JP2020141114A5 - - Google Patents

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Publication number
JP2020141114A5
JP2020141114A5 JP2019038082A JP2019038082A JP2020141114A5 JP 2020141114 A5 JP2020141114 A5 JP 2020141114A5 JP 2019038082 A JP2019038082 A JP 2019038082A JP 2019038082 A JP2019038082 A JP 2019038082A JP 2020141114 A5 JP2020141114 A5 JP 2020141114A5
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Japan
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die
push
unit
dicing tape
amount
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JP2019038082A
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English (en)
Japanese (ja)
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JP2020141114A (ja
JP7237655B2 (ja
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Priority to JP2019038082A priority Critical patent/JP7237655B2/ja
Priority claimed from JP2019038082A external-priority patent/JP7237655B2/ja
Priority to TW109101654A priority patent/TWI743655B/zh
Priority to CN202010118139.1A priority patent/CN111640702B/zh
Priority to KR1020200023361A priority patent/KR102316869B1/ko
Publication of JP2020141114A publication Critical patent/JP2020141114A/ja
Publication of JP2020141114A5 publication Critical patent/JP2020141114A5/ja
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Publication of JP7237655B2 publication Critical patent/JP7237655B2/ja
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JP2019038082A 2019-03-01 2019-03-01 半導体製造装置および半導体装置の製造方法 Active JP7237655B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2019038082A JP7237655B2 (ja) 2019-03-01 2019-03-01 半導体製造装置および半導体装置の製造方法
TW109101654A TWI743655B (zh) 2019-03-01 2020-01-17 半導體製造裝置及半導體裝置的製造方法
CN202010118139.1A CN111640702B (zh) 2019-03-01 2020-02-25 半导体制造装置及半导体器件的制造方法
KR1020200023361A KR102316869B1 (ko) 2019-03-01 2020-02-26 반도체 제조 장치 및 반도체 장치의 제조 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019038082A JP7237655B2 (ja) 2019-03-01 2019-03-01 半導体製造装置および半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JP2020141114A JP2020141114A (ja) 2020-09-03
JP2020141114A5 true JP2020141114A5 (enExample) 2022-01-11
JP7237655B2 JP7237655B2 (ja) 2023-03-13

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JP2019038082A Active JP7237655B2 (ja) 2019-03-01 2019-03-01 半導体製造装置および半導体装置の製造方法

Country Status (4)

Country Link
JP (1) JP7237655B2 (enExample)
KR (1) KR102316869B1 (enExample)
CN (1) CN111640702B (enExample)
TW (1) TWI743655B (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12159850B2 (en) 2020-12-25 2024-12-03 Yibu Semiconductor Co., Ltd. Semiconductor packaging method, semiconductor assembly and electronic device comprising semiconductor assembly
CN112992699B (zh) * 2021-02-01 2024-03-22 上海易卜半导体有限公司 半导体封装方法、半导体组件以及包含其的电子设备
TW202520412A (zh) * 2023-10-12 2025-05-16 日商松下知識產權經營股份有限公司 拾取系統、接合裝置、分類裝置及控制方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10189690A (ja) * 1996-12-26 1998-07-21 Hitachi Ltd 半導体チップのピックアップ方法及びピックアップ装置
KR100278137B1 (ko) 1997-09-04 2001-01-15 가나이 쓰도무 반도체소자의 탑재방법 및 그 시스템, 반도체소자 분리장치 및ic카드의 제조방법
JP2000323437A (ja) * 1999-05-12 2000-11-24 Sony Corp 半導体チップ剥離装置
JP2000353710A (ja) * 1999-06-14 2000-12-19 Toshiba Corp ペレットピックアップ装置および半導体装置の製造方法
JP4574251B2 (ja) 2003-09-17 2010-11-04 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
US20050274457A1 (en) * 2004-05-28 2005-12-15 Asm Assembly Automation Ltd. Peeling device for chip detachment
TWI463580B (zh) * 2007-06-19 2014-12-01 瑞薩科技股份有限公司 Manufacturing method of semiconductor integrated circuit device
JP5583475B2 (ja) 2010-05-19 2014-09-03 キヤノンマシナリー株式会社 ピックアップ装置
JP2012059829A (ja) 2010-09-07 2012-03-22 Elpida Memory Inc 半導体チップの剥離装置、ダイボンディング装置、半導体チップの剥離方法、半導体装置の製造方法
JP2013214683A (ja) 2012-04-04 2013-10-17 Mitsubishi Electric Corp 半導体チップのピックアップ装置
JP2014109511A (ja) 2012-12-03 2014-06-12 Canon Machinery Inc 位置決め方法、位置決め装置、およびダイボンダ
JP6349496B2 (ja) * 2014-02-24 2018-07-04 株式会社新川 半導体ダイのピックアップ装置及びピックアップ方法
JP2017034117A (ja) 2015-08-03 2017-02-09 日立化成株式会社 ダイシング・ダイボンディング一体型テープ
KR102472267B1 (ko) * 2016-04-28 2022-11-30 린텍 가부시키가이샤 보호막이 형성된 반도체 칩의 제조 방법 및 반도체 장치의 제조 방법
JP6797569B2 (ja) 2016-06-13 2020-12-09 ファスフォードテクノロジ株式会社 半導体製造装置および半導体装置の製造方法
WO2018061103A1 (ja) 2016-09-28 2018-04-05 富士機械製造株式会社 ウエハ供給装置および部品実装装置
TWI685046B (zh) 2017-03-24 2020-02-11 日商新川股份有限公司 拾取裝置以及拾取方法

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