JP2020157324A5 - - Google Patents

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Publication number
JP2020157324A5
JP2020157324A5 JP2019057450A JP2019057450A JP2020157324A5 JP 2020157324 A5 JP2020157324 A5 JP 2020157324A5 JP 2019057450 A JP2019057450 A JP 2019057450A JP 2019057450 A JP2019057450 A JP 2019057450A JP 2020157324 A5 JP2020157324 A5 JP 2020157324A5
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JP
Japan
Prior art keywords
laser
hole
composite material
processing method
paths
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JP2019057450A
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English (en)
Japanese (ja)
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JP7291510B2 (ja
JP2020157324A (ja
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Priority to JP2019057450A priority Critical patent/JP7291510B2/ja
Priority claimed from JP2019057450A external-priority patent/JP7291510B2/ja
Priority to US16/784,991 priority patent/US11583957B2/en
Priority to CA3071681A priority patent/CA3071681C/en
Priority to EP20156433.3A priority patent/EP3715037A1/en
Publication of JP2020157324A publication Critical patent/JP2020157324A/ja
Publication of JP2020157324A5 publication Critical patent/JP2020157324A5/ja
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Publication of JP7291510B2 publication Critical patent/JP7291510B2/ja
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JP2019057450A 2019-03-25 2019-03-25 レーザ加工方法 Active JP7291510B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2019057450A JP7291510B2 (ja) 2019-03-25 2019-03-25 レーザ加工方法
US16/784,991 US11583957B2 (en) 2019-03-25 2020-02-07 Laser processing method and laser processing apparatus
CA3071681A CA3071681C (en) 2019-03-25 2020-02-07 Laser processing method and laser processing apparatus
EP20156433.3A EP3715037A1 (en) 2019-03-25 2020-02-10 Laser processing method and laser processing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019057450A JP7291510B2 (ja) 2019-03-25 2019-03-25 レーザ加工方法

Publications (3)

Publication Number Publication Date
JP2020157324A JP2020157324A (ja) 2020-10-01
JP2020157324A5 true JP2020157324A5 (enExample) 2022-03-25
JP7291510B2 JP7291510B2 (ja) 2023-06-15

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ID=69570559

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JP2019057450A Active JP7291510B2 (ja) 2019-03-25 2019-03-25 レーザ加工方法

Country Status (4)

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US (1) US11583957B2 (enExample)
EP (1) EP3715037A1 (enExample)
JP (1) JP7291510B2 (enExample)
CA (1) CA3071681C (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102630873B1 (ko) * 2019-05-03 2024-01-31 삼성디스플레이 주식회사 윈도우의 제조 방법
JP7240774B2 (ja) * 2020-10-16 2023-03-16 国立大学法人信州大学 光学ユニット及びレーザー加工装置
CN114786340A (zh) * 2022-03-25 2022-07-22 武汉华工激光工程有限责任公司 一种盲孔加工方法和fpc的加工方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0775787B2 (ja) * 1990-05-23 1995-08-16 新日本製鐵株式会社 セラミックスのレーザ穴加工法
JP2001269793A (ja) * 2000-03-27 2001-10-02 Ricoh Microelectronics Co Ltd レーザ加工方法
DE10207288B4 (de) * 2002-02-21 2005-05-04 Newson Engineering Nv Verfahren zum Bohren von Löchern mittels eines Laserstrahls in einem Substrat, insbesondere in einem elektrischen Schaltungsubstrat
JP2004216385A (ja) * 2003-01-09 2004-08-05 Hitachi Via Mechanics Ltd レーザ穴明け加工方法
DE112009000138B4 (de) * 2008-01-17 2016-04-14 Honda Motor Co., Ltd. Laserbearbeitungsvorrichtung und Laserbearbeitungsverfahren
US8716625B2 (en) * 2012-02-03 2014-05-06 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Workpiece cutting
DE102012219196B3 (de) * 2012-10-22 2014-02-06 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Verfahren und Bearbeitungsmaschine zum Einstechen, Bohren oder Schneiden metallischer Werkstücke
US9950392B2 (en) * 2014-03-04 2018-04-24 Rohr, Inc. Forming one or more apertures in a fiber-reinforced composite object with a laser
GB2529153A (en) 2014-08-06 2016-02-17 Bae Systems Plc Substrate manufacture
JP6547933B2 (ja) 2014-12-09 2019-07-24 国立研究開発法人産業技術総合研究所 繊維強化複合材料のレーザー加工方法及びそのレーザー加工装置
JP6804224B2 (ja) 2016-06-22 2020-12-23 三菱重工業株式会社 レーザ加工装置およびレーザ加工方法
JP2018016525A (ja) * 2016-07-29 2018-02-01 三星ダイヤモンド工業株式会社 脆性材料基板のレーザー加工方法およびレーザー加工装置

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