JP2020141118A - 基板処理装置、基板処理システム及び載置台を位置合わせする方法 - Google Patents

基板処理装置、基板処理システム及び載置台を位置合わせする方法 Download PDF

Info

Publication number
JP2020141118A
JP2020141118A JP2019130348A JP2019130348A JP2020141118A JP 2020141118 A JP2020141118 A JP 2020141118A JP 2019130348 A JP2019130348 A JP 2019130348A JP 2019130348 A JP2019130348 A JP 2019130348A JP 2020141118 A JP2020141118 A JP 2020141118A
Authority
JP
Japan
Prior art keywords
position adjusting
substrate
mounting table
holding
substrate processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2019130348A
Other languages
English (en)
Japanese (ja)
Other versions
JP2020141118A5 (cg-RX-API-DMAC7.html
Inventor
民宏 小林
Tamihiro Kobayashi
民宏 小林
孝幸 山岸
Takayuki Yamagishi
孝幸 山岸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to PCT/JP2020/005865 priority Critical patent/WO2020175191A1/ja
Priority to US17/431,995 priority patent/US20250046645A1/en
Priority to CN202080014395.4A priority patent/CN113439328B/zh
Priority to KR1020217029943A priority patent/KR102604600B1/ko
Publication of JP2020141118A publication Critical patent/JP2020141118A/ja
Publication of JP2020141118A5 publication Critical patent/JP2020141118A5/ja
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
    • C23C16/4582—Rigid and flat substrates, e.g. plates or discs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68771—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting more than one semiconductor substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2019130348A 2019-02-27 2019-07-12 基板処理装置、基板処理システム及び載置台を位置合わせする方法 Withdrawn JP2020141118A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
PCT/JP2020/005865 WO2020175191A1 (ja) 2019-02-27 2020-02-14 基板処理装置、基板処理システム及び載置台を位置合わせする方法
US17/431,995 US20250046645A1 (en) 2019-02-27 2020-02-14 Substrate treatment device, substrate treatment system, and method for aligning placement table
CN202080014395.4A CN113439328B (zh) 2019-02-27 2020-02-14 基板处理装置、基板处理系统以及对载置台进行对位的方法
KR1020217029943A KR102604600B1 (ko) 2019-02-27 2020-02-14 기판 처리 장치, 기판 처리 시스템 및 적재대를 위치 정렬하는 방법

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019034320 2019-02-27
JP2019034320 2019-02-27

Publications (2)

Publication Number Publication Date
JP2020141118A true JP2020141118A (ja) 2020-09-03
JP2020141118A5 JP2020141118A5 (cg-RX-API-DMAC7.html) 2022-05-09

Family

ID=72280613

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019130348A Withdrawn JP2020141118A (ja) 2019-02-27 2019-07-12 基板処理装置、基板処理システム及び載置台を位置合わせする方法

Country Status (3)

Country Link
JP (1) JP2020141118A (cg-RX-API-DMAC7.html)
KR (1) KR102604600B1 (cg-RX-API-DMAC7.html)
CN (1) CN113439328B (cg-RX-API-DMAC7.html)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025047616A1 (ja) * 2023-08-31 2025-03-06 キヤノントッキ株式会社 真空チャンバ及び成膜装置
TWI880464B (zh) * 2022-11-22 2025-04-11 大陸商北京北方華創微電子裝備有限公司 半導體設備及其基座調節機構

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3313609B2 (ja) * 1997-03-19 2002-08-12 ウシオ電機株式会社 ウエハ周辺露光装置のウエハ処理ステージ
US6283692B1 (en) * 1998-12-01 2001-09-04 Applied Materials, Inc. Apparatus for storing and moving a cassette
JP3632575B2 (ja) 2000-08-04 2005-03-23 松下電器産業株式会社 光学素子成形装置
JP2002368066A (ja) * 2001-06-06 2002-12-20 Tokyo Electron Ltd 処理装置
JP3881567B2 (ja) * 2002-03-05 2007-02-14 東京エレクトロン株式会社 熱処理用ボート及び縦型熱処理装置
US7413612B2 (en) 2003-07-10 2008-08-19 Applied Materials, Inc. In situ substrate holder leveling method and apparatus
JP2006120799A (ja) * 2004-10-20 2006-05-11 Tokyo Electron Ltd 基板処理装置、基板載置台交換方法、及びプログラム
JP2009241464A (ja) 2008-03-31 2009-10-22 Dowa Metaltech Kk スクリーン印刷装置およびスクリーン版の位置決め方法
JP5088284B2 (ja) * 2008-09-30 2012-12-05 東京エレクトロン株式会社 真空処理装置
JP5544697B2 (ja) * 2008-09-30 2014-07-09 東京エレクトロン株式会社 成膜装置
JP5083153B2 (ja) 2008-09-30 2012-11-28 東京エレクトロン株式会社 真空処理装置
JP5083193B2 (ja) * 2008-12-12 2012-11-28 東京エレクトロン株式会社 成膜装置、成膜方法及び記憶媒体
US20100326797A1 (en) * 2009-04-23 2010-12-30 Applied Materials, Inc. Carrier for transporting solar cell substrates
JP2011060823A (ja) * 2009-09-07 2011-03-24 Nikon Corp 基板保持装置、露光装置、デバイス製造方法、及び基板保持装置の調整方法
JP2011161621A (ja) 2010-02-12 2011-08-25 Shinko Seimitsu Kanagata Seisakusho:Kk 研削加工用ツインドレッサー装置等の駆動方法等に関する発明
JP5482500B2 (ja) * 2010-06-21 2014-05-07 東京エレクトロン株式会社 基板処理装置
JP6287240B2 (ja) * 2014-01-17 2018-03-07 東京エレクトロン株式会社 真空処理装置及び真空処理方法
CN107078092B (zh) * 2014-10-30 2021-02-05 东京毅力科创株式会社 基板载置台
KR101589667B1 (ko) 2015-02-02 2016-01-29 한국기술교육대학교 산학협력단 히터블록 레벨 조절장치
JP2017199735A (ja) * 2016-04-25 2017-11-02 東京エレクトロン株式会社 基板の入れ替えシステム、基板の入れ替え方法及び記憶媒体
CN206193392U (zh) * 2016-11-15 2017-05-24 惠科股份有限公司 一种校正机构
JP6881010B2 (ja) 2017-05-11 2021-06-02 東京エレクトロン株式会社 真空処理装置
CN108465987B (zh) * 2018-05-22 2024-01-30 深圳市金洲精工科技股份有限公司 一种垂直度调整装置及其操作方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI880464B (zh) * 2022-11-22 2025-04-11 大陸商北京北方華創微電子裝備有限公司 半導體設備及其基座調節機構
WO2025047616A1 (ja) * 2023-08-31 2025-03-06 キヤノントッキ株式会社 真空チャンバ及び成膜装置

Also Published As

Publication number Publication date
KR20210127747A (ko) 2021-10-22
KR102604600B1 (ko) 2023-11-22
CN113439328B (zh) 2024-04-16
CN113439328A (zh) 2021-09-24

Similar Documents

Publication Publication Date Title
JP5650935B2 (ja) 基板処理装置及び位置決め方法並びにフォーカスリング配置方法
KR102009595B1 (ko) 플라즈마 처리 챔버에서 갭 높이 및 평탄화 조정을 제공하는 기판 서포트
TWI811712B (zh) 藉由介接腔室進行之易損零件的自動更換
CN107039307B (zh) 用连接等离子体处理系统的端部执行器自动更换消耗部件
CN111489984B (zh) 前开式环形盒
KR102817500B1 (ko) 처리 모듈 및 처리 방법
JP6432742B2 (ja) エピタキシャル成長装置及びエピタキシャルウェーハの製造方法
US20150107515A1 (en) Vacuum processing apparatus
US20210005502A1 (en) Stage, substrate processing apparatus and stage assembling method
KR102593916B1 (ko) 기판을 처리하는 장치, 및 기판을 처리하는 방법
JP2020141118A (ja) 基板処理装置、基板処理システム及び載置台を位置合わせする方法
CN112992769A (zh) 基板处理装置和载置台
KR20180070386A (ko) 기판처리시스템의 기판위치보정방법 및 그를 이용한 기판처리방법
KR20100105456A (ko) 기판 열처리 장치
US12500100B2 (en) Connected processing container and substrate processing method
WO2020175191A1 (ja) 基板処理装置、基板処理システム及び載置台を位置合わせする方法
CN112640076B (zh) 显示器cvd腔室的基座的平面度测量
KR20220110110A (ko) 프로세스 키트 구성요소들을 반응 챔버 내에 위치시키기 위한 고정 기구 및 방법
US6793766B2 (en) Apparatus having platforms positioned for precise centering of semiconductor wafers during processing
JP5693378B2 (ja) 移動装置
US10858735B2 (en) Alignment systems employing actuators providing relative displacement between lid assemblies of process chambers and substrates, and related methods
JP2020141118A5 (cg-RX-API-DMAC7.html)
US11996306B2 (en) Coupled processing containers, substrate processing system, and substrate processing method
KR20220128284A (ko) 기판 처리 장치 및 기판 처리 장치의 제어 방법
US20110058919A1 (en) Mechanical modularity chambers

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20220425

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20220425

A761 Written withdrawal of application

Free format text: JAPANESE INTERMEDIATE CODE: A761

Effective date: 20221207