JP7237655B2 - 半導体製造装置および半導体装置の製造方法 - Google Patents

半導体製造装置および半導体装置の製造方法 Download PDF

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JP7237655B2
JP7237655B2 JP2019038082A JP2019038082A JP7237655B2 JP 7237655 B2 JP7237655 B2 JP 7237655B2 JP 2019038082 A JP2019038082 A JP 2019038082A JP 2019038082 A JP2019038082 A JP 2019038082A JP 7237655 B2 JP7237655 B2 JP 7237655B2
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die
push
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unit
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Japanese (ja)
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JP2020141114A5 (enExample
JP2020141114A (ja
Inventor
勇輝 名久井
維月 五十嵐
明 齊藤
直樹 岡本
芳弘 栗原
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Fasford Technology Co Ltd
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Fasford Technology Co Ltd
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Priority to JP2019038082A priority Critical patent/JP7237655B2/ja
Priority to TW109101654A priority patent/TWI743655B/zh
Priority to CN202010118139.1A priority patent/CN111640702B/zh
Priority to KR1020200023361A priority patent/KR102316869B1/ko
Publication of JP2020141114A publication Critical patent/JP2020141114A/ja
Publication of JP2020141114A5 publication Critical patent/JP2020141114A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67138—Apparatus for wiring semiconductor or solid state device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
    • H01L2221/68386—Separation by peeling

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
JP2019038082A 2019-03-01 2019-03-01 半導体製造装置および半導体装置の製造方法 Active JP7237655B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2019038082A JP7237655B2 (ja) 2019-03-01 2019-03-01 半導体製造装置および半導体装置の製造方法
TW109101654A TWI743655B (zh) 2019-03-01 2020-01-17 半導體製造裝置及半導體裝置的製造方法
CN202010118139.1A CN111640702B (zh) 2019-03-01 2020-02-25 半导体制造装置及半导体器件的制造方法
KR1020200023361A KR102316869B1 (ko) 2019-03-01 2020-02-26 반도체 제조 장치 및 반도체 장치의 제조 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019038082A JP7237655B2 (ja) 2019-03-01 2019-03-01 半導体製造装置および半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JP2020141114A JP2020141114A (ja) 2020-09-03
JP2020141114A5 JP2020141114A5 (enExample) 2022-01-11
JP7237655B2 true JP7237655B2 (ja) 2023-03-13

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JP2019038082A Active JP7237655B2 (ja) 2019-03-01 2019-03-01 半導体製造装置および半導体装置の製造方法

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JP (1) JP7237655B2 (enExample)
KR (1) KR102316869B1 (enExample)
CN (1) CN111640702B (enExample)
TW (1) TWI743655B (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12159850B2 (en) 2020-12-25 2024-12-03 Yibu Semiconductor Co., Ltd. Semiconductor packaging method, semiconductor assembly and electronic device comprising semiconductor assembly
CN112992699B (zh) * 2021-02-01 2024-03-22 上海易卜半导体有限公司 半导体封装方法、半导体组件以及包含其的电子设备
TW202520412A (zh) * 2023-10-12 2025-05-16 日商松下知識產權經營股份有限公司 拾取系統、接合裝置、分類裝置及控制方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012059829A (ja) 2010-09-07 2012-03-22 Elpida Memory Inc 半導体チップの剥離装置、ダイボンディング装置、半導体チップの剥離方法、半導体装置の製造方法
JP5583475B2 (ja) 2010-05-19 2014-09-03 キヤノンマシナリー株式会社 ピックアップ装置
JP2017034117A (ja) 2015-08-03 2017-02-09 日立化成株式会社 ダイシング・ダイボンディング一体型テープ
JP2017224640A (ja) 2016-06-13 2017-12-21 ファスフォードテクノロジ株式会社 半導体製造装置および半導体装置の製造方法
WO2018061103A1 (ja) 2016-09-28 2018-04-05 富士機械製造株式会社 ウエハ供給装置および部品実装装置
WO2018174138A1 (ja) 2017-03-24 2018-09-27 株式会社新川 ピックアップ装置およびピックアップ方法

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JPH10189690A (ja) * 1996-12-26 1998-07-21 Hitachi Ltd 半導体チップのピックアップ方法及びピックアップ装置
KR100278137B1 (ko) 1997-09-04 2001-01-15 가나이 쓰도무 반도체소자의 탑재방법 및 그 시스템, 반도체소자 분리장치 및ic카드의 제조방법
JP2000323437A (ja) * 1999-05-12 2000-11-24 Sony Corp 半導体チップ剥離装置
JP2000353710A (ja) * 1999-06-14 2000-12-19 Toshiba Corp ペレットピックアップ装置および半導体装置の製造方法
JP4574251B2 (ja) 2003-09-17 2010-11-04 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
US20050274457A1 (en) * 2004-05-28 2005-12-15 Asm Assembly Automation Ltd. Peeling device for chip detachment
TWI463580B (zh) * 2007-06-19 2014-12-01 瑞薩科技股份有限公司 Manufacturing method of semiconductor integrated circuit device
JP2013214683A (ja) 2012-04-04 2013-10-17 Mitsubishi Electric Corp 半導体チップのピックアップ装置
JP2014109511A (ja) 2012-12-03 2014-06-12 Canon Machinery Inc 位置決め方法、位置決め装置、およびダイボンダ
JP6349496B2 (ja) * 2014-02-24 2018-07-04 株式会社新川 半導体ダイのピックアップ装置及びピックアップ方法
KR102472267B1 (ko) * 2016-04-28 2022-11-30 린텍 가부시키가이샤 보호막이 형성된 반도체 칩의 제조 방법 및 반도체 장치의 제조 방법

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5583475B2 (ja) 2010-05-19 2014-09-03 キヤノンマシナリー株式会社 ピックアップ装置
JP2012059829A (ja) 2010-09-07 2012-03-22 Elpida Memory Inc 半導体チップの剥離装置、ダイボンディング装置、半導体チップの剥離方法、半導体装置の製造方法
JP2017034117A (ja) 2015-08-03 2017-02-09 日立化成株式会社 ダイシング・ダイボンディング一体型テープ
JP2017224640A (ja) 2016-06-13 2017-12-21 ファスフォードテクノロジ株式会社 半導体製造装置および半導体装置の製造方法
WO2018061103A1 (ja) 2016-09-28 2018-04-05 富士機械製造株式会社 ウエハ供給装置および部品実装装置
WO2018174138A1 (ja) 2017-03-24 2018-09-27 株式会社新川 ピックアップ装置およびピックアップ方法

Also Published As

Publication number Publication date
JP2020141114A (ja) 2020-09-03
TW202103249A (zh) 2021-01-16
KR20200105753A (ko) 2020-09-09
KR102316869B1 (ko) 2021-10-25
CN111640702A (zh) 2020-09-08
TWI743655B (zh) 2021-10-21
CN111640702B (zh) 2023-08-08

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