JP2020155536A5 - - Google Patents

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Publication number
JP2020155536A5
JP2020155536A5 JP2019051427A JP2019051427A JP2020155536A5 JP 2020155536 A5 JP2020155536 A5 JP 2020155536A5 JP 2019051427 A JP2019051427 A JP 2019051427A JP 2019051427 A JP2019051427 A JP 2019051427A JP 2020155536 A5 JP2020155536 A5 JP 2020155536A5
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JP
Japan
Prior art keywords
metal plate
semiconductor element
terminal
electrically connected
metal
Prior art date
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Application number
JP2019051427A
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English (en)
Japanese (ja)
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JP2020155536A (ja
JP7088094B2 (ja
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Publication date
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Priority to JP2019051427A priority Critical patent/JP7088094B2/ja
Priority claimed from JP2019051427A external-priority patent/JP7088094B2/ja
Priority to CN202080021731.8A priority patent/CN113597671B/zh
Priority to PCT/JP2020/004299 priority patent/WO2020189065A1/ja
Publication of JP2020155536A publication Critical patent/JP2020155536A/ja
Publication of JP2020155536A5 publication Critical patent/JP2020155536A5/ja
Priority to US17/475,102 priority patent/US11990391B2/en
Application granted granted Critical
Publication of JP7088094B2 publication Critical patent/JP7088094B2/ja
Active legal-status Critical Current
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JP2019051427A 2019-03-19 2019-03-19 半導体装置 Active JP7088094B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2019051427A JP7088094B2 (ja) 2019-03-19 2019-03-19 半導体装置
CN202080021731.8A CN113597671B (zh) 2019-03-19 2020-02-05 半导体装置
PCT/JP2020/004299 WO2020189065A1 (ja) 2019-03-19 2020-02-05 半導体装置
US17/475,102 US11990391B2 (en) 2019-03-19 2021-09-14 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019051427A JP7088094B2 (ja) 2019-03-19 2019-03-19 半導体装置

Publications (3)

Publication Number Publication Date
JP2020155536A JP2020155536A (ja) 2020-09-24
JP2020155536A5 true JP2020155536A5 (https=) 2021-05-13
JP7088094B2 JP7088094B2 (ja) 2022-06-21

Family

ID=72520703

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019051427A Active JP7088094B2 (ja) 2019-03-19 2019-03-19 半導体装置

Country Status (4)

Country Link
US (1) US11990391B2 (https=)
JP (1) JP7088094B2 (https=)
CN (1) CN113597671B (https=)
WO (1) WO2020189065A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7666780B2 (ja) * 2021-11-11 2025-04-22 新光電気工業株式会社 半導体装置

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002164502A (ja) * 2000-11-28 2002-06-07 Unisia Jecs Corp 半導体装置
JP2003078093A (ja) * 2001-09-05 2003-03-14 Hitachi Unisia Automotive Ltd 半導体装置
JP3922698B2 (ja) * 2002-07-26 2007-05-30 株式会社日立製作所 半導体装置
JP4532303B2 (ja) 2005-02-08 2010-08-25 トヨタ自動車株式会社 半導体モジュール
JP4564937B2 (ja) 2006-04-27 2010-10-20 日立オートモティブシステムズ株式会社 電気回路装置及び電気回路モジュール並びに電力変換装置
WO2009125779A1 (ja) * 2008-04-09 2009-10-15 富士電機デバイステクノロジー株式会社 半導体装置及び半導体装置の製造方法
WO2012127696A1 (ja) * 2011-03-24 2012-09-27 三菱電機株式会社 パワー半導体モジュール及びパワーユニット装置
JP5947537B2 (ja) 2011-04-19 2016-07-06 トヨタ自動車株式会社 半導体装置及びその製造方法
JP5664475B2 (ja) * 2011-06-22 2015-02-04 株式会社デンソー 半導体装置
JP5626274B2 (ja) * 2012-06-29 2014-11-19 株式会社デンソー 半導体装置
WO2014002442A1 (ja) 2012-06-29 2014-01-03 株式会社デンソー 半導体装置および半導体装置の接続構造
JP6114149B2 (ja) * 2013-09-05 2017-04-12 トヨタ自動車株式会社 半導体装置
WO2015121900A1 (ja) * 2014-02-11 2015-08-20 三菱電機株式会社 電力用半導体モジュール
JP2015185749A (ja) 2014-03-25 2015-10-22 トヨタ自動車株式会社 半導体モジュール
JP6181136B2 (ja) 2015-11-09 2017-08-16 日立オートモティブシステムズ株式会社 電力変換装置
JP6708113B2 (ja) 2016-12-19 2020-06-10 株式会社デンソー 積層型冷却器
JP7069787B2 (ja) * 2018-02-09 2022-05-18 株式会社デンソー 半導体装置
JP2019153752A (ja) * 2018-03-06 2019-09-12 トヨタ自動車株式会社 半導体装置

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