CA3071681C - Laser processing method and laser processing apparatus - Google Patents

Laser processing method and laser processing apparatus Download PDF

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Publication number
CA3071681C
CA3071681C CA3071681A CA3071681A CA3071681C CA 3071681 C CA3071681 C CA 3071681C CA 3071681 A CA3071681 A CA 3071681A CA 3071681 A CA3071681 A CA 3071681A CA 3071681 C CA3071681 C CA 3071681C
Authority
CA
Canada
Prior art keywords
laser
hole
paths
composite material
processing method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CA3071681A
Other languages
English (en)
French (fr)
Other versions
CA3071681A1 (en
Inventor
Saneyuki Goya
Ryuichi Narita
Rudolf Weber
Christian Freitag
Ehsan ZAHEDI
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Heavy Industries Ltd
Original Assignee
Mitsubishi Heavy Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Heavy Industries Ltd filed Critical Mitsubishi Heavy Industries Ltd
Publication of CA3071681A1 publication Critical patent/CA3071681A1/en
Application granted granted Critical
Publication of CA3071681C publication Critical patent/CA3071681C/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/388—Trepanning, i.e. boring by moving the beam spot about an axis
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/142—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor for the removal of by-products
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/16—Composite materials, e.g. fibre reinforced

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Moulding By Coating Moulds (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
CA3071681A 2019-03-25 2020-02-07 Laser processing method and laser processing apparatus Active CA3071681C (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019-057450 2019-03-25
JP2019057450A JP7291510B2 (ja) 2019-03-25 2019-03-25 レーザ加工方法

Publications (2)

Publication Number Publication Date
CA3071681A1 CA3071681A1 (en) 2020-09-25
CA3071681C true CA3071681C (en) 2022-05-31

Family

ID=69570559

Family Applications (1)

Application Number Title Priority Date Filing Date
CA3071681A Active CA3071681C (en) 2019-03-25 2020-02-07 Laser processing method and laser processing apparatus

Country Status (4)

Country Link
US (1) US11583957B2 (enExample)
EP (1) EP3715037A1 (enExample)
JP (1) JP7291510B2 (enExample)
CA (1) CA3071681C (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102630873B1 (ko) * 2019-05-03 2024-01-31 삼성디스플레이 주식회사 윈도우의 제조 방법
JP7240774B2 (ja) * 2020-10-16 2023-03-16 国立大学法人信州大学 光学ユニット及びレーザー加工装置
CN114786340A (zh) * 2022-03-25 2022-07-22 武汉华工激光工程有限责任公司 一种盲孔加工方法和fpc的加工方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0775787B2 (ja) * 1990-05-23 1995-08-16 新日本製鐵株式会社 セラミックスのレーザ穴加工法
JP2001269793A (ja) * 2000-03-27 2001-10-02 Ricoh Microelectronics Co Ltd レーザ加工方法
DE10207288B4 (de) * 2002-02-21 2005-05-04 Newson Engineering Nv Verfahren zum Bohren von Löchern mittels eines Laserstrahls in einem Substrat, insbesondere in einem elektrischen Schaltungsubstrat
JP2004216385A (ja) * 2003-01-09 2004-08-05 Hitachi Via Mechanics Ltd レーザ穴明け加工方法
WO2009091020A1 (ja) * 2008-01-17 2009-07-23 Honda Motor Co., Ltd. レーザ加工装置及びレーザ加工方法
US8716625B2 (en) * 2012-02-03 2014-05-06 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Workpiece cutting
DE102012219196B3 (de) * 2012-10-22 2014-02-06 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Verfahren und Bearbeitungsmaschine zum Einstechen, Bohren oder Schneiden metallischer Werkstücke
US9950392B2 (en) * 2014-03-04 2018-04-24 Rohr, Inc. Forming one or more apertures in a fiber-reinforced composite object with a laser
GB2529153A (en) 2014-08-06 2016-02-17 Bae Systems Plc Substrate manufacture
JP6547933B2 (ja) 2014-12-09 2019-07-24 国立研究開発法人産業技術総合研究所 繊維強化複合材料のレーザー加工方法及びそのレーザー加工装置
JP6804224B2 (ja) * 2016-06-22 2020-12-23 三菱重工業株式会社 レーザ加工装置およびレーザ加工方法
JP2018016525A (ja) * 2016-07-29 2018-02-01 三星ダイヤモンド工業株式会社 脆性材料基板のレーザー加工方法およびレーザー加工装置

Also Published As

Publication number Publication date
CA3071681A1 (en) 2020-09-25
US11583957B2 (en) 2023-02-21
US20200306889A1 (en) 2020-10-01
JP7291510B2 (ja) 2023-06-15
EP3715037A1 (en) 2020-09-30
JP2020157324A (ja) 2020-10-01

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