CN113597671B - 半导体装置 - Google Patents

半导体装置 Download PDF

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Publication number
CN113597671B
CN113597671B CN202080021731.8A CN202080021731A CN113597671B CN 113597671 B CN113597671 B CN 113597671B CN 202080021731 A CN202080021731 A CN 202080021731A CN 113597671 B CN113597671 B CN 113597671B
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CN
China
Prior art keywords
metal plate
semiconductor element
terminal
electrically connected
insulating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202080021731.8A
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English (en)
Chinese (zh)
Other versions
CN113597671A (zh
Inventor
西畑雅由
吉川正太
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
Denso Corp
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Publication date
Application filed by Denso Corp filed Critical Denso Corp
Publication of CN113597671A publication Critical patent/CN113597671A/zh
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Publication of CN113597671B publication Critical patent/CN113597671B/zh
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • H10W40/778—Auxiliary members characterised by their shape in encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/20—Conductive package substrates serving as an interconnection, e.g. metal plates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/481—Leadframes for devices being provided for in groups H10D8/00 - H10D48/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/138—Containers comprising a conductive base serving as an interconnection having another interconnection being formed by a cover plate parallel to the conductive base, e.g. sandwich type
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/401—Package configurations characterised by multiple insulating or insulated package substrates, interposers or RDLs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/811—Multiple chips on leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H10W72/07354—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/341—Dispositions of die-attach connectors, e.g. layouts
    • H10W72/347—Dispositions of multiple die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/761—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors
    • H10W90/766—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
CN202080021731.8A 2019-03-19 2020-02-05 半导体装置 Active CN113597671B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019051427A JP7088094B2 (ja) 2019-03-19 2019-03-19 半導体装置
JP2019-051427 2019-03-19
PCT/JP2020/004299 WO2020189065A1 (ja) 2019-03-19 2020-02-05 半導体装置

Publications (2)

Publication Number Publication Date
CN113597671A CN113597671A (zh) 2021-11-02
CN113597671B true CN113597671B (zh) 2023-08-22

Family

ID=72520703

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080021731.8A Active CN113597671B (zh) 2019-03-19 2020-02-05 半导体装置

Country Status (4)

Country Link
US (1) US11990391B2 (https=)
JP (1) JP7088094B2 (https=)
CN (1) CN113597671B (https=)
WO (1) WO2020189065A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7666780B2 (ja) * 2021-11-11 2025-04-22 新光電気工業株式会社 半導体装置

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002164502A (ja) * 2000-11-28 2002-06-07 Unisia Jecs Corp 半導体装置
JP2003078093A (ja) * 2001-09-05 2003-03-14 Hitachi Unisia Automotive Ltd 半導体装置
JP2004063682A (ja) * 2002-07-26 2004-02-26 Hitachi Unisia Automotive Ltd 半導体装置
JP2013008749A (ja) * 2011-06-22 2013-01-10 Denso Corp 半導体装置及びその製造方法
CN103314437A (zh) * 2011-03-24 2013-09-18 三菱电机株式会社 功率半导体模块及电源单元装置
JP2014011338A (ja) * 2012-06-29 2014-01-20 Denso Corp 半導体装置
JP2015185749A (ja) * 2014-03-25 2015-10-22 トヨタ自動車株式会社 半導体モジュール
CN105518841A (zh) * 2013-09-05 2016-04-20 丰田自动车株式会社 具有共同围绕焊料黏结物以防止焊料散布的凹槽的半导体装置
CN106030796A (zh) * 2014-02-11 2016-10-12 三菱电机株式会社 功率用半导体模块

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4532303B2 (ja) 2005-02-08 2010-08-25 トヨタ自動車株式会社 半導体モジュール
JP4564937B2 (ja) 2006-04-27 2010-10-20 日立オートモティブシステムズ株式会社 電気回路装置及び電気回路モジュール並びに電力変換装置
WO2009125779A1 (ja) * 2008-04-09 2009-10-15 富士電機デバイステクノロジー株式会社 半導体装置及び半導体装置の製造方法
JP5947537B2 (ja) 2011-04-19 2016-07-06 トヨタ自動車株式会社 半導体装置及びその製造方法
WO2014002442A1 (ja) 2012-06-29 2014-01-03 株式会社デンソー 半導体装置および半導体装置の接続構造
JP6181136B2 (ja) 2015-11-09 2017-08-16 日立オートモティブシステムズ株式会社 電力変換装置
JP6708113B2 (ja) 2016-12-19 2020-06-10 株式会社デンソー 積層型冷却器
JP7069787B2 (ja) * 2018-02-09 2022-05-18 株式会社デンソー 半導体装置
JP2019153752A (ja) * 2018-03-06 2019-09-12 トヨタ自動車株式会社 半導体装置

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002164502A (ja) * 2000-11-28 2002-06-07 Unisia Jecs Corp 半導体装置
JP2003078093A (ja) * 2001-09-05 2003-03-14 Hitachi Unisia Automotive Ltd 半導体装置
JP2004063682A (ja) * 2002-07-26 2004-02-26 Hitachi Unisia Automotive Ltd 半導体装置
CN103314437A (zh) * 2011-03-24 2013-09-18 三菱电机株式会社 功率半导体模块及电源单元装置
JP2013008749A (ja) * 2011-06-22 2013-01-10 Denso Corp 半導体装置及びその製造方法
JP2014011338A (ja) * 2012-06-29 2014-01-20 Denso Corp 半導体装置
CN105518841A (zh) * 2013-09-05 2016-04-20 丰田自动车株式会社 具有共同围绕焊料黏结物以防止焊料散布的凹槽的半导体装置
CN106030796A (zh) * 2014-02-11 2016-10-12 三菱电机株式会社 功率用半导体模块
JP2015185749A (ja) * 2014-03-25 2015-10-22 トヨタ自動車株式会社 半導体モジュール

Also Published As

Publication number Publication date
US11990391B2 (en) 2024-05-21
US20220005750A1 (en) 2022-01-06
JP2020155536A (ja) 2020-09-24
WO2020189065A1 (ja) 2020-09-24
CN113597671A (zh) 2021-11-02
JP7088094B2 (ja) 2022-06-21

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