括：
沿显示母板切割线进行切割的步骤，以及同时将各个柔性线路板绑定至与其对应的显示面板的绑定区的步骤。
优选的是，所述制备方法在进行所述同时将各个柔性线路板绑定至与其对应的显示面板的绑定区的步骤的同时还包括：
同时将各个驱动芯片绑定至与其对应的柔性线路板的步骤。
优选的是，所述显示母板包括：对盒设置的第一基板和第二基板，所述显示母板的第二基板与切割机台接触；其中，
所述沿显示母板切割线进行切割的步骤，以及同时将各个柔性线路板绑定至与其对应的显示面板的绑定区的步骤包括：
沿切割线对所述第一基板进行切割；
同时将各个柔性线路板绑定至与其对应的显示面板的绑定区；以及
将显示母板进行翻转，以使第一基板与切割机台接触，并沿切割线对第二基板进行切割。
优选的是，所述显示母板包括：对盒设置的第一基板和第二基板，所述显示母板的第二基板与切割机台接触；其中，
所述沿显示母板切割线进行切割的步骤包括：从第一基板一侧开始沿切割线切割至第二基板以将显示母板切割成多个显示面板。
优选的是，所述制备方法在沿显示母板切割线进行切割的步骤之前还包括：
在显示母板的周边区域，在任意两相邻的显示面板的中间位置形成对位标记的步骤。
可选地，所述制备方法在沿显示母板切割线进行切割的步骤之前还包括：在显示母板的切割区形成围绕显示面板的至少一圈限定线。
进一步优选的是，所述至少一圈限定线为两圈限定线，且两圈限定线之间的间距等于切割刀的刀片厚度。
进一步优选的是，所述限定线的材料为荧光材料。
根据本发明的另一方面，提供一种用于上述显示面板的制备 方法的绑定切割装置，包括多个机械手和切割刀；其中，
所述切割刀，用于将显示母板沿切割线切割成多个显示面板；
所述多个机械手，用于同时将各个柔性线路板绑定至与其对应的显示面板的绑定区。
优选的是，每个机械手上均具有两个触脚，其中一个触脚用于抓取柔性线路板，另一个触脚用于抓取驱动芯片。
进一步优选的是，所述机械手上还设置有对位模块和第一摄像头；
所述第一摄像头，用于采集显示母板上的对位标记；
所述对位模块，用于根据第一摄像头所采集的信息，以对两个触脚进行微调。
优选的是，所述切割刀上还设置有第二摄像头；
所述第二摄像头，用于采集荧光材料所发射的荧光。
根据本发明实施例提供的显示面板的制备方法，同一显示母板上各个显示面板的柔性线路板是采用一次绑定工艺同时绑定的，因此可以大大提高显示面板的生产效率。
根据本发明实施例提供的绑定切割装置，能够采用一次绑定工艺绑定显示母板上各个显示面板的柔性线路板，因此可以大大提高显示面板的生产效率。
附图说明
图1为现有的显示母板的示意图；
图2为本发明的实施例2提供的一种显示面板的制备方法的流程图；
图3为本发明的实施例2提供的显示母板的示意图；
图4为本发明的实施例2提供的另一种显示面板的制备方法的流程图；
图5为本发明的实施例3提供的一种显示面板的制备方法的流程图；
图6为本发明的实施例3提供的显示面板的示意图；
图7为本发明的实施例3提供的另一种显示面板的制备方法的流程图。
其中附图标记为：1、显示母板；11、显示区；12、绑定区；13、限定线。
具体实施方式
为使本领域技术人员更好地理解本发明的技术方案，下面结合附图和具体实施方式对本发明作进一步详细描述。
实施例1：
本实施例提供一种显示面板的制备方法，所述显示面板包括显示区和绑定区，本实施例的制备方法包括：
沿显示母板切割线进行切割的步骤，以及同时将各个柔性线路板绑定至与其对应的显示面板的绑定区的步骤。
由于在本实施例的显示面板的制备方法中采用一次绑定工艺绑定同一显示母板上各个显示面板的柔性线路板，因此可以大大提高显示面板的生产效率。具体结合下述实施例进行说明。
实施例2：
本实施例提供一种显示面板的制备方法。下文中，将该制备方法称为第一方法。图2为第一方法的流程图，图3为示出本实施例提供的显示母板的示意图。所述显示母板1包括对盒设置的第一基板和第二基板，对所述显示母板1进行切割即可得到多个显示面板A。每个显示面板A均包括显示区11和绑定区12。如图2所示，该第一方法包括如下步骤一至四。
步骤一、取一显示母板1，将其放置在切割机台上(显示母板1的第二基板放置在切割机台上、与切割机台接触)，在显示母板1的周边区域，任意两相邻的显示面板的中间位置形成对位标记，如图3所示；可选地，步骤一也可以为：取一显示母板1， 在显示母板1的周边区域，任意两相邻的显示面板的中间位置形成对位标记，如图3所示，然后以第二基板与切割机台接触的方式将形成有对位标记的显示母板1放置在切割机台上。
步骤二、采用切割刀对显示母板1的第一基板进行切割。
在切割过程中，根据显示母板1上的对位标记，对切割刀在显示母板1的第一基板进行切割所遵循的轨迹进行校正，以防止切割到显示面板的显示区11从而导致显示面板损坏的现象。在此需要说明的是，在对第一基板切割时，需要将第一基板上与绑定区12对应的区域切掉，以暴露出第二基板的绑定区12。
步骤三、采用机械手，同时将与各个显示面板对应的柔性线路板绑定至第二基板上的对应绑定区12。
优选的，该步骤还包括同时将各个驱动芯片绑定至对应的柔性线路板上。在该步骤中，应当可以理解的是，机械手上的触脚的个数应当等于柔性线路板和驱动芯片的个数的总和，以便采用一次绑定工艺将多个柔性线路板和多个驱动芯片同时绑定，从而大大提高生产效率。
步骤四、将显示母板1整体翻转，使得第一基板与切割机台接触，采用切割刀再切割第二基板，至此完成显示面板的制备。
在第一方法中，采用一次绑定工艺将多个柔性线路板和多个驱动芯片同时绑定，从而大大提高生产效率；而且在第一方法中，先切割显示母板1的第一基板，之后再切割第二基板，可以有效地减小一次同时切割第一基板和第二基板导致显示面板的玻璃基底被切碎的几率。
本实施例还提供了另一种显示面板的制备方法。下文中，将该制备方法称为第二方法。图4为第二方法的流程图。第二方法中的将柔性线路板和驱动芯片绑定步骤与第一方法中对应步骤相同。第二方法与第一方法的区别在于：
与第一方法中的先切割第二基板、翻转显示模板、然后切割第一基板的方式不同，第二方法中先采用切割刀同时切割显示母板1的第一基板和第二基板(也就是，由第一基板一侧开始直接 向下切割至第二基板)，以将显示母板1切割成多个显示面板，之后再采用机械手，同时将与各个显示面板对应的柔性线路板和与各个柔性线路板对应的驱动芯片绑定。第二方法的其他步骤与第一方法中的对应步骤相同，在此不再详细描述。
相应的，本实施例还提供了一种应用于上述显示面板的制备方法的绑定切割装置，其包括多个机械手和切割刀；其中，所述切割刀，用于将显示母板1沿切割线切割成多个显示面板；所述多个机械手，用于同时将各个柔性线路板绑定至与其对应的显示面板的绑定区12。也就是说，机械手的个数等于显示母板1上显示面板的个数。
优选地，每个所述机械手上均具有两个触脚，其中一个触脚用于抓取柔性线路板，另一个触脚用于抓取驱动芯片。
采用具有该种机械手的绑定切割装置，可以采用一次绑定工艺将多个柔性线路板和多个驱动芯片同时绑定，从而大大提高显示面板的生产效率。
优选的，上述的机械手上还设置有对位模块和第一摄像头；所述第一摄像头，用于采集显示母板1上的对位标记；所述对位模块，用于根据第一摄像头所采集的信息，对两个触脚进行微调，以更加准确地将各个柔性线路板绑定至与其对应的显示面板的绑定区和将各个驱动芯片绑定至与其对应的柔性线路板，从而提高绑定工艺的精准度。
实施例3：
本实施例提供一种显示面板的制备方法。下文中，将该制备方法称为第三方法。图5为第三方法的流程图，图6为示出本实施例提供的显示面板的示意图。所述显示面板包括显示区11和绑定区12，显示母板1包括对盒设置的第一基板和第二基板。该第三方法包括如下步骤一至四。
步骤一、取一显示母板1，将其放置在切割机台上(显示母板1的第二基板放置在切割机台上、与切割机台接触)，在显示 母板1的切割区形成围绕各个显示面板的至少一圈限定线13，如图6所示；可选地，步骤一也可以为：取一显示母板1，在显示母板1的切割区形成围绕各个显示面板的至少一圈限定线13，如图6所示，然后以第二基板与切割机台接触的方式将形成有限定线13的显示母板1放置在切割机台上。
在该步骤中，优选地在各个显示面板周围形成两圈限定线13，且两圈限定线13的间距可以设定为切割刀的刀片厚度，以使切割更加精确。其中，限定线13的材料可以为荧光材料，在这种情况下，在切割刀上设置摄像头，且该摄像头能够采集荧光材料所发出的荧光，从而可以进一步地防止误切割的现象发生。
步骤二、采用切割刀对显示母板1的第一基板进行切割。
在切割过程中，根据显示母板1上的限定线13，对切割刀在显示母板1的第一基板进行切割所遵循的轨迹进行校正，以防止切割到显示面板的显示区11从而导致显示面板损坏的现象。在此需要说明的是，在对第一基板切割时，需要将第一基板上与绑定区12对应的区域切掉，以暴露出第二基板的绑定区12。
步骤三、采用机械手，同时将与各个显示面板11对应的柔性线路板绑定至第二基板上的对应绑定区12。
优选的，该步骤还包括同时将各个驱动芯片绑定至对应的柔性线路板上。在该步骤中，应当可以理解的是，机械手上的触脚的个数应当等于柔性线路板和驱动芯片的个数的总和，以便采用一次绑定工艺将多个柔性线路板和多个驱动芯片同时绑定，从而大大提高生产效率。
步骤四、将显示母板1整体翻转，使得第一基板与切割机台接触，采用切割刀再切割第二基板，至此完成显示面板的制备。
在第三方法中，采用一次绑定工艺将多个柔性线路板和多个驱动芯片同时绑定，从而大大提高生产效率；而且在第三方法中，先切割显示母板1的第一基板，之后再切割第二基板，可以有效地减小一次同时切割第一基板和第二基板导致显示面板的玻璃基底被切碎的几率。
本实施例还提供了另一种显示面板的制备方法。下文中，将该制备方法称为第四方法。图7为第四方法的流程图。第四方法中的将柔性线路板和驱动芯片绑定至显示面板的步骤与第三方法中对应步骤相同。第四方法与第三方法的区别在于：
与第三方法中的先切割第二基板、翻转显示模板、然后切割第一基板的方式不同，第四方法中先采用切割刀同时切割显示母板1的第一基板和第二基板(也就是，由第一基板一侧开始直接向下切割至第二基板)，以将显示母板1切割成多个显示面板并且同时暴露出第二基板的绑定区，之后再采用机械手，同时将与各个显示面板11对应的柔性线路板和与各个柔性线路板对应的驱动芯片绑定至第二基板的绑定区12。第四方法的其他步骤与第三方法中对应步骤相同，在此不再详细描述。
相应的，本实施例还提供了一种应用于上述显示面板的制备方法中的绑定切割装置，其包括多个机械手和切割刀；其中，所述切割刀，用于将显示母板1沿切割线切割成多个显示面板；所述多个机械手，用于同时将各个柔性线路板绑定至与其对应的显示面板的绑定区12。也就是说，机械手的个数等于显示母板1上显示面板的个数。
优选地，每个所述机械手上均具有两个触脚，其中一个触脚用于抓取柔性线路板，另一个触脚用于抓取驱动芯片。
采用具有该种机械手的绑定切割装置，可以采用一次绑定工艺将多个柔性线路板和多个驱动芯片同时绑定，从而大大提高显示面板的生产效率。
优选的，上述的机械手上还设置有对位模块和第一摄像头；所述第一摄像头，用于采集显示母板1上的对位标记；所述对位模块，用于根据第一摄像头所采集的信息，对两个触脚进行微调，以更加准确地将各个柔性线路板绑定至与其对应的显示面板的绑定区和将各个驱动芯片绑定至与其对应的柔性线路板，从而提高绑定工艺的精准度。
优选的，本实施例的切割刀上还设置有第二摄像头，用于采 集荧光材料所发射的荧光，以进一步防止误切割的现象发生。
可以理解的是，以上实施方式仅仅是为了说明本发明的原理而采用的示例性实施方式，然而本发明并不局限于此。对于本领域内的普通技术人员而言，在不脱离本发明的精神和实质的情况下，可以做出各种变型和改进，这些变型和改进也视为本发明的保护范围。

Claims (12)

  1. 一种显示面板的制备方法，所述显示面板包括显示区和绑定区，其中，所述制备方法包括：
    沿显示母板切割线进行切割的步骤，以及同时将各个柔性线路板绑定至与其对应的显示面板的绑定区的步骤。
  2. 根据权利要求1所述的显示面板的制备方法，在进行所述同时将各个柔性线路板绑定至与其对应的显示面板的绑定区的步骤的同时还包括：
    同时将各个驱动芯片绑定至与其对应的柔性线路板的步骤。
  3. 根据权利要求1或2所述的显示面板的制备方法，其中，所述显示母板包括：对盒设置的第一基板和第二基板，所述显示母板的第二基板与切割机台接触；其中，
    所述沿显示母板切割线进行切割的步骤，以及同时将各个柔性线路板绑定至与其对应的显示面板的绑定区的步骤包括：
    沿切割线对所述第一基板进行切割；
    同时将各个柔性线路板绑定至与其对应的显示面板的绑定区；以及
    将显示母板进行翻转，以使第一基板与切割机台接触，并沿切割线对第二基板进行切割。
  4. 根据权利要求1或2所述的显示面板的制备方法，其中，所述显示母板包括：对盒设置的第一基板和第二基板，所述显示母板的第二基板与切割机台接触；其中，
    所述沿显示母板切割线进行切割的步骤包括：
    从第一基板一侧开始沿切割线切割至第二基板以将显示母板切割成多个显示面板。
  5. 根据权利要求1至4中任意一项所述的显示面板的制备方 法，在沿显示母板切割线进行切割的步骤之前还包括：
    在显示母板的周边区域，在任意两相邻的显示面板的中间位置形成对位标记的步骤。
  6. 根据权利要求1至4中任意一项所述的显示面板的制备方法，在沿显示母板切割线进行切割的步骤之前还包括：
    在显示母板的切割区形成围绕各个显示面板的至少一圈限定线。
  7. 根据权利要求6所述的显示面板的制备方法，其中，所述至少一圈限定线为两圈限定线，且两圈限定线之间的间距等于切割刀的刀片厚度。
  8. 根据权利要求6或7所述的显示面板的制备方法，其中，所述限定线的材料为荧光材料。
  9. 一种用于权利要求1所述的显示面板的制备方法的绑定切割装置，包括多个机械手和切割刀；其中，
    所述切割刀，用于将显示母板沿切割线切割成多个显示面板；
    所述多个机械手，用于同时将各个柔性线路板绑定至与其对应的显示面板的绑定区。
  10. 根据权利要求9所述的绑定切割装置，其中，每个机械手上均具有两个触脚，其中一个触脚用于抓取柔性线路板，另一触脚用于抓取驱动芯片。
  11. 根据权利要求10所述的绑定切割装置，其中，所述机械手上还设置有对位模块和第一摄像头；
    所述第一摄像头，用于采集显示母板上的对位标记；
    所述对位模块，用于根据第一摄像头所采集的信息，以对两 个触脚进行微调。
  12. 根据权利要求9所述的绑定切割装置，其中，所述切割刀上还设置有第二摄像头；
    所述第二摄像头，用于采集荧光材料所发射的荧光。
PCT/CN2016/073839 2015-09-08 2016-02-16 显示面板的制备方法、绑定切割装置 WO2017041436A1 (zh)

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