JP2005508090A5 - - Google Patents

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Publication number
JP2005508090A5
JP2005508090A5 JP2003541045A JP2003541045A JP2005508090A5 JP 2005508090 A5 JP2005508090 A5 JP 2005508090A5 JP 2003541045 A JP2003541045 A JP 2003541045A JP 2003541045 A JP2003541045 A JP 2003541045A JP 2005508090 A5 JP2005508090 A5 JP 2005508090A5
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JP
Japan
Prior art keywords
semiconductor wafer
processing
measurement data
obtaining
receiving
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2003541045A
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English (en)
Japanese (ja)
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JP2005508090A (ja
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Publication date
Priority claimed from US10/020,551 external-priority patent/US6756243B2/en
Application filed filed Critical
Publication of JP2005508090A publication Critical patent/JP2005508090A/ja
Publication of JP2005508090A5 publication Critical patent/JP2005508090A5/ja
Pending legal-status Critical Current

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JP2003541045A 2001-10-30 2002-08-09 組み込み計測法を使用したカスケード制御の方法および装置 Pending JP2005508090A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/020,551 US6756243B2 (en) 2001-10-30 2001-10-30 Method and apparatus for cascade control using integrated metrology
PCT/US2002/025402 WO2003038888A2 (en) 2001-10-30 2002-08-09 Method and apparatus for cascade control using integrated metrology

Publications (2)

Publication Number Publication Date
JP2005508090A JP2005508090A (ja) 2005-03-24
JP2005508090A5 true JP2005508090A5 (enExample) 2006-01-05

Family

ID=21799234

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003541045A Pending JP2005508090A (ja) 2001-10-30 2002-08-09 組み込み計測法を使用したカスケード制御の方法および装置

Country Status (6)

Country Link
US (1) US6756243B2 (enExample)
EP (1) EP1451867A2 (enExample)
JP (1) JP2005508090A (enExample)
CN (1) CN1310298C (enExample)
TW (1) TWI221627B (enExample)
WO (1) WO2003038888A2 (enExample)

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US6708075B2 (en) * 2001-11-16 2004-03-16 Advanced Micro Devices Method and apparatus for utilizing integrated metrology data as feed-forward data
TWI266249B (en) * 2002-05-16 2006-11-11 Mosel Vitelic Inc Statistical process control method and system thereof
US7254453B2 (en) * 2002-11-21 2007-08-07 Advanced Micro Devices, Inc. Secondary process controller for supplementing a primary process controller
US6868301B1 (en) * 2003-02-11 2005-03-15 Kla-Tencor Corporation Method and application of metrology and process diagnostic information for improved overlay control
US6907369B1 (en) * 2003-05-02 2005-06-14 Advanced Micro Devices, Inc. Method and apparatus for modifying design constraints based on observed performance
JP2004335750A (ja) * 2003-05-08 2004-11-25 Tokyo Electron Ltd 処理スケジュール作成方法
US7482178B2 (en) * 2003-08-06 2009-01-27 Applied Materials, Inc. Chamber stability monitoring using an integrated metrology tool
JP4880888B2 (ja) * 2003-09-09 2012-02-22 セイコーインスツル株式会社 半導体装置の製造方法
JP4880889B2 (ja) * 2003-09-09 2012-02-22 セイコーインスツル株式会社 半導体装置の製造方法
US20060079983A1 (en) * 2004-10-13 2006-04-13 Tokyo Electron Limited R2R controller to automate the data collection during a DOE
US20060136444A1 (en) * 2004-12-17 2006-06-22 Taiwan Semiconductor Manufacturing Co., Ltd. System and method for integrated information service
US7526354B2 (en) * 2006-07-10 2009-04-28 Tokyo Electron Limited Managing and using metrology data for process and equipment control
US20080051930A1 (en) * 2006-07-10 2008-02-28 Oh Hilario L Scheduling method for processing equipment
US7525673B2 (en) * 2006-07-10 2009-04-28 Tokyo Electron Limited Optimizing selected variables of an optical metrology system
WO2008008727A2 (en) * 2006-07-10 2008-01-17 Applied Materials, Inc. Scheduling method for processing equipment
US7522968B2 (en) * 2006-07-10 2009-04-21 Applied Materials, Inc. Scheduling method for processing equipment
JP5213322B2 (ja) * 2006-10-05 2013-06-19 東京エレクトロン株式会社 基板処理方法及び基板処理装置並びにプログラムを記憶する記憶媒体
US7639351B2 (en) * 2007-03-20 2009-12-29 Tokyo Electron Limited Automated process control using optical metrology with a photonic nanojet
US7567353B2 (en) * 2007-03-28 2009-07-28 Tokyo Electron Limited Automated process control using optical metrology and photoresist parameters
US7372583B1 (en) 2007-04-12 2008-05-13 Tokyo Electron Limited Controlling a fabrication tool using support vector machine
US9760020B2 (en) 2012-11-21 2017-09-12 Kla-Tencor Corporation In-situ metrology
CN109923480B (zh) * 2016-11-14 2024-05-07 科磊股份有限公司 具有具备增强功能性的集成型计量工具的光刻系统
EP4155822A1 (en) * 2021-09-28 2023-03-29 ASML Netherlands B.V. Metrology method and system and lithographic system

Family Cites Families (10)

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Publication number Priority date Publication date Assignee Title
US3377958A (en) * 1965-06-16 1968-04-16 Marx & Co Louis Lane change for raceway toy
JPH0639755Y2 (ja) * 1989-10-25 1994-10-19 株式会社トミー レーシングゲーム用軌道装置
JP3599631B2 (ja) * 1993-03-09 2004-12-08 株式会社ルネサステクノロジ 欠陥検査方法及び欠陥検査装置
JPH0729958A (ja) * 1993-07-14 1995-01-31 Hitachi Ltd 半導体製造装置
EP0706209A3 (en) 1994-10-06 1996-12-27 Applied Materials Inc Thin film resistance measurement
US5987398A (en) 1998-04-30 1999-11-16 Sony Corporation Method and apparatus for statistical process control of machines and processes having non-constant mean of a response variable
US6162006A (en) 1998-05-22 2000-12-19 Asm America, Inc. Stackable cassette for use with wafer cassettes
US6197604B1 (en) 1998-10-01 2001-03-06 Advanced Micro Devices, Inc. Method for providing cooperative run-to-run control for multi-product and multi-process semiconductor fabrication
US6408220B1 (en) * 1999-06-01 2002-06-18 Applied Materials, Inc. Semiconductor processing techniques
JP4524720B2 (ja) * 1999-12-28 2010-08-18 ルネサスエレクトロニクス株式会社 プロセス制御装置

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